CN115188701A

CN115188701A - Clamping jaw mechanism and wafer clamping device

Info

Publication number: CN115188701A
Application number: CN202210992972.8A
Authority: CN
Inventors: 万先进; 李俊; 李文超; 边逸军
Original assignee: Ningbo Xinfeng Precision Technology Co ltd
Current assignee: Ningbo Xinfeng Precision Technology Co ltd
Priority date: 2022-08-18
Filing date: 2022-08-18
Publication date: 2022-10-14

Abstract

The invention relates to the technical field of clamping equipment, and particularly discloses a clamping jaw mechanism and a wafer clamping device. The mechanism comprises a driving module and two clamping jaw bodies; the drive module includes the shell, the detection subassembly, guide rail and the smooth first slider of locating on the guide rail of rigid coupling on the shell, a rigid coupling in first slider in two clamping jaw main parts, first slider can be close to or keep away from another clamping jaw main part, the rigid coupling has the mask subassembly on the first slider, when the mask subassembly is in first state, judge that two clamping jaw main parts loosen, when the mask subassembly is in the second state, judge that two clamping jaw main parts press from both sides tightly, when the mask subassembly is in the third state, judge that two clamping jaw main parts cross to press from both sides, the detection subassembly is used for detecting the state of mask subassembly. This mechanism is through the mode that sets up the matte subassembly, judges the centre gripping condition of two clamping jaw main parts, has realized whether the detection whether centre gripping and the centre gripping target in place to the clamping jaw main part, has promoted clamping jaw mechanism's work efficiency and job stabilization nature.

Description

Clamping jaw mechanism and wafer clamping device

Technical Field

The invention relates to the technical field of clamping equipment, in particular to a clamping jaw mechanism and a wafer clamping device.

Background

In some semiconductor processes, the use of additional materials to process the wafers introduces dust and organic contamination, and such processing equipment is often self-contained with cleaning systems. In order to clean the wafer more cleanly, a multi-station mode is adopted, so that a manipulator with a clamping jaw is required to carry the wafer between a plurality of vertical stations and a plurality of horizontal stations. The wafer is in each different station, and the state of placing all is different, because the form that the anchor clamps supported has great difference, causes the clamping jaw to need to satisfy the aversion requirement of different stations simultaneously, and the wafer on the vertical station has the condition of deflecting to one side, and for 300 millimeters diameter wafer, the deflection of top probably reaches about 10 millimeters, and this has proposed higher requirement to the form of centre gripping.

Due to rapid popularization of advanced packaging technologies such as 3D packaging and the like, the requirement for thinning the thickness of a circuit chip is more and more urgent, and therefore ultra-precise grinding is widely applied as a main process for thinning the back of a wafer. The effective thickness of the device layer on the wafer circuit is about 5-10 microns, but in order to ensure the strength of the chip processing process, the wafer needs to maintain a certain thickness, for example, the thickness of a 12-inch wafer is about 775 microns. Therefore, after the circuit layer is manufactured, a back thinning process is performed on the wafer.

At present, the mainstream process of thinning is mainly realized by grinding a wafer through a consolidated diamond grinding wheel, and a large amount of abrasive dust particles are generated in the grinding process. If the abrasive dust particles adhere to the surface of the wafer, the subsequent process steps are affected, and the yield of the chips is reduced. For this reason, a cleaning mechanism is usually integrated into the thinning apparatus, and the cleaning mechanism is a planar rotating cleaning device, which can remove 80% of the surface particles, but still does not reach the desired degree of cleanliness for the wafer processing. Further cleaning of the surface is required by subsequent cleaning equipment.

At present, the above processes increase the time and cost of wafer processing, and for this reason, the thinning layout patent applied before this department proposes to adopt a triple vertical cleaning mechanism. The high-efficiency reinforced cleaning is realized through linkage modes such as pre-cleaning, brushing, rotary cleaning and the like, so that the quantity of surface particles reaches the clean requirement of the manufacturing process after the wafer is conveyed out of the thinning equipment.

