CN101687228A

CN101687228A - Cleaning process and apparatus

Info

Publication number: CN101687228A
Application number: CN200880021905A
Authority: CN
Inventors: 姚福发
Original assignee: JSC-ECHIGO Pte Ltd
Current assignee: JSC-ECHIGO Pte Ltd
Priority date: 2007-04-27
Filing date: 2008-04-22
Publication date: 2010-03-31
Anticipated expiration: 2028-04-22
Also published as: TWI473667B; SG147361A1; TW200900166A; CN101687228B; SG147336A1; SG180053A1

Abstract

A method for cleaning an article held by support, the method comprising the steps of applying an acoustic wave to said article and support; rotating said article and support such that an area on the article previously masked by the support is exposed to said acoustic wave.

Description

Clean method and device

Technical field

The method that the present invention relates to cleaning systems and be used for cleaning substrate includes but not limited to different materials, for example the discoid substrate of glass, aluminium and silicon.

Background technology

Computer, electronics and entertainment industry use many discoid substrates to be used for the manufacturing of electronic circuit.These substrates typically comprise silicon chip, aluminium, plastics, glass, pottery and meet material.For convenience, said these materials will be discussed aluminium or glass in notice.Yet this should not be construed as the restriction to application of the present invention.

In the mill, these substrates will experience many processing, comprise conduction, the nonconducting and semi-conducting material of the material that applies and remove magnetic, optics and magneto-optic of repetition.

In manufacture process, substrate must repeatedly be polished, polishing, etching and cleaning.Because the trend of substrate design is towards miniaturization, the clean level that requires in the manufacture process of substrate also improves.Particularly, the complicated multilayer circuit substrate that requires to make thereon cleans very much.Otherwise, defective can appear, and cause output decline, production time to increase and the product quality variation thus.

A kind of known design to the cleaning module that is used to clean the aluminium dish comprises the cleaning station, and it has two and is set to brush cylinder adjacent one another are.These two brush cylinders form two center longitudinal axis parallel to each other.One or more then aluminium dishes are arranged between two center longitudinal axis of brush cylinder, thus at brush cylinder around their longitudinal axis whens rotation separately, the opposite side of dish can be cleaned.

First shortcoming of this known cleaning module is that it possibly can't satisfy the desired higher clean level of modern Application (for example integrated circuit of miniaturization).This is that this causes aforesaid defect of substrate inevitably because of every side and not maximization of the contact area between the brush cylinder separately at each dish.

Second shortcoming of this known cleaning module is the substrate limited amount that it cleaned in preset time.This is because be subjected to the restriction of aluminium dish diameter simultaneously by the quantity of the aluminium dish of two brush cylinder cleanings.In addition, the contact between brush and dish only is the line contact.Therefore, for the whole diameter of dish, brush must move down so that guarantee and contact fully between dish and the brush.As a result, the time of staying of dish in the cleaning station is quite long.

In addition, this known cleaning module generally has more than one cleaning station.The 3rd shortcoming of known cleaning module is that these aluminium dishes are individually transferred to another cleaning station from a cleaning station gradually.Therefore, cause in the transfer process between the different cleaning station and loading and unloading " free time " in the process of these dishes.

When these dishes are in the cleaning slot, also produce another problem.In this case, these dishes are kept by support member (often being at two points from the below), and these dishes will stand high frequency waves.Recently, it is more common using mega sonic wave (promptly having the sound wave that is typically greater than 700kHz ground frequency).These mega sonic waves are sent by the bottom from groove, in this bottom cleaning fluid flooded these dishes and sound wave produce will be from the get on cavitation bubble of particle-removing of dish.In this layout, dish will stand mega sonic wave and be removed the next stage that is used to handle then from groove.Yet mega sonic wave sends from the bottom of groove inevitably, and the support member that these dishes are installed on it produces shade on dish, thereby hinders these ripples to act on the part of described dish.In the past, when ultrasonic wave more commonly used, these ripples have long wavelength, and since ultrasonic wave around the diffraction of support member with therefore weaken shade on dish, the problem of shade is not to take place so continually.Use the mega sonic wave with shorter wavelength to be not easy to diffraction more, therefore, the problem of " shade " of support member dish is more remarkable.

For the dish in cleaning slot particularly, another problem of this method is that cleaning fluid sticks dish when these dishes are shifted out from groove.After each coating processing, dish need be cleaned, and will be cleaned again in the final stage before being assembled to hard disk drive fully.Because cleaning process is usually directed to these dishes are immersed in the groove of cleaning fluid with support member, from groove, shift out these dishes subsequently and cause fluid sticking of coiling, cause staining and spot from the xerantic solvent of differing of solvent.

In another stage of handling, before being transferred to discharge point, these dishes are placed in the baking oven dry.Baking oven depends on many factors to the rate of drying of dish, such as but not limited to:

I) temperature of the air in baking oven;

The ii) speed of the air circulation in baking oven and mode;

The iii) radiation effect of baking oven;

Iv) other thermals source of using in addition, and;

The v) air pressure in baking oven.

Relating to capital cost yet baking oven adjusted so that advantageously influence rate of drying, therefore, is useful although quicken rate of drying economically, and this expense possibly can't prove can obtain final benefit.

In each case, if the different phase of handling with different layouts so that avoid at least one determined problem of prior art then better.

Another shortcoming of prior art relates to the potential danger and the cleaning efficiency of the cross pollution in the deposit process in the fluid media (medium) in the immersion tank stayed that remove to suspend.Immersion tank is used to provide medium, removes the particle that is shifted by this medium from substrate, and substrate then is rinsed.Purpose is to use the circulation of fluid media (medium) with the outlet of particle deflection, thereby these particles go out from concentrated flow.Therefore, purpose be keep relative particle freely medium be attached to again on the substrate of back to prevent particle.In order to allow immersion tank that cleaning function is provided, it is crucial removing particle effectively.

The groove design relates to an end place that is positioned at groove and enters near the inlet of the medium in bottom.Any particle that has been deposited to the bottom can both be got back to suspension by stirring in the direction that generally makes progress, from the bottom towards the weir that allows MEDIA FLOW near top surface layer.This design depends on the particle that will be pushed in this layer so that their toward weir and the precipitation after be trapped in the weir.Remove medium in the scope of weir with pump, so just removed particle.For this design, the result is: make the particle aggregation that carries with medium easily from the inconsistent dead angle of the overall flow on the weir that enters the mouth from the formed whirlpool of the stream on the weir that enters the mouth in groove.Another problem relates to the overall deflection of particle on the direction of inlet stream.Although inlet is positioned to move near the particle that allows to be deposited on the bottom with the bottom, yet this has formed disorderly environment so that particle moves in random direction.The particle of certain percentage will be followed main flow and be located to the weir, and be removed then.Yet quite the particle of percentage in fact only can be along random walk and is therefore stayed in the immersion tank with suspending.Like this, what replacement was removed particle from groove is that the particle that possible avoid polluting substrate is forced in the suspension and thereby the bigger problem of generation now.

