CN101660740B - Lamp - Google Patents

Lamp Download PDF

Info

Publication number
CN101660740B
CN101660740B CN2009101761102A CN200910176110A CN101660740B CN 101660740 B CN101660740 B CN 101660740B CN 2009101761102 A CN2009101761102 A CN 2009101761102A CN 200910176110 A CN200910176110 A CN 200910176110A CN 101660740 B CN101660740 B CN 101660740B
Authority
CN
China
Prior art keywords
light source
mentioned
lamp
component
source support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2009101761102A
Other languages
Chinese (zh)
Other versions
CN101660740A (en
Inventor
大泽滋
森川和人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005221571A external-priority patent/JP4482706B2/en
Priority claimed from JP2005221688A external-priority patent/JP4725231B2/en
Priority claimed from JP2005371406A external-priority patent/JP4569465B2/en
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Publication of CN101660740A publication Critical patent/CN101660740A/en
Application granted granted Critical
Publication of CN101660740B publication Critical patent/CN101660740B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The invention provides a lamp which includes: an outer shell having heat conductivity, wherein the outer shell includes a light source support, and a heat radiating surface exposed to the outside of the outer shell and integrated with the heat radiating surface; a base provided in the outer shell; a wiring substrate, assembled with a light source supported on the light source support, wherein the wiring substrate is in screw fixation to the light source support, the light source is heated during lighting, and thermally connected to the light source support; and a transparent cover provided on the light source support in mode of covering the outer shell.

Description

Lamp
The application's case is that denomination of invention is " lamp ", and application number is dividing an application of 200610066778.8 patent application case.
Female case of the application's case is based on previous Japanese patent application case 2005-112339 (in application on April 8th, 2005), Japanese patent application case 2005-221571 (in application on July 29th, 2005), Japanese patent application case 2005-221688 (in application on July 29th, 2005), and Japanese patent application case 2005-371406 (in application on November 26th, 2005), and require priority wherein, its full content is disclosed in this with reference example.
The application of this division also requires above-mentioned priority.
Technical field
The invention relates to will be for example semiconductor element as the light emitting diode (light-emitting diode) as the lamp of light source, particularly be dispersed into expeditiously the lamp of lamp outside relevant for the heat that when lamp is lit a lamp, light source can be sent.
Background technology
As the lamp light source of alternative incandescent lamp, known have a light emitting diode.When light emitting diode followed its temperature to rise, its light output will descend and the life-span also will shorten.So, must be able to suppress the temperature rising of light emitting diode as the lamp of light source with light emitting diode.
For example, disclosing in Japanese Patent Laid-Open 2001-243809 communique has the LED electric light, and this LED electric light prevents that by the thermal diffusivity that improves light emitting diode light emitting diode is overheated.Previous LED electric light comprises lamp body, metal substrate and a plurality of light emitting diode.Lamp body is made of following: at one end have lamp socket (base) and have the metal-made radiating part of opening in other end setting, and be provided with translucent cover at the metal-made radiating part other end.The metal-made radiating part is the shape that is horn-like expansion from an end towards the other end.
Metal substrate is by having the high heat conduction component of electrical insulating property, and is fixed on the opening of metal-made radiating part.Light emitting diode is supported by metal substrate and is covered by translucent cover.
When the LED electric light threw light on, the heat that light emitting diode sends was delivered to the metal-made radiating part from metal substrate by high heat conduction component.Be delivered to the heat of metal-made radiating part, can be distributed to the atmosphere from the outer peripheral face of metal-made radiating part.Thus, it is overheated to suppress light emitting diode, and can improve the luminous efficiency (luminous efficacy) of LED electric light.
According to the LED electric light that the Japanese Laid-Open Patent communique discloses, the metal-made radiating part that distributes the heat that light emitting diode sends and the metal substrate that light emitting diode is installed are different inscapes.So in the structure, metal substrate and metal-made radiating part combine by high heat conduction component, but can't avoid producing thermal resistance (thermal resistance) at the bound fraction of metal substrate and metal-made radiating part.Therefore, can affect the heat conduction of between metal substrate and metal-made radiating part, carrying out, and the heat of light emitting diode can't be delivered to the metal-made radiating part from metal substrate expeditiously.Therefore, waiting further improvement aspect the temperature rising that suppresses light emitting diode.
And then the lamp circuit that makes light-emitting diode lighting in the above-mentioned LED electric light is necessary inscape.When lamp circuit being packed into the LED electric light, must accomplish can not cause because having lamp circuit the LED electric light to become large.Simultaneously well-known, if lamp circuit excess Temperature at ordinary times, then the reliability of circuit operation will descend, and the life-span will suffer damage.So when lamp circuit being packed into the LED electric light, indispensable is that the inhibition point circuit for lamp is overheated.Yet, in the publication communique of above-mentioned Japan, do not have the announcement about lamp circuit.Thus, in the LED electric light that in above-mentioned publication communique, discloses, can't satisfy and suppress the maximization of LED electric light and the overheated requirement of lamp circuit.
Summary of the invention
The object of the invention is to provide a kind of lamp, and it comprises the outer component with thermal conductivity, and above-mentioned outer component comprises light source support and the radiating surface that exposes in the outside of above-mentioned lamp, and above-mentioned light source support and above-mentioned radiating surface form one; Be arranged on the lamp socket of above-mentioned outer component; Wiring substrate is being assembled the light source that supports on above-mentioned light source support, above-mentioned wiring substrate is to utilize screw to be fixed to above-mentioned light source support, and to above-mentioned light source the heating when lighting a lamp to carry out heat conducting mode thermally coupled in above-mentioned light source support; And be arranged on translucent cover on the above-mentioned light source support in the mode that covers above-mentioned light source.
The implementation form according to the present invention, as outer component for example can use than iron, ferroalloy (alloy iron), with iron as the metal of principal component have the copper of better thermal conductivity, with the copper alloy of copper as principal component.And then also can use as than with iron as the lighter light metal such as aluminium of the metal of principal component (Light metal), light-alloy (light alloy).
In the implementation form of the present invention, can implement annular knurl (knurling) to the radiating surface of outer component.Thus, can make radiating surface tumbling (stain finish) and can increase the area of radiating surface.Simultaneously, in the implementation form of the present invention, also can prevent that the diaphragm that gets rusty is coated in the radiating surface of outer component with being used for.Particularly when being black, diaphragm can expeditiously heat be dispersed into the atmosphere from radiating surface.
In the implementation form of the present invention, as the heating light source, comparatively ideal is the semiconductor element that electric energy (electrical energy) is converted to light that uses as the light emitting diode.And then, also can use electroluminescent cell to replace light emitting diode.Light source is at least one, but quantity of light source is not limited.Light source also can be directly installed on light source support to be easy to transfer heat to light source support.Perhaps also light source can be installed on the distributing board, and make this distributing board and light source support thermally coupled.
In the implementation form of the present invention, translucent cover is protected light source in a covered manner, and it also can be for example spherical (globe) or umbrella (shade) shape, also can be flat.When translucent cover when being spherical, optical reflection film can be arranged on the part of this spherical inner face.Simultaneously, translucent cover can be and uses so that the light diffusion that light source sends or the arbitrary shape of optically focused.And then, also can utilize as translucent cover to make light optically focused that light source sends or the lens of diffusion.
According to implementation form of the present invention, the heat that can when lighting a lamp light source be sent is delivered to radiating surface from light source support, and is dispersed into the outside of lamp by this radiating surface.Because light source support and radiating surface become one, so between radiating surface and light source support, do not have the heat conducting bonding part of overslaugh.Thus, heat can be transmitted to radiating surface from light source support well, and the heat that can expeditiously light source be sent is transferred to radiating surface.Its result can improve the heat dispersion of light source, but and the establishment light source overheated.
To set forth other purposes of the present invention and advantage in explanation subsequently, part purpose and advantage are apparent in explanation, maybe can learn by putting into practice the present invention.Can realize and obtain the object of the invention and advantage by means of instrument and device (if the chemical case of the device here is exactly composition) that the application's case specializes.
Description of drawings
Incorporate into and consist of standard a part these description of drawings various embodiments of the present invention, and this embodiment together with above general introduction and following each embodiment is intended to explain principle of the present invention.
Fig. 1 is the stereogram of the lamp of the present invention's the 1st example.
Fig. 2 is the profile of the lamp of the present invention's the 1st example.
Fig. 3 is the profile that lamp socket, outer component and the translucent cover in expression the present invention the 1st example is in the lamp when being spaced from each other state.