The existing vertical cleaning apparatus is mainly present in a special CMP (Chemical mechanical Polishing) apparatus, and for the jaw portion, structures commonly used in the existing CMP apparatus are a straight plate type, a scissor type, and a gas jaw type. The straight plate type clamping jaw is used for processing a staggered annular groove on a flat plate, the wafer is embedded into the groove to be clamped through actions in the horizontal and vertical directions, and then the wafer is released through actions in the horizontal and vertical directions. Two claws of the scissors type clamping jaw are connected through a hinge, the center of the hinge is fixed to form a scissors shape, the handle portions of the scissors are respectively connected with connecting rods through the hinge, the other ends of the two connecting rods are connected through the hinge, the center of the hinge is fixed on a piston shaft of an air cylinder, an air cylinder body and the hinge are fixed relatively, and the stroke direction of the air cylinder passes through the center of the hinge. The scissors clamping jaws are opened and clamped through the stretching of the air cylinder. The gas claw type clamping jaw is used for clamping in a mode that the clamping jaw is installed on two claws of the gas claw.

However, the above clamping jaws cannot detect whether the clamping jaw clamps the wafer or not and whether the clamping jaw clamps the wafer in place or not, which causes challenges for smooth operation of the clamping jaw mechanism and seriously affects the working efficiency of the clamping jaw mechanism.

Disclosure of Invention

The invention aims to provide a clamping jaw mechanism and a wafer clamping device, which can detect whether a clamping jaw clamps a wafer or not and whether the clamping jaw clamps the wafer in place or not, so that the working efficiency and the working stability of the clamping jaw mechanism are improved.

In order to achieve the purpose, the invention adopts the following technical scheme:

a clamping jaw mechanism comprises a driving module and two clamping jaw main bodies; drive module includes shell, detection module, rigid coupling in guide rail on the shell is located with the cunning first slider on the guide rail, two a rigid coupling in the clamping jaw main part in first slider, first slider can be close to or keep away from another clamping jaw main part, the rigid coupling has the mask subassembly on the first slider, works as when the mask subassembly is in first state, judges that two clamping jaw main parts loosen, works as when the mask subassembly is in the second state, judges that two clamping jaw main parts are tight, works as when the mask subassembly is in the third state, judges that two clamping jaw main parts cross the clamp, detection module is used for detecting the state of mask subassembly.

As a preferable technical scheme of the clamping jaw mechanism, a second sliding block is further slidably arranged on the guide rail, the other of the two clamping jaw main bodies is fixedly connected to the second sliding block, and the first sliding block and the second sliding block can be close to or far away from each other.

As a preferred technical scheme of the clamping jaw mechanism, the shell is further rotatably connected with a gear, the gear can rotate around the axis of the gear, the first sliding block is fixedly connected with a first rack, the second sliding block is fixedly connected with a second rack, the first rack and the second rack are respectively meshed with the gear, and the length direction of the first rack is parallel to the length direction of the second rack.

As a preferable technical solution of the gripper mechanism, both the length direction of the first rack and the length direction of the second rack are parallel to the length direction of the guide rail.

As the preferred technical scheme of clamping jaw mechanism, the matte subassembly includes the light matte, detection module includes photoelectric switch, photoelectric switch's inductor is the light matte.

As a preferred technical solution of the gripper mechanism, the light shielding sheet includes a first light shielding sheet and a second light shielding sheet, and the photoelectric switch includes a first photoelectric switch, a second photoelectric switch and a third photoelectric switch; when the mask assembly is in the first state, the first light ray mask shields the first photoelectric switch; when the mask assembly is in the second state, the second light ray mask shields the second photoelectric switch; when the mask component is in the third state, the second light mask shields the third photoelectric switch.

As a preferable technical scheme of the clamping jaw mechanism, the driving module further comprises a driving unit, and the driving unit is used for driving the first sliding block to reciprocate along the length direction of the guide rail.

The utility model provides a device is got to wafer clamp for the centre gripping wafer, including foretell gripper mechanism, every gripper body keeps away from the equal rigid coupling of drive module's one end has contact block, two contact block is used for the centre gripping respectively the both sides of wafer.

As a preferred technical scheme of the wafer clamping device, one side of the contact block is provided with a fitting groove, and when the contact block clamps the wafer, the groove wall of the fitting groove is fitted with part of the outer surface of the wafer.

As a preferable technical scheme of the wafer clamping device, the attaching groove penetrates through the contact block, and the depth of the attaching groove is gradually increased along the direction from the edge of the attaching groove to the middle of the attaching groove.

