CN114798647A

CN114798647A - Lifting structure, single-wafer cleaning mechanism, method and equipment

Info

Publication number: CN114798647A
Application number: CN202210522748.2A
Authority: CN
Inventors: 许峯嘉; 蔡嘉雄; 徐柏翔
Original assignee: Chuang Wei Electronics Changzhou Co ltd
Current assignee: Chuang Wei Electronics Changzhou Co ltd
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-07-29
Also published as: TW202344317A; TWI832319B

Abstract

The invention provides a lifting structure, a single-wafer cleaning mechanism, a single-wafer cleaning method and single-wafer cleaning equipment, and relates to the technical field of semiconductor processing equipment. The lifting structure comprises a driving assembly and at least one lifting assembly. The driving assembly comprises a driving part and at least one butting body, and the butting body is connected with the driving part; the top of the abutting body is provided with an abutting surface which is undulated in a preset direction. One end of the lifting component is abutted to the abutting surface, and the driving part drives the abutting body to move along the preset direction, so that the lifting component moves along the abutting surface. The single-wafer cleaning mechanism provided by the invention adopts the lifting structure and can execute the single-wafer cleaning method provided by the invention; the single-wafer cleaning equipment provided by the invention adopts the single-wafer cleaning mechanism. The lifting structure, the single wafer cleaning mechanism, the single wafer cleaning method and the single wafer cleaning equipment can solve the technical problem of poor lifting synchronism in the prior art.

Description

Lifting structure, single-wafer cleaning mechanism, method and equipment

Technical Field

The invention relates to the technical field of semiconductor processing equipment, in particular to a lifting structure, a single-wafer cleaning mechanism, a single-wafer cleaning method and single-wafer cleaning equipment.

Background

In the semiconductor industry, various liquid medicine procedures are common in wafer wet cleaning equipment. Therefore, not only the various liquid medicines need to be discharged separately, but also the exhaust of each liquid medicine needs to be separated, and the mutual pollution among the liquid medicines is avoided. At present, various cover lifting methods exist in the industry. Most of these methods have poor lifting synchronization, which results in poor air tightness between the covers.

Disclosure of Invention

The invention aims to provide a lifting structure which can solve the technical problem of poor lifting synchronism in the prior art.

The invention also aims to provide a single wafer cleaning mechanism which can solve the technical problem of poor lifting synchronism in the prior art.

The invention also aims to provide a single wafer cleaning method which can solve the technical problem of poor lifting synchronism in the prior art.

The invention also aims to provide single-wafer cleaning equipment which can solve the technical problem of poor lifting synchronism in the prior art.

Embodiments of the invention may be implemented as follows:

embodiments of the present invention provide a lifting structure comprising a drive assembly and at least one lifting assembly;

the driving assembly comprises a driving part and at least one butting body, and the butting body is connected with the driving part; the top of the abutting body is provided with an abutting surface which is undulated in a preset direction;

one end of the lifting component is abutted to the abutting surface, and the driving part drives the abutting body to move along the preset direction, so that the lifting component moves along the abutting surface.

Compared with the prior art, the lifting structure provided by the invention has the beneficial effects that:

the lifting structure can drive the abutting body to move along the preset direction through the driving part, so that the abutting body can move relative to the lifting assembly, and the lifting assembly moves along the abutting surface; because the height of the abutting body is in a state of fluctuating, the lifting component can be lifted and lowered in the process of moving along the abutting surface. Wherein, because the in-process that drives lifting unit and remove at the drive division, the drive division drives the butt joint body and can directly accomplish rising and the reduction to lifting unit along the removal of predetermineeing the direction, can drive the shroud when lifting unit goes up and down and realize going up and down, lifting unit's lift action directly reflects on the lift action of shroud, can improve the lift synchronism of shroud, prevent the poor problem of leakproofness between the shroud, consequently, the lift structure that this application provided can improve the poor technical problem of lift synchronism among the prior art.

Optionally, the abutment surface comprises a high level surface, a low level surface and a transition surface; the two ends of the transition surface are respectively connected with the high-level surface and the low-level surface, and the transition surface is obliquely arranged.

Optionally, the abutting body is provided with a plurality of abutting surfaces, and the plurality of abutting surfaces are sequentially arranged along the preset direction. The number of the butting bodies is two or more, and the two or more butting bodies are arranged in parallel along the direction perpendicular to the preset direction; in the direction perpendicular to the preset direction, at least part of the high-level surface is arranged corresponding to the transition surface or the low-level surface on the adjacent abutting body.

Optionally, the drive section comprises a drive device and a gear set; the driving part is in transmission connection with at least one abutting body through the gear set.

Optionally, the preset direction is a circumferential direction.

A single wafer cleaning mechanism comprises a cover and the lifting structure, wherein the cover is connected with the other end of the lifting assembly, and the lifting assembly is used for jacking or lowering the cover.

The single wafer cleaning mechanism provided by the invention adopts the lifting structure, and the beneficial effects of the single wafer cleaning mechanism relative to the prior art are the same as the beneficial effects of the lifting structure relative to the prior art, and are not repeated herein.

Optionally, the single wafer cleaning mechanism further comprises a rotating assembly and a collecting assembly, the collecting assembly is arranged below the cover cap and used for collecting gas and liquid generated in the wafer cleaning process, the cover cap and the collecting assembly are arranged on the rotating assembly in a surrounding mode, and the top of the rotating assembly is used for placing the wafer.

Optionally, the collecting assembly includes a first collecting part and a second collecting part, the first collecting part is located above the second collecting part, a liquid collecting hole and a gas collecting channel are arranged on the first collecting part, the liquid collecting hole is used for collecting and discharging the liquid, the gas collecting channel is connected to the second collecting part, and the second collecting part is used for being connected to a negative pressure device to form negative pressure in the gas collecting channel.

Optionally, the number of the covers is multiple, and the multiple covers are sequentially stacked and covered; the lifting assembly comprises a plurality of lifting parts and a plurality of sliding parts, and the end parts of the lifting parts are connected to the sliding parts in a one-to-one correspondence manner; the end parts of the lifting parts, which are far away from the sliding part, are connected to the covers in a one-to-one correspondence manner; the plurality of abutting bodies are arranged in parallel along a direction perpendicular to the preset direction, and the plurality of sliding parts are abutted with the plurality of abutting surfaces respectively; two adjacent lifting parts are arranged in a staggered manner.

Optionally, the single wafer cleaning mechanism further comprises a plurality of cleaning assemblies; the cleaning assembly is arranged close to the cover cap, and an opening is formed in the center of the cover cap; the cleaning assembly is used for spraying cleaning liquid to the wafer in the cover cap through the opening; at least part of the cleaning assemblies are provided with suckback valves for controlling the spraying amount of the cleaning liquid; and/or the inner wall of the cover cap forms a rough surface.

The single-wafer cleaning equipment comprises a moving mechanism and at least two single-wafer cleaning mechanisms, wherein the moving mechanism is arranged close to the single-wafer cleaning mechanisms and is used for taking out a wafer from the single-wafer cleaning mechanisms and/or putting the wafer into the single-wafer cleaning mechanisms.

The single wafer cleaning device provided by the invention adopts the single wafer cleaning mechanism, and the beneficial effects of the single wafer cleaning device relative to the prior art are the same as the beneficial effects of the single wafer cleaning mechanism relative to the prior art, and are not repeated herein.

A single wafer cleaning method is applied to the single wafer cleaning mechanism. The cover covers are multiple and are sequentially stacked; the abutting bodies and the lifting assemblies are multiple, and the lifting assemblies are connected with the covers in a one-to-one correspondence manner;

the single wafer cleaning method comprises the following steps:

receiving a cleaning signal;

controlling a driving part to operate positively according to the cleaning signal to drive the plurality of butting bodies to move along the preset direction so as to control the plurality of covers to rise gradually;

receiving a cleaning completion signal, wherein the cleaning completion signal indicates that cleaning of the wafer is completed;

and controlling a driving part to reversely operate according to the cleaning completion signal to drive the plurality of butting bodies to move along the direction opposite to the preset direction so as to gradually control the plurality of covers to be lowered.

