CN104064500B - For the cleaning device and method of thin slice pan - Google Patents
For the cleaning device and method of thin slice pan Download PDFInfo
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- CN104064500B CN104064500B CN201410286965.1A CN201410286965A CN104064500B CN 104064500 B CN104064500 B CN 104064500B CN 201410286965 A CN201410286965 A CN 201410286965A CN 104064500 B CN104064500 B CN 104064500B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sampling And Sample Adjustment (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a kind of cleaning device and method for thin slice pan, belong to semiconductor technology manufacture field, low speed is set in process cavity and collects ring and at least one high speed collection ring, collect the height gear of ring at a high speed by adjusting, different apocenosis passages are divided in process cavity, cleansing medium is reduced because cross pollution brings detrimental effect to silicon wafer cleaning process, in addition, pumping chamber keeps being evacuated the air-flow in process cavity, suppress the periphery that chemical reagent evaporates into process cavity, different cleansing mediums in being capable of achieving to silicon wafer cleaning process carry out different discharge opeing treatment, the gas exhaust inspecting to different technical process flow fields can be realized simultaneously, it is simple and practical.
Description
Technical field
The invention belongs to semiconductor technology manufacture field, it is related to a kind of cleaning device and method for thin slice pan.
Background technology
The deep-submicron stage is being entered into integrated circuit feature size, it is required in IC wafer manufacturing process
Wafer surface cleanliness factor it is more and more harsher, in order to ensure the cleanliness factor on wafer material surface, the manufacturing process of integrated circuit
In there are hundreds of road mattings, matting account for the 30% of whole manufacturing process.
Silicon wafer cleaning method conventional at present based on monolithic wet-chemical cleaning, conventional monolithic wet-chemical cleaning
Common method is：Chuck clamps silicon slice rotating, while different processing mediums are sprayed in silicon chip surface using different spray arms,
Processing medium is collected using the process cavity of ring-type, finally dries silicon chip by nitrogen or other media.Due to wet method
The process of Chemical cleaning uses various acid-base reagents, organic solvent, ultra-pure water and nitrogen etc., sprays various cleansing mediums same
Often cross pollution in one process cavity, detrimental effect is brought, it is necessary to right to reduce because of cross pollution to silicon wafer cleaning process
The different medium of cleaning silicon chip carries out separate treatment, reclaims or directly emits, in addition, in technical process in process cavity
Need preferable airflow field and suppress the periphery that chemical reagent evaporates into process cavity.
Therefore, those skilled in the art need to be improved to the cleaning device of existing thin slice pan and method, reduce
Because cross pollution brings detrimental effect to silicon wafer cleaning process.
The content of the invention
In place of in view of the shortcomings of the prior art, it is an object of the invention to provide a kind of cleaning device for thin slice pan
And method, reduce because cross pollution brings detrimental effect to silicon wafer cleaning process.
The object of the invention is realized by following technical proposals：
The present invention provides a kind of cleaning device for thin slice pan, including process cavity, including：
Pan carrying platform, including chuck and rotary shaft, the rotary shaft be arranged on the chuck lower section and with it is described
Chuck coaxial line, the rotary shaft is used to drive the chuck to do spinning campaign；
First driving means, located at the lower section of the rotary shaft, drive the rotary shaft to move up and down or spin transhipment
It is dynamic；
Low speed collects ring, on the circumferencial direction below the chuck, discharged during rotary shaft low speed rotation for being collected
Cleansing medium, the low speed collects ring and is provided with leakage fluid dram for discharging cleansing medium, the leakage fluid dram connected drainage passage；
At least one collects at a high speed ring, located at the periphery of the chuck, is arranged for collecting when the rotary shaft rotates at a high speed
The cleansing medium put, the high speed is collected ring lower section and is provided with the second drive device for driving the high speed collection ring to do lifting fortune
It is dynamic；
The cavity wall of the process cavity is highly more than the ring wall of low speed collection ring highly, and collecting ring when the high speed declines
During to low-grade location, the high speed is collected ring and is in closure state between the low speed collects ring, at the same the high speed collect ring and
Between the process cavity cavity wall in opened condition, when the high speed collects ring rises to high tap position, the high speed collect ring and
It is in closure state between the process cavity cavity wall, while it is in open shape that the high speed is collected between ring and low speed collection ring
State；The height gear of ring is collected at a high speed in switching, the side ring wall and adjacent high speed for any of which is collected ring at a high speed collect ring,
Low speed collects ring or process cavity cavity wall in opened condition and forms different apocenosis passages；
The cavity wall periphery of the process cavity is provided with pumping chamber, is formed for being evacuated between the process cavity and the pumping chamber
Nozzle ring, the cavity wall of the pumping chamber is connected with the discharge duct of aspiration pump.