Fig. 4 is the profile along the F4-F4 line of Fig. 2.
Fig. 5 is the profile along the F5-F5 line of Fig. 2.
Fig. 6 is the stereogram of the lamp of the present invention's the 2nd example.
Fig. 7 is the profile of the lamp of the present invention's the 2nd example.
Fig. 8 is the profile of the lamp of the present invention's the 3rd example.
Fig. 9 is the profile of the lamp of the present invention's the 4th example.
Figure 10 is the profile that lamp socket, outer component and the translucent cover in expression the present invention the 4th example is in the lamp when being spaced from each other state.
Figure 11 is the profile along the F11-F11 line of Fig. 9.
Figure 12 is the profile of the present invention's the 5th example lamp.
Figure 13 is the profile of the lamp of the present invention's the 6th example.
Figure 14 is the profile along the F14-F14 line of Figure 13.
Figure 15 is the profile of the position relationship of wire and insulating cylinder in expression the present invention the 6th example.
Figure 16 is the front view that supports the position relationship of the distributing board of light emitting diode and light source support in expression the present invention the 6th example.
Figure 17 is the plane of employed insulating component in the present invention's the 6th example.
Figure 18 is the profile along the F18-F18 line of Figure 17.
Figure 19 is the profile along the F19-F19 line of Figure 17.
Figure 20 is the stereogram of employed insulating cylinder in the present invention's the 6th example.
Figure 21 is the profile of the lamp of the present invention's the 7th example.
Figure 22 is illustrated in the present invention's the 7th example the profile of the position relationship of the light source support of outer component, light source, light source outer cover and fixator.
Figure 23 is illustrated in the present invention's the 7th example the profile of the position relationship of light source outer cover, fixator and heat insulation outer cover.
Figure 24 is illustrated in the present invention's the 7th example, decomposes the stereogram of the position relationship of outer component, heat transfer plate and light source.
Figure 25 is illustrated in the stereogram that decomposes the light source outer cover in the present invention's the 7th example.
Figure 26 is the profile of the present invention's the 8th example lamp.
Figure 27 is the plane of the lamp of the present invention's the 8th example.
Figure 28 is the profile of the lamp of the present invention's the 9th example.
Figure 29 is the plane of the lamp of the present invention's the 9th example.
1,100: lamp 2,101: outer component
3,102: light source 4: translucent cover
4b, 42b, 81a, 81b, 81c, 81d: edge
4a, 42a: opening 5,105: lamp circuit
6,106: insulating component 7,107: lamp socket
8,110: perisporium 8a: button ends groove
9,111: end wall 10,112: radiating surface
11,113: light source support 11a, 63,114: supporting surface
12: resettlement section 12a, 116a: openend
14,142,148a, 148b: screw 16a, 16b, 98,122a, 122b: through hole
18: light emitting diode 19,160: distributing board
20: insulated substrate 20a, 28a: the 1st
20b, 28b: the 2nd 21: patterned layer
22,24: protective layer 23: thermal diffusion layer
23a, 23b, 23a, 23d, 89a, 89b: zone
25: bottom 26: screw
28: distributing board 29,161: circuit component
30a, 30b, 162a, 162b: wire 32a, 163a: surrounding wall portion
32b: the locking wall 33a of section, 33b: through hole
35,167: metal-made outer cover of lamp holder 36,168: connecting elements
36a: outer peripheral face 37: leading section
38,170: fasten projection 39,62,93,157: order difference part
41a: reflecting part 41b: light projection unit
43: optical reflection film 45: retainer
46,165: the space
61,123a, 123b, 147a, 147b, 151a, 151b, 152: protuberance
83: capacitor 84: chip element
87a, 87b: guide part 88,149: buckling groove
91: minor diameter part 92: large-diameter portion
94: insulating cylinder 95: inserting hole
96: heart yearn 97: insulating barrier
103: light source outer cover 104: the outer cover fixator
108: heat insulation outer cover 121,173: male screw portion
127: light-emitting component 128: cover glass
129: island areas 82a, 132a, 132b: the 1st buckling parts
82b, 133a, 133b: the 2nd buckling parts 135: heat transfer plate
136a, 36b, 136c, 136d, 136e, 136f, 136e: sliding part
138: lens 139: lens fixture
140: light reflection surface 141: the light emitting surface
143: lip portions 144: light entrance face
146a, 146b: fixator element 150: receiving portion
155: press section 158,174: box thread section
163b: closure wall section 167: outer cover of lamp holder
175: buckling parts 176,221: thermal dissipating path
177: exhaust outlet 178: air entry
201: the 2 fin of 200: the 1 fin
203: the 2 edge outer covers of 202: the 1 edge outer covers
220: urceolus 221a: an end
221b: the other end
The specific embodiment
Referring to Fig. 1 to Fig. 5 the present invention's the 1st example is described.
Fig. 1 and Fig. 2 disclose the lamp 1 that has compatible electric light shape with incandescent lamp.Lamp 1 comprises outer component 2, light source 3, translucent cover 4, lamp circuit 5, insulating component 6 and lamp socket 7.
Outer component 2 usefulness for example have the metal material of excellent heat conductivity as the aluminium and make.Such as Fig. 2 and shown in Figure 3, outer component 2 comprises perisporium 8 and end wall 9.Perisporium 8 and end wall 9 mutual moulding are integrated.Perisporium 8 forms cylindric.The outer peripheral face of perisporium 8 becomes the radiating surface 10 that is exposed to lamp 1 outside.Radiating surface 10 forms the taper that reduces one by one along the direction external diameter that axially passes through of perisporium 8.
One end of end wall 9 sealing perisporiums 8.End wall 9 forms discoideus light source support 11.Light source support 11 comprises the smooth supporting surface 11a that exposes in outer component 2 outsides.
In the 1st example, also can implement annular knurl to the radiating surface 10 of outer component 2, make this radiating surface 10 tumbling (crepe finish).Thus, can increase the area of dissipation of radiating surface 10.And then, also can prevent that the diaphragm that gets rusty is coated to radiating surface 10 with being used for.When diaphragm is black, heat is dispersed into the atmosphere from radiating surface 10.
Such as Fig. 2 and shown in Figure 3, outer component 2 comprises resettlement section 12 (receptacle).Resettlement section 12 determines by the space that is surrounded by perisporium 8 and end wall 9, and is positioned at the inboard of radiating surface 10.Resettlement section 12 comprises the openend 12a relative with end wall 9.Openend 12a is positioned at the other end of perisporium 8.
Perisporium 8 comprises and exposes in the resettlement section 12 inner peripheral surface.Form button at this inner peripheral surface and end groove 8a.Button ends the openend 12a that groove 8a is positioned at resettlement section 12, and continues at the circumferencial direction of perisporium 8.Peripheral part at end wall 9 forms recess 14.Recess 14 forms circular in the mode of ambient light source support portion 11, and at foreign side's opening of outer component 2.
To shown in Figure 4, form a screw 15 and a pair of through hole 16a, 16b in light source support 11 such as Fig. 2.Screw 15 is positioned at the central authorities of light source support 11.Through hole 16a, 16b with the centre across the configuration that is parallel to each other of the mode of screw 15.Screw 15 1 ends and through hole 16a, 16b one end are at the supporting surface 11a of light source support 11 opening.Screw 15 other ends and through hole 16a, the 16b other end be 12 openings in the resettlement section.
Such as Fig. 4 and shown in Figure 5, light source 3 comprises and forms for example four light emitting diodes 18 of chip (chip) shape.Light emitting diode 18 is an example of spot light, and is installed on the discoideus distributing board 19 in the mode that is listed as two row.Distributing board 19 comprises insulated substrate 20.Insulated substrate 20 comprises the 1st 20a and the 2nd 20b.The 2nd 20b is positioned at the opposition side of the 1st 20a.
Be laminated with patterned layer 21 (pattern layer) and protective layer 22 (resist layer) on the 1st 20a top of insulated substrate 20.Patterned layer 21 is for example by such as the metal forming of copper and form.Protective layer 22 overlay pattern layers 21.Top at the 2nd 20b of insulated substrate 20 is laminated with thermal diffusion layer 23 and protective layer 24.Thermal diffusion layer 23 is for example used such as the metal forming with excellent heat conductivity of copper and is formed.Thermal diffusion layer 23 guarantees that than being used for the patterned layer 21 of thermal capacity is thick.As shown in Figure 5, thermal diffusion layer 23 is divided into 23a, 23b, four zones of 23c, 23d.Zone 23a, 23b, 23c, 23d are corresponding with the installation site of light emitting diode 18 and be spaced from each other.Protective layer 24 cover heating diffusion layers 23.Each light emitting diode 18 is installed on the 1st 20a of insulated substrate 20, and is electrically connected with patterned layer 21.