The beneficial effects of the single wafer cleaning method provided by the invention relative to the prior art are the same as the beneficial effects of the single wafer cleaning mechanism relative to the prior art, and are not described again.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram illustrating a lifting structure provided in a first embodiment of the present application;

FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1;

FIG. 3 is a schematic view of a set-up structure at B in FIG. 1;

fig. 4 is a schematic structural diagram illustrating a lifting assembly provided in the first embodiment of the present application;

FIG. 5 is a schematic diagram illustrating a single wafer cleaning mechanism provided in the second embodiment of the present application;

FIG. 6 is a schematic diagram of a single wafer cleaning mechanism in a first state according to an embodiment of the present application;

FIG. 7 is a schematic diagram of a second state of a single wafer cleaning mechanism according to an embodiment of the present application;

FIG. 8 is a schematic diagram illustrating a third state of a single wafer cleaning mechanism according to an embodiment of the present application;

FIG. 9 is a schematic diagram illustrating a fourth state of a single wafer cleaning mechanism according to an embodiment of the present application;

FIG. 10 is a schematic diagram illustrating a fifth state of a single wafer cleaning mechanism in an embodiment of the present application;

FIG. 11 is a flowchart illustrating a method for cleaning a single wafer according to a third embodiment of the present application;

fig. 12 is a flowchart illustrating a step S2 of a single wafer cleaning method according to a third embodiment of the present application;

fig. 13 is another flowchart of step S2 in the single wafer cleaning method according to the third embodiment of the present application.

Icon: a 10-single wafer cleaning mechanism; 11-a frame body; 12-a cover cap; 1001-first cover; 1002-a second cover; 1003-third cover; 1004-a fourth cover; 13-a lifting structure; 14-a rotating assembly; 15-a cleaning mechanism; 16-a collection assembly; 161-a first collecting section; 1611-liquid trap; 1612-gas collection channel; 1613-a liquid collection chamber; 162-a second collection portion; 1621-a collection channel; 100-a drive device; 110-gear set; 111-a body; 112-tooth part; 113-a slide linkage; 200-a drive assembly; 210-a drive section; 220-a butt-joint body; 2001-first abutment; 2002-a second abutment; 2003-a third abutment; 2004-a fourth abutment; 201-an abutment surface; 221-high level surface; 222-a transition surface; 223-low level; 300-a lifting assembly; 301-a guide block; 310-a fixed part; 311-mating holes; 320-a lifting part; 330-a sliding part; 340-elastic member.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.

Example one

In order to solve the technical problem of poor lifting synchronism in the prior art, a lifting structure 13 is provided in the present embodiment.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a lifting structure 13 provided in an embodiment of the present application. The lifting structure 13 includes a drive assembly 200 and at least one lifting assembly 300. The driving assembly 200 includes a driving portion 210 and an abutting body 220, and the abutting body 220 is connected with the driving portion 210. The top of the abutting body 220 has an abutting surface 201, and the abutting surface 201 is undulated in a predetermined direction. In other words, the height of the abutting body 220 varies at different positions relative to the driving portion 210. One end of the lifting assembly 300 abuts against the abutting surface 201, and when the driving portion 210 drives the abutting body 220 to move along the preset direction, the lifting assembly 300 can move along the abutting surface 201. In the process that the lifting component 300 moves along the abutting surface 201, since the height of the abutting body 220 is in a state of fluctuation, the abutting body 220 can drive the lifting component 300 to be lifted or lowered through the abutting surface 201, and therefore the purpose of jacking and lowering the lifting component 300 is achieved.

In the process of moving the lifting unit 300 along the contact surface 201, in order to facilitate the lifting unit 300 to be jacked up or lowered down by the contact body 220, the height of the contact body 220 is gradually increased or decreased, so as to prevent a large step from being formed at the top of the contact body 220, thereby preventing the lifting unit 300 from being lifted up or down. It should be appreciated that in some embodiments of the present application, a stepped structure with a small height difference may be formed at the top of the abutting body 220 without affecting the lifting of the lifting assembly 300. Hereinafter, a state in which the height of the top of the abutting body 220 is gradually increased or decreased will be described as an example.

As described above, the driving portion 210 drives the abutting body 220 to move along the predetermined direction, so that the abutting body 220 can move relative to the lifting assembly 300, and the lifting assembly 300 moves along the abutting surface 201; since the height of the abutting body 220 is in a state of fluctuating, the lifting assembly 300 can be lifted and lowered during the process of moving along the abutting surface 201. Wherein, because in the process that drive portion 210 drove lifting unit 300 and removes, drive portion 210 drives the removal of butt joint body 220 along preset direction and can directly accomplish the rising and the reduction to lifting unit 300, consequently, the lift structure 13 that this application provided can improve the poor technical problem of lift synchronism among the prior art.

The driving portion 210 includes a driving device 100 and a gear set 110, and the driving device 100 is in transmission connection with at least one abutting body 220 through the gear set 110. In other words, the abutting body 220 is disposed on the gear set 110, the driving device 100 is in transmission connection with the gear set 110, and during the operation of the driving device 100, power can be transmitted to the abutting body 220 through the gear set to drive the abutting body 220 to move along the preset direction. Alternatively, the gear set 110 has a rotatable body 111, a plurality of teeth portions 112 are formed on the outer circumference of the body 111, such that the body 111 integrally forms a gear or a rack, and correspondingly, the gear set 110 further includes at least one gear which is fitted to the output shaft of the driving device 100 and is engaged with the teeth portions 112 on the outer circumference of the body 111, such that the body 111 is rotated by means of gear transmission during the operation of the driving device 100. In this case, the abutting body 220 is disposed on the main body 111, and the main body 111 can drive the abutting body 220 to move, so that the abutting body 220 can move along the predetermined direction.

The direction of rotation of the body 111 is the circumferential direction, which can be understood as the first direction.

It should be understood that in other embodiments of the present application, the driving of the abutment body 220 may be implemented in other ways. For example, the drive portion includes a chain transmission assembly, a belt transmission assembly, a clutch assembly, or the like; in other words, the abutting body can be driven to move along the preset direction in a chain transmission mode; the butting body can also be driven to move along the preset direction in a belt transmission mode; the butting body can be driven to move along the preset direction in a clutch transmission mode.

Optionally, in this embodiment, the predetermined direction is a circumferential direction, in other words, the main body 111 may drive the abutting body 220 to move along a circumferential path. Based on this, in the process that the abutting body 220 moves along the preset direction, in order to conveniently drive the lifting assembly 300 to stably lift, the abutting body 220 extends along an arc-shaped path or a circumferential path; for example, the abutting body 220 may form an arc shape, and the lifting assembly 300 may reciprocate on the top of the abutting body 220 by the forward rotation and the reverse rotation of the driving device 100, so as to facilitate the lifting assembly 300 to perform a lifting motion for a plurality of times; for another example, the abutting body 220 may form a ring shape, so that the driving device 100 may perform the lifting motion a plurality of times by rotating only forward to realize the lifting assembly 300; alternatively, the lifting assembly 300 may be implemented to perform lifting actions multiple times by only reversing; alternatively, the lifting assembly 300 may perform the lifting operation multiple times by combining the forward rotation and the reverse rotation.

It should be noted that, when the abutting body 220 forms an arc shape, the abutting body 220 has a first end and a second end, and if the lifting assembly 300 can only be lifted or lowered by moving from the first end to the second end, the lifting assembly 300 needs to be lifted and lowered by the forward rotation and the reverse rotation of the driving device 100. If the lifting assembly 300 moves from the first end to the second end, the lifting assembly 300 can be lifted and lowered by the forward rotation of the driving device 100, and then the lifting assembly 300 is reset to the first end by the reverse rotation of the driving device 100; of course, the raising and lowering of the lift assembly 300 is also accomplished by reversing the drive 100.

Further, when the abutting body 220 is formed in a circumferential shape, an initial position may be provided on the abutting body 220, and the abutting body 220 may be moved from the initial position to the initial position again to complete the raising and lowering of the lifting assembly 300 at least once, and based on this, the driving device 100 can effectively realize the control of the raising and lowering of the lifting assembly 300 regardless of the forward rotation only, the reverse rotation only, or the combination of the forward rotation and the reverse rotation.

Optionally, in this embodiment, the lifting assembly 300 is multiple, and correspondingly, multiple abutting bodies 220 are disposed in the preset direction, and the multiple abutting bodies 220 form a ring shape on the main body 111 together; in other words, each abutting body 220 is arc-shaped. Each abutting body 220 is disposed corresponding to one of the lifting assemblies 300. Under the condition that the driving device 100 is in operation, the main body 111 drives the abutting bodies 220 to rotate, and the plurality of abutting bodies 220 respectively drive the plurality of lifting assemblies 300 to lift. Of course, in this case, the driving device 100 may implement the ascending and descending of the ascending and descending assembly 300 by combining the forward rotation and the reverse rotation, and implement the ascending and descending assembly 300 to perform the ascending and descending operation a plurality of times.

It should be understood that, in the case that a plurality of abutting bodies 220 are arranged in a preset direction, it can also be considered that a plurality of abutting surfaces 201 arranged in a row along the preset direction are arranged on one abutting body 220, and each abutting surface 201 is arranged corresponding to one lifting assembly 300.