Preferably, the discharge duct is provided with the air-flow micromatic setting for adjusting capacity.
Preferably, pumping chamber top be provided with prevent liquid splash block ring.
Preferably, apocenosis passage is provided between the process cavity and the pumping chamber, the apocenosis passage is used to collect gas
The drop formed after stream condensation.
Preferably, the sparge pipe for cleaning pan is provided with above the pan carrying platform.
Preferably, the chuck is provided with least three is used for the holder of holding plate-like article.
The present invention also provides a kind of cleaning method for thin slice pan, comprises the following steps：
S1, startup first driving means, drive the pan carrying platform to rise to " loaded " position, after holding plate-like article
Drop to process station；
S2, the second drive device drive the high speed to collect ring and move up and down, and any of which is collected the one of ring at a high speed
Side ring wall collects ring, low speed and collects ring or process cavity cavity wall in opened condition and form apocenosis passage with adjacent high speed；
S3, first driving means drive the pan carrying platform to do spinning campaign, the hydrojet pipe inspection first
Cleansing medium is cleaned to the pan, and the first cleansing medium is discharged by apocenosis passage, and cleaning stops injection after finishing
First cleansing medium；
The height gear of ring is collected at a high speed in S4, switching, any of which is collected the side ring wall and adjacent height of ring at a high speed
Speed is collected ring, low speed and collects ring or process cavity cavity wall in opened condition and form the apocenosis passage being different from S2；
S5, the cleansing medium of hydrojet pipe inspection second are cleaned to the pan, and the second cleansing medium is by row
Liquid passage is discharged, and cleaning stops the second cleansing medium of injection after finishing；
S6, repeat step S4 and S5 one or many, stop first driving means and drive the pan carrying platform to do
Spinning campaign, when its low speed rotation, the leakage fluid dram that cleansing medium is collected on ring by the low speed is discharged；
S7, first driving means drive the pan carrying platform to rise to unloading position, take pan away.
Preferably, in the cleaning process, the pumping chamber keeps being evacuated the air-flow in process cavity, and by being evacuated
Discharge duct discharge on chamber.
Preferably, after cleaning process terminates, the rotary speed for changing chuck dries the liquid on pan surface.
The present invention sets low speed in process cavity and collects ring and at least one high speed collection ring, and ring is collected at a high speed by adjusting
Height gear, divide different apocenosis passages in process cavity, reduce cleansing medium because cross pollution is to silicon wafer cleaning process
Detrimental effect is brought, in addition, pumping chamber keeps being evacuated the air-flow in process cavity, suppresses chemical reagent and evaporates into
The periphery of process cavity, the different cleansing mediums in being capable of achieving to silicon wafer cleaning process carry out different discharge opeing treatment, while can
The gas exhaust inspecting to different technical process flow fields is realized, it is simple and practical.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below by to be used needed for embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, can also obtain other attached according to these accompanying drawings
Figure.
Fig. 1 is structural representation when pan carrying platform is in " loaded " position in the present invention；
Fig. 2 is the present invention by adjusting the structural representation of the first apocenosis passage that the height gear of collection ring at a high speed is formed
Figure；
Fig. 3 is the present invention by adjusting the structural representation of the second apocenosis passage that the height gear of collection ring at a high speed is formed
Figure；
Fig. 4 is the present invention by adjusting the structural representation of the 3rd apocenosis passage that the height gear of collection ring at a high speed is formed
Figure；
Fig. 5 is structural representation when pan carrying platform is in unloading position in the present invention.