Can use as distributing board 19, for example be laminated with the form person of patterned layer, thermal diffusion layer and protective layer at the metal substrate with excellent heat conductivity.Yet consider cost; comparatively ideal is can use as insulated substrate 20 to be mixed with for example epoxy resin of glass powder (epoxy) resin substrate processed, also can use the form person who is laminated with patterned layer, thermal diffusion layer and protective layer at this resin substrate.
Distributing board 19 is overlapped in light source support 11 with its thermal diffusion layer 23 towards the state of the supporting surface 11a of light source support 11.Distributing board 19 is fixed on the light source support 11 by screw 26.Screw 26 connects the central authorities of distributing board 19 and is screwed into screw 15.Be screwed into by this, distributing board 19 is adjacent to the supporting surface 11a of base plate supports section 11, and distributing board 19 is thermally coupled with base plate supports section 11.
Therefore, the heat that light emitting diode 18 sends is delivered to thermal diffusion layer 23 from insulated substrate 20, and fully is diffused into each corner of thermal diffusion layer 23.The heat that is diffused into thermal diffusion layer 23 can be delivered to light source support 11 by protective layer 24.
According to the 1st example, be formed with heat conduction path from distributing board 19 to supporting surface 11a in the light source support 11 of outer component 2.For the thermal resistance of this heat conduction path is suppressed for less, comparatively ideal is the filling heat-conducting substance as the grease (grease) take silicon (silicon) as principal component for example between distributing board 19 and supporting surface 11a.
Translucent cover 4 for example is plastic orbicule (globe), at one end forms to have the hemispherical of opening 4a.Translucent cover 4 is supported on this outer member 2 thus by the recess 14 that the edge 4b that will determine opening 4a embeds outer component 2.Translucent cover 4 hides light source support 11, light emitting diode 8 and distributing board 19.Therefore light emitting diode 18 is relative with the inner face of translucent cover 4.
Lamp circuit 5 usefulness are so that light emitting diode 18 throws light on, and it makes a modular unit.As shown in Figure 2, lamp circuit 5 comprises distributing board 28 and a plurality of circuit component 29.Distributing board 28 comprises the 1st 28a and is positioned at the 2nd 28b of the 1st 28a opposition side.Circuit component 29 is installed on the 1st 28a of distributing board 28.Each circuit component 29 comprises a plurality of conductor terminals.Conductor terminal connects distributing board 28, and is welded in the conductive pattern (not shown) that is printed on the distributing board 28.
Lamp circuit 5 is housed in the resettlement section 12 of outer component 2.Lamp circuit 5 comprises, with two wire 30a, 30b of light emitting diode 18 electric connections and the wire (not shown) that is electrically connected with lamp socket 7. Wire 30a, 30b are applied in through hole 16a, the 16b that end wall 9 opens and import to distributing board 19.Wire 30a, 30b are connected in the patterned layer 21 of distributing board 19 by methods such as welding.Therefore, as shown in Figure 2, about translucent cover 4 be positioned at lamp 1 on the outer component 2 towards, lamp circuit 5 hangs down from light source support 11 by wire 30a, 30b.
Insulating component 6 is examples that make the insulating barrier of electric insulation between outer component 2 and lamp circuit 5.Insulating component 6 is to use the products formed that synthetic resin material as the polybutylene terephthalate (polybutyleneterephthalate) is for example arranged.As shown in Figure 2, insulating component 6 forms cup-shaped (cup), this cup-shaped 32b of closure wall section that comprises cylindric surrounding wall portion 32a and this surrounding wall portion of sealing 32a one end.Form a pair of through hole 33a, the 33b that passes through wire 30a, 30b at the 32b of closure wall section.The axial length A of insulating component 6 is shorter than the axial length B of ending the outer component 2 of groove 8a from the light source support 11 of outer component 2 to button.
Insulating component 6 embeds in the resettlement section 12 from the openend 12a of resettlement section 12.Thus, the surrounding wall portion 32a of insulating component 6 covers the inner peripheral surface of outer component 2 perisporiums 8, and the 32b of closure wall section of insulating component 6 covers the inner face of the end wall 9 of outer component 2.Therefore, insulating component 6 separates outer component 2 and lamp circuit 5.
Lamp socket 7 is used for electric current supply to lamp circuit 5.Lamp socket 7 comprises metal-made outer cover of lamp holder 35 and is fixed on the connecting elements 36 of outer cover of lamp holder 35.Outer cover of lamp holder 35 is screwed into the lamp socket of not shown ligthing paraphernalia in detachable mode.Connecting elements 36 is to use the products formed that synthetic resin material as the polybutylene terephthalate is for example arranged, and has electrical insulating property.Connecting elements 36 forms hollow cylindrical, and comprises the outer peripheral face 36a of arc-shaped bend.
As shown in Figure 2, connecting elements 36 comprises the leading section 37 of the openend 12a inboard that embeds resettlement section 12.Outer peripheral face at leading section 37 forms fastening projection 38.Groove 8a fastens with only detaining when leading section 37 being embedded into openend 12a inboard to fasten projection 38.By this fastening, outer component 2 is connected with lamp socket with coaxial shape connection.And then connecting elements 36 is between outer cover of lamp holder 35 and outer component 2, and above-mentioned electric insulation between the two and heat insulation.
Be connected at connecting elements 36 under the state of outer component 2, connecting elements 36 outer peripheral face 36a are connected with the radiating surface 10 of outer component 2.And then, at the root portion formation order difference part 39 of leading section 37.Order difference part 39 comprises flat horizontal surface, and it continues at connecting elements 36 circumferencial directions, and extends in the diametric(al) of connecting elements 36.When the leading section 37 with connecting elements 36 was inserted into the openend 12a of resettlement section 12, order difference part 39 can touch openend 12a.Thus, for resettlement section 12, the insertion amount of the leading section 37 of connecting elements 36 can be restricted.
Simultaneously, the insertion amount of restriction leading section 37 will produce space S thus between the surrounding wall portion 32a of the leading section 37 of this connecting elements 36 and insulating component 6.Owing to have a space S, for example before fastening projection 38 and button and ending groove 8a and fasten, can eliminate 37 pairs of insulating components of leading section 6 and produce and disturb these bad situations.In other words, can prevent from following the dimensional tolerance (dimensional tolerance) of connecting elements 36 and outer component 2 to produce fastening projection 38 and detain the fastening that ends groove 8a bad.Thus, lamp socket 7 can be connected to securely the openend 12a of resettlement section 12.
In the lamp 1 of the 1st example, if lamp 1 is lit a lamp, then light emitting diode 18 will generate heat.Light emitting diode 18 is except can be by, also cooling off in the following manner being cooled off at the cross-ventilation of translucent cover 4 interior generations.
The heat that light emitting diode 18 sends is delivered to the light source support 11 of outer component 2 by distributing board 19.Be delivered to the heat of light source support 11, be delivered to radiating surface 10 from end wall 9 by perisporium 8, and be dispersed into lamp 1 outside by radiating surface 10.
Accept the light source support 11 of the heat that light emitting diode 18 sends, it is to be configured as one with the perisporium 8 with radiating surface 10.So, can not have the heat conducting bonding part of overslaugh from light source support 11 to radiating surface on 10 the heat conduction path, thereby the thermal resistance of heat conduction path can suppressed for less.Therefore, the heat that is delivered to the light emitting diode 18 of light source support 11 can be dispersed into radiating surface 10 expeditiously.
In addition, in the 1st example, form the recess 14 of the ring-type of ambient light source support portions 11 at the end wall 9 of outer component 2, this recess 14 is at foreign side's opening of outer component 2.Thus, can increase the surface area of outer component 2 by having recess 14, although need the shape of restriction outer component 2 from the appearance requirement of lamp 1, still can increase the heat dissipation capacity of outer component 2.
This result can improve the cooling performance of light emitting diode 18, and can prevent that light emitting diode 18 is overheated.The luminous efficiency that therefore, can suppress light emitting diode 18 descends and can make the life of light emitting diode 18.