The invention has the beneficial effects that:

this clamping jaw mechanism is through the mode that sets up the matte subassembly, and the centre gripping condition of two clamping jaw bodies can be judged to the interval between two clamping jaw bodies of response that can be direct through the detection subassembly to the state of matte subassembly, obtains clamping jaw body and loosens, clamping jaw body presss from both sides tightly or clamping jaw body crosses the conclusion of pressing from both sides. Whether the clamping jaw main body is clamped or not and whether the clamping jaw main body is clamped in place or not are detected, and therefore the working efficiency and the working stability of the clamping jaw mechanism are improved.

Drawings

Fig. 1 is a schematic structural diagram of a wafer clamping device and a wafer according to an embodiment of the present invention;

fig. 2 is a front view of a wafer clamping device and a wafer according to an embodiment of the present invention;

fig. 3 is a rear view of a wafer clamping device and a wafer according to an embodiment of the present invention;

FIG. 4 is a schematic structural view of a jaw body and contact block provided by an embodiment of the present invention;

FIG. 5 is a schematic structural view of a drive module and jaw body provided by an embodiment of the invention;

FIG. 6 is a schematic structural view of a detection assembly and a mask assembly in a first state according to an embodiment of the present invention;

FIG. 7 is a schematic structural view of a detection assembly and a mask assembly in a second state provided by an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a detection assembly and a mask assembly in a third state according to an embodiment of the present invention.

In the figure:

100. a drive module; 110. a housing; 121. a first slider; 122. a first rack; 131. a second slider; 132. a second rack; 140. a gear; 150. a guide rail; 161. a first light shield; 162. a second light shield; 171. a first photoelectric switch; 172. a second photoelectric switch; 173. a third photoelectric switch; 180. a drive unit;

200. a jaw body; 300. a contact block; 301. fitting the groove; 400. and (5) a wafer.

Detailed Description

In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation that the first and second features are not in direct contact, but are in contact via another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

As shown in fig. 1-3 and 5-8, the present embodiment provides a jaw mechanism comprising a drive module 100 and two jaw bodies 200; the driving module 100 includes a housing 110, a detection component, a guide rail 150 fixedly connected to the housing 110, and a first slider 121 slidably disposed on the guide rail 150, one of the two clamping jaw main bodies 200 is fixedly connected to the first slider 121, the first slider 121 can be close to or away from the other clamping jaw main body 200, a mask component is fixedly connected to the first slider 121, when the mask component is in a first state, it is determined that the two clamping jaw main bodies 200 are loosened, when the mask component is in a second state, it is determined that the two clamping jaw main bodies 200 are clamped, when the mask component is in a third state, it is determined that the two clamping jaw main bodies 200 are clamped, and the detection component is used for detecting a state of the mask component.

The clamping jaw mechanism can directly reflect the distance between the two clamping jaw bodies 200 by setting the shielding piece assembly, and the clamping conditions of the two clamping jaw bodies 200 can be judged by detecting the state of the shielding piece assembly by the detection assembly, so that the conclusion that the clamping jaw bodies 200 are loosened, the clamping jaw bodies 200 are clamped or the clamping jaw bodies 200 are over-clamped is obtained. Therefore, whether the clamping jaw main body 200 is clamped or not and whether the clamping jaw main body is clamped in place or not are detected, and further the working efficiency and the working stability of the clamping jaw mechanism are improved.

In the prior art, the rigidity of the scissor type clamping jaw and the air claw type clamping jaw is poor, the structure of the clamping jaw mechanism is simple, the stress is uniform, and the rigidity of the clamping jaw main body 200 is improved.

The design that shell 110 surrounds the rest on drive module 100 for shell 110 can play the protective effect to the rest, and clamping jaw main part 200 passes the shell opening and is connected with the slider, and the top of shell 110 side is seted up to the shell opening, and above design has promoted the protective effect to the particulate matter raise dust among the operational environment.

In prior art, the clamping jaw can rock when snatching and treat the holder, openly snatchs to have the risk of knocking and splitting and treating the holder.