Summary of the invention

A kind of cleaning module that is used to clean one or more substrates of first aspect design of the present invention comprises being operable as the one or more brushes that move along the radial path about described substrate.For example, this cleaning module can be more useful, but is not limited to, and is used to clean the aluminium dish.

Preferably, brush can be near a side of substrate, thereby when brush was shifted to the center of substrate, the appropriate section crossover of the scrubbing part of described brush and substrate was to be in contact with one another.

In a preferred embodiment, cleaning module comprises that also the substrate whirligig is with rotary substrate when substrate contacts with the scrubbing part of brush.The substrate whirligig can comprise the rotatable shaft of the periphery that is connected to described at least one substrate.The scrubbing part clean Surface zone maximization that this can allow the quilt of substrate to brush.

Preferably, described brush is the area of the scrubbing part of the rotatable brush that is used for cleaning substrate with maximization.In this embodiment, contact with the line of the brush of prior art longitudinally and to compare, described brush provides " zone " to contact.For the dish situation of identical time of stop in the cleaning station, this can provide the per unit area actual contact time longer than vertical brush.

Preferably, substrate and brush are operable as in same direction rotation, thereby the relative frictional force between brush and substrate can more effectively clean the latter.

The radius of gyration of brush is designed to the suboptimization that radius more than or equal to substrate can allow the scrubbing part cleaning that the quilt of substrate brushes.

In addition, this cleaning module can also comprise the one or more periphery brushes of the outer rim that is used for cleaning substrate, and/or is used for cleaning in the edge in the hole of substrate one or more and brushes.This can guarantee the higher levels of cleaning of substrate.For the application of the miniaturization that relates to integrated circuit, this will be useful.

A second aspect of the present invention relates to a kind of method of locating one or more brushes during the one or more substrates of cleaning, comprises step: move described brush along the radial path about substrate.This method especially but do not get rid of is used to clean the aluminium dish.

A third aspect of the present invention relates to a kind of method that cleans one or more substrates, and this method comprises the following steps: to move one or more brushes along the radial path about substrate, and makes the scrubbing part of brush and the appropriate section crossover of substrate.

By rotary substrate when the scrubbing part of brush and the appropriate section crossover of substrate, the scrubbing part clean Surface zone that the quilt of substrate is brushed can be optimised.

Preferably, the method for this cleaning substrate can also comprise step: rotating brush is with the area maximization of the scrubbing part of the brush that is used in cleaning substrate.

Preferably, brush and substrate rotate in same direction, thereby the scrubbing part of brush and the relative frictional force cleaning latter between the substrate.

In addition, the method for this cleaning substrate can also comprise step: it is adjacent with the edge of substrate to move one or more periphery brushes, and/or move one or more in brush adjacent with the edge in the hole of substrate, with satisfy may needs higher levels of substrate cleaning.

In fourth aspect, the invention provides a kind of method that is used to clean the article that keep by support member, this method comprises the following steps: to apply sound wave on described article and support member; Rotating described article and support member makes supported the zone of covering before on the described article be exposed under the described sound wave.

Therefore by rotation and thereby change the station of article, by the shade displacement that support member causes, therefore allow the part of the previous crested of dish is optionally exposed and since be exposed to make mega sonic wave under clean thorough.

In a preferred embodiment, article can be dish, substrate, wafer or other objects with flat profile.

In a preferred embodiment, support member can comprise the support that is used for once engaging several article.In a preferred embodiment, engagement means can be by gravity, can also be by article being placed on the outwards outstanding lug.Alternatively, joint can be by vacuum or mechanical engagement, forms those joints or the support of shade for a part that relates to described support member on the part of article, and the present invention all is suitable for.

Preferably, rotation has the pivot outside dish.In this example, rotation can realize by the rotation fully of dish and support member.Alternately, thus dish can rotate around its own center by support member as roller in case in groove rolling disc.

In aspect the 5th, the invention provides a kind of cleaning systems that are used for clean article, comprising: article position support member thereon; Sonic generator is used to guide sound wave along the path that overlaps with support member and article; Described support member is arranged as optionally and rotates around pivot, and therefore rotates described article.

In aspect the 6th, the invention provides a kind of method that is used for removing article, in the groove that comprises the following steps: to provide supported of described article to engage and be immersed in cleaning fluid from cleaning systems; Move down described groove so that article are moved to wherein the station that the part of article at least no longer is submerged from complete submergence station with respect to article; Remove article from described groove.

In aspect the 7th, the invention provides a kind of cleaning systems that are used for clean article, comprising: the groove that comprises clean liquid; Be used in clean liquid, engaging the support member of article; Wherein said groove can optionally be moved in the direction that is used for removing from described clean liquid described article with respect to described support member.

In eight aspect, the invention provides a kind of method of dry goods, comprise the following steps: described article are placed in the baking oven; Remuval of damp and hot air-flow then; Guide described thermal current into described baking oven.

By baking oven being made amendment (comprise and for example increase the extra energy, enhancing circulation of air and supercharging), can influence for example factor of the drying of the article of dish in baking oven.Yet another factor comprises the humidity that reduces in baking oven self.By the predrying thermal current that enters in the baking oven before entering baking oven, can get around the problem relevant dexterously with rate of drying.

In a preferred embodiment, in order further to reduce temperature, moisture separator can be added to baking oven.

In aspect the 9th, the invention provides a kind of collecting chamber assembly that is suspended in the particle in the immersion tank that is used to collect, comprising: the permeable screen cloth that described particle can pass through; Chamber in described assembly, thus described chamber entered by described screen cloth to the particle in the described assembly, described chamber is communicated with the outlet fluid of described groove, and the particle that wherein enters the collecting chamber assembly leaves described groove by outlet.

In aspect the tenth, the invention provides a kind of interior intake assembly of fluid inflow groove that is used to promote, described assembly comprises: aperture array, described opening homogeneous turbulence body source together are communicated with; Described aperture arrangement is that the feasible direction that flows from the fluid of arbitrary opening is parallel to the direction from the stream of each other opening.

The array that provides access is realized two useful aspects.The firstth, reduce the disturbance in groove.Having single bigger inlet according to prior art causes along the stream of the axial path of this inlet.Yet, the periphery edge of this stream be in move and stationary fluid between shear pressure can form whirlpool, and the therefore disturbance in groove.By the array that provides access, can in groove, produce bigger and more uniform stream, thereby the influence of the edge effect of restriction main flow.

