CN116845026A - Wafer carrier and clamping adjustment device and method for operating same - Google Patents
Wafer carrier and clamping adjustment device and method for operating same Download PDFInfo
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- CN116845026A CN116845026A CN202311020826.XA CN202311020826A CN116845026A CN 116845026 A CN116845026 A CN 116845026A CN 202311020826 A CN202311020826 A CN 202311020826A CN 116845026 A CN116845026 A CN 116845026A
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims description 98
- 210000000707 wrist Anatomy 0.000 claims description 43
- 230000005540 biological transmission Effects 0.000 claims description 41
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 163
- 230000009471 action Effects 0.000 description 10
- 230000002457 bidirectional effect Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The invention discloses a wafer carrier and a clamping and adjusting device and method for operating the wafer carrier, and relates to the technical field of wafer production auxiliary tools.
Description
Technical Field
The invention relates to the technical field of wafer production auxiliary tools, in particular to a wafer carrier and a clamping and adjusting device and method for operating the wafer carrier.
Background
At present, the production of wafers in the semiconductor industry is a key step, after wafers are formed by slicing crystal bars, the wafers need to be placed on a wafer carrier, and then the wafers are transferred by matching with a mechanical arm;
the chinese patent with publication number CN109545733a discloses a wafer carrier and a robot for operating the wafer carrier, the wafer carrier comprises: carrier ring for clamping a wafer and a magnetic component disposed in the carrier ring, the robot comprising: the upper clamping part and the lower clamping part are provided with electromagnetic components, and the polarity of the outward side of the electromagnetic components is opposite to the polarity of the outward side of the corresponding magnetic components on the wafer carrier when the electromagnetic components are electrified;
although the fixing of the manipulator to the wafer carrier is realized by the magnetic attraction mode, the following defects still exist: wafers are directly placed into carrier rings of the wafer carriers, the carrier of the wafers is unstable, if the wafers fall off the wafer carriers due to shaking or tilting when the wafer carriers are clamped by the manipulator, the requirement on the stability of the transfer of the manipulator is high.
Disclosure of Invention
The invention aims to overcome the prior art, and provides a wafer carrier and a clamping and adjusting device and a method for operating the wafer carrier, wherein two circular arc clamping plates are mutually opened to clamp and fix a wafer, the bottom of the wafer is supported and protected by a wafer bottom protection mechanism, the wafer is stably supported, the stability requirement on the transfer of the clamping and adjusting device can be reduced, the movement degree of the clamping and adjusting device is high, the wafer carrier can be quickly placed at a required position, the opening or closing operation of the two circular arc clamping plates in the wafer carrier can be manually controlled, the clamping and adjusting device can also be electrically controlled, the wafer bottom protection mechanism in the wafer carrier can also be electrically controlled by the clamping and adjusting device, the matching degree of the wafer carrier and the clamping and adjusting device is high, the transfer of the wafer carrier and the wafer inside is stable and reliable, and the problems in the background technology can be effectively solved.
In order to achieve the above purpose, the present invention provides the following technical solutions: a wafer carrier, comprising:
the carrier mounting rack comprises a mounting frame, an anti-interference groove, side plates, a placing through groove and a wedge-shaped clamping groove, wherein the anti-interference groove is respectively formed in the left end and the right end of the rear side of the mounting frame, the side plates are respectively fixedly connected to the two ends of the front side of the mounting frame, the wedge-shaped clamping groove is respectively formed in one side, away from each other, of each side plate, and the vertical placing through groove is formed in each side plate;
the open type wafer bearing mechanism comprises a rotating shaft, vertical gears, double-sided racks, connecting rods, arc-shaped clamping plates, arc-shaped wafer edge limiting grooves and dovetail sliding strips, wherein two vertical rotating shafts are rotationally connected to two sides in a mounting frame, the vertical gears are fixedly connected to the middle parts of the two rotating shafts respectively, the dovetail sliding strips are longitudinally and slidably connected to the dovetail grooves at the bottom in the mounting frame, the double-sided racks are fixedly connected to the tops of the dovetail sliding strips, two sides of the double-sided racks are respectively connected with the two vertical gears in a meshed mode, two opposite arc-shaped clamping plates are fixedly connected to the rear sides of the two vertical gears through the connecting rods respectively, and the arc-shaped wafer edge limiting grooves are respectively formed in the inner sides of the two arc-shaped clamping plates;
the wafer bottom protection mechanism is positioned below the circular arc clamping plate;
the clamping plate opening control mechanism is arranged between the two side plates, and the rear end of the clamping plate opening control mechanism is connected with the dovetail sliding bar.
The two side plates at the front side of the mounting frame are used for mounting the clamping plate opening control mechanism, the interference prevention groove can prevent interference to the movement of the connecting rod, the placing through groove can be matched with the positioning protruding block at the placing position of the wafer carrier, the limitation of the position of the wafer carrier is completed, the wafer carrier is prevented from being collided by mistake and shifted, the clamping plate opening control mechanism can push the double-sided rack to move backwards, the dovetail groove and the dovetail sliding bar limit the movement direction of the double-sided rack, the meshing of the double-sided rack and the two vertical gears can enable the two connecting rods and the circular arc clamping plates to open mutually, cut wafers can conveniently fall between the two circular arc clamping plates, the wafer bottom protection mechanism supports and protects the fallen wafers bottom, the falling wafers are prevented from falling from the bottom between the two circular arc clamping plates, then the clamping plate opening control mechanism pulls the double-sided rack to move forwards, the two circular arc clamping plates are closed, the wafers are firmly fixed by clamping the edges of the two circular arc clamping plates along the limiting groove and the edges of the wafers, and the wafers are firmly fixed between the two circular arc clamping plates, and the wafers can not stably bear and stably when the wafers are transferred.
Further, the unfolded wafer bearing mechanism further comprises an arc clamping groove, an arc pad and an arc clamping strip, wherein the arc clamping groove is formed in the upper side and the lower side of the edge of the arc wafer in the limiting groove respectively, the arc pad is arranged in the edge of the arc wafer in the limiting groove, and the upper side and the lower side of the arc pad are integrally formed and connected with the arc clamping strip which is clamped with the arc clamping groove respectively. The circular arc pad and the circular arc clamping strip are made of silica gel, the circular arc clamping groove and the circular arc clamping strip can fix the circular arc pad on the inner side of the circular arc wafer edge limiting groove, the circular arc pad is contacted with the two side edges of the wafer, the edges of the wafer can be protected, and the edges of the wafer are prevented from being worn by the circular arc clamping plates.