In addition, because light emitting diode 18 is installed on the distributing board 19 with thermal diffusion layer 23, so the heat that light emitting diode 18 sends will be diffused into by the thermal diffusion layer 23 of distributing board 19 each corner of distributing board 19.Therefore, the heat that light emitting diode 18 can be sent is delivered to light source support 11 from the wider range of distributing board 19.Therefore, heat will be transmitted to light source support 11 from light emitting diode 18 well, and the cooling performance of light emitting diode 18 is further improved.
In addition, the lamp 1 of the 1st example has the resettlement section 12 of collecting point circuit for lamp 5 in outer component 2 inboards.Thus, outer component 2 and lamp circuit 5 need not be configured in mutually side by side lamp 1 axially on.Therefore, the axial length of lamp 1 is shortened, and small-sized lamp 1 can be provided.
Meanwhile, be housed in the lamp circuit 5 of resettlement section 12, by insulating component 6 and outer component 2 electric insulations.Thus, can improve heat dispersion by the outer component 2 made from metal, and outer component 2 inside of lamp circuit 6 can being packed into.
The cup-shaped insulating component 6 that makes electric insulation between outer component 2 and the lamp circuit 5 is products formeds of synthetic resin material, and thermal conductivity is lower than outer component 2.Therefore, can be from outer section material 2 hot grazing point circuit for lamp 5, and suppress the heat that light emitting diode 18 sends and be delivered to lamp circuit 5 from outer component 2.Its result can protect lamp circuit 5 that itself and the heat of sending from light emitting diode 18 are separated.Thus, the faulty operation of lamp circuit 5 can be prevented, and the life of lamp circuit 5 can be made.
The resettlement section 12 of collecting point circuit for lamp 5 surrounded by outer component 2, perisporium 8 and end wall 9, and the openend 12a of resettlement section 12 is sealed by lamp socket 7.In other words, lamp circuit 5 is housed in the space that is separated by outer component 2 and lamp socket 7, and the air stream of lamp 1 outside this space of can not flowing through.Thus, can avoid causing producing that dust is attached on the lamp circuit 5 in the air of leaky (tracking).
Fig. 6 and Fig. 7 disclose the present invention's the 2nd example.
This 2nd example, different from above-mentioned the 1st example about the item of outer component 2 and translucent cover 4.In addition, the structure of the lamp 1 and useful technique effect that obtains of structure is identical with the 1st example thus.Therefore, in the 2nd example, to partly paying same reference marks with the 1st example same structure, and the description thereof will be omitted.
Such as Fig. 6 and shown in Figure 7, in the lamp 1 of the 2nd example, the external diameter of the perisporium 8 of outer component 2, except with the end of the openend 12a adjacency of the resettlement section 12 of outer component 2, the external diameter of perisporium 8 is all fixed.Therefore outer component 2 forms straight cylindrical.
Moreover, comprise reflecting part 41a and light projection unit 41b as the orbicule of translucent cover 4.Reflecting part 41a comprises towards the opening 42a of light source support 11 openings and determines the edge 42b of this opening 42a.Edge 42b embeds in the recess 14 of outer component 2.Reflecting part 41a forms the taper that extends in the mode that begins the diameter enhancing from edge 42b.Inner face at this reflecting part 41a is laminated with optical reflection film 43.
Light projection unit 41b forms as one with mode and the reflecting part 41a that is connected with reflecting part 41a.Light projection unit 41b is relative with optical reflection film 43 and light emitting diode 18.
Can by the translucent cover 4 of shape like this, use optical reflection film 43 to make from the part light of light emitting diode 18 radiation and reflect to light projection unit 41b.Therefore, utilize light projection unit 41b to make from most of light of light emitting diode 18 radiation and carry out optically focused, and it is projected the outside of lamp 1.
As shown in Figure 7, outer component 2 is provided with retainer 45 in the bight that is determined by perisporium 8 and end wall 9.Retainer 45 forms from the inner peripheral surface of perisporium 8 outstanding, and the ring-type that is connected with the circumferencial direction of perisporium 8.Retainer 45 is not to be defined in ring-type.For example, can the circumferencial direction of perisporium 8 will be configured in the mode of devices spaced apart from the outstanding a plurality of retainers of perisporium 8 inner peripheral surfaces.
Retainer 45 internal diameters are less than the external diameter of the 32b of closure wall section of insulating component 6.Therefore, even under the state of the resettlement section 12 that insulating component 6 is embedded outer component 2, retainer 45 is also between the 32b of closure wall section of end wall 9 and insulating component 6.Its result, the light source support 11 on the end wall 9 is spaced from each other with insulating component 6, and in the above-mentioned space 46 that has between the two.
According to the lamp 1 of the 2nd example, owing to have space 46, the light source support 11 that receives the heat of light emitting diode 18 can be remained on insulating component 6 is non-contacting state.Therefore, space 46 will be delivered to the heat insulation of insulating component 6 from light source support 11 as overslaugh heat and play a role with the space, and the heat that light emitting diode 18 sends will be difficult to directly be delivered to insulating component 6 from light source support 11.
Therefore, although the lamp circuit 5 that accommodate outer component 2 inside can receive the heat of being sent by light emitting diode 18, still the heat affecting to lamp circuit 5 can be suppressed for minimum.So, can prevent the faulty operation of lamp circuit 5, and can make the life of lamp circuit 5.
Fig. 8 discloses the present invention's the 3rd example.
This 3rd example is different from above-mentioned the 1st example with respect to the fixing means of the translucent cover 4 of outer component 2.In addition, the structure of the lamp 1 and useful technique effect and the 1st example that obtain of structure is same thus.Therefore, in the 3rd example, to partly paying same reference marks with the 1st example same structure, and the description thereof will be omitted.
As shown in Figure 8, the edge 4b of translucent cover 4 for example is to be the recess 14 that bonding agent 51 is fixed on outer component 2 by silicon.Bonding agent 51 is filled in the recess 14.Recess 14 forms in the mode of ambient light source support portion 11, and compares the direction depression towards lamp socket 7 with the supporting surface 11a of permanent wiring plate 19.So, to compare with the light emitting diode 18 on the distributing board 19, bonding agent 51 is arranged on the position of deflection lamp socket 7 directions.
According to the lamp 1 of the 3rd example, translucent cover 4 is fixed on the bonding agent 51 of outer component 2, it is filled in the recess 14 that the supporting surface 11a than light source support 11 caves in more.So, will be difficult to directly inject bonding agent 51 from the light of light emitting diode 18 radiation.Therefore, even contain ultraviolet ray in the light of light emitting diode 18 radiation, also can prevent the deteriorated of bonding agent 51.Thereby translucent cover 4 can be firmly held on the outer component 2 for a long time.
Fig. 9 to Figure 11 discloses the present invention's the 4th example.
In this 4th example, light source support 11 shapes of outer component 2 are different from above-mentioned the 3rd example.In addition, the structure of the lamp 1 and useful technique effect and the 1st example that obtain of structure is same thus.Therefore, in the 3rd example to the 1st and the 3rd example in same structure partly pay same reference marks, and the description thereof will be omitted.
To shown in Figure 11, the end wall 9 of outer component 2 has the protuberance 61 of giving prominence to towards translucent cover 4 from light source support 11 such as Fig. 9.Protuberance 61 forms discoid less than light source support 11 1 circle.Protuberance 61 forms as one with end wall 9, and surrounds by the recess 14 that translucent cover 4 is installed and to be coaxial shape.So, between protuberance 61 and light source support 11, form an order difference part 62.Order difference part 62 forms in continuous circular of the circumferencial direction of protuberance 61.
Front end at protuberance 61 forms smooth supporting surface 63.Supporting surface 63 is compared with the end wall 9 of outer component 2 and is more entered translucent cover 4 inboards.Thus, supporting surface 63 is highly suitable apart from degree and the raised part 61 of recess 14.
In the 4th example, the distributing board 19 that light emitting diode 18 is installed is fixed on the central portion of supporting surface 63 by screw 26.Distributing board 19 is thermally coupled in supporting surface 63.And then screw 15 and through hole 16a, 16b run through protuberance 61 and at supporting surface 63 openings.
According to the lamp 1 of the 4th example, at the protuberance 61 that light source support 11 formation of outer component 2 are given prominence to translucent cover 4, fixed the distributing board 19 with light emitting diode 18 at the front end face 63 of this protuberance 61.Therefore, light emitting diode 18 is to compare the mode that more enters translucent cover 4 inboards with the end wall 19 of outer component 2 and to be offset.Therefore, the light from light emitting diode 18 radiation can be imported to translucent cover 4 inboards expeditiously, and then be dispersed into the outside of translucent cover 4.