Label is described as follows in figure：
10th, process cavity；20th, pan carrying platform；21st, chuck；22nd, rotary shaft；23rd, holder；30th, first dress is driven
Put；40th, low speed collects ring；41st, leakage fluid dram；50th, ring is collected at a high speed；50A, first collect at a high speed ring；50B, second are collected at a high speed
Ring；51st, the second drive device；60th, pumping chamber；61st, nozzle ring；62nd, discharge duct；63rd, air-flow micromatic setting；64th, block
Ring；65th, apocenosis passage；65A, the first apocenosis passage；65B, the second apocenosis passage；65C, the 3rd apocenosis passage；65D, the 4th row
Liquid passage；70th, sparge pipe；80th, pan.
Specific embodiment
Describe embodiments of the present invention in detail below in conjunction with schema and embodiment, thereby how the present invention is applied
Technological means can fully understand and implement according to this to solve technical problem and reach the implementation process of technology effect.
The present invention provides a kind of cleaning device for thin slice pan, including process cavity 10, also includes：Pan is carried
Platform 20, including chuck 21 and rotary shaft 22, rotary shaft 22 be arranged on the lower section of chuck 21 and with the coaxial line of chuck 21, rotary shaft 22
For driving chuck 21 to do spinning campaign；First driving means 30, located at the lower section of rotary shaft 22, drive rotary shaft 22 to rise
Drop motion or spinning campaign；Low speed collects ring 40, low for collecting rotary shaft 22 on the circumferencial direction of the lower section of chuck 21
The cleansing medium discharged during speed rotation, low speed collects ring 40 and is provided with leakage fluid dram 41 for discharging cleansing medium, and leakage fluid dram 41 connects
Connect apocenosis passage；At least one collects at a high speed ring 50, located at the periphery of chuck 21, is arranged for collecting when rotary shaft 22 rotates at a high speed
The cleansing medium put, the lower section of collection ring 50 is provided with the second drive device 51 at a high speed is used to drive collection ring 50 at a high speed to do lifting fortune
It is dynamic；The top of pan carrying platform 20 is provided with the sparge pipe 70 for cleaning pan 80, and chuck 21 is provided with least three
For the holder 23 of holding plate-like article 80.
The cavity wall of the process cavity 10 is highly more than the ring wall of low speed collection ring 40 highly, and collecting ring 50 when high speed drops to
During low-grade location, it is in closure state to collect at a high speed between ring 50 and low speed collection ring 40, while collecting ring 50 and process cavity 10 at a high speed
Between cavity wall in opened condition, when high speed collects ring 50 rises to high tap position, collect at a high speed ring 50 and the cavity wall of process cavity 10 it
Between be in closure state, while collect ring 50 and low speed at a high speed collecting between ring 40 in opened condition；Ring 50 is collected at a high speed in switching
Height gear, the side ring wall and adjacent high speed for any of which is collected ring 50 at a high speed collect ring 50, low speed collect ring 40 or
The cavity wall of process cavity 10 in opened condition and forms different apocenosis passages 65.
To realize the gas exhaust inspecting to flow field in different technical process, the cavity wall periphery of process cavity 10 is provided with pumping chamber
60, the nozzle ring 61 for being evacuated is formed between process cavity 10 and pumping chamber 60, the cavity wall of pumping chamber 60 is connected with pumping
The discharge duct 62 of pump.Preferably, discharge duct 62 is provided with the air-flow micromatic setting 63 for adjusting capacity, pumping chamber 60
Top be provided with prevent liquid splash block ring 64.The 4th apocenosis passage 65D, the 4th are provided between process cavity 10 and pumping chamber 60
Apocenosis passage 65D is used to collect the drop formed after condensation.