Further, the wafer bottom protection mechanism comprises an arc-shaped bottom protection groove, fastening screws and an arc-shaped bottom protection plate, the arc-shaped bottom protection groove is formed in the inner side bottom of the arc-shaped clamping plate, the arc-shaped bottom protection plate is clamped in the arc-shaped bottom protection groove, and the outer side bottom of the arc-shaped clamping plate is fixedly connected with the arc-shaped bottom protection plate through the fastening screws. The inner side of the circular arc bottom guard plate protrudes from the circular arc bottom guard groove, when the two circular arc clamping plates slightly open, the protruding part of the circular arc bottom guard plate can block the edge of the wafer, the wafer is prevented from falling from the bottoms of the two circular arc clamping plates, and the circular arc bottom guard plate can be firmly fixed in the circular arc bottom guard groove by the fastening screw.
Further, the wafer bottom protection mechanism comprises a sliding sleeve, a sliding long plate, a bottom tray and a first strong magnetic block, the center of the bottom of the mounting frame is fixedly connected with the sliding sleeve, the sliding long plate is longitudinally and slidably connected in the sliding sleeve, the bottom tray is fixedly connected to the rear end of the sliding long plate, and the first strong magnetic block is fixedly connected to the front end of the sliding long plate. Through a strong magnetic block a slip long board in the slip cap internal sliding, can make collet position, collet can remove the central point between two convex splint and put the support to the bottom center of wafer, when not needing to protect the wafer bearing, pulling slip long board and collet forward, the collet is located the connecting rod below this moment, can make two convex splint open to the biggest position this moment, and the bottom center and the border of wafer no longer receive the support, and the wafer can fall to the position that needs to place from between two convex splint.
Further, the splint open control mechanism includes knob, connecting plate, control double-screw bolt and nut, fixedly connected with connecting plate between two curb plates, and the middle part of connecting plate is connected with fore-and-aft control double-screw bolt through the bearing rotation, and middle part sets up in the double-sided rack, and the front end of double-sided rack is inlayed and is had the nut, the rear end and the nut threaded connection of control double-screw bolt, and the front end fixedly connected with knob of control double-screw bolt, the conical groove has been seted up at the front side middle part of knob, and the inner wall of conical groove is provided with friction line. The knob can be twisted to drive the control stud to rotate, the double-sided rack is driven to move back and forth along the dovetail sliding strip by the threaded action of the control stud and the nut, so that the double-sided rack is driven to move back and forth, and the clamping adjusting device can control the control knob and the stud to rotate by the conical groove and the friction lines.
A clamping adjustment device for operating the wafer carrier, comprising:
the carrier clamping and connecting mechanism comprises a U-shaped seat I, an opposite direction adjusting assembly and wedge-shaped clamping blocks, wherein the U-shaped seat I is connected with two wedge-shaped clamping blocks corresponding to each other left and right through the opposite direction adjusting assembly, a wedge-shaped surface is arranged at the rear side of one end, close to each other, of each wedge-shaped clamping block, and the wedge-shaped clamping blocks are mutually matched with the corresponding wedge-shaped clamping grooves;
the clamping plate opening electric control mechanism is arranged in the middle of the U-shaped seat I;
the bottom tray electric mechanism is arranged at the lower side of the middle part of the U-shaped seat I.
The opposite direction adjusting component in the U-shaped seat I can drive the two wedge-shaped clamping blocks to move close to each other and move away from each other, when the opposite direction adjusting component drives the two wedge-shaped clamping blocks to move away from each other, then the two wedge-shaped clamping blocks are aligned with the wedge-shaped clamping grooves on the outer sides of the two side plates, the rear end of the clamping plate opening electric control mechanism is also aligned with the conical grooves, the rear end of the bottom tray electric mechanism is aligned with the strong magnetic block I, the opposite direction adjusting component drives the two wedge-shaped clamping blocks to move close to each other, the wedge-shaped clamping blocks are clamped into the corresponding wedge-shaped clamping grooves, the assembly of the carrier clamping connecting mechanism and the carrier mounting frame in the wafer carrier in the clamping adjusting device is completed, the wedge-shaped face of the wedge-shaped clamping blocks is matched with the wedge-shaped clamping grooves, the rear end of the clamping plate opening electric control mechanism has a trend of pressing towards the conical grooves, and the clamping plate opening electric control mechanism can stably drive a knob and control studs to rotate through friction force provided by friction lines, manual torsion of the knob is changed into electric torsion.
Further, the splint opens electric control mechanism and includes the motor cabinet, opens motor, major axis and toper transmission head, the middle part of U type seat one opens the motor through motor cabinet fixedly connected with, and the output shaft of opening the motor rear side fixedly connected with front end of major axis, the rear end fixedly connected with toper transmission head of major axis, the periphery side fixedly connected with friction line of toper transmission head, and the rear end and the toper recess of toper transmission head correspond the cooperation setting.
The motor base is used for installing an opening motor, the opening motor adopts a servo motor and can rotate positively and negatively, the opening motor drives the conical transmission head to rotate through the long shaft, when the clamping adjusting device is fixed with a wedge clamping groove in the wafer carrier through the wedge clamping block, the conical transmission head is inserted into the conical groove, friction lines and friction transmission of friction lines can enable the conical transmission head to drive the knob and the control stud to rotate.
Further, the bottom tray electric mechanism comprises a fixing sleeve, an electric telescopic rod and a strong magnetic block II, wherein the lower side of the middle part of the U-shaped seat I is fixedly connected with the front end of the electric telescopic rod through the fixing sleeve, the rear end of the electric telescopic rod is fixedly connected with the strong magnetic block II, the strong magnetic block II corresponds to the strong magnetic block I in front-back mode, and the magnetic poles of one end of the strong magnetic block II, which is close to the strong magnetic block I, are opposite. The fixed sleeve is used for fixing the electric telescopic rod, the second strong magnetic block and the first strong magnetic block can be close to and magnetically attracted by the telescopic action of the electric telescopic rod, and then the telescopic action of the electric telescopic rod can drive the sliding long plate and the bottom tray to move forwards and backwards to change positions, so that the electric control operation on the position of the bottom tray is realized, and the electric control of the clamping and adjusting device on the wafer carrier is realized.