Moreover, owing to have protuberance 61, so the surface area of light source support 11 and thermal capacity increase.Thus, although limited the shape of outer component 2 from lamp 1 appearance requirement, still can increase the heat dissipation capacity of outer component 2.Its result can improve the cooling performance of light emitting diode 18, suppresses the decline of luminous efficiency, and can make the life of light emitting diode 18.
Meanwhile, to be filled in the projecting height of the degree of bonding agent 51 of recess 14 and protuberance 61 suitable for light emitting diode 18 distance.In other words, interdicted by the peripheral part of protuberance 61 from the light of light emitting diode 18 towards recess 14, and be difficult to be directly incident on bonding agent 51 from the light of light emitting diode 18 radiation.
Therefore, even from the light of light emitting diode 18 radiation, containing ultraviolet ray, also can prevent the deteriorated of bonding agent 51.Therefore, translucent cover 4 can be firmly held on the outer component 2 for a long time.
Figure 12 discloses the present invention's the 5th example.
In this 5th example, the shape of the light source support 11 of outer component 2 is different from above-mentioned the 2nd example.In addition, the structure of the lamp 1 and useful technique effect and the 2nd example that obtain of structure is same thus.Therefore in the 5th example, to partly paying same reference marks with the 2nd example same structure, and the description thereof will be omitted.
As shown in figure 12, the end wall 9 of outer component 2 has the protuberance 71 of giving prominence to towards translucent cover 4 from light source support 11.Protuberance 71 forms discoid than the little circle of light source support 11.Protuberance 71 forms as one with end wall 9, and is coaxial shape by recess 14 encirclements that embed translucent cover 4.So, between protuberance 71 and light source support 11, form an order difference part 72.Order difference part 72 forms on the circumferencial direction of protuberance 71 continuous circular.
Form smooth supporting surface 73 at protuberance 71 front ends.Supporting surface 73 is compared the inboard of the reflecting part 41a that more enters translucent cover 4 with the end wall 9 of outer component 2.Thus, supporting surface 73 is equivalent to the height of raised part 71 apart from the degree of recess 14.
In the 5th example, the distributing board 19 of light emitting diode 18 is installed, it is fixed on the central portion of supporting surface 73 by screw 26.Distributing board 19 is thermally coupled in supporting surface 63.And then screw 15 and through hole 16a, 16b connect protuberance 71 and at supporting surface 73 openings.
According to the lamp 1 of the 5th example, light emitting diode 18 is compared the reflecting part 41a that more enters translucent cover 4 with the end wall 19 of outer component 2 inboard.So, the light from light emitting diode 18 radiation can be imported translucent cover 4 inboards expeditiously.Thus, can make the light from light emitting diode 18 reflex to the direction of transmittance section 41b by optical reflection film 43, and can emit to from transmittance section 41b the outside of translucent cover 4.
And then, owing to have protuberance 71, so can increase surface area and the thermal capacity of light source support 11.Therefore, although consider the appearance requirement of lamp 1, and the shape of restriction outer component 2 still can increase the heat dissipation capacity of outer component 2.Its result can improve the cooling of light emitting diode 18 and suppress luminous efficiency decline, and can make the life of light emitting diode 18.
Figure 13 to Figure 20 has disclosed the present invention's the 6th example.
The difference of this 6th example and above-mentioned the 1st example mainly is that for the resettlement section 12 of outer component 2, the method for supporting of lamp circuit 5 is different.In addition, the structure of the lamp 1 and useful technique effect that obtains of structure is all same with the 1st example thus.Thus, in the 6th example, use same reference marks for the component part identical with the 1st example, and the description thereof will be omitted.
Such as Figure 13 and shown in Figure 14, consist of the distributing board 28 of lamp circuit 5, form the rectangle that axially is elongate at the perisporium 8 of outer component 2.Distributing board 28 has the 1st to the 4th edge 81a, 81b, 81c, 81d.The the 1st and the 2nd edge 81a, 81b extend axially along perisporium 8.The the 3rd and the 4th edge 81c, 81d extend along the diametric(al) of perisporium 8.The 3rd edge 81c touches the 32b of closure wall section of insulating component 6.The 4th edge 81d is relative with lamp socket 7.
The bight that determines at the 1st edge 81a and the 4th edge 81d by distributing board 28 forms the 1st buckling parts 82a.Equally, the bight that is determined by the 2nd edge 81b and the 4th edge 81d of distributing board 28 forms the 2nd buckling parts 82b.The the 1st and the 2nd buckling parts 82a, 82b are cut to the right angle by two bights with distributing board 28 respectively and form.The the 1st and the 2nd buckling parts 82a, 82b are not limited to otch.For example also can be respectively arranged with in two bights of distributing board 28 to the outstanding protuberance of perisporium 8, and with raised part as the 1st and the 2nd buckling parts 82a, 82b.And then, also two bights of distributing board 28 directly can be used as the 1st and the 2nd buckling parts 82a, 82b.
Distributing board 28 from the resettlement section 12 openend 12a inboard and give prominence to towards the connecting elements 36 of lamp socket 7.In other words, distributing board 28 is crossed between outer components 2 and the lamp socket 7 and its 4th edge 81d enters connecting elements 36 inboards.
As shown in figure 13, the circuit component 29 of formation lamp circuit 5 contains capacitor 83 (condensor).Capacitor 83 has thermo-labile, and if characteristic overheated then that the life-span can shorten.Capacitor 83 is installed in the end that is adjacent to the 4th edge 81d among the 1st 28a of distributing board 28 by methods such as welding.
And then the conductor terminal of each circuit component 29 runs through distributing board 28 and outstanding from the 2nd 28b of distributing board 28.At this 2nd 28b a plurality of chip elements 84 are installed.
As shown in figure 14, the inner peripheral surface at connecting elements 36 is formed with a pair of retainer 85a, 85b.Retainer 85a, 85b are outstanding from connecting elements 36 inner peripheral surfaces in the mode corresponding with the 1st and the 2nd buckling parts 82a, the 82b of distributing board 28. Retainer 85a, 85b are contacted with the 1st and the 2nd buckling parts 82a, the 82b of distributing board 28.Thus, distributing board 28 is clipped between the end wall 9 of retainer 85a, the 85b of lamp socket 7 and outer component 2.
To shown in Figure 19, be formed with a pair of guide part 87a, 87b at the surrounding wall portion 32a of insulating component 6 inner peripheral surface such as Figure 17.Guide part 87a, 87b are relative on the diametric(al) of surrounding wall portion 32a, and outstanding from the interior week of surrounding wall portion 32a.And guide part 87a, 87b extend axially along surrounding wall portion 32a's.
Form buckling groove 88 at each guide part 87a, 87b.Chimeric the 1st and the 2nd edge 81a, the 81b that distributing board 28 is arranged slidably in the buckling groove 88, and extending axially along surrounding wall portion 32a always.Buckling groove 88 1 ends are by the 32b of the closure wall section sealing of insulating component 6.The other end of buckling groove 88 is to the other end opening of surrounding wall portion 32a.
For resettlement section 12 that lamp circuit 5 is packed into, as front end, the surrounding wall portion 32a that distributing board 28 is inserted into insulating component 6 under this state is inboard with the 3rd edge 81c of distributing board 28.The update of this distributing board 28, it is that the 1st and the 2nd edge 81a, 81b with this distributing board 28 is inserted into buckling groove 88.Rear flank in distributing board 28 is inserted into surrounding wall portion 32a, then the 3rd edge 81c of distributing board 28 will touch the 32b of closure wall section of insulating component 6.Therefore, need not to consider especially and can determine the insertion amount of 28 pairs of insulating components 6 of distributing board.Therefore, lamp circuit 5 is packed into the operability of resettlement section 12 is better.
Distributing board 28 is inserted into after the surrounding wall portion 32a inboard of insulating component 6, the connecting elements 36 of lamp socket 7 is connected to the openend 12a of outer component 2.Connect by this, so that retainer 85a, the 85b of connecting elements 36 contact with the 1st and the 2nd buckling parts 82a, the 82b of distributing board 28.Thus, distributing board 28 can be clipped between the end wall 11 and retainer 85a, 85b of outer component 2, and can keep this lamp circuit 5 in the axial not mode of transfer point circuit for lamp 5 of perisporium 8.Meanwhile because the buckling groove 88 that the 1st and the 2nd edge 81a of distributing board 28,81b are entrenched in insulating component 6, so can the circumferencial direction of perisporium 8 not transfer point circuit for lamp 5 mode and keep this lamp circuit 5.And then, if further strengthen the chimeric of the 1st edge 81a of distributing board 28 and buckling groove 88, then can be only by the chimeric of the 1st edge 28a and buckling groove 88 with on the circumferencial direction of perisporium 8 not the mode of transfer point circuit for lamp 5 keep this lamp circuit 5.