In this embodiment, the guide rail 150 is further slidably provided with a second slider 131, the other of the two jaw bodies 200 is fixedly connected to the second slider 131, and the first slider 121 and the second slider 131 can move close to or away from each other. The movable design of the two clamping jaw main bodies 200 improves the working flexibility of the clamping jaw mechanism. Above design has ensured the accuracy of the clamping action of clamping jaw main part 200 through the mode of injecing two clamping jaw main parts 200 actions, has reduced the risk of treating the holder collision, has promoted this clamping jaw mechanism's job stabilization nature, has ensured clamping jaw mechanism's work efficiency.

Further, a gear 140 is rotatably connected to the housing 110, the gear 140 can rotate around its axis, a first rack 122 is fixedly connected to the first slider 121, a second rack 132 is fixedly connected to the second slider 131, the first rack 122 and the second rack 132 are respectively engaged with the gear 140, and the length direction of the first rack 122 is parallel to the length direction of the second rack 132. By means of the design of the gear 140, the moving amplitudes of the first rack 122 and the second rack 132 can be consistent, so that the first slider 121 and the second slider 131 can be ensured to be smoothly close to or far away from each other, and the structure is simple and the operation is stable.

Still further, the length direction of the first rack 122 and the length direction of the second rack 132 are both parallel to the length direction of the guide rail 150. The above design defines the arrangement positions of the first rack 122 and the second rack 132, simplifies the structure of the driving module 100, and reduces the occupied space of the driving module 100.

In this embodiment, the mask assembly includes a light mask, the detection assembly includes a photoelectric switch, and the sensor of the photoelectric switch is the light mask. The optical detection has the advantages of low cost, high accuracy and high safety.

Further, the light shielding sheet includes a first light shielding sheet 161 and a second light shielding sheet 162, and the photoelectric switch includes a first photoelectric switch 171, a second photoelectric switch 172, and a third photoelectric switch 173; when the mask assembly is in the first state, the first light mask 161 blocks the first photoelectric switch 171; when the mask assembly is in the second state, the second light mask 162 shields the second photoelectric switch 172; when the mask assembly is in the third state, the second light mask 162 shields the third photoelectric switch 173. The structure is simple and reliable, the work is stable, the occupied space is small, and the condition detection of the detection assembly on the mask assembly can be smoothly completed.

Preferably, the first light shielding sheet 161 and the second light shielding sheet 162 are sequentially disposed, and the first photoelectric switch 171, the second photoelectric switch 172, and the third photoelectric switch 173 are sequentially disposed in a direction from the first slider 121 to the second slider 131.

Specifically, the first photoelectric switch 171, the second photoelectric switch 172, and the third photoelectric switch 173 are all correlation type photoelectric sensors, which have the advantages of simple and reliable structure, high working stability, and low production cost.

In this embodiment, by adjusting the width of the second light shielding plate 162, whether the second light shielding plate 162 shields the second photoelectric switch 172 when the shielding plate assembly is in the third state can be automatically selected according to software logic.

Preferably, the driving module 100 further includes a driving unit 180, and the driving unit 180 is configured to drive the first slider 121 to reciprocate along the length direction of the guide rail 150. Specifically, the driving unit 180 is a cylinder. The cylinder has a simple structure, can ensure that the reciprocating motion of the first sliding block 121 is smoothly and accurately completed, and has stable work and small occupied space.

As shown in fig. 1 to fig. 5, the embodiment further provides a wafer clamping apparatus for clamping a wafer 400, including the above-mentioned clamping jaw mechanism, one end of each clamping jaw body 200 away from the driving module 100 is fixedly connected with a contact block 300, and the two contact blocks 300 are respectively used for clamping two sides of the wafer 400.

The wafer clamping device adopts a mode of clamping the two sides, so that the risk of collision with the wafer 400 existing in the front clamping process can be avoided, the action of clamping the wafer 400 can be smoothly completed, and the working efficiency and the working stability of the wafer clamping device are guaranteed.

In the prior art, the clamping jaws are difficult to adjust universally according to the size of the wafer 400. Specifically, the contact block 300 is removably attached to the jaw body 200. Due to the detachable design of the contact block 300, the contact block 300 can be replaced according to the size of the wafer 400, the universality degree of the clamping jaw body 200 is improved, and the application range of the wafer clamping device is enlarged.