Further, the device also comprises a wrist adjusting mechanism and an external assembly, wherein the wrist adjusting mechanism is arranged on the external assembly, and the rear end of the wrist adjusting mechanism is fixedly connected with the front side of the U-shaped seat I. The external component is used for fixing the wrist adjusting mechanism on an external mechanical arm, the wrist adjusting mechanism can flexibly adjust the left-right inclination angle and the pitching angle of the U-shaped seat, the wafer carrier can be accurately clamped and fixed by the carrier clamping and connecting mechanism, and meanwhile, the left-right inclination angle and the pitching angle of the wafer carrier can be accurately adjusted in the subsequent transfer of the wafer carrier.
The application method of the clamping and adjusting device comprises the following steps:
step one, a wrist adjusting mechanism is installed on an external mechanical arm through an external component, and then the wrist adjusting mechanism works to adjust a U-shaped seat I to be in a horizontal state;
secondly, the opposite direction adjusting assembly works to enable the two wedge-shaped clamping blocks to be far away from each other, then an external mechanical arm enables the U-shaped seat I to be close to the outer side of the side plate, the conical transmission head stretches into the conical groove, meanwhile, the wedge-shaped clamping blocks correspond to the wedge-shaped clamping grooves, then the opposite direction adjusting assembly enables the two wedge-shaped clamping blocks to be close to each other, the two wedge-shaped clamping blocks are respectively clamped into the corresponding wedge-shaped clamping grooves, and clamping and fixing of the wafer carrier are completed;
step three, the motor is opened to work so as to drive the long shaft and the conical transmission head to rotate, the conical transmission head drives the control stud to rotate clockwise through friction transmission with the knob, and the control stud and the screw thread of the nut act to drive the double-sided rack to move backwards;
step four, the double-sided rack drives two vertical gears on two sides to rotate, so that the two arc clamping plates are driven to open through the connecting rod, the two arc clamping plates surround a wafer to be carried, then the open motor reversely rotates to drive the control stud to rotate anticlockwise, the two arc clamping plates are close to each other, the edge of the wafer is clamped through the arc pad in the limit groove of the edge of the arc wafer, and carrying of the wafer is completed;
and fifthly, stretching the stretching end of the electric telescopic rod to enable the second strong magnetic block to be magnetically attracted with the first strong magnetic block, and then continuing stretching the electric telescopic rod to push the sliding long plate and the bottom tray to move mutually until the bottom tray is positioned at the center of the lower side of the wafer, so that the bottom tray protects the bottom of the wafer.
Compared with the prior art, the invention has the beneficial effects that: the wafer carrier and the clamping and adjusting device and method for operating the wafer carrier have the following advantages:
1. the two arc clamping plates are mutually opened to clamp and fix the wafer, the bottom of the wafer is carried and protected by the wafer bottom protection mechanism, the wafer is carried stably, and the requirement on stability of the clamping and adjusting device during transferring can be reduced;
2. the clamping and adjusting device has high activity degree of freedom, is beneficial to rapidly placing the wafer carrier at a required position, and the opening or closing operation of the two circular arc clamping plates in the wafer carrier can be controlled manually or electrically;
3. the wafer bottom protection mechanism in the wafer carrier can also be electrically controlled by the clamping and adjusting device, so that the matching degree of the wafer carrier and the clamping and adjusting device is high, and the transfer of the wafer carrier and the internal wafer is stable and reliable.
Drawings
FIG. 1 is a schematic view of a wafer carrier according to the present invention;
FIG. 2 is a schematic view of a partial enlarged structure of the portion A in FIG. 1 according to the present invention;
FIG. 3 is a schematic view of a wafer carrier according to the present invention;
FIG. 4 is a schematic view of the circular arc pad and circular arc clip strip of the wafer carrier of the present invention;
FIG. 5 is a schematic view of a clamping and adjusting device and a wafer carrier according to the present invention;
FIG. 6 is a schematic view of a partially enlarged structure of the present invention at B in FIG. 5;
FIG. 7 is a schematic view of a clamping and adjusting device according to the present invention;
FIG. 8 is a schematic top view of a clamping and adjusting device according to the present invention;
FIG. 9 is a schematic view showing a bottom view of the clamping and adjusting device of the present invention;
fig. 10 is a schematic structural view of the clamping adjustment device of the present invention when clamping a wafer carrier.