It should be noted that in other embodiments of the present application, in the case that a plurality of abutting bodies 220 are disposed in a predetermined direction, only one lifting assembly 300 may be disposed; in other words, the number of the lifting assemblies 300 may correspond to the number of the abutment bodies 220 arranged in the preset direction, such that each abutment body 220 corresponds to one lifting assembly 300. In other embodiments of the present disclosure, the number of the lifting assemblies 300 may be less than the number of the abutting bodies 220 arranged in the predetermined direction.

It should be understood that in other embodiments of the present application, the preset direction may also be a direction extending along a straight line, and based on this, the driving device 100 may implement the reciprocating motion of the lifting assembly 300 along the abutting surface 201 by using a combination of forward rotation and reverse rotation, so as to implement the lifting of the lifting assembly 300. For example, the driving device 100 drives the lifting component 300 to move along the abutting surface 201 when rotating forward to realize the lifting of the lifting component 300, and the driving device 100 drives the lifting component 300 to move along the abutting surface 201 when rotating backward to realize the lowering of the lifting component 300.

Optionally, referring to fig. 2, fig. 2 is an enlarged schematic structural diagram of a point a in fig. 1. In some embodiments of the present application, the top of the abutment body 220 is provided with a high level surface 221, a transition surface 222 and a low level surface 223; the height of the high level surface 221 relative to the main body 111 is higher than that of the low level surface 223 relative to the main body 111, two ends of the transition surface 222 are respectively connected with the high level surface 221 and the low level surface 223, and the transition surface 222 is obliquely arranged. When the lifting structure 13 is normally disposed on a horizontal plane, the inclined arrangement of the transition surface 222 means that the transition surface 222 is inclined relative to the horizontal plane, and based on this, the transition surface 222 may be an inclined plane or a curved surface, where the curved surface may be a convex curved surface or a concave curved surface.

When the abutting body 220 moves in the predetermined direction, one of the high-level surface 221, the transition surface 222 and the low-level surface 223 abuts against the lifting assembly 300 on the same low-level abutting body 220. For example, when the lower surface 223 abuts against the lifting assembly 300, the lifting assembly 300 is in the lower position. When the contact body 220 moves along the predetermined direction to the transition surface 222 to contact the lifting assembly 300, the transition surface 222 is inclined to gradually raise the lifting assembly 300 due to the transition surface 222. When the abutting body 220 moves to the high level surface 221 along the predetermined direction to abut against the lifting assembly 300, the lifting assembly 300 is at the high level. In the case that the lifting assembly 300 moves to the high level surface 221 or the low level surface 223, since the high level surface 221 and the low level surface 223 are both planes substantially parallel to the horizontal plane, even if the driving device 100 has an error in the driving stroke, it is ensured that the height of the lifting assembly 300 is not substantially changed, thereby ensuring the position accuracy of the lifting assembly 300 when the lifting assembly 300 is lifted to the high level or lowered to the low level.

It should be understood that in other embodiments of the present application, in the case of using the driving device 100 with higher control accuracy, for example, the driving device 100 is a servo stepper motor, one or both of the high level surface 221 and the low level surface 223 may be eliminated, the lifting height of the lifting assembly 300 may be adjusted directly by adjusting the driving stroke of the driving device 100, and the position accuracy of controlling the lifting assembly 300 to lift may also be ensured.

It is noted that in some embodiments, a semi-circular protrusion or a spherical protrusion is provided on the main body 111, which can also be considered as an abutment 220 having a high surface 221, a transition surface 222 and a low surface 223.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a lifting assembly 300 provided in the embodiment of the present application. Optionally, the lifting assembly 300 comprises a lifting portion 320 and a sliding portion 330; the sliding portion 330 abuts against the abutment surface 201, and one end of the elevating portion 320 is connected to the sliding portion 330. During the process that the main body 111 drives the abutting body 220 to move, the sliding portion 330 slides along the abutting surface 201, so that the sliding portion 330 is raised or lowered, and thus the lifting portion 320 can be raised or lowered along with the sliding portion 330.

Optionally, in order to enable the lifting assembly 300 to be stably engaged with the abutting body 220, the lifting assembly 300 may further include a fixing portion 310, the fixing portion 310 is configured to be fixedly connected to a support plate of the single wafer cleaning mechanism 10, the support plate is a part of the frame body 11 of the single wafer cleaning mechanism 10, and the support plate may be configured to support the cover 12 and other components. Wherein, the fixing portion 310 is provided with a matching hole 311; the lift portion 320 is movably inserted into the fitting hole 311. Alternatively, the lifting part 320 has a rod shape to facilitate the lifting part 320 to penetrate the fitting hole 311 and to facilitate the lifting part 320 to move in the fitting hole 311.

In the process of the abutting body 220 moving along the straight line in the predetermined direction, the sliding portion 330 moves on the top of the abutting body 220, and at the same time, the abutting body 220 can jack up the sliding portion 330 to simultaneously jack up the lifting portion 320, and the lifting portion 320 can move in the matching hole 311. Of course, in the case where the driving device 100 is reversely rotated, the sliding portion 330 slides along the top of the abutting body 220, and the sliding portion 330 is lowered, thereby lowering the elevating portion 320.

When lowered, the sliding part 330 and the lifting part 320 may be lowered by their own weight. Of course, in other embodiments of the present application, in order to ensure stable engagement of the sliding portion 330 and the top of the abutting body 220, an elastic member 340 is disposed between the fixing portion 310 and the sliding portion 330, and the sliding portion 330 and the fixing portion 310 compress the elastic member 340 when the lifting portion 320 is lifted. When the lifting part 320 is lowered, the sliding part 330 can stably abut against the abutting body 220 by the elastic recovery action of the elastic member 340, thereby improving the fitting stability between the sliding part 330 and the abutting body 220.

Optionally, in some embodiments of the present application, the sliding portion 330 is a roller. Of course, in other embodiments, the sliding portion 330 may be arranged in other manners.

Referring to fig. 1, the abutting bodies 220 are multiple, and the abutting bodies 220 are disposed in parallel; and in the direction perpendicular to the preset direction, at least part of the high level surface 221 on the abutting body 220 is arranged in parallel with the low level surface 223 or the transition surface 222 on the adjacent abutting body 220; the lifting assembly 300 includes a plurality of sliding portions 330 and a plurality of lifting portions 320, each cover 12 corresponds to a set of the sliding portions 330 and the lifting portions 320, and the plurality of sliding portions 330 in the lifting assembly 300 are respectively abutted with the plurality of abutting bodies 220 arranged in parallel. It should be noted that, in some embodiments of the present application, a plurality of abutting bodies 220 are disposed on one main body 111, and when the main body 111 is driven by the driving device 100, the main body 111 can simultaneously drive the plurality of abutting bodies 220 to move.

Here, the abutting bodies 220 are arranged in parallel means that a plurality of abutting bodies 220 are arranged in parallel in a direction perpendicular to the preset direction, for example, as in fig. 1, a first abutting body 2001, a second abutting body 2002, a third abutting body 2003 and a fourth abutting body 2004 are arranged in parallel in a direction perpendicular to the preset direction. During the driving of the main body 111 by the driving device 100, the plurality of abutting bodies 220 are simultaneously moved in a predetermined direction.

Optionally, in some embodiments of the present application, at least a portion of the high surface 221 of the abutting body 220 is disposed corresponding to the low surface 223 or the transition surface 222 of the adjacent abutting body, so that in the case that one of the sliding portions 330 of the lifting assembly 300 is disposed on the high surface 221 of one of the abutting bodies 220, the adjacent sliding portion 330 may be disposed on the transition surface 222 or the low surface 223, and this may be reflected in the state that one of the lifting portions 320 is lifted.

The following exemplifies a case where three abutting bodies 220 are provided on the main body 111 in a direction perpendicular to the predetermined direction, where "at least a part of the high-level surface 221 of the abutting body 220 is disposed in parallel with the low-level surface 223 or the transition surface 222 of the adjacent abutting body 220". The three abutments 220 are numbered X, Y and Z in sequence along a direction perpendicular to the predetermined direction, the partial high level 221 of X corresponding to the low level 223 or transition 222 of Y and the partial high level 221 of Y corresponding to the low level 223 or transition 222 of Z. Of course, in other embodiments, the number of the abutting bodies 220 may also be two, four or more.

