CN114683163A - Dehumidifying device and polishing equipment - Google Patents
Dehumidifying device and polishing equipment Download PDFInfo
- Publication number
- CN114683163A CN114683163A CN202011631949.3A CN202011631949A CN114683163A CN 114683163 A CN114683163 A CN 114683163A CN 202011631949 A CN202011631949 A CN 202011631949A CN 114683163 A CN114683163 A CN 114683163A
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- Prior art keywords
- head
- polishing
- sensor
- gas
- wafer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Abstract
The invention provides a dehumidifying device and polishing equipment, wherein the dehumidifying device and a sensor for wafer slide sheet detection are fixed on one side of a polishing head through a fixing block, the dehumidifying device comprises a quick connector and a blowing column, the blowing column is vertically fixed in the fixing block, one end of the blowing column is connected with the quick connector to communicate dehumidifying gas, the other end of the blowing column is provided with a jet orifice, and the jet orifice jets gas towards the head of the sensor to form gas wall protection on the head of the sensor. The dehumidifying device provided by the invention can effectively remove liquid drops attached to the head of the sensor for detecting the wafer slip sheet, avoids false alarm caused by the liquid drops attached to the head of the sensor, improves the accuracy of the slip sheet detection, reduces the rejection rate and improves the operation efficiency of equipment.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a dehumidifying device and polishing equipment.
Background
The semiconductor silicon wafer is a main substrate material for manufacturing a super large scale integrated circuit, along with the rapid development of the semiconductor industry, the precision requirement on the substrate material is higher and higher, particularly, the excircle surface state of the wafer is stricter and stricter, and the excircle surface of the wafer needs to be polished during substrate processing, so that the defects of slippage, epitaxial stacking faults and the like are not generated at the edge of the epitaxial wafer, and the yield of the epitaxial wafer or a device is improved.
The surface polishing of the wafer is usually completed by two polishing steps of Double Side Polishing (DSP) and front side Final Polishing (FP). Double-side polishing is used to grind both front and back sides of a wafer, and a desired wafer shape can be achieved by control of a polishing pad, while final polishing polishes only the front side of the wafer.
Fig. 1 is a schematic structural diagram of a polishing head in a front final polishing process, and fig. 2 is a schematic structural diagram of a sensor for wafer slide detection on the polishing head. As shown in fig. 1 and 2, in the front final polishing process, when a chip or a slip (sliding out of the polishing head) occurs during the polishing of the wafer 13, the sensor 12 on the side surface of the polishing head 10 detects the wafer 13 and outputs a signal, and after receiving the signal, the polishing apparatus stops the operation of the polishing head 10 and gives an alarm to prompt, so that an operator cleans the damaged wafer.
However, during the polishing process, residual water in the moisture retention nozzle 11 on the polishing head 10 may splash onto the sensor 12, and if water vapor accumulates on the head 12a of the sensor 12 to form the water droplet 14, a false alarm may be triggered, which may cause the corresponding polishing head 10 to stop operating, and a manual air gun is required to blow off the water on the sensor 12, thereby eliminating the false alarm. Because the polishing head 10 stops operating, need take off the wafer 13 of pressing under polishing head 10, on the polishing pad 15 and scrap, the rejection rate increases, and need the manual work to take the air gun to blow clean the water on the sensor 12 and just can remove the false alarm, then carry out equipment operation, waste time and energy, equipment efficiency reduces.
Disclosure of Invention
The invention aims to provide a dehumidifying device and polishing equipment, which are used for removing liquid drops attached to the head of a sensor for detecting a wafer slip sheet, avoiding false alarm of the sensor and improving the accuracy of slip sheet detection.
The invention provides a dehumidifying device which comprises a dehumidifying device and a sensor for detecting a wafer slide sheet, wherein the sensor is fixed on one side of a polishing head through a fixing block, the head of the sensor is exposed at the bottom of the fixing block and faces to a wafer, the dehumidifying device comprises a quick connector and an air blowing column, the air blowing column is vertically fixed in the fixing block, one end of the air blowing column is connected with the quick connector to communicate dehumidifying gas, the other end of the air blowing column is provided with a jet orifice, and the jet orifice jets the gas towards the head of the sensor to form air wall protection at the head of the sensor.
Optionally, the sensor includes a laser emitter, an optical fiber receiver, and a controller, the laser emitter is configured to emit laser, the optical fiber receiver is configured to receive reflected laser and convert the reflected laser into an electrical signal, and the controller is configured to determine whether a wafer slides out from the polishing head according to the electrical signal of the optical fiber receiver.