In the figure:
1 a carrier mounting frame, 11 a mounting frame, 12 an interference prevention groove, 13 a side plate, 14 a placing through groove, 15 a wedge clamping groove, 2 a tensioning wafer bearing mechanism, 21 a rotating shaft, 22 a vertical gear, 23 a double-sided rack, 24 a connecting rod, 25 a circular arc clamping plate, 26 a circular arc wafer edge limit groove, 27 a circular arc clamping groove, 28 a circular arc pad, 29 a circular arc clamping strip, 210 a dovetail sliding strip, 3a wafer bottom protection mechanism, 31 a circular arc bottom protection groove, 32 a fastening screw, 33a circular arc bottom protection plate, 34 a sliding sleeve, 35 a sliding long plate, 36 a bottom tray, 37 a strong magnetic block I, 4 a clamping plate opening control mechanism, 41 a knob, 42 a connecting plate, 43 a control stud, 44 a nut, 5 a carrier clamping connecting mechanism, 51U-shaped seat I, 52 a sliding rod, 53 a bidirectional screw rod, 54 a movable block, 55 a wedge clamping block, 56 a motor sleeve and 57 a clamping motor;
the device comprises a 6-clamping-plate opening electric control mechanism, a 61-motor seat, a 62-opening motor, a 63 long shaft, a 64-conical transmission head, a 7-bottom-tray electric mechanism, a 71 fixing sleeve, a 72-electric telescopic rod, a 73 strong magnetic block II, an 8-wrist adjusting mechanism, a 81 fixing plate, a 82 movable shaft, a 83 bevel gear I, a 84U-shaped seat II, a 85 bevel gear II, a 86 rotating cylinder, a 87 transmission shaft, a 88 driven gear I, a 89 driven gear II, a 810 driving gear I, a 811 wrist motor I, a 812 driving gear II, a 813 wrist motor II, a 9 external component, a 91 clamping adjusting device mounting plate, a 92 mounting hole, a 93 arch frame and a 10 wafer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 4 and fig. 10, the present embodiment provides a technical solution: a wafer carrier comprises a carrier mounting frame 1, an opening wafer carrying mechanism 2, a wafer bottom protection mechanism 3 and a clamping plate opening control mechanism 4;
the carrier mounting frame 1 comprises a mounting frame 11, an anti-interference groove 12, side plates 13, a placing through groove 14 and a wedge-shaped clamping groove 15, wherein the anti-interference groove 12 is respectively formed in the left end and the right end of the rear side of the mounting frame 11, the side plates 13 are respectively fixedly connected to the two ends of the front side of the mounting frame 11, the wedge-shaped clamping groove 15 is respectively formed in one side, away from each other, of the two side plates 13, and the vertical placing through groove 14 is formed in the side plate 13;
the opening wafer bearing mechanism 2 comprises a rotating shaft 21, vertical gears 22, double-sided racks 23, connecting rods 24, arc clamping plates 25, arc wafer edge limiting grooves 26 and dovetail sliding strips 210, wherein two vertical rotating shafts 21 are rotatably connected to two sides in a mounting frame 11, the vertical gears 22 are fixedly connected to the middle parts of the two rotating shafts 21 respectively, the dovetail sliding strips 210 are longitudinally and slidably connected to the dovetail grooves at the bottom in the mounting frame 11, the double-sided racks 23 are fixedly connected to the tops of the dovetail sliding strips 210, two sides of the double-sided racks 23 are respectively meshed with the two vertical gears 22, the rear sides of the two vertical gears 22 are respectively fixedly connected with two opposite arc clamping plates 25 through the connecting rods 24, and the arc wafer edge limiting grooves 26 are respectively formed in the inner sides of the two arc clamping plates 25;
the opening wafer carrying mechanism 2 further comprises an arc clamping groove 27, an arc pad 28 and an arc clamping strip 29, wherein the arc clamping groove 27 is respectively formed in the upper side and the lower side of the arc wafer edge limiting groove 26, the arc pad 28 is arranged in the arc wafer edge limiting groove 26, and the arc clamping strip 29 which is clamped with the arc clamping groove 27 is respectively and integrally formed in the upper side and the lower side of the arc pad 28. The circular arc pad 28 and the circular arc clamping strip 29 are made of silica gel, the circular arc clamping groove 27 and the circular arc clamping strip 29 can fix the circular arc pad 28 on the inner side of the circular arc wafer edge limiting groove 26, the circular arc pad 28 is in contact with the two side edges of the wafer, the edges of the wafer can be protected, and the edges of the wafer are prevented from being worn by the circular arc clamping plates 25.
The wafer bottom protection mechanism 3 is positioned below the circular arc clamping plate 25;
the wafer bottom protection mechanism 3 comprises a circular arc bottom protection groove 31, fastening screws 32 and a circular arc bottom protection plate 33, the circular arc bottom protection groove 31 is formed in the inner side bottom of the circular arc clamping plate 25, the circular arc bottom protection plate 33 is clamped in the circular arc bottom protection groove 31, and the outer side bottom of the circular arc clamping plate 25 is fixedly connected with the circular arc bottom protection plate 33 through the fastening screws 32. The inner side of the circular arc bottom guard plate 33 protrudes from the circular arc bottom guard groove 31, when the two circular arc clamping plates 25 are slightly opened, the protruding part of the circular arc bottom guard plate 33 can block the edge of the wafer, so that the wafer is prevented from falling from the bottoms of the two circular arc clamping plates 25, and the circular arc bottom guard plate 33 can be firmly fixed in the circular arc bottom guard groove 31 by the fastening screws 32.
The cleat opening control mechanism 4 is installed between the two side plates 13, and the rear end of the cleat opening control mechanism 4 is connected to the dovetail slide 210.
The clamping plate opening control mechanism 4 comprises a knob 41, a connecting plate 42, a control stud 43 and a nut 44, wherein the connecting plate 42 is fixedly connected between the two side plates 13, the middle part of the connecting plate 42 is rotatably connected with the longitudinal control stud 43 through a bearing, the middle part in the double-sided rack 23 is provided with the nut 44, the front end of the double-sided rack 23 is embedded with the nut 44, the rear end of the control stud 43 is in threaded connection with the nut 44, the front end of the control stud 43 is fixedly connected with the knob 41, the middle part of the front side of the knob 41 is provided with a conical groove, and the inner wall of the conical groove is provided with friction lines. The knob 41 can be twisted to drive the control stud 43 to rotate, the double-sided rack 23 is driven to move back and forth along the dovetail sliding bar 210 by the action of the control stud 43 and the screw thread of the nut 44, so that the double-sided rack 23 is driven to move back and forth, and the conical groove and the friction lines can enable the clamping adjusting device to control the control knob 41 and the stud 43 to rotate.
The two side plates 13 at the front side of the mounting frame 11 are used for mounting the clamping plate opening control mechanism 4, the interference prevention groove 12 can prevent interference to the movement of the connecting rod 24, the placing through groove 14 can be matched with the positioning convex blocks at the placing position of the wafer carrier, the limitation of the position of the wafer carrier is completed, the wafer carrier is prevented from being collided by mistake and shifted, the clamping plate opening control mechanism 4 can push the double-sided rack 23 to move backwards, the dovetail groove and the dovetail sliding strip 210 limit the moving direction of the double-sided rack 23, the meshing of the double-sided rack 23 and the two vertical gears 22 can enable the two connecting rods 24 and the circular arc clamping plates 25 to open mutually, the cut wafer can conveniently fall between the two circular arc clamping plates 25, the wafer bottom protection mechanism 3 supports and protects the bottom of the fallen wafer, the falling wafer bottom from the bottom between the two circular arc clamping plates 25, then the clamping plate opening control mechanism 4 pulls the double-sided rack 23 to move forwards, the two circular arc clamping plates 25 are completed, the clamping and the edge of the wafer is clamped and clamped along the edge of the limiting groove 26 and the wafer, the wafer is firmly transferred between the two circular arc clamping plates 25 and the wafer carrier can not stably and stably fall down when the wafer is carried by the clamping plates.