In yet another aspect, the invention provides a kind of collecting chamber assembly, have the screen cloth that particle can pass through.This permeable screen cloth can be placed on darker station, groove inherence, and the bigger zone that wherein can catch particle can be provided.

Should be noted that the permeability of screen cloth refers to the ability of particle by screen cloth, it may be to pass through by the perforation that is formed in the screen cloth.The accurate dimension of perforation depends on the particle of removing from substrate, and this is common practise for a person skilled in the art.

Screen cloth can help transfer particle in one direction.For example, compared with allowing particle to escape, the easier permission particle of screen cloth is by entering in the collecting chamber assembly.A method that realizes this point is the perforation with taper, thereby perforation can be greater than the aperture in the chamber side in the aperture of " groove side ".This effect can by molded, cold pressing or penetrate screen cloth and realize with taper-type dropper.

Providing the weir to arrange only is in order to be positioned at the particle of near surface.The collecting chamber assembly allows particle to enter in any degree of depth that capture chamber gives prominence to.Thereby the increase of particle collecting zone will be caught more a high proportion of particle inevitably.

Therefore, the dead band relevant with prior art is reduced by bigger stream zone, and, formerly in the prior art scheme problem in the indoor particles suspended that is in of submergence, then disposed valuably now, because they can be partial to towards capture chamber by bigger stream zone subsequently.

Description of drawings

For facility, with further reference to accompanying drawing the present invention is described, possible layout of the present invention shown in the accompanying drawing.The present invention also can adopt other layouts, and therefore, and the details in the accompanying drawing should not be understood that it is the generality that replaces in the explanation of front of the present invention.

Fig. 1 is illustrated in the cleaning module before substrate cleaning is handled;

Fig. 2 illustrates the example of the robot lift in the cleaning module of Fig. 1;

Fig. 3 illustrates the processing jig pallet in the cleaning module of Fig. 1;

Fig. 4 illustrates the first cleaning station of the cleaning module of Fig. 1;

Fig. 5 is illustrated in the closure diagram of the substrate that the first cleaning station place of Fig. 4 is cleaned;

Fig. 6 illustrates the second cleaning station of the cleaning module of Fig. 1;

Fig. 7 is illustrated in the closure diagram of the substrate that the second cleaning station place of Fig. 6 is cleaned;

Fig. 8 illustrates the 3rd cleaning station of the cleaning module of Fig. 1;

Fig. 9 is illustrated in the cleaning module after substrate cleaning is handled;

Figure 10 is illustrated in the side view at the cleaning station in the different structure;

Figure 11 illustrates the cleaning module at the cleaning station that comprises Figure 10;

Figure 12 A and 12B are the planes of dish, and the substrate cleaning method according to two embodiment of the present invention is shown;

Figure 13 A illustrates the front view of support member and dish according to an embodiment of the invention to 13E;

Figure 14 illustrates the sequenced front view of cleaning slot according to another embodiment of the present invention;

Figure 15 illustrates the front view according to the immersion tank of prior art;

Figure 16 A and 16B illustrate the front view of collecting chamber assembly according to an embodiment of the invention;

Figure 17 is illustrated in the interactional schematic diagram of arranging interior adjacent submergence spout according to the inlet of further embodiment of this invention; And

Figure 18 A and 18B illustrate the isometric drawing of immersion tank according to another embodiment of the present invention.

The specific embodiment

Fig. 1 illustrates the cleaning module 101 that is used to clean one or more substrates according to an embodiment.In this example, this cleaning module 101 is divided into three parts: loading part 103; Cleaning section 105; With unloading portion 107.

Loading part 103 comprises that form is three substrate carrier or the magazine of feed jig pallet 109, and each is used to keep 20 one folded discoid substrates 110.Be transferred to before pallet 109 is used for according to cleaning of the present invention, these substrates 110 can live through various upstream process (for example ultrasonic wave cleaning).

Before substrate cleaning was handled, the substrate 110 at the place, the station that evenly separates in particular pallet 109 was transferred to the processing jig pallet 113 that cleans in the station 103 by the robot gatherer.Cleaning section 103 comprises three cleaning stations 401,601,801, and they will be described later.In order to simplify, the details relevant that cleaning station only is shown in the drawings with handling jig pallet 113.

Fig. 2 provides the robot lift's 201 who is arranged in pallet 109 tops that keep 25 substrates 110 example.Robot lift 210 comprises 5 lifting arms 203 that are arranged in parallel.In addition, each distance between adjacent lifting arm 203 is identical, and can be any multiple of the sum of each substrate 110.Robot lift 201 can be simultaneously risen all (1+kn) individual substrates to processing jig pallet 113 from pallet 109, wherein variable " k " be the multiple of substrate sum and variable " n " can be any integer 0,1,2,3 ... }.For specific present embodiment, as shown in Figure 2, " k " value is 5.Like this, in cleaning between elementary period, lifting arm 203 can be simultaneously rises the 1st, the 6th, the 11st, the 16th and the 21st substrate 110 to handling jig pallet 113 from pallet 109.

When lifting arm 203 when substrate 110 in the pallet 109 aligns, their engage simultaneously the periphery edge of (1+kn) individual substrate below the horizontal diameter axis of substrate, so that the substrate that these are chosen is transferred to as shown in Figure 3 processing jig pallet 113 from pallet 109.

Handle jig pallet 113 and comprise, the arranged in form of the axle 205 that the substrate whirligig drives with motor is at the periphery of substrate 110, thereby should axle 205 contacts the periphery of substrates 110.The axle 205 that this motor drives is connected to motor 207, thereby axle 205 is around the longitudinal axis rotation parallel with the axle of handling jig pallet 113.Like this, when axle 205 when rotating clockwise or counterclockwise, the substrate in handling jig pallet 113 correspondingly rotates on the direction opposite with axle 205.

With reference to figure 1, in the beginning process of clean cycle, the robot lift who is similar to robot lift 201 from the 1st, 3,5,7,9,11,13,15,17 and 19 substrate 110 of the left end of pallet 109 transfers to the processing jig pallet 113 the cleaning section 105.At substrate or have among another embodiment of robot lift of difference " k " value with varying number, will be risen to the substrate of handling jig pallet 113 from pallet 109 is determined by expression formula (1+kn), such as explained, n={0,1,2,3, ..., and " k " is the multiple of substrate thickness.