It should be noted that the above-mentioned "at least a part of the high level surface 221 of the abutting body 220 corresponds to the low level surface 223 or the transition surface 222" of the adjacent abutting body 220 "is required to establish the condition that the plurality of sets of the sliding part 330 and the lifting part 320 are arranged in the direction perpendicular to the predetermined direction in the lifting assembly 300. If the plurality of sets of sliding portions 330 and lifting portions 320 in the lifting assembly 300 are disposed in a staggered manner in a direction perpendicular to the predetermined direction, the distance of the abutting body 220 needs to be adjusted according to the staggered distance between the lifting assemblies 300, so that the plurality of lifting assemblies 300 can be sequentially lifted in the process that the plurality of abutting bodies 220 move along with the main body 111.

Optionally, referring to fig. 3, fig. 3 is an enlarged schematic structural diagram of a portion B in fig. 1, in some embodiments of the present application, in order to facilitate arrangement between the plurality of sets of sliding portions 330 and the lifting portion 320 in the lifting assembly 300, in a direction perpendicular to the predetermined direction, two adjacent sets of sliding portions 330 and the lifting portion 320 are disposed in a staggered manner; based on this, in order to facilitate that the two sliding portions 330 in the lifting assembly 300 are at the high position at the same time, the high-position surfaces 221 on the two adjacent abutting bodies 220 are arranged in a staggered manner; in addition, since the height of the undulation of the contact body 220 represents the rising or falling height of the ascending and descending portion 320, in the case of the ascending, the height of the ascending and descending portions 320 is not on the same plane when the preset rising heights of the plurality of ascending and descending portions 320 are different.

In addition, in the case where the plurality of sliding portions 330 and the plurality of elevating portions 320 are provided in the elevating assembly 300, the elevating assembly 300 further includes a guide block 301; the guide slider 301 is disposed on one side of the sliding portion 330 along the predetermined direction. Based on this, in the process that the driving device 100 drives the abutting bodies 220 to move in the preset direction, due to the offset relationship between the high-level surfaces 221 of two adjacent abutting bodies 220, the two adjacent abutting bodies 220 are partially offset, so that when one sliding portion 330 is lifted, the other sliding portion 330 is in a low position or on the transition surface 222, at this time, the guide slider 301 can contact the side surface of the abutting body 220, so that the guiding of the lifting assembly 300 is realized through the matching relationship between the abutting bodies 220 and the guide slider 301, and the lifting assembly 300 can be stably abutted against the abutting surface 201 when the abutting bodies 220 move in the preset direction.

Of course, in other embodiments of the present application, the guide block 301 may be eliminated, and other ways to provide the guiding function to the lifting assembly 300 may be adopted. For example, a slide rail is disposed on the top of the abutting body 220, and a sliding structure adapted to the slide rail is disposed on the lifting assembly 300, so that the guiding of the lifting assembly 300 is realized through the sliding fit between the slide rail and the sliding structure.

In order to raise and lower the plurality of raising and lowering portions 320 in the raising and lowering assembly 300, not only the plurality of abutting bodies 220 may be provided on one main body 111, but also the plurality of main bodies 111 may be provided, and one abutting body 220 may be provided on each main body 111, so that the plurality of covers 12 are raised and lowered by driving the plurality of covers 12 by the plurality of main bodies 111, respectively. Of course, in other embodiments, a plurality of main bodies 111 may be adopted, and a plurality of abutting bodies 220 may be disposed on each main body 111 to drive the plurality of lifting portions 320 to lift.

Referring to fig. 1 and fig. 6, optionally, in the embodiment of the present application, the main body 111 is multiple, that is, the gear set 110 and the driving device 100 are multiple, and the multiple driving devices 100 are respectively in transmission fit with the multiple gear sets 110; and a plurality of bodies 111 are arranged in parallel; the abutting bodies 220 on two adjacent main bodies 111 are arranged in parallel along a direction perpendicular to the preset direction. In the embodiment shown in fig. 6, two main bodies 111 are provided, the two main bodies 111 are provided in parallel, and the two driving devices 100 drive the two main bodies 111 to rotate forward or backward. In addition, two abutting bodies 220 are provided on each main body 111.

It should be noted that the two bodies 111 are disposed in parallel, in which one body 111 is disposed around the rotating assembly 14, and the other body 111 is disposed around the body 111. The main body 111 located inside is rotatably engaged with the rotating assembly 14 through the sliding rail connecting member 113, so that when one of the driving devices 100 is operated, the main body 111 can be driven to rotate relative to the rotating assembly 14, and the abutting body 220 on the main body 111 is driven to rotate; in the case of the view of fig. 6, the third abutting body 2003 and the fourth abutting body 2004 are arranged on the inner main body 111, that is, the inner main body 111 can simultaneously drive the third abutting body 2003 and the fourth abutting body 2004 to move along the preset direction. Correspondingly, the main body 111 at the outer side is rotationally matched with the main body 111 at the inner side through a slide rail connecting piece 113, so that the other driving device 100 can drive the main body 111 to rotate relative to the main body 111 at the inner side when in operation; in the case of fig. 6, the first abutting body 2001 and the second abutting body 2002 are disposed on the outer main body 111, that is, the outer main body 111 can simultaneously drive the first abutting body 2001 and the second abutting body 2002 to move along the preset direction. Optionally, the sliding rail connecting member 113 may be an i-shaped sliding rail, and the two main bodies 111 may be slidably disposed and connected to two sides of the sliding rail connecting member 113, respectively, so as to implement independent rotation of the two main bodies 111; it should be understood that in other embodiments, the two bodies 111 may be connected to two independent sliding members, so as to realize independent rotation of the two bodies 111.

Correspondingly, the number of the sets of the sliding portions 330 and the lifting portions 320 in the lifting assembly 300 is four, the four sets of the sliding portions 330 and the lifting portions 320 are arranged in a staggered manner along the direction perpendicular to the preset direction, the staggered arrangement refers to that any two adjacent sets of the sliding portions 330 and the lifting portions 320 are arranged in a staggered manner along the direction perpendicular to the preset direction, and the connecting lines of the four sets of the sliding portions 330 and the lifting portions 320 are approximately in an S shape.

To sum up, the lifting structure 13 provided in the embodiment of the present application can drive the abutting body 220 to move along the preset direction through the driving portion 210, so that the abutting body 220 can move relative to the lifting assembly 300, and the lifting assembly 300 moves along the abutting surface 201; since the height of the abutting body 220 is in a state of fluctuating, the lifting assembly 300 can be lifted and lowered during the process of moving along the abutting surface 201. Wherein, because in the process that drive portion 210 drove lifting unit 300 and removes, drive portion 210 drives the removal of butt joint body 220 along preset direction and can directly accomplish the rising and the reduction to lifting unit 300, consequently, the lift structure 13 that this application provided can improve the poor technical problem of lift synchronism among the prior art.

Example two

Referring to fig. 5, fig. 5 is a schematic structural diagram of a single wafer cleaning mechanism 10 provided in the present embodiment. The embodiment provides a single wafer cleaning mechanism 10, wherein the single wafer cleaning mechanism 10 is used for cleaning a single wafer to remove residues, dust particles, dirt and the like on the single wafer so as to ensure that the single wafer has high quality. During the process of cleaning the single wafer by the single wafer cleaning mechanism 10, a plurality of chemicals are sprayed onto the single wafer to ensure that various residues on the single wafer can be effectively cleaned. Therefore, in order to prevent cross contamination between a plurality of chemicals, it is necessary to separately collect products generated after cleaning a single wafer by each chemical during cleaning of the single wafer by each chemical.

The single wafer cleaning mechanism 10 is provided with a plurality of covers 12, the plurality of covers 12 are sequentially covered, and a flow guide channel is formed between any two covers 12 by lifting and lowering part of the covers 12 so as to distinguish products formed by cleaning a single wafer by a plurality of agents. In order to respectively realize the lifting of the covers 12, most of lifting devices adopted in the prior art are complex, and due to complex structural arrangement, the lifting synchronism of the covers 12 is poor, the sealing performance between the adjacent covers 12 is poor, and the distinguishing and collecting of products generated by cleaning a single wafer by using various agents are influenced. It should be noted that the above-mentioned "sequentially raising" refers to that the covers 12 can be controlled to be raised one by one, that is, one of the covers 12 is controlled to be kept in a raised state, so as to form a flow guiding channel between the raised cover 12 and the adjacent cover 12; when the medicine is switched, the other cover cap 12 is controlled to be lifted and kept in the lifted state at the same time, so that a diversion channel is formed with the other adjacent cover cap 12.

Alternatively, in order to improve the hydrophilicity of the cap 12, in the present embodiment, the inner wall of the cap 12 is provided with a rough surface, in other words, the inner surface of the cap 12 exhibits an uneven state, but of course, it can be considered that the inner wall of the cap 12 exhibits a state of undulation. On the basis of the above, under the condition of improving the hydrophilicity of the inner wall of the cover 12, it can be ensured that the liquid product lifted after the wafer is cleaned can better flow along the inner wall of the cover 12, so that the liquid product is provided with good flow guiding performance through the inner wall of the cover 12. It should be understood that in other embodiments of the present application, the provision of a roughened surface on the inner wall of the cover 12 may be eliminated.