Optionally, the air blow column is fixed in position by a set screw.
Optionally, the fixing block is fixed on a connecting plate and fixed on one side of the polishing head through the connecting plate.
Optionally, the jet orifice is a fan-shaped jet orifice, and a fan-shaped opening of the fan-shaped jet orifice faces the head of the sensor.
Optionally, the dehumidified gas is compressed gas.
Optionally, the dehumidifying gas is an inert gas.
Correspondingly, the invention also provides polishing equipment, which comprises a polishing head, a polishing disk, a polishing pad arranged on the polishing disk and a driving assembly for driving the polishing head, wherein the polishing head comprises the dehumidifying device.
Optionally, the polishing head further comprises a moisture retention spray head, and the moisture retention spray head and the dehumidifying device are respectively arranged on two sides of the polishing head.
Optionally, the polishing apparatus is for chemical mechanical polishing.
In summary, the invention provides a dehumidification device and a polishing apparatus, the dehumidification device and a sensor for wafer sliding sheet detection are fixed on one side of a polishing head through a fixing block, gas is sprayed to a head of the sensor through the dehumidification device to form a gas wall protection at the head of the sensor, liquid drops attached to the head of the sensor for wafer sliding sheet detection are effectively removed, false alarm caused by the liquid drops attached to the head of the sensor is avoided, accuracy of sliding sheet detection is improved, rejection rate is reduced, and operation efficiency of the apparatus is improved.
Drawings
FIG. 1 is a schematic diagram of a polishing head;
FIG. 2 is a schematic diagram of a sensor for wafer slide detection on a polishing head;
fig. 3 is a schematic structural diagram of a dehumidifying apparatus according to an embodiment of the present invention;
wherein the reference numerals are:
10-a polishing head; 11-a moisturizing spray head; 12-a sensor; 12 a-the head of the sensor; 13-a wafer; 14-water droplets; 15-a polishing pad;
100-a sensor; 100 a-head of sensor; 101-a laser emitter; 102-a fiber optic receiver; 110-a dehumidifying means; 111-quick connector; 112-a gas blowing column; 112 a-ejection port; 120-fixed block; 130-set screws; 140-connecting plate.
Detailed Description
The dehumidifying apparatus and polishing device of the present invention will be described in further detail with reference to the accompanying drawings and specific examples. The advantages and features of the present invention will become more apparent from the following description and drawings, it being understood, however, that the concepts of the present invention may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. The drawings are in simplified form and are not to scale, but are provided for convenience and clarity in describing embodiments of the invention.
The terms "first," "second," and the like in the description are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other sequences than described or illustrated herein. Similarly, if the method described herein comprises a series of steps, the order in which these steps are presented herein is not necessarily the only order in which these steps may be performed, and some of the described steps may be omitted and/or some other steps not described herein may be added to the method. Although elements in one drawing may be readily identified as such in other drawings, the present disclosure does not identify each element as being identical to each other in every drawing for clarity of description.
Fig. 3 is a schematic structural diagram of the dehumidifier provided in this embodiment, as shown in fig. 3, the dehumidifier 110 and the sensor 100 for wafer slide detection are fixed on one side of the polishing head through a fixing block 120, and a head 100a of the sensor 100 is exposed at the bottom of the fixing block 120 and is disposed facing the wafer, wherein the dehumidifier 110 includes a quick connector 111 and a gas blowing column 112, the gas blowing column 112 is vertically fixed in the fixing block 120, one end of the gas blowing column 112 is connected to the quick connector 111 to communicate the dehumidified gas, and the other end is provided with a jet port 112a, and the jet port 112a jets the gas toward the head 100a of the sensor 100 to form a gas wall protection at the head 100a of the sensor 100, so as to prevent moisture from gathering to cause false alarm of the sensor 100 a.
In this embodiment, the sensor 100 is a photoelectric sensor, and the sensor 100 is disposed at a side of the polishing head to monitor a state of the wafer. When the wafer slides out of the polishing head and passes through the sensor 100, the wafer is strongly reflected, the reflected light is sensed by the sensor, and the sensor sends a signal to inform the machine station of stopping working. Specifically, the sensor 100 includes a laser transmitter 101, a fiber optic receiver 102, and a controller (not shown), wherein the laser transmitter 101 is configured to transmit laser (toward the polishing pad), the fiber optic receiver 102 is configured to receive the reflected laser and convert the reflected laser into an electrical signal, and the controller is configured to determine whether the wafer slides out of the polishing head according to the electrical signal of the fiber optic receiver 102.