Fig. 4 to 9 illustrates the operation to each station.For simplicity, these stations are considered separately, and a pallet 113 once is shown in the accompanying drawing.In a preferred embodiment, a plurality of pallets are arranged, simultaneously cleaning is carried out at each station at each station.Usually, pallet 113 moves to each station, finishes processing simultaneously, and pallet moves along conveyer then, and new pallet is introduced in the first stop 401, and at far-end, pallet 113 is turned from conveyer and removed.Empty pallet 113 can be introduced at the section start that is used to receive new building of operation then again, perhaps the replacement by the operator, the perhaps independent conveyer of handling by further automation.Below, this process is described in more detail.

Handle jig pallet 113 and be arranged on the conveyer (not shown), thereby it can be crossed over the opposite end of cleaning section 105 and moves.Fig. 4 illustrates the layout when processing jig pallet 113 moves in the first cleaning station 401.In the first cleaning station 401, each plate-like brush 403 is designed to clean a side of particular substrate 110.Like this, need 20 brushes 403 of a row to clean by handling all 10 substrates 110 that jig pallet 113 supports.In the present embodiment, it is right that brush 403 shows as the independently brush of corresponding each substrate, fully separates each other to receive corresponding substrate 110 at the brush of each described centering.

When handling jig pallet 113 and move into the first cleaning station 401, this row brush 403 be lowered with a part of crossover of dish, this part is in the present embodiment less than half of the surface area of each substrate 110.Because brush 402 and substrate 110 crossovers, they contact each other.

Fig. 5 illustrates by the closure figure of one of substrate 110 of a pair of brush 403 cleanings, in every side of substrate 110 brush is arranged.When brush 403 when the radial path with respect to substrate 110 moves, the scouring portion 501 of each brush and substrate 110 crossovers are to contact the counterpart of substrate 110.

With the axle 205 that rotation motor in the counterclockwise direction drives, substrate 110 is rotated by operation motor 207 on opposite clockwise direction, thereby substrate 110 is cleaned by the scouring portion of brush 403.Similarly, brush 403 also is connected to the motor (not shown), thereby they also rotate on the clockwise direction identical with the substrate rotation.As a result, clean the latter in the scouring portion of brush 403 and the relative frictional force between the substrate 110.

Advantageously, the radius of gyration of brush 403 equals or is preferably more than the radius of substrate 110, thereby because in the scouring portion 501 of brush 403 and the relative CONTACT WITH FRICTION between the side separately of substrate 110, substrate 110 is by brush 403 cleaning up hill and dale.Brush 403 the radius of gyration usually can be than the radius of substrate 110 about 5mm that grows up.Therefore, because embodiments of the invention are negated the round effect (circular effects) during cleaning is handled, on the surface that preset time, substrate 110 can be cleaned by prior art greater than substrate by the surfaces of brush 403 cleanings, will be with reference to figure 12A and 12B description.

In the present embodiment, this row brush 403 rises to former initial station thereafter between 5 to 20 seconds the clean cycle duration.

After having cleaned substrate 110, handle jig pallet 113 and move towards the second cleaning station 601 along cleaning section 105 then at place, the first cleaning station.

The second cleaning station 601 comprises 10 one rows' periphery brush 603.When handling jig pallet 113 and move in the second cleaning station 601, thereby this row's periphery brush 603 reduces the periphery edge of contact substrates 110.In addition, the second cleaning station 601 also comprises the interior brushes 605 that are used for cleaning 10 one rows at the edge in the hole of each substrate 110.

Fig. 7 illustrates by the closure figure of one of substrate 110 of periphery brush 603 and interior brush 605 the two cleanings.When both contacted respectively with the edge in the periphery edge of substrate 110 and the hole of substrate 110 when periphery brush 603 and interior brush 605, substrate 110 rotated in the clockwise direction.Like this, the outer ledge of substrate 110 and inside edge both are by substrate 110 with brush opposite CONTACT WITH FRICTION cleaning between 603,605.

Advantageously, interior brush 605 is connected to the motor (not shown), thereby interior brush rotates on about the opposite counter clockwise direction of substrate rotation.This makes the cleaning time of substrate 110 shorter.Thereby, advantageously, allow periphery brush 603 also on the clockwise direction identical, rotate with the substrate rotation.Like this, the relative frictional force cleaning latter between brush 603,605 and the substrate.

After the cleaning of substrate 110 being finished, handle jig pallet 109 and advance to the cleaning of the 3rd shown in Fig. 8 station 801 at 601 places, the second cleaning station.When handling jig pallet 113 and move into the 3rd cleaning station 801,20 one rows' brush 803 reduce with the only about half of regional crossover on each surface of substrate.As can be seen, the 3rd cleaning station 401 is identical with the first cleaning station, does not therefore need further detailed description.

Should be appreciated that the clean level of substrate 110 is enhanced when substrate 110 is sequentially cleaned in three cleaning stations.In addition, consider the modularity at cleaning station 401,601,801, can be adjusted at the duration of each clean cycle at 401,601,801 places, cleaning station independently of one another.

When the substrate cleaning at 801 places, the 3rd cleaning station is finished, handle jig pallet 109 moves to cleaning section 105 once more along cleaning section 105 opposite end.Another feed anchor clamps 901 are arranged in the unloading portion 107 adjacent with the opposite end of cleaning section 105.Dependence to be operating another robot lift with robot lift's 201 same or analogous mode of operations of Fig. 2, and the substrate 110 on the processing jig pallet 109 in cleaning section 105 is raised to the pallet 901 in the unloading portion 107 of cleaning module 101 then.

After substrate 110 was transferred to pallet 901, as required, substrate can experience various downstream (for example ultrasonic wave flushing) then.

Then, the robot lift of cleaning module 101 moves back to the pallet 109 in the loading part 103, simultaneously lifting arm moves the distance an of substrate thickness (or a dice spaced), handles jig pallet 113 thereby can be transferred to corresponding to following a series of substrates 110 of the 2nd, 4,6,8,10,12,14,16,18 and 20 substrate 110 from the left end of pallet 109.Then, continue and identical as mentioned above cleaning again.

Like this, when handling jig pallet 113 and move through cleaning station 105, a plurality of substrates 110 are transferred to next cleaning from a cleaning station together and are stood.This and prior art are opposite, and in the prior art, these substrates are generally by single transfer.Thereby, should be appreciated that cleaning module 110 makes reprinting and unload the single substrate caused " free time " that will clean the shortest.

Though three cleaning stations 401,601,801 in cleaning module 101 are disclosed as modularization or independently, should be appreciated that can be with them in conjunction with cleaning the station to form one.The side view at this one cleaning station (being designated as 1001) only is shown in Figure 10 for brevity.