A method for using a wafer carrier comprises the following steps:
step one, twisting the knob 41 can drive the clockwise control stud 43 to rotate, and the screw action of the control stud 43 and the nut 44 drives the double-sided rack 23 to move backwards along the dovetail sliding bar 210;
step two, when the double-sided rack 23 moves backwards, the two vertical gears 22 are driven to rotate, so that the two connecting rods 24 and the arc-shaped clamping plates 25 are opened;
step three, placing the wafer between the two arc clamping plates 25, wherein the edge of the wafer is blocked by the upper side protection of the arc bottom guard plate 33;
step four, twisting the knob 41 can drive the anticlockwise control stud 43 to rotate, drive the double-sided rack 23 to move forwards, and the two arc clamping plates 25 are mutually close;
and fifthly, the edge of the wafer 10 is clamped by the circular pad 28, so that the bearing and fixing of the wafer 10 are completed.
In a second embodiment, referring to fig. 1 to 4, the present embodiment provides a technical solution: the wafer carrier of this embodiment is substantially identical to the first embodiment in structure, except that:
the wafer bottom protection mechanism 3 comprises a sliding sleeve 34, a sliding long plate 35, a bottom tray 36 and a first strong magnetic block 37, wherein the sliding sleeve 34 is fixedly connected to the bottom center of the mounting frame 11, the sliding long plate 35 is longitudinally and slidably connected in the sliding sleeve 34, the bottom tray 36 is fixedly connected to the rear end of the sliding long plate 35, and the first strong magnetic block 37 is fixedly connected to the front end of the sliding long plate 35.
When the wafer supporting and protecting device is used, the first strong magnetic block 37 drives the sliding long plate 35 to slide in the sliding sleeve 34, so that the bottom tray 36 can be positioned, the bottom tray 36 can be moved to the center position between the two circular arc clamping plates 25, the bottom center of the wafer is supported, when the wafer is not required to be supported and protected, the sliding long plate 35 and the bottom tray 36 are pulled to move forwards, the bottom tray 36 is positioned below the connecting rod 24, the two circular arc clamping plates 25 can be opened to the maximum position at the moment, the bottom center and the edge of the wafer are not supported, and the wafer can fall to the position required to be placed from the position between the two circular arc clamping plates 25.
In a third embodiment, referring to fig. 5 to 9, the present embodiment provides a technical solution: the clamping and adjusting device is used for operating the wafer carrier and comprises a carrier clamping and connecting mechanism 5, a clamping plate opening electric control mechanism 6 and a bottom tray electric mechanism 7:
the carrier clamping and connecting mechanism 5 comprises a U-shaped seat I51, an opposite adjusting component and wedge-shaped clamping blocks 55, wherein the U-shaped seat I51 is connected with two wedge-shaped clamping blocks 55 corresponding to left and right through the opposite adjusting component, a wedge-shaped surface is arranged at the rear side of one end, close to each other, of the two wedge-shaped clamping blocks 55, and the wedge-shaped clamping blocks 55 are mutually matched with the corresponding wedge-shaped clamping grooves 15;
the clamping plate opening electric control mechanism 6 is arranged in the middle of the U-shaped seat I51;
the bottom tray electric mechanism 7 is installed at the lower side of the middle part of the U-shaped seat I51.
The opposite direction adjusting assembly comprises a slide bar 52, a bidirectional screw 53, movable blocks 54, a motor sleeve 56 and a clamping motor 57, wherein the clamping motor 57 is a servo motor, the bottom of the inner side of the U-shaped seat I51 is fixedly connected with the transverse slide bar 52, the top of the inner side of the U-shaped seat I51 is rotationally connected with the bidirectional screw 53, the two ends of the bidirectional screw 53 are opposite in thread direction, the two ends of the bidirectional screw 53 are respectively in threaded connection with screw holes on the side surfaces of the two movable blocks 54, sliding holes on the side surfaces of the two movable blocks 54 are in sliding connection with the slide bar 52, the rear ends of the two movable blocks 54 are fixedly connected with two left and right opposite wedge-shaped clamping blocks 55, one end of the bidirectional screw 53 is fixedly connected with an output shaft of the clamping motor 57, the clamping motor 57 is fixed on the outer side of the U-shaped seat I51 through the motor sleeve 56, the clamping motor 57 works to drive the bidirectional screw 53 to positively and negatively rotate, and the two movable blocks 54 can be mutually close to or mutually far away along the slide bar 52 under the action of the threads of the bidirectional screw 53, so that the two wedge-shaped clamping blocks 55 are mutually close to or mutually far away;
the opposite direction adjusting component in the U-shaped seat I51 can drive the two wedge-shaped clamping blocks 55 to move close to each other and move away from each other, when the opposite direction adjusting component drives the two wedge-shaped clamping blocks 55 to move away from each other, then the two wedge-shaped clamping blocks 55 are aligned with the wedge-shaped clamping grooves 15 on the outer sides of the two side plates 13, the rear end of the clamping plate opening electric control mechanism 6 is aligned with the conical grooves, the rear end of the bottom tray electric mechanism 7 is aligned with the strong magnetic block I37, the opposite direction adjusting component drives the two wedge-shaped clamping blocks 55 to move close to each other, the wedge-shaped clamping blocks 55 are clamped into the corresponding wedge-shaped clamping grooves 15, the assembly of the carrier clamping connecting mechanism 5 and the carrier mounting frame 1 in the wafer carrier in the clamping adjusting device is completed, due to the fact that the wedge-shaped surfaces of the wedge-shaped clamping blocks 55 are matched with the wedge-shaped clamping grooves 15, the rear end of the clamping plate opening electric control mechanism 6 has a trend of pressing towards the conical grooves, the friction force provided by friction lines by the clamping plate opening electric control mechanism 6 can stably drive the knob 41 and the control stud 43 to rotate, manual torsion of the clamping plate 41 is changed into electric torsion.