The present invention also provides a kind of cleaning method for thin slice pan, comprises the following steps：
S1, startup first driving means 30, drive the pan carrying platform 20 to rise to " loaded " position, clamp plate-like
Thing is after 80s to drop to process station；
S2, the second drive device 51 drive the high speed to collect ring 50 and move up and down, and any of which is collected ring at a high speed
50 side ring wall collects ring 50, low speed and collects ring 40 or the cavity wall of process cavity 10 in opened condition and the row of being formed with adjacent high speed
Liquid passage 65；
S3, first driving means 30 drive the pan carrying platform 20 to do spinning campaign, and the sparge pipe 70 sprays
Penetrate the first cleansing medium to clean the pan 80, the first cleansing medium is discharged by apocenosis passage 65, and cleaning is finished
Stop the first cleansing medium of injection afterwards；
S4, switching at a high speed collect ring 50 height gear, make any of which at a high speed collect ring 50 side ring wall with it is adjacent
High speed collect the discharge opeing that ring 50, low speed collects ring 40 or the cavity wall of process cavity 10 in opened condition and formation is different from step S2
Passage 65；
S5, sparge pipe 70 spray the second cleansing medium and the pan 80 are cleaned, and the second cleansing medium is by row
Liquid passage 65 is discharged, and cleaning stops the second cleansing medium of injection after finishing；
S6, repeat step S4 and S5 one or many, stop first driving means 30 and drive the pan carrying platform
20 do spinning campaign, and when its low speed rotation, cleansing medium is collected the leakage fluid dram 41 on ring 40 and discharged by the low speed；
S7, first driving means 30 drive the pan carrying platform 20 to rise to unloading position, take pan 80 away.
Preferably, in cleaning process, pumping chamber 60 keeps being evacuated the air-flow in process cavity 10, and by pumping chamber 60
On discharge duct 62 discharge, additionally, after cleaning process terminates, the rotary speed of chuck 21 can be changed by the surface of pan 80
Liquid is dried.
Embodiment one
The silicon chip technical process of pan 80 presets three kinds of processing mediums in the present embodiment：First cleansing medium, the second cleaning
Medium and the 3rd cleansing medium, the then cleaning device for thin slice pan that the present embodiment is provided include that low speed collects the He of ring 40
Two are collected at a high speed ring 50, and low speed collects ring 40 is used to collect the cleansing medium discharged during 22 low speed rotation of rotary shaft, receives at a high speed
Collection ring 50 is used to collect the cleansing medium discharged when rotary shaft 22 rotates at a high speed, and pan 80 is semi-conductor silicon chip.
As shown in figure 1, pan carrying platform 20 rises to the position that silicon chip is loaded by its first driving means 30, card
The holder 23 for being used to clamp silicon chip on disk 21 is opened, and clamps silicon chip.
As shown in Fig. 2 pan carrying platform 20 drops to process station, now first ring 50A and second is collected at a high speed
Ring 50B being collected at a high speed high tap position being risen to by the second drive device 51, the sparge pipe 70 for spraying the first cleansing medium is transported
Move to the top of chuck 21, the chuck 21 for clamping silicon chip carries out spinning by first driving means 30, while sparge pipe 70 starts
Spray the first cleansing medium.In the engineering of the first cleansing medium technique, the first cleansing medium collects at a high speed ring 50A along first
Inwall flow in the first apocenosis passage 65A.
As shown in figure 3, after after the first cleansing medium sprinkling Preset Time, first collects at a high speed ring 50A by the second driving dress
Put 51 drivings and drop to low-grade location, now, first collects at a high speed ring 50A collects ring 40 in closure state with low speed, and first at a high speed
Ring 50A and second is collected to collect ring 50B at a high speed in opened condition and form the second apocenosis passage 65B.
Sparge pipe 70 for spraying the second cleansing medium moves to the top of chuck 21, and the chuck 21 for clamping silicon chip keeps certainly
Rotary motion changes over corresponding rotary speed, while sparge pipe 70 starts to spray the second cleansing medium.It is situated between in the second cleaning
In the engineering of matter technique, the second cleansing medium of sprinkling flow to the second apocenosis passage along the second inwall for collecting ring 50B at a high speed
In 65B.
As shown in figure 4, after after the second cleansing medium sprinkling Preset Time, second collects at a high speed ring 50B by the second driving dress
Put 51 drivings and drop to low-grade location, now, second collects at a high speed ring 50B collects ring 40 in closure state with low speed, and second at a high speed
Collect ring 50B and the cavity wall of process cavity 10 in opened condition and form the 3rd apocenosis passage 65C.