Correspondingly, the single wafer cleaning mechanism 10 in this embodiment can solve the technical problem of the prior art that the lifting synchronization of the covers 12 is poor, in which the single wafer cleaning mechanism 10 employs the lifting structure 13 in the above embodiment.

In this embodiment, the other end of the lifting assembly 300 is connected to the cover 12, so that the lifting assembly 300 can lift and lower the cover 12 at the same time. The driving part 210 can drive the abutting body 220 to move along the preset direction, so that the lifting assembly 300 moves along the abutting surface 201, and the abutting surface 201 has the change of height fluctuation, so that the lifting assembly 300 can lift along with the movement of the abutting body 220, and the cover 12 can be driven to lift when the lifting assembly 300 lifts, and the lifting action of the lifting assembly 300 is directly reflected on the lifting action of the cover 12, so that the lifting synchronism of the cover 12 can be improved, and the problem of poor sealing performance between the covers 12 is solved.

It should be noted that, when the lower surface 223 abuts against the lifting assembly 300, the lifting assembly 300 is in the lower position, and the cover 12 is in the lowered position. When the following driving part 210 moves in the predetermined direction until the transition surface 222 abuts against the lifting assembly 300, the transition surface 222 is inclined, so that the transition surface 222 gradually raises the lifting assembly 300, and thus the lifting assembly 300 gradually raises the cover 12. When the abutting body 220 moves to the high-level surface 221 along the predetermined direction to abut against the lifting assembly 300, the lifting assembly 300 is at the high position, and correspondingly, the cover 12 is at the raised position. Under the condition that the lifting assembly 300 moves to the high level surface 221 or the low level surface 223, since the high level surface 221 and the low level surface 223 are both planes substantially parallel to the horizontal plane, even if the driving device 100 has an error in the driving stroke, the height of the lifting assembly 300 can be ensured not to be changed basically, so that the lifting assembly 300 can ensure the position accuracy of the cover 12 driven by the lifting assembly 300 to be lifted to the high level or lowered to the low level, and the sealing performance among a plurality of covers 12 can be ensured. The technical problem of poor lifting synchronism of the covers 12 in the prior art can be solved.

Optionally, in this embodiment, since multiple cleaning agents are required to be used for cleaning the wafer, in order to prevent cross contamination of products generated after the wafer is cleaned by the multiple cleaning agents, multiple products obtained after cleaning need to be collected differently, so that multiple cleaning chambers need to be provided for the multiple cleaning agents, and in the single-wafer cleaning mechanism 10, each cover 12 can form one cleaning chamber; that is, in order to clean the wafer with respect to a plurality of cleaning agents, a plurality of covers 12 are provided in the single wafer cleaning mechanism 10. Correspondingly, in order to facilitate the lifting of the covers 12, the lifting assembly 300 includes a plurality of sliding portions 330 and a plurality of lifting portions 320, and each cover 12 is disposed corresponding to one lifting portion 320, so as to respectively lift the covers 12.

When a plurality of covers 12 are provided, the plurality of covers 12 are sequentially stacked and covered. A cleaning cavity can be formed between every two cover caps 12, and when one cover cap 12 is lifted, a cleaning cavity with enough space can be formed between the other cover cap 12 which is not lifted and is adjacent to the cover cap 12, so that the collection of products after the cleaning agent cleans the wafer can be facilitated. Of course, the inner side of the cover 12 located at the innermost layer and the peripheral side of the rotating means 14 form a cleaning chamber.

It should be understood that in other embodiments of the present application, among the plurality of covers 12 of the single wafer cleaning mechanism 10, the plurality of covers 12 may be lifted and lowered by using the lifting structure 13. Of course, in other embodiments of the present application, the lifting structure 13 may be used for lifting and lowering some of the covers 12 in the plurality of covers 12; for example, only one cover 12 uses the above-mentioned lifting structure 13 to lift the cover 12; for another example, half of the number of the covers 12 may be lifted by using the lifting structure 13.

Alternatively, in the case where a plurality of caps 12 employ the above-described lifting structure 13, in order to separately collect products generated from a plurality of medicaments, it is necessary to lift different caps 12 when collecting products generated from different medicaments, in other words, it is necessary to enable the caps 12 to be lifted in sequence. Therefore, in the first embodiment, at least a part of the high level surface 221 on one abutting body 220 corresponds to the transition surface 222 or the low level surface 223 on the adjacent abutting body 220. Thus, in the case where one of the sliding portions 330 is located on the high-level surface 221 to lift one of the covers 12, the adjacent sliding portion 330 is located on the transition surface 222 or the low-level surface 223 to leave the corresponding cover 12 in an unremoved state, and therefore, a plurality of covers 12 can be lifted one by one.

Note that, in order to lift the covers 12, not only the contact bodies 220 may be provided in one driving unit 210, but also the driving units 210 may be provided to lift the covers 12 so that the driving units 210 drive the covers 12. Of course, in other embodiments, a plurality of driving portions 210 may be adopted, and a plurality of abutting bodies 220 may be disposed on each driving portion 210 to drive the plurality of covers 12 to ascend and descend.

In order to facilitate the sequential lifting of the plurality of covers 12, of course, the plurality of covers 12 should be lifted in a sequence such that the cover 12 located on the outer side is lifted first, and then the cover 12 located on the inner side is lifted sequentially. Correspondingly, the outer contact body 220 may be sequentially controlled to lift the lifting assembly 300, and then the inner contact body 220 may be sequentially controlled to lift the corresponding lifting assembly 300. In other words, the driving device 100 controlling the movement of the outer abutting bodies 220 may be preferentially operated so that the outer two abutting bodies 220 move in the preset direction. Since the high-level surface 221 of the outer abutting body 220 corresponds to the low-level surface 223 or the transition surface 222 of the inner abutting body 220, the outer covers 12 can be raised in sequence. Similarly, when the inner two covers 12 need to be lifted, the other driving device 100 can be controlled to operate to lift the inner two covers 12 one by one. Correspondingly, when it is desired to lower a plurality of covers 12. The driving device 100 corresponding to the inner abutting body 220 is controlled to reversely rotate to sequentially lower the inner two layers of covers 12, and then the driving device 100 corresponding to the outer abutting body 220 is controlled to reversely rotate to sequentially lower the outer two layers of covers 12.

Of course, in the case that the number of the driving portions 210 is greater than two, or the number of the abutting bodies 220 on each driving portion 210 is greater than two, the plurality of covers 12 may be controlled to be sequentially lifted according to the above-mentioned principle.

With continued reference to FIG. 5, in an embodiment of the present application, the single wafer cleaning mechanism 10 further includes a rotating assembly 14 and a collection assembly 16. A collection assembly 16 is disposed below the cover 12, and the collection assembly 16 is used to collect gases and liquids generated during wafer cleaning, the cover 12 and the collection assembly 16 are disposed around the rotation assembly 14, and the top of the rotation assembly 14 is used to place the wafer. Wherein, in the process of cleaning the wafer, the rotating component 14 drives the wafer to rotate, so as to facilitate the overall cleaning of the wafer. During wafer cleaning, the generated liquid and gas are guided by the cover 12 to the collection assembly 16, and the collection assembly 16 can collect the gas and liquid generated by cleaning.

Referring to fig. 5 and 6, the collecting assembly 16 includes a first collecting portion 161 and a second collecting portion 162. The first collecting portion 161 and the second collecting portion 162 are both disposed around the rotating assembly 14, and the first collecting portion 161 is located above the second collecting portion 162. The first collecting part 161 is provided with a liquid collecting hole 1611 and a gas collecting channel 1612, and the liquid collecting hole 1611 is used for collecting and discharging liquid generated in the cleaning process; the gas collecting channel 1612 is connected to the second collecting part 162, and the second collecting part 162 is used for connecting to a negative pressure device to form negative pressure in the gas collecting channel 1612.

In order to facilitate the liquid collecting hole 1611 to collect the liquid generated during the cleaning process, a liquid collecting cavity 1613 is opened in the first collecting part 161, and the liquid collecting hole 1611 is opened in the bottom wall of the liquid collecting cavity 1613, so that the liquid guided to the first collecting part 161 can be collected by the liquid collecting cavity 1613, and the liquid is collected in the liquid collecting hole 1611 and discharged. Of course, in order to collect the liquid discharged from the liquid collecting hole 1611, the liquid collecting hole 1611 may be connected to a collecting container through a pipe to collect the liquid discharged from the liquid collecting hole 1611. Since the covers 12 are provided to separately collect a plurality of kinds of medicines, in order to collect the liquids guided by the covers 12, the first collecting portion 161 is provided with a plurality of liquid collecting chambers 1613, and the bottom wall of each liquid collecting chamber 1613 is provided with a liquid collecting hole 1611; the liquids guided by the different covers 12 enter the different liquid collecting cavities 1613 respectively, so that the liquids generated by cleaning the wafer with different agents are poured into the different liquid collecting cavities 1613 to be guided out through the different liquid collecting holes 1611, and thus the different liquids generated by the different agents can be collected separately.