This one cleaning station 1001 comprises and is arranged as parallel to each other and perpendicular to 10 elongated members (one of them is designated as 1002) of the moving direction of handling jig pallet 113.

Elongated member 1002 comprises three arms 1003,1005,1007 that extend from elongated portion, and respectively with one group of identical as previously described brush 403; 603; 605; 803.Thereby, can see that one cleaning station 1001 combines three cleaning stations 401,601,801.Therefore, in this embodiment, elongated member 1002 can be realized cleaning at all stations simultaneously.

When handling jig pallet 113 and be moved in the one cleaning station 1001, one cleaning station 1001 reduces, thereby is handling substrate 110 on the jig pallet 113 by arbitrary group of brush 403; 603; 605; 803 cleanings.Another arm (not shown) can be set during cleaning, to support this dish.Support arm is best to the second cleaning station, and guaranteeing the application of periphery brush 603, it may tend to stablizing of during cleaning destruction dish and thereby it be pushed away alignment.By providing support, dish can be maintained at suitable station.

In addition, support arm can provide extra driving to rotate this dish.Do like this, the contact between support arm and dish can be with roller, and described roller provides the needed torque of all or part so that drive the rotation of described dish.

Consider this one cleaning station 1001, being to be appreciated that to have the one or more processing jig pallets that cleaning section 105 moves that are parallel to.This is because arm 1003,1005,1007 can be designed to align with substrate 110 in described one or more processing jig pallets, thus substrate 110 can the while by the brush 401 of all groups; 601; 605; 803 cleanings.

Figure 11 illustrates the cleaning module 110 with one cleaning station 1001.For brevity, not shown one cleaning station 1001 and robot lift in Figure 11.In this example, cleaning module 110 comprises that three are handled jig pallet 113a-c.To move to next cleaning station opposite with handling anchor clamps 113 cleaning of from cleaning section 105 station on conveyer, and processing anchor clamps 113a-c is fixed on the suitable station in the cleaning section 105.This is because substrate 110 is shifted between adjacent pallet along cleaning module 101 by special robot lift.

Should be appreciated that this design of cleaning module 101 may be suitable if wish to be increased in the quantity of the substrate 110 that is cleaned during substrate cleaning is handled.

Can expect that also the substrate whirligig can be the form of the axle that drives of motor, this can be operated on the wall with the medium pore that is fixed to substrate 110.Yet substrate 110 may be risen from handling jig pallet 113, thereby substrate 110 can be fixed to the axle rotation together that the institute's speed motor on it drives with them.

In addition, it will also be appreciated that brush 403,803 also can be fully and the side crossover of substrate 110.Like this, when brush 403,803 or substrate 110 rotation, perhaps when brush 403,803 and substrate 110 all rotate in the opposite direction, make that the relative frictional force between brush 403,803 and substrate 110 cleans the latter.

Figure 12 A and 12B illustrate the effect that changes the scouring pattern based on the radius of gyration of brush with respect to the diameter of dish.

In Figure 12 A, the situation that the radius of gyration 1110 wherein is significantly less than the diameter of the dish of being cleaned 1105 is shown.Although be extreme case, this illustrates dust 1115 and is deposited on the periphery of cleaning radius 1110.Because radius is very little, dust is stayed the whole of dish 1105 surface 1120 or to small part, thereby has offset the benefit of scrub process.

On the contrary, Figure 12 B illustrates the effect that has obviously greater than the radius 1210 of the diameter of dish 1205.Here, dust 1220,1230 is deposited on the internal diameter or hole 1215 and periphery edge 1225 of dish.By hole 1215 and periphery edge 1230 are applied scrub process, dust 1220,1230 is removed from coiling 1205 in one two step process.

In fact, the radius of gyration of brush can change, and different benefits is provided.Although illustrate some advantages than long radius, it should not thought limitation of the present invention because no matter the radius of gyration how, the efficient of this method all is better than the effect of prior art.

Thereby, though use preferred embodiment to describe the present invention, such as those skilled in the clear, can make many changes within the scope of the claims, and not depart from scope of the present invention as claimed in claim.

Figure 13 A illustrates the detailed icon of support member 1305, and this support member is used to engage article, for example coils (not shown), when its in cleaning slot the time.Cleaning slot typically is filled with cleaning fluid, for example the isopropyl alcohol of Wen He deionized water or dilution.

Typically, this groove has the sonic generator in the bottom, and the support member reduction is coiled and is used for cleaning in the groove thus, and sonic generator produces ripple and produce the hole subsequently with the particle-removing that gets on from dish.The ultrasonic wave of frequency of utilization about 200kHz traditionally, the recent then frequency used has begun to be used more at large greater than the mega sonic wave of 700kHz.Use mega sonic wave ground characteristic shown in Figure 13 A.Because high frequency, its wavelength is shorter, thereby as less the manifesting of diffraction pattern in the cleaning of the ultrasonic wave as shown in Figure 13 B experience.The result is that the shade that reduces size concerning ultrasonic wave shown in Figure 13 B influences 1325 and replaced by bigger shadow region 1315 concerning the mega sonic wave cleaning now.These shades by the contact support member 1305 sound wave start cause that this support member is seen from the downstream of described support member and is equivalent to veil.Thereby although known the shade 1325 that has to a certain degree in traditional ultrasonic wave cleaning, because the increase of the size of shade 1315, this problem is exaggerated and therefore becomes even more serious for the mega sonic wave cleaning.

Figure 13 C demonstrates scheme according to an embodiment of the invention to 13E.In traditional cleaning slot, dish is by supports support, and support member has lug or the projection at two some place contact discs in the bottom of coiling.Figure 13 C illustrates the traditional arrangement similar arrangements with 1350 supported supports of its mid-game, and wherein support member can be mounted in a pair of lug 1305 on the bigger support that keeps several such dishes.These dishes are lowered in the cleaning slot 1355, therefore are immersed in the cleaning fluid.When sound wave contact lug 1305, keep not being cleaned for the part that the shade 1345 in downstream causes coiling from lug 1305.Scheme according to this embodiment of the invention is that dish 1350 is rotated around pivot 1340.Although hatching effect can not removed in the station by change dish 1350, the shade that is caused by lug 1305 moves to the different piece of dish, makes previous " hypographous " zone of dish be exposed under the sound wave and thereby is cleaned.As from seeing Figure 13 D, dish 1350 has centered on pivot 1340 ROT13s 60, thereby forms new shadow region 1365, but shade before is exposed under the sound wave, so realizes effectively with completely cleaning of coiling.In order to guarantee in usually relevant with the cleaning time of staying cleaning up hill and dale, support member can swing on opposite direction 1370, and thereby make other shadow region 1375, but also will before two shadow regions expose so that promotion is cleaned.