Sparge pipe 70 for spraying the 3rd cleansing medium moves to the top of chuck 21, and the chuck 21 for clamping silicon chip keeps certainly
Rotary motion changes over corresponding rotary speed, while sparge pipe 70 starts to spray the 3rd cleansing medium.It is situated between in the 3rd cleaning
In the engineering of matter technique, the 3rd cleansing medium of sprinkling is flow in the 3rd apocenosis passage 65C along the inwall of process cavity 10.
As shown in figure 5, pan carrying platform 20 rises to unloading position, the folder of chuck 21 by first driving means 30
Gripping member 23 is unclamped, and takes silicon chip away.
After after the 3rd cleansing medium sprinkling Preset Time, the chuck 21 of clamping silicon chip can change over corresponding rotary speed will
The liquid of silicon chip surface is dried, and nitrogen or other media can be passed through during drying.
Additionally, in cleaning process, pumping chamber 60 keeps being evacuated the air-flow in process cavity 10, and by pumping chamber 60
Discharge duct 62 discharge, preferably, discharge duct 62 is provided with the air-flow micromatic setting 63 for adjusting capacity, pumping chamber
60 tops be provided with prevent liquid splash block ring 64.The 4th apocenosis passage 65D is provided between process cavity 10 and pumping chamber 60, the
Four apocenosis passage 65D are used to collect the drop formed after condensation.
The present invention sets low speed collection ring 40 and at least one in process cavity 10 and collects ring 50 at a high speed, by adjusting at a high speed
The height gear of ring 50 is collected, different apocenosis passages 65 are divided in process cavity 10, reduce cleansing medium because of cross pollution pair
Silicon wafer cleaning process brings detrimental effect, and in addition, pumping chamber 60 keeps being evacuated the air-flow in process cavity 10, suppression
Chemical reagent processed evaporates into the periphery of process cavity, and the different cleansing mediums in being capable of achieving to silicon wafer cleaning process carry out different rows
Liquid treatment, while the gas exhaust inspecting to different technical process flow fields can be realized, it is simple and practical.
Described above has shown and described some preferred embodiments of the invention, but as previously described, it should be understood that the present invention
Be not limited to form disclosed herein, be not to be taken as the exclusion to other embodiment, and can be used for various other combinations,
Modification and environment, and can be in invention contemplated scope described herein, by above-mentioned teaching or the technology or knowledge of association area
It is modified.And the change and change that those skilled in the art are carried out do not depart from the spirit and scope of the present invention, then all should be in this hair
In the protection domain of bright appended claims.
Claims (9)
1. a kind of cleaning device for thin slice pan, including process cavity, it is characterised in that including：
Pan carrying platform, including chuck and rotary shaft, the rotary shaft be arranged on the chuck lower section and with the chuck
Coaxial line, the rotary shaft is used to drive the chuck to do spinning campaign；
First driving means, located at the lower section of the rotary shaft, drive the rotary shaft to move up and down or spinning campaign；
Low speed collects ring, and on the circumferencial direction below the chuck, that is discharged during for collecting rotary shaft low speed rotation is clear
Medium is washed, the low speed collects ring and is provided with leakage fluid dram for discharging cleansing medium, the leakage fluid dram connected drainage passage；
At least one collects at a high speed ring, located at the periphery of the chuck, for collecting what is discharged when the rotary shaft rotates at a high speed
Cleansing medium, the high speed is collected ring lower section and is provided with the second drive device for driving the high speed collection ring to move up and down；
The cavity wall of the process cavity highly more than the low speed collect ring ring wall highly, when the high speed collect ring drop to it is low
During gear, the high speed is collected ring and is in closure state between the low speed collects ring, while the high speed collects ring and described
Between process cavity cavity wall in opened condition, when the high speed collects ring rises to high tap position, the high speed collects ring and described
It is in closure state between process cavity cavity wall, while the high speed is collected between ring and low speed collection ring in opened condition；Cut
The height gear for collecting ring at a high speed is changed, the side ring wall for making any of which collect ring at a high speed collects ring, low speed with adjacent high speed
Collect ring or process cavity cavity wall in opened condition and form different apocenosis passages；
The cavity wall periphery of the process cavity is provided with pumping chamber, and the ring for being evacuated is formed between the process cavity and the pumping chamber
Shape nozzle, the cavity wall of the pumping chamber is connected with the discharge duct of aspiration pump.