The clamping plate opening electric control mechanism 6 comprises a motor seat 61, an opening motor 62, a long shaft 63 and a conical transmission head 64, wherein the opening motor 62 is fixedly connected to the middle of the U-shaped seat I51 through the motor seat 61, an output shaft at the rear side of the opening motor 62 is fixedly connected with the front end of the long shaft 63, the rear end of the long shaft 63 is fixedly connected with the conical transmission head 64, the periphery side of the conical transmission head 64 is fixedly connected with friction lines, and the rear end of the conical transmission head 64 is correspondingly matched with the conical groove.
The motor base 61 is used for installing the motor 62 that opens, open motor 62 adopts servo motor, can positive and negative rotation, opens motor 62 and drives the conical transmission head 64 through major axis 63 and rotate, and when the clamping adjustment device passes through wedge fixture block 55 to be fixed with wedge draw-in groove 15 in the wafer carrier, conical transmission head 64 just inserts the toper recess, friction line and friction transmission of friction line can make conical transmission head 64 drive knob 41 and control double-screw bolt 43 rotation.
The bottom tray electric mechanism 7 comprises a fixed sleeve 71, an electric telescopic rod 72 and a strong magnetic block II 73, wherein the lower side of the middle part of the U-shaped seat I51 is fixedly connected with the front end of the electric telescopic rod 72 through the fixed sleeve 71, the rear end of the electric telescopic rod 72 is fixedly connected with the strong magnetic block II 73, the strong magnetic block II 73 corresponds to the strong magnetic block I37 in front-back mode, and the magnetic poles of one end of the strong magnetic block II 73, which is close to the strong magnetic block I37, are opposite. The fixing sleeve 71 is used for fixing the electric telescopic rod 72, the second strong magnetic block 73 and the first strong magnetic block 37 can be close to each other and magnetically attracted by the telescopic rod 72, and then the sliding long plate 35 and the bottom tray 36 can be driven to move back and forth to change positions by the telescopic rod 72, so that the electric control operation of the position of the bottom tray 36 is realized, and the electric control of the clamping and adjusting device on the wafer carrier is realized.
In a fourth embodiment, referring to fig. 5 to 9, the present embodiment provides a technical solution: the present embodiment is substantially identical to the third embodiment in structure, and differs from the third embodiment in that:
the wrist adjusting mechanism 8 and the external assembly 9 are further included, the wrist adjusting mechanism 8 is installed on the external assembly 9, and the rear end of the wrist adjusting mechanism 8 is fixedly connected with the front side of the U-shaped seat I51. The external connection assembly 9 is used for fixing the wrist adjusting mechanism 8 on an external mechanical arm, the wrist adjusting mechanism 8 can flexibly adjust the left-right inclination angle and the pitching angle of the U-shaped seat I51, the wafer carrier can be accurately clamped and fixed by the carrier clamping and connecting mechanism 5, and meanwhile, the left-right inclination angle and the pitching angle of the wafer carrier can be accurately adjusted in the subsequent transfer of the wafer carrier.
The external connection assembly 9 comprises a clamping and adjusting device mounting plate 91, a mounting hole 92 and an arch frame 93; four corners of the clamping and adjusting device mounting plate 91 are respectively provided with mounting holes 92, the inside of the mounting holes 92 can be fixed on an external mechanical arm through bolts, the rear side of the clamping and adjusting device mounting plate 91 is fixedly connected with an arch frame 93, and the arch frame 93 is used for mounting the wrist adjusting mechanism 8;
the wrist adjusting mechanism 8 comprises a fixed plate 81, a movable shaft 82, a first bevel gear 83, a second U-shaped seat 84, a second bevel gear 85, a rotating cylinder 86, a transmission shaft 87, a first driven gear 88, a second driven gear 89, a first driving gear 810, a first wrist motor 811, a second driving gear 812 and a second wrist motor 813, wherein the middle part of the rear side of the arch 93 is rotationally connected with the longitudinal rotating cylinder 86 through a bearing, the rear end of the rotating cylinder 86 is fixedly connected with the middle part of the front side of the second U-shaped seat 84, the movable shaft 82 is rotationally connected between the rear sides of the second U-shaped seat 84, the two ends of the movable shaft 82 are respectively fixedly connected with the front ends of the two fixed plates 81, the rear ends of the two fixed plates 81 are fixedly connected with the front side of the first U-shaped seat 51, the movable shaft 82 is positioned at the inner side part of the second U-shaped seat 84 and fixedly connected with the first bevel gear 83, the rotating cylinder 86 is rotationally connected with the transmission shaft 87, the rear end of the transmission shaft 87 is fixedly connected with a bevel gear II 85, the bevel gear II 85 is in meshed connection with a bevel gear I83, the front end of the transmission shaft 87 is fixedly connected with a driven gear II 89, the front end of the rotation cylinder 86 is fixedly connected with a driven gear I88, the rear top of the clamping and adjusting device mounting plate 91 is fixedly connected with a wrist motor I811, the output shaft of the wrist motor I811 is fixedly connected with a driving gear I810, the bottom of the driving gear I810 is in meshed connection with the top of the driven gear II 89, the rear bottom of the clamping and adjusting device mounting plate 91 is fixedly connected with a wrist motor II 813, the output shaft of the wrist motor II 813 is fixedly connected with a driving gear II 812, the top of the driving gear II 812 is in meshed connection with the bottom of the driven gear I88, and the wrist motor I811 and the wrist motor II 813 are servo motors with self-locking functions and have the same power model;
when the pitching angles of the U-shaped seat I51 and the wafer carrier need to be adjusted, the wrist motor II 813 does not work and is self-locked, the wrist motor I811 works to drive the driving gear I810 to rotate, the driving gear I810 drives the driven gear II 89 and the transmission shaft 87 to rotate through meshing action, so that the bevel gear II 85 is driven to rotate, the bevel gear II 85 drives the movable shaft 82 to rotate relative to the U-shaped seat II 84 through transmission of the bevel gear I83, so that the pitching angles of the U-shaped seat I51 and the wafer carrier change, and when the output shaft of the wrist motor I811 rotates clockwise, the front ends of the U-shaped seat I51 and the wafer carrier move downwards, and vice versa;
when the left-right inclination angle of the first U-shaped seat 51 and the wafer carrier needs to be adjusted, the first wrist motor 811 and the second wrist motor 813 rotate at the same speed in the same direction, so that the second driven gear 89 and the first driven gear 88 rotate in the same direction, at this time, the rotating cylinder 86 and the transmission shaft 87 rotate in the same direction, so that the left-right inclination angle of the second U-shaped seat 84, the fixing plate 81, the first U-shaped seat 51 and the wafer carrier is driven to change, when the output shaft of the first wrist motor 811 rotates clockwise, the output shaft of the second wrist motor 813 rotates clockwise at the same speed as the output shaft of the first wrist motor 811, so that the second U-shaped seat 84, the fixing plate 81, the first U-shaped seat 51 and the wafer carrier are driven to incline leftwards, and vice versa.