In the present embodiment, a bonding groove 301 is formed on one side of the contact block 300, and when the contact block 300 clamps the wafer 400, a groove wall of the bonding groove 301 is bonded to a portion of the outer surface of the wafer 400. The arrangement of the fitting groove 301 plays a role in guiding, the fault tolerance rate of the grabbing action of the clamping jaw main body 200 is improved, the contact block 300 can adapt to the clamping action of the wafer 400 at different stations, and the vertical deflection of the wafer 400 is adaptive, so that the risk of collision of a to-be-clamped part is further reduced, the accuracy of the clamping action is guaranteed, and the working efficiency of the clamping jaw mechanism is improved.

Further, the attaching groove 301 penetrates the contact block 300, and the depth of the attaching groove 301 is gradually increased in a direction from the edge of the attaching groove 301 to the middle of the attaching groove 301. The design of shallow edge grooves and deep middle grooves of the fitting groove 301 improves the fault-tolerant capability of adjusting the relative position between the wafer 400 and the clamping jaw body 200, and further improves the adaptability to the vertical deflection wafer 400.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A jaw mechanism, comprising:

two jaw bodies (200);

drive module (100), including shell (110), detection module, rigid coupling in guide rail (150) on shell (110) are located with the cunning first slider (121), two in clamping jaw main part (200) a rigid coupling in first slider (121), first slider (121) can be close to or keep away from another clamping jaw main part (200), the rigid coupling has the matte subassembly on first slider (121), works as when the matte subassembly is in first state, judges that two clamping jaw main parts (200) loosen, works as when the matte subassembly is in the second state, judges that two clamping jaw main parts (200) press from both sides tightly, works as when the matte subassembly is in the third state, judges that two clamping jaw main parts (200) cross the clamp, detection module is used for detecting the state of matte subassembly.

2. Gripper mechanism according to claim 1, characterized in that a second slider (131) is slidably arranged on the guide rail (150), the other of the two gripper bodies (200) is fixed to the second slider (131), and the first slider (121) and the second slider (131) can move closer to or away from each other.

3. The jaw mechanism of claim 2, wherein a gear (140) is further rotatably connected to the housing (110), the gear (140) can rotate around its axis, a first rack (122) is fixedly connected to the first slider (121), a second rack (132) is fixedly connected to the second slider (131), the first rack (122) and the second rack (132) are respectively engaged with the gear (140), and a length direction of the first rack (122) is parallel to a length direction of the second rack (132).

4. Gripper mechanism according to claim 3, characterized in that the length direction of the first rack (122) and the length direction of the second rack (132) are both parallel to the length direction of the guide rail (150).

5. A jaw mechanism as claimed in claim 1, wherein said mask assembly comprises a light mask and said detection assembly comprises a photoelectric switch, the sensor of said photoelectric switch being said light mask.

6. Gripper mechanism according to claim 5, characterized in that the light ray mask comprises a first light ray mask (161) and a second light ray mask (162), the opto-electronic switches comprising a first opto-electronic switch (171), a second opto-electronic switch (172) and a third opto-electronic switch (173); when the mask assembly is in the first state, the first light mask (161) shields the first photoelectric switch (171); when the mask assembly is in the second state, the second light mask (162) shields the second photoelectric switch (172); when the mask assembly is in the third state, the second light ray mask (162) shields the third photoelectric switch (173).

7. Gripper mechanism according to any one of the claims 1 to 6, characterized in that the drive module (100) further comprises a drive unit (180), the drive unit (180) being adapted to drive the first slider (121) in a reciprocating motion along the length of the guide rail (150).

8. A wafer clamping device is used for clamping a wafer (400), and is characterized by comprising the clamping jaw mechanism as claimed in any one of claims 1 to 7, wherein one end of each clamping jaw body (200) far away from the driving module (100) is fixedly connected with a contact block (300), and the two contact blocks (300) are respectively used for clamping two sides of the wafer (400).

9. The wafer clamping device as claimed in claim 8, wherein a fitting groove (301) is formed on one side of the contact block (300), and when the contact block (300) clamps the wafer (400), a groove wall of the fitting groove (301) fits with a part of an outer surface of the wafer (400).

10. The wafer clamping apparatus as claimed in claim 9, wherein the fitting groove (301) penetrates through the contact block (300), and a depth of the fitting groove (301) is gradually increased in a direction from an edge of the fitting groove (301) to a middle of the fitting groove (301).