In the polishing process, a large amount of polishing liquid is needed, and in order to prevent the abrasive particles of the polishing liquid from crystallizing, a plurality of moisturizing nozzles for spraying cleaning liquid are generally configured for the polishing machine. The cleaning liquid sprayed by the moisturizing spray head can form a mirror surface water film on the surface of the polishing pad to induce the sensor to generate false alarm, so that the polishing process is influenced to a certain extent, and the operation efficiency of the machine is influenced. In addition, the cleaning liquid sprayed by the moisturizing nozzle may be sprayed to the head of the sensor and accumulated thereon as droplets having a certain shape, and the droplets may be located on a path of light emission or reception, thereby affecting accuracy of the slider detection.
Based on this, the invention arranges a dehumidifying device 110 near the sensor for detecting the wafer slide so as to dehumidify the surface of the head of the sensor. The dehumidifying device 110 and the sensor 100 are fixed on one side of the polishing head through a fixing block 120, the blowing column 112 of the dehumidifying device 110 is vertically fixed in the fixing block 120, and optionally, the dehumidifying device 110 is located on one side of the sensor 100 close to the moisture retention nozzle, for example, the dehumidifying device 110 is located at a position between the laser transmitter 101 and the optical fiber receiver 102. The quick connector 111 of the dehumidifier 110 is connected with a cleaning gas to provide a dehumidifying gas to the gas blowing column 112, and a jet 112a is disposed at one end of the gas blowing column 112 facing the wafer, and the gas is jetted toward the head 100a of the sensor 100, that is, the end faces of the laser emitter 101 and the optical fiber receiver 102 facing the wafer through the jet 112a to remove the liquid drops attached to the head 100a of the sensor 100. Further, an air wall can be formed around the head 100a of the sensor 100 by controlling the flow rate of the dehumidified gas, so that the cleaning liquid sprayed by the moisturizing spray head is prevented from approaching, and the false alarm caused by the liquid attached to the head 100a of the sensor 100 is eliminated.
In this embodiment, the air blowing column 112 is fixed in the fixing block 120 by a set screw 130, the fixing block 120 is fixed on one side of the polishing head by a connecting plate 140, the jet 112a is a fan-shaped jet, and the fan-shaped jet is opened toward the head 100a of the sensor 100. Specifically, the up-down position of the air blowing column 112 on the fixing block 120 is adjusted to ensure that the cleaning air coming out of the injection port 112a of the air blowing column 112 can blow away the water vapor in the area of the head 100a of the sensor 100 quickly, and then the air blowing column 112 is fixed in position by the set screw 130.
Optionally, the dehumidifying gas is compressed gas, so as to form a pressurized air wall protection near the head 100a of the sensor 100, and when the liquid splashes to the area near the head 100a of the sensor 100, the liquid is blown away by air with a certain air pressure, and further does not splash to the surface of the sensor 100, thereby implementing the dehumidifying function of the sensor surface. In this embodiment, the dehumidifying gas is a filtered clean gas, and the dehumidifying gas may also be an inert gas, so as to reduce the interference of the dehumidifying gas on polishing. The inert gas may be, for example, nitrogen, helium, argon, or the like.
Correspondingly, the invention also provides polishing equipment which comprises a polishing head, a polishing disk, a polishing pad arranged on the polishing disk and a driving assembly for driving the polishing head, wherein the polishing head comprises the dehumidifying device, a sensor for detecting the wafer slip sheet and a moisturizing spray head, the dehumidifying device and the sensor are fixed on one side of the polishing head, and the moisturizing spray head is fixed on the other side of the polishing head.
Alternatively, the Polishing apparatus is used for Chemical Mechanical Polishing (CMP), for example, for a front side Final Polishing (FP) process of a wafer. Specifically, the wafer is adsorbed on the bottom surface of the polishing head, one surface of the wafer, which is provided with a deposition layer, is pressed against the upper surface of the polishing pad, and the polishing head rotates in the same direction as the polishing pad under the actuation of the driving assembly and gives a downward load to the wafer; meanwhile, the polishing solution is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the chemical mechanical polishing of the wafer is completed under the combined action of chemistry and machinery. The sensor located on one side of the polishing head is used for detecting whether the wafer in the polishing head slides out, the dehumidifying device arranged nearby the sensor is used for removing liquid drops attached to the head of the sensor, accuracy of slide sheet detection is improved, false alarm caused by liquid attached to the head of the sensor is avoided, and operation efficiency of the device is improved.