At this time of vibration, the quantity of the vibration of dish and used time will change according to the type of the cleaning that will carry out, and it will be apparent to those skilled in the art that needs the time of staying how long so that clean any zone that lives through shade up hill and dale in liquid.

The rotation of dish can be avoided the problem relevant with the shadow region.The station that should be appreciated that the point of rotation can change according to the character of cleaning, and determines that the desirable point of rotation for any concrete situation only is conventional test.For example, the present invention also comprises the point of rotation that has in the zone of dish, thereby for example in the center dish rotation of dish itself and the support member maintenance is static.Its realization can be by allowing lug take on roller, and the rotation by lug/roller comes rotating disc like this, so that expose hypographous zone to the cleaning sound wave.

Figure 14 illustrates cleaning slot 1405, and the article that will be cleaned in this groove are dish 1410 in this example, is immersed in the cleaning fluid and by lug 1415 and supports.Traditional means that shift out article in the cleaning back of following relate to the rise article and do not have cleaning fluid.Yet this cleaning fluid that will cause quite mentioning is attached on and causes on the article spot occurring when dry goods, and further, owing to the even spot that forms of the uneven drying of staying the fluid on the article.Relate to a plurality of steps according to the solution of the present invention, its purpose is to make fluid that sticking of article minimized.In first step, the rule method is similar to passing, and these article are in this example for dish 1410, and are raised by the lug 1420 of rising support member, up to these dish 1410 surfaces 1406 near cleaning fluid 1407.Groove 1405 reduces by 1425 rather than coil raised then.Therefore, the electrostatic attraction of the fluid of the more volume in groove is tended to fluid is pulled away from the surface of dish, and this is promptly, impossible with making under the dish situation about rising from groove under opposite situation.This principle is called " dynamically drying ".Then groove is reduced, leave the surface of cleaning slot, stop reduction process 1425 this moment up to the centre bore 1421 of dish.At last, projection 1430 is inserted in the hole 1421, and dish is lifted away from support member 1415 and takes away so that will coil from cleaning fluid.

The problem relevant with existing method amplified by the centre bore in coiling.When coiling in a consecutive steps when cleaning slot rises, this hole produces disturbance on the surface of cleaning fluid.There is broken string in the place of having observed cleaning fluid contact hole on dish.Thereby, this programme seek by the level that the hole is coiled in rise reduce whole cleaning slot then rather than from solvent rise coil and reduce this broken string.

To coil another problem that rises from the clean surface in one is moved continuously is the relative velocity on the surface of solvent streams placing.Therefore the surf zone that is retained on the cleaning fluid that still is attached on panel surface is more and more littler, owing in the flow velocity difference of the cleaning fluid of panel surface, increased the speed that forms the cleaning fluid droplet on panel surface.By reducing whole groove, suitable volume, the cleaning fluid that sticks if not whole flows down from panel surface, thereby the danger that forms the cleaning fluid droplet is significantly reduced.

Also have, in order to quicken dry run, solvent is heated so that improve any evaporation rate of staying the solvent on the dish.Typically, the temperature of solvent is lifted between 50 ℃ to 60 ℃.

Another problem of prior art is after substrate is removed particle, removes the ability of particle from immersion tank.Typically, after cleaning, substrate is rinsed, and therefore stays the bottom of the deposit of particles suspended or precipitation at groove.For fear of the cross pollution of the substrate that in shifting out the substrate that is rinsed, produces, use the layout shown in Figure 15 that particle is removed from groove.As will be described, stay in the groove and the situation of the cleannes of the next group substrate that influence will be rinsed for the particle that significant proportion is arranged, this method is not effective especially.

This groove 1500 of prior art has the fluid that the promotes deionized water for example inlet 1505 that flows in the groove 1500.Because inlet 1505 is as the submergence spout, with the streaming flow of experience with the identical viscosity of immersion fluid, it is typically 1 to 4 dispersion gradient 1511, though it can be subjected to the wall of spout and groove and the adjacent restriction of bottom.Thereby for larger-diameter inlet 1505, the diffusion of injection will increase along with being ejected into the length in the groove.The opposite end of groove is flatly pointed in the injection 1530 of diffusion.Remain in the groove 1500 and particles suspended 1535 are pointed to 1540 outsides from spraying then, and when the flushing flow filling slot of fluid, upwards flow through it, cross the weir subsequently and be collected in bottom 1555.Typically, bottom 1555 links with pump, from enter the mouth 1505 to the weir 1515 fluid circulation forms the process of removing particle 1550.

Yet, use this inlet 1505 to form the outer disturbance region of diffusion zone.This causes whirlpool 1560A, B, and it is by the mobile fluid outside diffusion zone and the shearing between the stationary fluid and form effectively.Whirlpool 1560A, B will be captured in particle 1565A, B in the whirlpool, therefore make to remove particle difficulty more.The more outside in the zone outside near the diffuse flow 1530 these are being positioned at the bottom of groove has formed the dead band, does not wherein have what fluid circulation to remove sediment 1565A from such dead band.Therefore, the particle of significant proportion and particularly those have sunk as the sedimental particle of precipitation and will stay in the groove, and may have only by the labor cleaning to groove and just can be removed.

A solution to this problem is at the embodiment shown in Figure 16 A and the 16B according to of the present invention.Because the weir arrangement requirement particle of prior art at first is in suspension, secondly from the bottom of groove, removed, be difficult to guarantee therefore that the weir can collect all particles effectively.Thereby according to the present invention, collecting chamber assembly 1605 can be installed in the groove 1600.In this example, the collecting chamber assembly comprises screen cloth 1620, and it is the thin slice with perforation basically, but can wait be all net or other this type of have a flat member of the opening that can pass through by its particle.

Perforation can change according to the kind of all material the ratio of the gross area of screen cloth.For example, in one embodiment, be of a size of the sheet metal that 300mm takes advantage of 200mm, for example stainless steel can have 0.06m ²The gross area.In this thin slice, opening or perforation can form by for example punching press, and diameter range is 1 to 2mm.Be spaced apart the situation of 10mm, opening or perforation field to the ratio of the area of whole thin slice in 0.7% to 2.9% scope.

Should be appreciated that the replacement sheet metal, also can use plastic tab, for example polyethylene or polypropylene thus can punching press or molded these openings.

In another embodiment, screen cloth can be a silk screen, uses for example stainless steel wire of 1mm of diameter.For the opening of 1mm, be reduced to 2mm at interval, described ratio is brought up to about 20%.

Should be appreciated that the preference based on the user can change practical puncture size and selection at interval, like this equally to the selection of the kind of screen cloth and structure.