In addition, in order to facilitate collection of gas generated by cleaning the wafer, the second collection portion 162 is provided with a collection channel 1621 corresponding to the gas collection channel 1612, and the collection channel 1621 communicates with the gas collection channel 1612. Collecting channel 1621 inserts negative pressure device to make negative pressure device form the negative pressure in collecting channel 1621, thereby can form the negative pressure inside gas collection channel 1612, and then can inhale the gas that washs the wafer production through the negative pressure of gas collection channel 1612, separately collect gas and liquid. Of course, to facilitate collection of gases, the collection channel 1621 may be connected to a gas container to collect the extracted gases. Correspondingly, for the different gas that produces to different medicaments, seted up a plurality of gas collection passageway 1612 on first collection portion 161, it is corresponding, seted up a plurality of collection passageways 1621 on second collection portion 162, every collection passageway 1621 all communicates with a gas collection passageway 1612 to when different medicaments wash the wafer, can carry out gaseous collection through different gas collection passageway 1612 and collection passageway 1621. Of course, a plurality of collecting channels 1621 may be connected to a plurality of gas containers, so as to separately collect a plurality of gases.

With continued reference to fig. 5, the single-wafer cleaning mechanism 10 further includes a cleaning mechanism 15, as shown in fig. 5, a plurality of cleaning mechanisms are provided, the cleaning mechanism 15 is disposed outside the cover 12, and the cleaning mechanism 15 is used for spraying cleaning agent onto the wafer on the rotating assembly 14, thereby providing cleaning effect to the wafer. It should be noted that the cleaning mechanism 15 may include a plurality of cleaning assemblies, so as to spray a plurality of different cleaning agents to the wafer through the cleaning nozzles of the plurality of cleaning assemblies; of course, it can also be understood that the cleaning nozzles of each cleaning assembly are used for spraying one cleaning agent to the wafer, and the cleaning nozzles of the cleaning assemblies are respectively used for spraying a plurality of cleaning agents to the wafer.

Wherein, in order to control the cleaning liquid jet quantity of at least one cleaning spray head conveniently, at least one cleaning assembly is provided with a suck-back valve. Wherein, at least one is that a suck-back valve is arranged in one of the cleaning assemblies so as to control the medicament injection quantity of the cleaning spray head in the cleaning assembly; or, the two or more cleaning assemblies are provided with a suck-back valve to control the medicament injection amount of the plurality of cleaning spray heads in the plurality of cleaning assemblies; or the back suction valves are arranged in all the cleaning assemblies, so that the spraying amount of the cleaning spray heads in all the cleaning assemblies can be controlled.

EXAMPLE III

Based on the single wafer cleaning mechanism 10 provided in the second embodiment, the present embodiment provides a single wafer cleaning method, which can be applied to any one of the single wafer cleaning mechanisms 10 provided in the second embodiment to clean a wafer, so as to solve the technical problem of poor lifting synchronization in the prior art.

In order to facilitate the single wafer cleaning method, in this embodiment, the single wafer cleaning mechanism 10 may further include a control device, the driving portion 210 is electrically connected to the control device, and the control device may control the driving portion 210 to operate to control the plurality of covers 12 to move up and down. The cleaning mechanism 15 is electrically connected to the control device, the control device can control the cleaning mechanism 15 to clean the wafer, the cleaning mechanism 15 can also feed back a signal indicating that the cleaning operation at a stage is completed when the cleaning operation at the stage is completed, and the control device can control the driving unit 210 to perform the next operation according to the signal indicating that the cleaning operation is completed.

Optionally, in order to facilitate the control device to control the driving part 210 to perform the action of lifting the cover 12 in time sequence, the single-wafer cleaning mechanism 10 may include a visual recognition device disposed outside the cover 12 and used for detecting whether the wafer is placed in place on the rotating assembly 14.

Referring to fig. 11, fig. 11 is a flowchart illustrating a single wafer cleaning method according to an embodiment of the present disclosure. The single wafer cleaning method comprises the following steps:

and step S1, receiving a cleaning signal.

Wherein the cleaning signal may be a cleaning signal sent by human operation after the wafer is placed at the designated position on the rotating assembly 14; or a cleaning signal sent after the wafer is recognized to be placed in position by the visual recognition device. In other words, in the event that the control device receives a cleaning signal, it indicates that the wafer has been placed at the designated position on the rotating assembly 14 and that cleaning of the wafer is allowed to begin, as shown in FIG. 6. Of course, the cleaning signal may be a signal indicating that the cleaning operation at a certain stage is completed, indicating that the cleaning operation at the stage is completed, and the operation at the next stage may be performed.

Step S2, the driving portion is controlled to operate forward according to the cleaning signal to drive the plurality of abutments to move along the predetermined direction, so as to sequentially control the plurality of covers to move up.

It should be noted that "successively" indicates that the control device controls the driving part to operate to drive one of the covers 12 to be lifted, and controls the lifting of the other cover 12 after the completion of one stage of cleaning, and the lifting of the covers 12 appears to be lifted one by one during the whole cleaning process. Of course, in the case of raising one of the covers 12 to a prescribed height, in order to avoid an influence on the cleaning operation of the cleaning mechanism 15, it is necessary to perform the raising of the next cover 12 after the cleaning operation is completed at this stage; in other words, after the raising operation of the control cover 12 is completed, the cleaning operation of the cleaning mechanism 15 is controlled; after the cleaning operation of one stage of the cleaning mechanism 15 is completed, the raising operation of the other cover 12 is controlled, and the former cover is kept at the designated height.

Optionally, in this embodiment, the plurality of covers 12 are at least provided with a first cover 1001, a second cover 1002, a third cover 1003 and a fourth cover 1004 in sequence from outside to inside, and it should be noted that, in the case of taking fig. 6 to 10 as views, the number of covers 12 is four, and the four covers 12 are sequentially stacked and covered, and the four covers 12 are the first cover 1001, the second cover 1002, the third cover 1003 and the fourth cover 1004 in sequence from outside to inside. It should be understood that other numbers of covers 12 may be used in other embodiments of the present application, such as two, three, five, or more. The number of the covers 12 can be determined according to the number of the cleaning actions, and three covers 12 are arranged for the three-stage cleaning actions; five covers 12 are arranged for cleaning in five stages; of course, the number of covers 12 can also be greater than the number of cleaning actions.

In addition, in the present embodiment, the purge signal includes a purge start signal, a first completion signal, a second completion signal, and a third completion signal. The cleaning start signal indicates that a cleaning operation can be initiated when the wafer has been placed in a designated position on the spin module 14. The first completion signal indicates that the first stage of cleaning action has been completed; the second completion signal indicates that the second stage of cleaning of the wafer is completed; the third completion signal indicates completion of the third stage of cleaning.

Based on this, referring to fig. 12, step S2 may include:

step S21, controlling the driving portion to operate forward according to the cleaning start signal to drive one of the abutting bodies to move along a predetermined direction so as to drive the first cover to lift.

Wherein the first cover 1001 is raised as shown in fig. 7.

Step S22, controlling the driving portion to operate forward according to the first completion signal to drive one of the abutting bodies to move along a predetermined direction so as to drive the second cover to lift.

Wherein second cover 1002 is raised completely as shown in fig. 8.

Step S23, controlling the driving portion to operate forward according to the second completion signal to drive one of the abutting bodies to move along the predetermined direction so as to drive the third cover to lift.

Wherein the third cover 1003 is raised completely as shown in fig. 9.

Step S24, controlling the driving portion to operate forward according to the third completion signal to drive one of the abutting bodies to move along the predetermined direction so as to drive the fourth cover to lift.

Wherein the fourth cap 1004 completes lifting as shown in fig. 10.

It should be noted that, when the first cap 1001, the second cap 1002, the third cap 1003, or the fourth cap 1004 is driven to complete the raising operation, in other words, when the first cap 1001, the second cap 1002, the third cap 1003, or the fourth cap 1004 is driven to raise to a predetermined position, the driving unit 210 may feed back a signal of raising and lowering to the position to the control device, at this time, the control device may control the cleaning mechanism 15 to perform the cleaning operation of the corresponding stage on the wafer, and after the cleaning operation of the corresponding stage is completed, a corresponding completion signal is sent to perform the next operation. Accordingly, in the process of completing the entire multi-stage cleaning operation, the first cap 1001, the second cap 1002, the third cap 1003, and the fourth cap 1004 are sequentially lifted to sequentially complete the multi-stage cleaning operation, thereby completing the cleaning of the wafer.