Referring to fig. 1 to 10, a method for using a clamping adjustment device includes the following steps:
firstly, mounting a wrist adjusting mechanism 8 on an external mechanical arm through an external component 9, and then adjusting a U-shaped seat I51 to a horizontal state by the operation of the wrist adjusting mechanism 8;
secondly, the opposite adjustment assembly works to enable the two wedge-shaped clamping blocks 55 to be far away from each other, then an external mechanical arm enables the U-shaped seat I51 to be close to the outer side of the side plate 13, the conical transmission head 64 stretches into the conical groove, meanwhile, the wedge-shaped clamping blocks 55 correspond to the wedge-shaped clamping grooves 15, then the opposite adjustment assembly enables the two wedge-shaped clamping blocks 55 to be close to each other, and the two wedge-shaped clamping blocks 55 are respectively clamped into the corresponding wedge-shaped clamping grooves 15, so that clamping and fixing of the wafer carrier are completed;
step three, the expanding motor 62 works to drive the long shaft 63 and the conical transmission head 64 to rotate, the conical transmission head 64 drives the control stud 43 to rotate clockwise through friction transmission with the knob 41, and the control stud 43 and the nut 44 act by threads to drive the double-sided rack 23 to move backwards;
step four, the double-sided rack 23 drives the two vertical gears 22 on two sides to rotate, so that the connecting rod 24 drives the two arc clamping plates 25 to open to enable the two arc clamping plates 25 to surround a wafer to be carried, then the open motor 62 reversely rotates to drive the control stud 43 to rotate anticlockwise, so that the two arc clamping plates 25 are close to each other, the edge of the wafer 10 is clamped by the arc pads 28 of the limit grooves 26 on the edge of the arc wafer, and carrying of the wafer 10 is completed;
and fifthly, the telescopic end of the electric telescopic rod 72 is extended to enable the second strong magnetic block 73 and the first strong magnetic block 37 to be magnetically attracted together, then the electric telescopic rod 72 is extended continuously to push the sliding long plate 35 and the bottom tray 36 to move mutually until the bottom tray 36 is positioned at the center of the lower side of the wafer, and the bottom tray 36 protects the bottom of the wafer.
It should be noted that the input ends of the clamping motor 57, the expanding motor 62, the electric telescopic rod 72, the wrist motor one 811 and the wrist motor two 813 disclosed in the above embodiments are electrically connected to the output end of the external power source through the external PLC controller, and the external PLC controller controls the clamping motor 57, the expanding motor 62, the electric telescopic rod 72, the wrist motor one 811 and the wrist motor two 813 to operate by methods commonly used in the prior art.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A wafer carrier, comprising:
the carrier mounting frame (1) comprises a mounting frame (11), wherein anti-interference grooves (12) are respectively formed in the left end and the right end of the rear side of the mounting frame (11), side plates (13) are respectively fixedly connected with the two ends of the front side of the mounting frame (11), and wedge-shaped clamping grooves (15) are respectively formed in one sides, away from each other, of the two side plates (13);
the open type wafer bearing mechanism (2) comprises arc clamping plates (25), two vertical rotating shafts (21) are rotatably connected to two sides in the mounting frame (11), vertical gears (22) are fixedly connected to the middle parts of the two rotating shafts (21) respectively, dovetail sliding strips (210) are longitudinally and slidably connected to the dovetail grooves at the bottom in the mounting frame (11), double-sided racks (23) are fixedly connected to the tops of the dovetail sliding strips (210), two sides of each double-sided rack (23) are respectively connected with the two vertical gears (22) in a meshed mode, two opposite arc clamping plates (25) are fixedly connected to the rear sides of the two vertical gears (22) through connecting rods (24), and arc wafer edge limiting grooves (26) are respectively formed in the inner sides of the two arc clamping plates (25);
the wafer bottom protection mechanism (3) is positioned below the circular arc clamping plate (25);
the clamping plate opening control mechanism (4) is arranged between the two side plates (13), and the rear end of the clamping plate opening control mechanism (4) is connected with the dovetail sliding bar (210).
2. The wafer carrier of claim 1, wherein: the opening wafer bearing mechanism (2) further comprises an arc pad (28), arc clamping grooves (27) are respectively formed in the upper side and the lower side of the arc wafer edge limiting grooves (26), the arc pad (28) is arranged in the arc wafer edge limiting grooves (26), and the upper side and the lower side of the arc pad (28) are respectively connected with arc clamping strips (29) which are clamped with the arc clamping grooves (27) in an integrated manner.
3. The wafer carrier of claim 1, wherein: the wafer bottom protection mechanism (3) comprises a circular arc bottom protection plate (33), a circular arc bottom protection groove (31) is formed in the inner side bottom of the circular arc clamping plate (25), the circular arc bottom protection plate (33) is clamped in the circular arc bottom protection groove (31), and the outer side bottom of the circular arc clamping plate (25) is fixedly connected with the circular arc bottom protection plate (33) through fastening screws (32).