Can use many alternative layouts, but in the present embodiment, screen cloth is crossed over the total length of collecting chamber assembly, this assembly has uniform perforation distributions in described screen cloth.Because in the present embodiment, the collecting chamber assembly is crossed over from the bottom of groove to the substantial distance on surface, the particle in any motion in groove but not only those particles near the surface can collect the chamber of being collected.Thereby, in the situation that has formed whirlpool 1640, when whirlpool 1640 during its screw during at mobile particle on the direction of screen cloth, the particle 1645 in the whirlpool 1640 that keeps motion may still pass through screen cloth 1620.In case particle 1635 is in the described chamber, screen cloth will be taken on the barrier of a part of delivery chamber 1637 that stops these particles.In addition, screen cloth self will be as obstruction, the mobile dissipation that whirlpool is caused.Thereby in case particle inlet chamber 1637, most of the energy that whirlpool 1640 is given will be weakened, and therefore compares with those particles at outdoor, and particle 1635 is deenergized relatively.Therefore, particle will sink 1636 and sink to the bottom 1639 of chamber, and they are removed 1638 to promote the outflow of fluid from groove 1600 by pump or other devices there.

Thereby the present invention who has merged collecting chamber assembly 1605 can remove particle from groove, no matter whether form whirlpool in the dead band of groove.Thereby, keep particle device at the volley, no matter whether it is directly to be partial to collecting chamber 1605 or only to move near this assembly, will cause the removal of particle.

Another scheme to this problem shown in Figure 15 is to replace single inlet with inlet array 1705A, B, C.This inlet array can be accumulated the single inlet area identical that has with prior art.Yet the wideer distribution of inlet array 1705A, B, C produces the wideer zonation of diffusion 1710, thereby the distributions 1725 at the place, station early in groove 1700 is much bigger.Because 1725 uniformity of distributions is higher, the generation in dead band is significantly reduced (if not the words of being eliminated fully), thereby the particle of collecting in these stations also obviously reduces.Should be appreciated that the distribution and concentrate in groove of the geometry of groove, the flow by inlet and particle can indicate direction from the stream of inlet so that reach optimum efficiency.

In another embodiment of the present invention, the scheme among Figure 16 A, B and Figure 17 can be incorporated in the scheme shown in Figure 18 A and the 18B.Here, groove 1800 shown in two independent diagrams so that be clear that two features that are combined among the single embodiment.Therefore, arrange the end of inlet array 1805 at roughly elongated groove 1800.This inlet array 1805 is given prominence to by level and is realized across three pipes of groove along an end of described groove.Each pipe has one and enters mouth so that have the inlet of concentrating level across the height of groove.Three pipes itself also provide the inlet array of two dimension so that form the very broad distributions of passing through these inlets.These pipes are connected to the manifold with fluid source 1810, are dispersed to inlet by the manifold fluid.Inlet is directed on the direction on the surface that is parallel to groove longitudinally downward along groove 1825, and roughly points to collecting chamber assembly 1815.In the present embodiment, the collecting chamber assembly comprises the screen cloth of the distal end wall of basic covering groove 1800, so that accept the wide diffuse flow from inlet 1805.Work in the mode shown in Figure 16 A and the 16B, the particle in groove will be moved and guide the screen cloth 1830 by collecting chamber assembly 1815 by diffuse flow 1825.Thereby, at the embodiment shown in Figure 18 A and the 18B benefit of all useful embodiment described herein is shown, because wide diffuse flow is avoided the generation of whirlpool and the gathering of particle in the dead band subsequently.Because from the directed collecting chamber assembly 1815 of stream of inlet 1805, all particles that are captured in this stream will have very big possibility by screen cloth (if not passing through at once), will finally pass through screen cloth 1825 times in constant flow.Therefore, particle will be trapped in the collecting chamber assembly.Both as the face of accepting also under the situation as the device of dispersion train, the particle that the quilt in assembly 1815 deenergizes will be fallen the bottom of assembly at screen cloth, and can they be removed by near the outlet the bottom that is positioned at collecting chamber 1820 at once.

Thereby can see that various aspects of the present invention can provide benefit individually with respect to prior art, and can provide very effective means in the venue for from groove 1800, removing particle.

Claims

1. cleaning module that is used to clean at least one substrate, this module comprise can be operated with about described at least one substrate at least one brush of path movement radially.

2. cleaning module according to claim 1, wherein, when described at least one brush when described radial path moves, the appropriate section crossover of the scrubbing part of described at least one brush and described at least one substrate.

3. according to arbitrary described cleaning module in the aforementioned claim, also comprise the substrate whirligig, to rotate described at least one substrate.

4. cleaning module according to claim 3, wherein, described substrate whirligig comprises the rotatable shaft with the periphery of described at least one substrate.

5. according to arbitrary described cleaning module in the aforementioned claim, wherein, described at least one brush is rotatable.

6. according to arbitrary described described cleaning module in the claim 3 to 5, wherein, described at least one substrate and described at least one brush can be operated to rotate in same direction.

7. according to claim 5 or 6 described cleaning modules, the radius of gyration of wherein said at least one brush is more than or equal to the radius of described at least one substrate.

8. according to arbitrary described cleaning module in the aforementioned claim, also comprise at least one periphery brush of the outer rim that is used to clean described at least one substrate.

9. according to arbitrary described cleaning module in the aforementioned claim, also comprise the interior brush that is used for cleaning at the edge in the hole of described at least one substrate.

10. cleaning module that is used to clean a plurality of substrates, this module comprises:

Be used for supporting the pallet of described substrate with the relation that predetermined space is opened;

Be positioned at a plurality of brushes of first stop, in the corresponding described a plurality of substrates of each brush one;

Wherein, each brush can be operated to brush radially path movement about each substrate of one in the described a plurality of substrates of correspondence.

11. cleaning module according to claim 10, wherein, the described substrate of described first tray support makes that the plane that is limited by described substrate is parallel.

12. according to claim 10 or 11 described cleaning modules, also comprise more than second brushes that are positioned at second station, and

Be used for described pallet is moved to from described first stop the conveyer at described second station.

13. cleaning module according to claim 12 also comprises a plurality of periphery brushes, is used to clean the outer rim of each substrate, and brush in a plurality of, is used to clean the edge in the hole of each substrate;

Described a plurality of periphery brushes and interior brush are located at the 3rd station in the middle of described first and second stations;

Wherein, described conveyer is suitable for that also described pallet is moved to described the 3rd station from described first stop and moves to described second station then.

14. the method for at least one brush of location during at least one substrate of cleaning, the method comprising the steps of: about described at least one substrate described at least one brush of path movement radially.