In the present embodiment, in order to facilitate driving the first cover 1001, the second cover 1002, the third cover 1003, and the fourth cover 1004 to lift or lower, the lifting structure 13 includes at least two driving assemblies 200, and each driving assembly 200 includes a driving portion 210 and at least two abutting bodies 220; at least four abutting bodies 220 are arranged in a direction perpendicular to the preset direction; one of the driving portions 210 is used for driving at least the first abutting body 2001 and the second abutting body 2002 which are arranged in the direction perpendicular to the preset direction to move, and the other driving portion 210 is used for driving at least the third abutting body 2003 and the fourth abutting body 2004 which are arranged in the direction perpendicular to the preset direction to move; the first cover 1001, the second cover 1002, the third cover 1003, and the fourth cover 1004 are abutted with the first abutting body 2001, the second abutting body 2002, the third abutting body 2003, and the fourth abutting body 2004 in one-to-one correspondence.

In other words, in the present embodiment, the first abutting body 2001, the second abutting body 2002, the third abutting body 2003, and the fourth abutting body 2004 are provided in correspondence with the first cover 1001, the second cover 1002, the third cover 1003, and the fourth cover 1004. Wherein the first abutment 2001 cooperates with the first cover cap 1001, the second abutment 2002 cooperates with the second cover cap 1002, the third abutment 2003 cooperates with the third cover cap 1003, and the fourth abutment 2004 cooperates with the fourth cover cap 1004.

In view of this, referring to fig. 13, steps S21 to S24 are:

step S211, controlling the driving portion to operate forward according to the cleaning start signal to drive the first abutting body to move along the predetermined direction, so as to drive the first cover to lift.

Step S221, controlling the driving portion to rotate forward according to the first completion signal to drive the second abutting body to move along the predetermined direction, so as to drive the second cover to lift.

Step S231, controlling another driving portion to operate forward according to the second completion signal to drive the third abutting body to move along the predetermined direction, so as to drive the third cover to lift.

Step S241, controlling another driving portion to rotate forward according to the third completion signal to drive the fourth abutting body to move along the predetermined direction, so as to drive the fourth cover to lift.

Of course, step S2 may also be considered to include steps S211 to S241.

Wherein "driving one of the abutting bodies to move along a predetermined direction" can be understood as: only one of the abutting bodies moves, correspondingly, the first cover cap, the second cover cap, the third cover cap and the fourth cover cap respectively correspond to one abutting body, and each abutting body is connected with one driving device and respectively controlled independently.

It can also be understood that: at least one of the abutments moving, one of: if the two butting bodies move, correspondingly, the first cover cap, the second cover cap, the third cover cap and the fourth cover cap respectively correspond to one butting body, the butting bodies corresponding to the first cover cap and the second cover cap are connected with the same driving device to move synchronously, and the butting bodies corresponding to the third cover cap and the fourth cover cap are connected with the same driving device to move synchronously; of course, it is also understood that three abutment bodies move together and are connected to a drive for simultaneous movement.

It should be noted that, when any one of the covers 12 is raised to a predetermined height and the height is maintained unchanged, the lifting assembly 300 corresponding to the cover 12 is kept stationary on the abutting body 220, or the lifting assembly 300 corresponding to the cover 12 is displaced on the high level surface 221 of the abutting body 220. Wherein, the cover 12 is maintained at the preset height, and the lifting assembly 300 corresponding to the cover 12 is maintained still on the high level surface 221 of the abutting body 220; alternatively, the lifting assembly 300 corresponding to the cover 12 is displaced on the high level surface 221 of the abutting body 220, and the high level surface 221 is disposed substantially horizontally, so that the corresponding cover 12 is not raised or lowered even if the lifting assembly 300 is displaced on the high level surface 221.

For example, in the process of performing steps S231 and S241, the first cover 1001 and the second cover 1002 are maintained at the preset height, and the height is kept unchanged, at this time, the lifting assembly 300 corresponding to the first cover 1001 is kept still on the high level surface 221 of the first abutting body 2001, and the lifting assembly 300 corresponding to the second cover 1002 is kept still on the high level surface 221 of the second abutting body 1002. For another example, in the process of executing step S221, the first cover 1001 is maintained at the preset height and kept at the same height, and at this time, since the first abutting body 2001 and the second abutting body 2002 are located on the same driving portion 210, the driving portion 210 drives the second abutting body 2002 and drives the first abutting body 2001, so that the lifting assembly 300 corresponding to the first cover 1001 moves on the high-level surface 221 of the first abutting body 2001. For example, in the process of executing step S241, the third cover 1003 is maintained at the preset height, and the height is kept unchanged, at this time, since the third abutting body 2003 and the fourth abutting body 2004 are located on the same driving portion 210, so that the driving portion 210 drives the fourth abutting body 2004 and simultaneously drives the third abutting body 2003, and the lifting assembly 300 corresponding to the third cover 1003 moves on the high level surface 221 of the third abutting body 2003.

It should be understood that, in other embodiments of the present application, in the case that the number of the covers 12, the number of the abutting bodies 220, or the number of the driving portions 210 are different, the control steps may be adjusted according to actual conditions, so that the plurality of covers 12 are sequentially lifted under the control of the control device, so as to sequentially perform the multi-stage cleaning operation, thereby completing the cleaning of the wafer.

After the cleaning is completed, in other words, after step S2, with continuing reference to fig. 11, the single wafer cleaning method further includes,

and step S3, receiving a cleaning completion signal.

Wherein the cleaning completion signal indicates that cleaning of the wafer is completed. In other words, the cleaning mechanism 15 performs a multi-stage cleaning operation, which further indicates that the wafer has been cleaned and can be taken out.

Step S4, controlling the driving part to reversely rotate according to the cleaning completion signal to drive the plurality of abutting bodies to move in a direction opposite to the predetermined direction, so as to sequentially control the plurality of covers to lower.

After the wafer is cleaned, the covers 12 can be controlled to be lowered so as to facilitate the wafer to be exposed from the opening on the cover 12, thereby facilitating the taking out of the wafer and facilitating the placement of the next wafer to be cleaned; of course, the plurality of covers 12 are also simultaneously restored to the original state, thereby facilitating the next multi-stage cleaning.

Alternatively, step S4 may include:

controlling the other driving part to reversely rotate according to the cleaning completion signal to drive the third butting body and the fourth butting body to move along the direction opposite to the preset direction so as to drive the fourth cover cap and the third cover cap to sequentially lower; and the driving part is controlled to reversely run to drive the first abutting body and the second abutting body to move along the direction opposite to the preset direction so as to drive the second cover and the first cover to sequentially lower.

In other words, in the case of controlling the lowering of the covers 12, the covers 12 can be lowered in sequence from inside to outside, which not only can quickly and effectively complete the lowering operation of the covers 12, but also can prevent the lowering operations of the covers 12 from affecting each other and causing damage to the adjacent covers 12.

Based on the single-wafer cleaning method provided by the embodiment, multi-stage cleaning actions can be rapidly and effectively completed, so that the cleaning operation of the wafer can be rapidly completed. Meanwhile, liquid products or gaseous products formed in the cleaning stages can be recovered in a distinguished manner by gradually lifting the covers 12, so that cross contamination among the products formed by the cleaning agents is prevented, and meanwhile, the recycling of various products is facilitated.

Example four

In the present embodiment, a single wafer cleaning apparatus (not shown) is provided, which includes a moving mechanism and at least two single wafer cleaning mechanisms 10 provided above. The transfer mechanism is disposed between at least two single wafer cleaning mechanisms 10, and the transfer mechanism is used to transfer wafers between the single wafer cleaning mechanisms 10. That is, the transfer mechanism can transfer the wafer onto the spin module 14 for cleaning the wafer; of course, after the wafer is cleaned, the moving mechanism may remove the cleaned wafer from the rotating assembly 14 to output the wafer.

The moving mechanism may include a robot for grasping the wafer. The manipulator can be used for grabbing and placing the wafer to be cleaned on the rotating assembly 14 so as to conveniently clean the wafer to be cleaned; the robot can also take out the cleaned wafer from the single wafer cleaning mechanism 10, so as to facilitate the output of the cleaned wafer.