Thereby lamp circuit 5 remains in the resettlement section 12 of outer component 2 in irremovable mode.
As shown in figure 13, the distributing board 28 of lamp circuit 5, it is two regional 89a, 89b that the inside of the surrounding wall portion 32a of insulating component 6 is separated along diametric( al).Zone 89a, 89b be to inner space 90 openings of lamp socket 7, and be interconnected by this space 90.
The the 1st and the 2nd 28a, 28b of distributing board 28 all do not point to the light source support 11 of accepting the heat that light emitting diode 18 sends, and relative with the surrounding wall portion 32a of insulating component 6.So, the welding portion of the conductor terminal of circuit component 29 and distributing board 28, it can away from the 32b of closure wall section of the insulating component 6 that joins with light source support 11, can suppress the heat affecting to welding portion.
And then, being adjacent to the capacitor 83 of the 4th edge 81d of distributing board 28, it enters lamp socket 7 inner spaces 90, and is away from the light source support 11 that receives the heat that light emitting diode 18 sends.So heat labile capacitor 83 will be difficult to be subject to the impact of the heat that light emitting diode 18 sends, and can improve the persistence of capacitor 83.
In addition because the part of lamp circuit 5 enters the space 90 of lamp socket 7 inboards, so can make insulating component 6 and outer component 2 axially on length shorten.Thus, can be conducive to realize the miniaturization of lamp 1.If outer section material 2 axially on length shorten, the area that then will produce radiating surface 10 reduces this drawback.As its countermeasure, also can become large by the external diameter with outer component 2, and remedy the part that these radiating surface 10 areas reduce.
Such as Figure 13 and shown in Figure 16, the circuit component 29 that is installed in the 1st 28a of distributing board 28 can be higher than the chip element 84 that is installed in the 2nd 28b.Thus, the distributing board 28 described in this example, it is in the mode of the regional 89a between the 1st 28a and the insulating component 6 surrounding wall portion 32a greater than the regional 89b between the 2nd 28b and the insulating component 6 surrounding wall portion 32a, and is offset for lamp 1 center line X1.
Consequently, can make higher circuit component 29 as much as possible away from the perisporium 8 of outer component 2, circuit component 29 will be difficult to be subject to be delivered to the heat affecting of being sent by light emitting diode 18 of perisporium 8.Meanwhile, even between the 2nd 28b and outer component 2 perisporiums 8, be provided with regional 89b, also can be in guaranteeing in a way volume.Thus, even the conductor terminal of circuit component 29 is outstanding from the 2nd 28b of distributing board 28 to regional 89b, conductor terminal also is difficult to be subject to be delivered to the heat affecting of being sent by light emitting diode 18 of perisporium 8.Thereby, can prevent that the welding portion of conductor terminal and distributing board 28 is overheated.
According to the lamp 1 in the 6th example, the distributing board 28 of lamp circuit 5 is with the 1st and the 2nd 28a, the 28b state relative with the inner peripheral surface of the surrounding wall portion 32a of insulating component 6 respectively, and is contained in the resettlement section 12 of outer component 2.Therefore, the 1st of distributing board 28 the 28a or the 2nd 28b can be not relative with the 32b of closure wall section of insulating component 6.
Therefore, need not between distributing board 28 and the 32b of closure wall section to form the roughly space of sealing, the heat that lamp circuit 5 sends or also be difficult to be gathered in the end of the resettlement section 12 that is adjacent to light source support 11 from the heat that light emitting diode 18 is delivered to light source support 11.Thereby, can prevent that light source support 11 is overheated, and can be conducive to improve the cooling performance of light emitting diode 18.
In addition, because distributing board 28 strides across lamp socket 7 from outer component 2, so the size of distributing board 28 can not be subject to the restriction of insulating component 6 internal diameters.Thus, can increase the size that determines distributing board 28 or increase circuit component 29 is arranged in the free degree on the distribution version 28, and can be easy to carry out the circuit design of lamp circuit 5.
And then, disclosed the structure that prevents from producing between outer component 2 and wire 30a, the 30b short circuit in the 6th example.
Such as Figure 14 and shown in Figure 15, a pair of through hole 16a, the 16b that are positioned at light source support 11 have respectively minor diameter part 91, large-diameter portion 92 and order difference part 93.Order difference part 93 is positioned at the border of minor diameter part 91 and large-diameter portion 92.
Chimeric respectively among through hole 16a, the 16b have an insulating cylinder 94.Insulating cylinder 94 is for example had the synthetic resin material manufacturing of electrical insulating property like this by polybutylene terephthalate.Insulating cylinder 94 strides across minor diameter part 91 and thereby large-diameter portion 92 covers through hole 16a, 16b inner face.
Insulating cylinder 94 has the inserting hole 95 that passes wire 30a, 30b.Inserting hole 95 is connected in through hole 33a, the 33b of insulating component 6.As shown in figure 15, with the through hole 33a of inserting hole 95, the edge of opening of 33b adjacency, it utilizes diameter to pass through tangent plane (chamfering) and is expanded.Thus, can with wire 30a, 30b from through hole 33a, when 33b imports to inserting hole 95, prevent that wire 30a, 30b are stuck in the edge of opening of inserting hole 95.
Insulating cylinder 94 is embedded into through hole 16a, the 16b from the supporting surface 11a direction of light source support 11.By distributing board 28 is fixed on the supporting surface 11a, and so that insulating cylinder 94 be clipped between the order difference part 93 of this distributing board 28 and through hole 16a, 16b.Thus, insulating cylinder 94 can be remained on the light source support 11.Thereby, need not insulating cylinder 94 is bonded on the light source support 11, and can be easy to carry out the assembly operation of lamp 1.
Wire 30a, 30b have the heart yearn 96 that for example uses copper cash and the insulating barrier 97 that covers this heart yearn 96.Insulating barrier 97 is removed at the leading section of wire 30a, 30b.Therefore, at the leading section of wire 30a, 30b, heart yearn 96 exposes the outside at insulating barrier 97.The heart yearn 96 that exposes by the welding etc. method be electrically connected at distributing board 28.
When removing insulating barrier 97, if produce inequality in the scope of removing insulating barrier 97, heart yearn 96 length of then exposing from insulating barrier 97 will produce change.Therefore, for example shown in Figure 15, when wire 30a was imported through hole 16a from through hole 33a, it is inboard that the heart yearn 96 that exposes can be positioned at through hole 16a.Be entrenched in insulating cylinder 94 among the through hole 16a between the heart yearn 96 that exposes and through hole 16a, and make electric insulation between the heart yearn 96 that exposes and the light source support 11.
Thereby, can utilize insulating cylinder 94 to prevent from producing short circuit between the heart yearn 96 that exposes and the light source support 11.
The heart yearn 96 that exposes inserts a pair of through hole 98 of opening to distributing board 19 from inserting hole 95, and passes through hole 98 and import on the distributing board 19.Heart yearn 96 front ends that expose are welded in the island areas (land) (not shown) that is formed on the distributing board 19.
The distributing board 28 of lamp circuit 5 is offset from lamp center line X1 as mentioned above.Thus, as shown in figure 16, can make each through hole 98 between adjacent regional 23a, the 23b and 23c, 23d of thermal diffusion layer 23.Thus, although through hole 98 runs through distributing board 19, still can not reduce the area of thermal diffusion layer 23.Thereby the heat that light emitting diode 18 can be sent is delivered to light source support 11 expeditiously by diffusion layer 23, and it is overheated to suppress light emitting diode 18.
Figure 21 to Figure 25 has disclosed the present invention's the 7th example.
Lamp 100 in the 7th example has outer component 101, light source 102, light source outer cover 103, outer cover fixator 104, lamp circuit 105, insulating component 106, lamp socket 107 and heat insulation outer cover 108.
Outer component 101 is to use the metal material that has excellent heat conductivity as aluminium to make.As shown in figure 24, outer component 101 has perisporium 110 and end wall 111.Perisporium 110 and end wall 111 form as one.It is roughly fixing cylindric that perisporium 110 forms external diameter.The outer peripheral face of perisporium 110 becomes radiating surface 112.
End wall 111 sealing perisporiums 110 1 ends.End wall 111 forms discoideus light source support 113.Light source support 113 has smooth supporting surface 114 at the opposition side of perisporium 110.