2. the cleaning device for thin slice pan according to claim 1, it is characterised in that set on the discharge duct
There is the air-flow micromatic setting for adjusting capacity.
3. the cleaning device for thin slice pan according to claim 1, it is characterised in that the pumping chamber top sets
There is prevent liquid splash to block ring.
4. the cleaning device for thin slice pan according to claim 1, it is characterised in that the process cavity with it is described
Apocenosis passage is provided between pumping chamber, the apocenosis passage is used to collect the drop formed after condensation.
5. the cleaning device for thin slice pan according to claim 1, it is characterised in that the pan carries flat
The sparge pipe for cleaning pan is provided with above platform.
6. the cleaning device for thin slice pan according to claim 1, it is characterised in that the chuck be provided with to
Few three holders for being used for holding plate-like article.
7. a kind of cleaning method of the cleaning device for thin slice pan based on described in claim 5, it is characterised in that bag
Include following steps：
S1, startup first driving means, drive the pan carrying platform to rise to " loaded " position, decline after holding plate-like article
To process station；
S2, the second drive device drive the high speed to collect ring and move up and down, and any of which is collected a side ring of ring at a high speed
Wall collects ring, low speed and collects ring or process cavity cavity wall in opened condition and form apocenosis passage with adjacent high speed；
S3, first driving means drive the pan carrying platform to do spinning campaign, the cleansing medium of hydrojet pipe inspection first
The pan is cleaned, the first cleansing medium is discharged by apocenosis passage, cleaning stops injection first and cleans after finishing
Medium；
The height gear of ring is collected at a high speed in S4, switching, and the side ring wall for making any of which collect ring at a high speed is received with adjacent high speed
Collection ring, low speed collect ring or process cavity cavity wall in opened condition and form the apocenosis passage being different from step S2；
S5, the cleansing medium of hydrojet pipe inspection second are cleaned to the pan, and the second cleansing medium is logical by discharge opeing
Road is discharged, and cleaning stops the second cleansing medium of injection after finishing；
S6, repeat step S4 and S5 one or many, stop first driving means and drive the pan carrying platform to spin
Transhipment is dynamic, and when its low speed rotation, the leakage fluid dram that cleansing medium is collected on ring by the low speed is discharged；
S7, first driving means drive the pan carrying platform to rise to unloading position, take pan away.
8. cleaning method according to claim 7, it is characterised in that in the cleaning process, pumping chamber is kept to technique
Air-flow in chamber is evacuated, and is discharged by the discharge duct on pumping chamber.
9. cleaning method according to claim 7, it is characterised in that after cleaning process terminates, changes the rotation speed of chuck
Spend and dry the liquid on pan surface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410286965.1A CN104064500B (en) | 2014-06-24 | 2014-06-24 | For the cleaning device and method of thin slice pan |
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| CN201410286965.1A CN104064500B (en) | 2014-06-24 | 2014-06-24 | For the cleaning device and method of thin slice pan |
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| CN104064500B true CN104064500B (en) | 2017-06-13 |
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| US10155252B2 (en) * | 2015-04-30 | 2018-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor apparatus and washing method |
| CN106711060B (en) * | 2015-11-16 | 2019-07-26 | 弘塑科技股份有限公司 | The fluid collection device of spin etch cleaning machine |
| CN107030050B (en) * | 2017-05-31 | 2018-01-30 | 重庆市桑麻环保科技有限公司 | A kind of environmental protecting device |
| US11355366B2 (en) * | 2018-08-30 | 2022-06-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for shuttered wafer cleaning |
| CN113471104B (en) * | 2021-06-10 | 2023-12-12 | 鄂尔多斯市同晖电子科技有限公司 | LED chip substrate thinning patch processing device related to intelligent community |
| CN114130782A (en) * | 2021-11-29 | 2022-03-04 | 上海华力微电子有限公司 | Single wafer chemical liquid recovery device and method |
| CN114798647A (en) * | 2022-05-13 | 2022-07-29 | 创微微电子(常州)有限公司 | Lifting structure, single-wafer cleaning mechanism, method and equipment |
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| CN104064500A (en) | 2014-09-24 |
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