4. The wafer carrier of claim 1, wherein: the wafer bottom protection mechanism (3) comprises a bottom tray (36), a sliding sleeve (34) is fixedly connected to the bottom center of the mounting frame (11), a sliding long plate (35) is longitudinally and slidably connected in the sliding sleeve (34), the bottom tray (36) is fixedly connected to the rear end of the sliding long plate (35), and a strong magnetic block I (37) is fixedly connected to the front end of the sliding long plate (35).
5. The wafer carrier of claim 1, wherein: the clamping plate opening control mechanism (4) comprises a control stud (43) and a nut (44), a connecting plate (42) is fixedly connected between two side plates (13), the middle part of the connecting plate (42) is rotationally connected with the longitudinal control stud (43) through a bearing, the middle part in the double-sided rack (23) is provided with the nut (44), the front end of the double-sided rack (23) is inlaid with the nut (44), the rear end of the control stud (43) is in threaded connection with the nut (44), the front end of the control stud (43) is fixedly connected with a knob (41), the middle part of the front side of the knob (41) is provided with a conical groove, and the inner wall of the conical groove is provided with friction lines.
6. A clamping adjustment device for operating a wafer carrier as claimed in any one of claims 1 to 5, characterized in that: comprising the following steps:
the carrier clamping and connecting mechanism (5) comprises a U-shaped seat I (51), an opposite adjusting assembly and wedge-shaped clamping blocks (55), wherein the U-shaped seat I (51) is connected with two wedge-shaped clamping blocks (55) corresponding to each other left and right through the opposite adjusting assembly, a wedge-shaped surface is arranged at the rear side of one end, close to each other, of each wedge-shaped clamping block (55), and the wedge-shaped clamping blocks (55) are mutually matched with the corresponding wedge-shaped clamping grooves (15);
the clamping plate opening electric control mechanism (6) is arranged in the middle of the U-shaped seat I (51);
the bottom tray electric mechanism (7) is arranged at the lower side of the middle part of the U-shaped seat I (51).
7. The clamp adjustment device of claim 6, wherein: the clamping plate opening electric control mechanism (6) comprises a long shaft (63) and a conical transmission head (64), the middle part of the U-shaped seat I (51) is fixedly connected with an opening motor (62) through a motor seat (61), an output shaft at the rear side of the opening motor (62) is fixedly connected with the front end of the long shaft (63), the rear end of the long shaft (63) is fixedly connected with the conical transmission head (64), the outer periphery side of the conical transmission head (64) is fixedly connected with friction lines, and the rear end of the conical transmission head (64) is correspondingly matched with the conical groove.
8. The clamp adjustment device of claim 7, wherein: the bottom tray electric mechanism (7) comprises an electric telescopic rod (72), the lower side of the middle of the U-shaped seat I (51) is fixedly connected with the front end of the electric telescopic rod (72) through a fixing sleeve (71), the rear end of the electric telescopic rod (72) is fixedly connected with a strong magnetic block II (73), the strong magnetic block II (73) corresponds to the strong magnetic block I (37) in front-back mode, and the magnetic poles of one ends of the strong magnetic block II (73) and the strong magnetic block I (37) are close to each other are opposite.
9. The clamp adjustment device of claim 8, wherein: the wrist adjusting mechanism (8) and the external assembly (9) are further included, the wrist adjusting mechanism (8) is installed on the external assembly (9), and the rear end of the wrist adjusting mechanism (8) is fixedly connected with the front side of the U-shaped seat I (51).
10. A method of using the clamp adjustment mechanism of claim 9, wherein: the method comprises the following steps:
firstly, installing a wrist adjusting mechanism (8) on an external mechanical arm through an external component (9), and then adjusting a U-shaped seat I (51) to a horizontal state by the operation of the wrist adjusting mechanism (8);
secondly, the opposite adjustment assembly works to enable the two wedge-shaped clamping blocks (55) to be far away from each other, then an external mechanical arm enables the U-shaped seat I (51) to be close to the outer side of the side plate (13), the conical transmission head (64) stretches into the conical groove, meanwhile, the wedge-shaped clamping blocks (55) correspond to the wedge-shaped clamping grooves (15), then the opposite adjustment assembly enables the two wedge-shaped clamping blocks (55) to be close to each other, and the two wedge-shaped clamping blocks (55) are respectively clamped into the corresponding wedge-shaped clamping grooves (15) to finish clamping and fixing of the wafer carrier;
step three, the motor (62) is opened to work so as to drive the long shaft (63) and the conical transmission head (64) to rotate, the conical transmission head (64) drives the control stud (43) to rotate clockwise through friction transmission with the knob (41), and the control stud (43) and the nut (44) act by threads so as to drive the double-sided rack (23) to move backwards;
step four, the double-sided rack (23) drives two vertical gears (22) on two sides to rotate, so that the connecting rod (24) drives the two arc clamping plates (25) to open, the two arc clamping plates (25) encircle a wafer to be carried, then the open motor (62) reversely rotates to drive the control stud (43) to rotate anticlockwise, the two arc clamping plates (25) are close to each other, and the edge of the wafer (10) is clamped by the arc pad (28) in the limit groove (26) on the edge of the arc wafer, so that the carrying of the wafer (10) is completed;
and fifthly, the telescopic end of the electric telescopic rod (72) stretches to enable the second strong magnetic block (73) and the first strong magnetic block (37) to be magnetically attracted together, then the electric telescopic rod (72) continues to stretch to push the sliding long plate (35) and the bottom tray (36) to move mutually until the bottom tray (36) is positioned at the center of the lower side of the wafer, and the bottom tray (36) protects the bottom of the wafer.
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| CN202311020826.XA CN116845026B (en) | 2023-08-11 | 2023-08-11 | Wafer carrier and clamping adjustment device and method for operating same |
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| CN202311020826.XA CN116845026B (en) | 2023-08-11 | 2023-08-11 | Wafer carrier and clamping adjustment device and method for operating same |
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| CN117464527B (en) * | 2023-12-28 | 2024-03-12 | 太原市恒山机电设备有限公司 | Sharpening machine suitable for large casting blank thickness variation range and use method thereof |
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| CN116845026B (en) | 2024-01-30 |
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