Inboard at outer component 101 forms resettlement section 116.The space that resettlement section 116 is surrounded by perisporium 110 and end wall 111 and determining, and this resettlement section 116 is positioned at radiating surface 112 inboards.Form retainer 117 in the bight that is determined by perisporium 110 and end wall 111.Retainer 117 forms circular, and it is projected into perisporium 110 inboards, and continues at the circumferencial direction of perisporium 110.
Resettlement section 116 has the openend 116a relative with end wall 111.Openend 116a is positioned at the other end of perisporium 110.Inner peripheral surface at perisporium 110 forms only groove 118 of button.Button ends groove 118 and forms circularly, and it is positioned at resettlement section 116 openend 116a and continues at the circumferencial direction of perisporium 10.
Peripheral part at end wall 111 forms recess 119.Recess 119 forms the circular of coaxial shape ambient light source support portion 113.Inner peripheral surface at recess 119 forms male screw portion 121.Also can form box thread section at recess 119 outer peripheral faces, and replace this male screw portion 121.
As shown in figure 24, the supporting surface 114 in light source support 113 forms a pair of through hole 122a, 122b and a pair of protuberance 123a, 123b.Through hole 122a, 122b are to exist spaced mode to be configured in the diametric(al) of light source support 113. Protuberance 123a, 123b form for example cylindric, and vertically outstanding from supporting surface 114.Protuberance 123a, 123b are to exist spaced mode to be configured in the diametric(al) of light source support 113.Perpendicular direction arranged side by side through hole 122a, 122b and column direction and protuberance 123a, 123b intersects.
To shown in Figure 24, light source 102 has bottom 125 (base), distributing board 126 and shaped like chips light-emitting component 127 such as Figure 21.Bottom 125 usefulness have the metal material of excellent heat conductivity and make as aluminium alloy.Distributing board 126 is overlapping with bottom 125.Light-emitting component 127 is light emitting diode for example, is installed in distributing board 126 central authorities.
Light-emitting component 127 is covered by transparent hemispherical cover glass 128.And then distributing board 126 has a plurality of island areas 129.Island areas 129 to be surrounding the mode of cover glass 128, and have the interval and and be listed in the circumferencial direction of distributing board 126.Distributing board 126 except cover glass 128 and island areas 129 parts, itself and covered by not illustrated insulating barrier.
As shown in figure 24, in the bottom 125 and distributing board 126 peripheral parts form couple of conductor insertion portion 131a, 131b and a pair of the 1st buckling parts 132a, 132b and a pair of the 2nd buckling parts 133a, 133b. Wire insertion portion 131a, 131b and the 1st buckling parts 132a, 132b and the 2nd buckling parts 133a, 133b are respectively the U-shaped otch. Wire insertion portion 131a, 131b and the 1st buckling parts 132a, 132b and the 2nd buckling parts 133a, 133b might not be otch, also can be for example circular port.
Wire insertion portion 131a, 131b and the 1st buckling parts 132a, 132b and the 2nd buckling parts 133a, 133b are the circumferencial directions that has gapped mode mutually and be listed in bottom 125 and distributing board 126.In other words, wire insertion portion 131a, 131b and the 1st buckling parts 132a, 132b and the 2nd buckling parts 133a, 133b lay respectively between the adjacent island areas 129.
Such as Figure 21 and shown in Figure 22, the bottom 125 of light source 102 is overlapping with the supporting surface 114 of light source support 113.Has flexible heat transfer plate 135 between the supporting surface 114 and bottom 125 of light source support 113.Heat transfer plate 135 is take silicon for example as the resin thin plate of principal component, and forms discoideus than light source 102 large circles.Heat transfer plate 135 is thermally coupled between the bottom 125 and light source support 113 of light source 102.
A plurality of sliding part 136a, 136b, 136c, 136d, 136e, 136f at circumferencial direction to exist spaced mode to be formed on the peripheral part of heat transfer plate 135.Sliding part 136a, 136b, 136c, 136d, 136e, 136f for example are the U-shaped otch.Sliding part 136a, 136b are corresponding to wire insertion portion 131a, 131b, and sliding part 136c, 136d are corresponding to the 1st buckling parts 132a, 132b.And then, sliding part 136e, 136f is corresponding to the 2nd buckling parts 133a, 133b.
Under heat transfer plate 135 was clipped in state between light source support 113 and the bottom 125,114 outstanding protuberance 123a, 123b were entrenched in the 1st buckling parts 132a, 132b securely by sliding part 136c, the 136d of heat transfer plate 135 from supporting surface.Chimeric by this, can stop light source 102 in circumferencial direction and the diametric movement of light source support 113.The result is, light-emitting component 127 will be positioned on the center line of outer component 101, and wire insertion portion 131a, 131b and sliding part 136a, 136b will overlap.
Such as Figure 21 and shown in Figure 22, light source outer cover 103 has lens 138 and lens fixture 139.The luminous intensity that lens 138 are used for control lamp 101 distributes (luminous intensitydistribution), and it is shaped to one by transparent materials such as glass or synthetic resin.
Lens 138 have light reflection surface 140, light emitting surface 141, recess 142 and lip portions 143.Light reflection surface 140 forms for example dome shape.Light emitting surface 141 is plane and relative with light reflection surface 140.Recess 142 to be inserting the mode of cover glass 128, from the central portion of light reflection surface 140 to light emitting surface 141 depressions.Recess 142 has the light entrance face 144 that surrounds cover glass 128.Lip portions 143 is outstanding to the diametric(al) outside of lens 138 from the outer peripheral face of lens 138.Lip portions 143 is adjacent to light emitting surface 141, and continues at the circumferencial direction of lens 138.
Lens fixture 139 is the part that separates with lens 138, and forms the cylindric of encirclement lens 138.As shown in figure 25, lens fixture 139 has a pair of fixator element 146a, 146b.Fixator element 146a, 146b are for example made by the non-light transmittance synthetic resin material with electrical insulating property, and form respectively the semicircle tubular.
Fixator element 146a, 146b have respectively a pair of protuberance 147a, 147b and a pair of recess 148a, 148b.Protuberance 147a, the 147b of one side fixator element 146a is fitted to recess 148a, the 148b of opposite side fixator element 146b.Protuberance 147a, the 147b of opposite side fixator element 146b is fitted to recess 148a, the 148b of a side fixator element 146a.Chimeric by this, fixator element 146a, 146b are mutually corresponding outstanding, and can be assembled into cylindric lens fixture 139.
Form buckling groove 149 at lens fixture 139 inner peripheral surfaces.Buckling groove 149 is positioned at along lens fixture 139 end on axially, and continues at the circumferencial direction of lens fixture 139.Along the axial other end of lens fixture 139, form receiving portion 150 and a pair of protuberance 151a, 151b.
Receiving portion 150 is relative with the peripheral part of the distributing board 126 of light source 102, and has a plurality of otch 152.Otch 152 is with mode and the compartment of terrain corresponding with the island areas 129 of light source 102 and be listed in the circumferencial direction of lens fixture 139. Protuberance 151a, 151b are corresponding with the 2nd buckling parts 133a, the 133b of light source 102, and outstanding to light source 102 from the other end of lens fixture 139.
As shown in figure 25, fixator element 146a, 146b give prominence to mutually to be clipped in the state between the lens 138.Thus, the lip portions 143 of lens 138 embeds buckling groove 149, and is clipped between fixator element 146a, the 146b.The result is that lens 138 will remain on the inboard of lens fixture 139, and an end of the light emitting surface 141 sealing lens fixtures 139 of lens 138.
Such as Figure 21 and shown in Figure 22, light source outer cover 103 and the light source support 113 of outer component 101 between clamping light source 102 is arranged.More specifically, that is, the receiving portion 150 of lens fixture 139 is connected in the distributing board 126 of light source 102 in the mode of avoiding island areas 129.And then, be entrenched in securely the 2nd buckling parts 133a, the 133b of light source 102 from lens fixture 139 outstanding protuberance 151a, 151b.Chimeric by this, can stop light source outer cover 103 mobile in circumferencial direction and the diametric(al) of light source 102.Thus, the cover glass 128 that is used for covering luminous element 127 enters the recess 142 of lens 138, and wire insertion portion 131a, 131b or the 1st buckling parts 132a, 132b overlap with the otch 152 of receiving portion 150.
Therefore, light source outer cover 103 in the optical axis X2 of as shown in figure 21 lens 138 and light-emitting component 127 mode consistent with each other, determines the position with respect to light source 102.