15. the method for at least one substrate of cleaning, this method comprises the following steps: and to make the scrubbing part of described at least one brush and the appropriate section crossover of described at least one substrate about described at least one substrate described at least one brush of path movement radially.

16. method according to claim 15, this method also comprises step: rotate described at least one substrate.

17. according to claim 15 or 16 described methods, also comprise step: rotate described at least one brush.

18. according to claim 16 or 17 described methods, wherein said at least one substrate and described at least one brush are in same direction rotation.

19., also comprise step: be adjacent to move at least one periphery brush with the edge of described at least one substrate according to arbitrary described method in the claim 15 to 18.

20., also comprise step: be adjacent to move at least one with the edge in hole in described at least one substrate and brush according to arbitrary described method in the claim 15 to 19.

21. a method that is used to clean the article that kept by support member, this method comprises the following steps:

Apply sound wave on described article and support member;

Rotating described article and support member makes the zone of being covered by described support member before on the described article be exposed to described sound wave.

22. method according to claim 21, wherein, described sound wave is unidirectional mega sonic wave or ultrasonic wave.

23. according to claim 21 or 22 described methods, wherein, described support member and article are immersed in the liquid.

24. according to arbitrary described method in the claim 21 to 23, wherein, be directed upwards towards at described sound wave under the situation of described article, described support member remains on vertical direction with described article.

25. according to arbitrary described method in the claim 21 to 24, wherein, described support member comprises the lug of the periphery edge that contacts described article.

26. cleaning systems that are used for clean article comprise:

Described article position support member thereon;

Sonic generator is used for along the Way guidance sound wave that overlaps with described support member and article;

Described support member is arranged as optionally and rotates around pivot, and therefore rotates described article.

27. cleaning systems according to claim 26, wherein, described support member is arranged as the described article in location so that be immersed in the liquid, and described sonic generator is arranged as and produces the ripple that passes described liquid.

28. according to claim 26 or 27 described cleaning systems, wherein, the degree of rotation of described support member and article or degree are enough to allow whole article be exposed to described sound wave.

29. according to arbitrary described cleaning systems in the claim 26 to 28, wherein, described sonic generator produces mega sonic wave.

30. a method that is used for removing from cleaning systems article comprises the following steps:

Described article are provided, and supported of these article engage and are immersed in the groove of cleaning fluid;

Move down described groove so that described article are moved to the position that the part of described at least article no longer is submerged from complete submerged position with respect to described article;

Remove described article from described groove.

31. method according to claim 30, wherein said part is greater than 50% of described article.

32. method according to claim 30, wherein, described article comprise the hole and are the described part of the part of described article, make described hole no longer be submerged.

33. according to the arbitrary described method of claim 37, also comprise second support member, it is used for engaging described article at least a portion of described article when described clean liquid is given prominence to.

34. according to the described cleaning systems of claim 38, wherein, described second support member comprises the projection that is arranged as in the hole that is inserted in described article.

35. according to claim 26 or 29 described cleaning systems, wherein, described article are any or its combinations in dish, wafer and the substrate.

36. according to claim 26 or 29 described cleaning systems, wherein, described support member is arranged as and engages a plurality of described article.

37. according to claim 30 or 36 described methods, wherein, described article are any or its combinations in dish, wafer and the substrate.

38. according to claim 1 or 29 described methods, wherein, described support member is arranged as and engages a plurality of described article.

39. the method for a dry goods comprises the following steps:

Described article are placed in the baking oven;

Then thermal current is dried;

Guide described thermal current into described baking oven.

40., also comprise step: before guiding described thermal current into described baking oven step, to the dehumidification in described baking oven according to the described method of claim 39.

41. one kind is used to collect the collecting chamber assembly that is suspended in the particle in the immersion tank, comprises:

The Tou Guoed screen cloth that described particle passes through;

Chamber in described assembly, thus described chamber entered by described screen cloth to the particle in the described assembly, described chamber is communicated with the outlet fluid of described groove, and the particle that wherein enters described collecting chamber assembly leaves described groove by described outlet.

42. according to the described assembly of claim 41, wherein, described assembly is positioned at described groove at the some place that overlaps with the direction that stream limited that enters described groove by the inlet in the described groove.

43. according to claim 41 or 42 described assemblies, wherein, described screen cloth comprises thin slice, described thin slice has a plurality of perforation that penetrate described thin slice.

44., wherein, in use, leave described chamber by described screen cloth thereby described assembly is arranged such that the particle that the bottom of described thin slice does not have perforation to prevent to rest on the bottom of described chamber according to the described assembly of claim 43.

45. according to arbitrary described assembly in the claim 41 to 44, wherein, thereby described assembly prevents that the fluid in described groove from just leaving described outlet without described assembly near being placed in described outlet.

46. according to arbitrary described assembly in the claim 41 to 45, wherein, the ratio of the gross area of described perforation and described screen cloth is less than 10%.

47. according to arbitrary described assembly in the claim 41 to 46, wherein, described arrangement of components is to make the described bottom of described outlet and described chamber adjoin.

48. according to arbitrary described assembly in the claim 41 to 47, wherein, described assembly is positioned at described groove makes the described bottom of described chamber near the described bottom of described groove.

49. according to the described assembly of claim 48, wherein, described assembly is positioned at described groove makes described in use screen cloth outstanding from the surface of the fluid of described groove.

50. according to claim 48 or 49 described assemblies, wherein, the submergence of described screen cloth partly comprises equally distributed perforation.

51. one kind is used to promote that fluid flows into the intake assembly in the groove, described assembly comprises:

Aperture array, described opening homogeneous turbulence body source together are communicated with;

Described aperture arrangement is that the feasible direction that flows from the fluid of arbitrary opening is parallel to the direction from the stream of each other opening.

52. according to the described intake assembly of claim 51, wherein, the described direction of described stream is parallel to the surface of the fluid in described groove.

53. according to claim 51 or 52 described intake assemblies, wherein, described inlet is positioned on the face of described groove, and adjacent one another are.

54. a groove that comprises immersion fluid comprises:

Be used to promote that fluid flows into the inlet array in the described groove;

Collecting chamber assembly with the Tou Guoed screen cloth that is immersed in the described fluid, particle can pass through described screen cloth, thereby described collecting chamber assembly is communicated with the outlet fluid of described groove and is arranged such that the fluid in described groove passed through described collecting chamber assembly before leaving by described outlet.

55. a groove that comprises immersion fluid comprises according to arbitrary described intake assembly in the claim 51 to 53, and according to arbitrary described collecting chamber assembly in the claim 41 to 50.