In summary, the invention provides a dehumidifying device and polishing equipment, the dehumidifying device and a sensor for wafer slide sheet detection are fixed on one side of a polishing head through a fixing block, the dehumidifying device comprises a quick connector and an air blowing column, the air blowing column is vertically fixed in the fixing block, one end of the air blowing column is connected with the quick connector to communicate dehumidifying gas, the other end of the air blowing column is provided with a jet orifice, and the jet orifice jets the gas towards the head of the sensor to form air wall protection on the head of the sensor. The dehumidification device provided by the invention can effectively remove liquid drops attached to the head of the sensor for detecting the wafer slip sheet, improves the accuracy of the slip sheet detection, avoids false alarm caused by liquid attached to the head of the sensor, reduces the rejection rate and improves the operation efficiency of equipment.
The above description is only for the purpose of describing the preferred embodiments of the present invention and is not intended to limit the scope of the claims of the present invention, and any person skilled in the art can make possible the variations and modifications of the technical solutions of the present invention using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention, and therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention belong to the protection scope of the technical solutions of the present invention.
Claims (10)
1. The utility model provides a dehydrating unit, characterized in that, dehydrating unit and the sensor that is used for wafer gleitbretter to detect are fixed in one side of rubbing head through a fixed block, the head of sensor expose in the bottom of fixed block and towards the wafer setting, wherein, dehydrating unit includes quick connector and air blow post, the air blow post is vertical to be fixed in the fixed block, the one end of air blow post is connected quick connector is in order to communicate dehumidification gas, and the other end is provided with the jet orifice, the jet orifice towards the head injection gas of sensor is in the head of sensor forms the protection of air wall.
2. The dehumidification device as claimed in claim 1, wherein the sensor comprises a laser transmitter, a fiber receiver and a controller, the laser transmitter is used for transmitting laser, the fiber receiver is used for receiving the reflected laser and converting the reflected laser into an electrical signal, and the controller is used for determining whether the wafer slides out of the polishing head according to the electrical signal of the fiber receiver.
3. The dehumidifier device of claim 1 wherein said gas blowing post is positionally fixed by a set screw.
4. The dehumidifying device as claimed in claim 1, wherein the fixing block is fixed to a connection plate and fixed to a side of the polishing head through the connection plate.
5. The dehumidifier device according to claim 1, wherein the jet opening is a fan-shaped jet opening, and a fan-shaped opening of the fan-shaped jet opening faces the head of the sensor.
6. A dehumidifying device as claimed in claim 1 wherein the dehumidified gas is compressed gas.
7. A dehumidifying device as claimed in claim 1 wherein the dehumidifying gas is an inert gas.
8. A polishing apparatus comprising a polishing head, a polishing disk, a polishing pad provided on the polishing disk, and a drive assembly for driving the polishing head, the polishing head comprising the dehumidifying device according to any one of claims 1 to 7.
9. The polishing apparatus as recited in claim 8, wherein the polishing head further comprises a moisture retention nozzle, and the moisture retention nozzle and the dehumidifying device are respectively provided on both sides of the polishing head.
10. The polishing apparatus according to claim 8, wherein the polishing apparatus is used for chemical mechanical polishing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011631949.3A CN114683163A (en) | 2020-12-31 | 2020-12-31 | Dehumidifying device and polishing equipment |
| TW110105753A TWI818237B (en) | 2020-12-31 | 2021-02-19 | Dehumidifier and polishing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011631949.3A CN114683163A (en) | 2020-12-31 | 2020-12-31 | Dehumidifying device and polishing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114683163A true CN114683163A (en) | 2022-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011631949.3A Pending CN114683163A (en) | 2020-12-31 | 2020-12-31 | Dehumidifying device and polishing equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114683163A (en) |
| TW (1) | TWI818237B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW508652B (en) * | 2001-10-03 | 2002-11-01 | Taiwan Semiconductor Mfg | Device and method for wafer drying |
| CN100442448C (en) * | 2003-08-07 | 2008-12-10 | 株式会社荏原制作所 | Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
| SG147336A1 (en) * | 2007-04-27 | 2008-11-28 | Jcs Echigo Pte Ltd | Cleaning process and apparatus |
| KR102573280B1 (en) * | 2018-03-21 | 2023-09-01 | 삼성전자주식회사 | substrate cleaning method, substrate cleaning apparatus and manufacturing method of semiconductor device using the same |
-
2020
- 2020-12-31 CN CN202011631949.3A patent/CN114683163A/en active Pending
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2021
- 2021-02-19 TW TW110105753A patent/TWI818237B/en active
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| Publication number | Publication date |
|---|---|
| TWI818237B (en) | 2023-10-11 |
| TW202228199A (en) | 2022-07-16 |
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