Optionally, the moving mechanism may further include a loading device and a discharging device, both of which are disposed adjacent to the at least one single-wafer cleaning mechanism 10, the loading device being configured to transport the uncleaned wafer onto the rotating assembly 14 for cleaning the wafer; the blanking device is used for removing the cleaned wafer on the rotating assembly 14 to output the cleaned wafer.

Of course, the moving mechanism can also be provided with a manipulator, a feeding device and a discharging device at the same time; the loading device can convey the wafer to be cleaned to be close to the mechanical arm, and the mechanical arm grabs and places the wafer to be cleaned on the rotating assembly 14; after the wafer cleaning is completed, the manipulator can grab and place the cleaned wafer on the blanking equipment, so that the cleaned wafer is output through the blanking equipment.

In summary, the lifting structure 13, the single wafer cleaning mechanism 10, the single wafer cleaning method and the single wafer cleaning apparatus provided in the embodiment of the present application can drive the abutting body 220 to move along the preset direction through the driving portion 210, so that the abutting body 220 can move relative to the lifting assembly 300, and the lifting assembly 300 moves along the abutting surface 201; since the height of the abutting body 220 is in a state of fluctuating, the lifting assembly 300 can be lifted and lowered during the process of moving along the abutting surface 201. Wherein, because the in-process that drives lifting unit 300 and remove at drive division 210, drive division 210 drives the removal of butt joint body 220 along preset direction can directly accomplish rising and the reduction to lifting unit 300, can drive shroud 12 when lifting unit 300 goes up and down and realize going up and down, lifting unit 300's lift action directly reflects on shroud 12's the lift action, can improve shroud 12's lift synchronism, prevent the poor problem of leakproofness between the shroud 12, therefore, the lift structure 13 that this application provided can improve the poor technical problem of lift synchronism among the prior art.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A lifting structure, characterized in that the lifting structure comprises a drive assembly and at least one lifting assembly;

2. The hoisting structure of claim 1 wherein the abutment surface comprises a high level surface, a low level surface, and a transition surface; the two ends of the transition surface are respectively connected with the high-level surface and the low-level surface, and the transition surface is obliquely arranged.

3. The lifting structure according to claim 2, wherein the abutting body has a plurality of abutting surfaces, and the abutting surfaces are arranged in sequence along the preset direction;

the number of the butting bodies is two or more, and the two or more butting bodies are arranged in parallel along the direction perpendicular to the preset direction; in the direction perpendicular to the preset direction, at least part of the high-level surface is arranged corresponding to the transition surface or the low-level surface on the adjacent abutting body.

4. The elevating structure according to any one of claims 1 to 3, wherein the driving part comprises a driving device and a gear train; the driving device is in transmission connection with at least one of the abutting bodies through the gear set.

5. A hoisting structure as claimed in any one of claims 1-3, characterized in that the predetermined direction is a circumferential direction.

6. A single wafer cleaning mechanism comprising a lid and a lift structure as recited in any one of claims 1-5, said lid being coupled to the other end of said lift assembly, said lift assembly being adapted to raise and lower said lid.

7. The single wafer cleaning mechanism of claim 6 further comprising a spin module and a collection module, wherein the collection module is disposed below the lid, the collection module is configured to collect gases and liquids generated during wafer cleaning, the lid and the collection module are disposed around the spin module, and the top of the spin module is configured to receive the wafer.

8. The single wafer cleaning mechanism according to claim 7, wherein the collection assembly comprises a first collection portion and a second collection portion, the first collection portion is located above the second collection portion, the first collection portion is provided with a liquid collecting hole and a gas collecting channel, the liquid collecting hole is used for collecting and discharging the liquid, the gas collecting channel is connected to the second collection portion, and the second collection portion is used for being connected to a negative pressure device to form negative pressure in the gas collecting channel.

9. The single wafer cleaning mechanism according to claim 6, wherein the number of the covers is plural, and the plural covers are sequentially stacked and covered; the lifting assembly comprises a plurality of lifting parts and a plurality of sliding parts, and the end parts of the lifting parts are connected to the sliding parts in a one-to-one correspondence manner; the ends, far away from the sliding part, of the lifting parts are connected to the covers in a one-to-one correspondence manner; the plurality of abutting bodies are arranged in parallel along a direction perpendicular to the preset direction, and the plurality of sliding parts are abutted with the plurality of abutting surfaces respectively; two adjacent lifting parts are arranged in a staggered manner.

10. The single wafer cleaning mechanism according to claim 9, further comprising a plurality of cleaning assemblies; the cleaning assembly is arranged close to the cover cap, and an opening is formed in the center of the cover cap; the cleaning assembly is used for spraying cleaning liquid to the wafer in the cover cap through the opening; at least part of the cleaning assemblies are provided with suckback valves for controlling the spraying amount of the cleaning liquid;

and/or the inner wall of the cover cap forms a rough surface.

11. A single wafer cleaning apparatus comprising at least two single wafer cleaning mechanisms according to any one of claims 6 to 10 and a handling mechanism disposed adjacent to the single wafer cleaning mechanism for removing a wafer from the single wafer cleaning mechanism and/or for placing a wafer into the single wafer cleaning mechanism.

12. A single wafer cleaning method, which is applied to the single wafer cleaning mechanism according to any one of claims 6 to 10, wherein the cover is provided in plurality, and the plurality of covers are sequentially stacked; the abutting bodies and the lifting assemblies are multiple, and the lifting assemblies are connected with the covers in a one-to-one correspondence manner;

the single wafer cleaning method comprises the following steps:

receiving a cleaning signal;

13. The single wafer cleaning method as claimed in claim 12,

the plurality of covers are sequentially overlapped and covered, and at least a first cover, a second cover, a third cover and a fourth cover are sequentially arranged in the direction from outside to inside;

the cleaning signals comprise a cleaning starting signal, a first finishing signal, a second finishing signal and a third finishing signal; the first completion signal indicates that the cleaning of the first stage of the wafer is completed; the second completion signal indicates that the second stage of cleaning of the wafer is completed; the third completion signal indicates completion of a third stage of cleaning of the wafer;

the step of controlling the driving part to operate forward according to the cleaning signal to drive the plurality of abutting bodies to move along the preset direction successively so as to control the plurality of covers to rise successively comprises the following steps:

controlling the driving part to operate positively according to the cleaning start signal to drive one of the butting bodies to move along a preset direction so as to drive the first cover cap to lift;

controlling the driving part to operate positively according to the first completion signal to drive one of the butting bodies to move along a preset direction so as to drive the second cover to lift;

controlling the driving part to operate positively according to the second completion signal to drive one of the butting bodies to move along a preset direction so as to drive the third cover to rise;

and controlling the driving part to operate positively according to the third completion signal to drive one of the butting bodies to move along a preset direction so as to drive the fourth cover to rise.

14. The single wafer cleaning method as claimed in claim 13,

the lifting structure comprises at least two driving assemblies, and each driving assembly comprises a driving part and at least two butting bodies; at least four abutting bodies are arranged in a direction perpendicular to the preset direction; one of the driving parts is at least used for driving the first abutting body and the second abutting body which are arranged in the direction perpendicular to the preset direction to move, and the other driving part is at least used for driving the third abutting body and the fourth abutting body which are arranged in the direction perpendicular to the preset direction to move; the first cover cap, the second cover cap, the third cover cap and the fourth cover cap are in one-to-one correspondence with the first abutting body, the second abutting body, the third abutting body and the fourth abutting body;

controlling the driving part to operate positively according to the cleaning start signal to drive the first abutting body to move along the preset direction so as to drive the first cover cap to lift;

controlling the driving part to operate positively according to the first completion signal to drive the second abutting body to move along the preset direction so as to drive the second cover cap to lift;

controlling another driving part to operate positively according to the second completion signal to drive the third butting body to move along the preset direction so as to drive the third cover to lift;

and controlling the other driving part to operate positively according to the third completion signal to drive the fourth butting body to move along the preset direction so as to drive the fourth cover to lift.

15. The single wafer cleaning method as claimed in claim 14,

the step of controlling the driving part to reversely operate according to the cleaning completion signal to drive the plurality of abutting bodies to sequentially move in a direction opposite to the preset direction so as to sequentially control the plurality of covers to lower comprises the following steps:

controlling the other driving part to reversely rotate according to the cleaning completion signal to drive the third butting body and the fourth butting body to move along a direction opposite to the preset direction so as to drive the fourth cover cap and the third cover cap to sequentially lower; and controlling the driving part to reversely operate to drive the first abutting body and the second abutting body to move along a direction opposite to the preset direction so as to drive the second cover and the first cover to sequentially lower.

16. The method of claim 14, wherein the lid corresponding lift assembly remains stationary on the abutment or is displaced on the elevation surface of the abutment when any one of the lids is raised to a predetermined height and remains at the same height.