As shown in figure 21, outer cover fixator 104 is cylinder or angle tubular by the metal material moulding that has excellent heat conductivity as aluminium alloy.Outer cover fixator 104, its external diameter equate with the external diameter of outer component 101, and have internal diameter and the length that can cover continuously light source 102 and light source outer cover 103.
Form press section 155 at outer cover fixator 104 1 ends.Press section 155 is inner peripheral surface from outer cover fixator 104 side-prominent bead in diametric(al).Other end existence at outer cover fixator 104 forms the circular connecting portion of coaxial shape 156.Connecting portion 156 is outstanding to the recess 119 of outer component 101 from the other end of outer cover fixator 104.The diameter of connecting portion 156 is less than the diameter of outer cover fixator 104.Border at this connecting portion 156 and outer cover fixator 104 other ends forms order difference part 157.Order difference part 157 has the plane that the circumferencial direction at outer cover fixator 104 continues.
Inner peripheral surface at connecting portion 156 forms box thread section 158.Box thread section 158 can be screwed into the male screw portion 121 of recess 119.Form box thread section when replacing the situation of male screw portion 121 at the outer peripheral face of recess 119, also can form male screw portion at the outer peripheral face of connecting portion 156.
Outer cover fixator 104 by box thread section 158 being screwed into the male screw portion 121 of recess 119, is linked to outer component 101 thereby be coaxial shape.Follow being screwed into of outer cover fixator 104, the press section 155 of outer cover fixator 104 can touch an end of lens fixture 139.Thus, lens fixture 139 will be to light source support 113 extruding of outer component 102.So, the press section 155 of outer cover fixator 104 remain and light source 102 between clamping light source outer cover 103.
Such as Figure 21 and shown in Figure 22, when outer cover fixator 104 was connected in outer component 102, the peripheral part of the end wall 111 of outer component 102 then can touch the order difference part 157 of outer cover fixator 104.Thus, outer component 102 can increase with the contact area of outer cover fixator 104, and the heat conduction path from outer component 102 to outer cover fixator 104 can increase.
Lamp circuit 105 is used for light-emitting component 127 is thrown light on, and it is housed in the resettlement section 116 of outer component 102.By lamp circuit 105 being housed in outer component 101 inboards, and need not with this outer member 101 and lamp circuit 105 mutually be configured in side by side lamp 100 axially.Thus, the axial length of lamp 100 is shortened, and can obtain miniature lamp 100.
As shown in figure 21, lamp circuit 105 has distributing board 160 and a plurality of circuit component 161.Lamp circuit 105 is electrically connected at light source 102 by two wire 162a, 162b as shown in figure 24.Wire 162a, 162b are on wire insertion portion 131a by light source 102 of through hole 122a, the 122b of light source support 113, distributing board 126 that 131b imports to light source 102. Wire 162a, 162b front end are welded on respectively on two island areas 129.
Insulating component 106 is an example of the insulating barrier of electric insulation between outer component 101 and lamp circuit 105.Insulating component 106 products formed for using the such synthetic resin material of polybutylene terephthalate for example to make.As shown in figure 21, insulating component 106 forms cup-shaped, this cup-shaped 163b of closure wall section that has surrounding wall portion 163a cylindraceous, reaches this surrounding wall portion of sealing 163a one end.
Insulating component 106 embeds in the resettlement section 116 from the openend 116a of resettlement section 116.Thus, the inner peripheral surface of the perisporium 110 of the surrounding wall portion 163a of insulating component 116 contact outer component 101, and the 163b of closure wall section of insulating component 116 touches retainer 117.Retainer 117 is between the 163b of closure wall section of light source support 113 and insulating component 116.So light source support 113 is spaced from each other with the 163b of closure wall section, and in the above-mentioned space 165 that exists between the two.
Owing to have space 165, therefore thermally coupled light source support 113 in light source 102 can be remained the state that does not contact insulating component 106.So heat conducting heat insulationly work with the space will 106 be carried out from light source support 113 to insulating component as overslaugh in space 165, the heat that light source 102 sends is difficult to directly be delivered to insulating component 106 from light source support 113.
Thereby, although within the outer component 101 of the heat that receives light source 102, contain lamp circuit 105, still can protect lamp circuit 105 and the heat of light source 102 to separate.Thus, the faulty operation of lamp circuit 105 can be prevented, and the life-span of lamp circuit 105 can be prolonged.
The 163b of closure wall section of insulating component 106 has not illustrated a pair of through hole.Because by wire 162a, 162b, therefore will run through the 163b of closure wall section and to the resettlement section 116 and space 165 openings in the through hole.
Lamp socket 107 is used for electric current supply to lamp circuit 105.Lamp socket 107 has metal outer cover of lamp holder 167 and is fixed on the connecting elements 168 of outer cover of lamp holder 167.Outer cover of lamp holder 167 is connected on the lamp socket of ligthing paraphernalia in detachable mode.Lamp 100 described in the 7th example as shown in figure 21, is installed on the lamp socket with lamp socket 107 state up.
Connecting elements 168 products formed for using the such synthetic resin material of polybutylene terephthalate for example to make.Connecting elements 168 has electrical insulating property, and its thermal conductivity is lower than outer component 101.
Connecting elements 168 has the leading section 169 of the openend 116a inboard that embeds resettlement section 116.Form fastening projection 170 at leading section 169 outer peripheral faces.When leading section 169 is embedded rear flank in the openend 116a, groove 118 fastens with only detaining to fasten projection 170.By this fastening, outer component 101 is connected with coaxial shape with lamp socket 107.And then connecting elements 168 is between outer cover of lamp holder 167 and outer component 101, and between is electrically insulated and heat insulation.
As shown in figure 21, connecting elements 168 has diameter greater than the peripheral part 171 of leading section 169.Peripheral part 171 is to be coaxial shape in the diametric(al) outside of outer component 101 to give prominence to.Peripheral part 171 at connecting elements 168 forms circular supporting walls 172.Supporting walls 172 surrounds the leading section 169 of connecting elements 168 with coaxial shape.Outer peripheral face at supporting walls 172 forms male screw portion 173.
The products formed of heat insulation outer cover 108 for using synthetic resin material for example to make, and form the cylindric of hollow.The thermal conductivity of heat insulation outer cover 108 is lower than outer component 101.As shown in figure 21, heat insulation outer cover 108 has internal diameter and the length that can surround with coaxial shape outer component 101 and outer cover fixator 104.
Inner peripheral surface at heat insulation outer cover 108 1 ends forms box thread section 174.And then, at the other end formation buckling parts 175 of heat insulation outer cover 108.Buckling parts 175 is inner peripheral surface from the other end of heat insulation outer cover 108 side-prominent bead in diametric(al).Buckling parts 175 internal diameters are less than the external diameter of outer cover fixator 104.
The box thread section 174 of heat insulation outer cover 108 is screwed into the male screw portion 173 of connecting elements 168.Be screwed into by this, the buckling parts 175 of heat insulation outer cover 108 will be stuck in an end of outer cover fixator 104.Thus, heat insulation outer cover 108 surrounds the state of outer position 101 and outer cover fixator 104 with coaxial shape, and is connected in the connecting elements 168 of lamp socket 107.
Forming thermal dissipating path 176 between heat insulation outer cover 108 and the outer component 101 and between heat insulation outer cover 108 and the outer cover fixator 104.Thermal dissipating path 176 surrounds outer component 101 and outer cover fixator 104, and axially continuing at lamp 100.
Thermal dissipating path 176 1 ends are by peripheral part 171 sealings of connecting elements 168.Peripheral part 171 at connecting elements 168 forms a plurality of exhaust outlets 177.Exhaust outlet 177 is located on the circumferencial direction of connecting elements 168 side by side in the mode that has the interval, and is communicated in an end of thermal dissipating path 176.The other end of thermal dissipating path 176 is by buckling parts 175 sealings of heat insulation outer cover 108.Buckling parts 175 at heat insulation outer cover 108 forms a plurality of air entries 178.Air entry 178 to be existing spaced mode to be located at side by side on the circumferencial direction of heat insulation outer cover 108, and is communicated in the other end of thermal dissipating path 176.
In the 7th example, at the buckling parts 175 formation air entries 178 of heat insulation outer cover 108.The other end at heat insulation outer cover 108 forms a plurality of protuberances that join with outer cover fixator 104 1 ends, and the space between the protuberance of adjacency is replaced this air entry 178 as air entry.Equally, also can be formed at the other end of heat insulation outer cover 108 a plurality of through holes of thermal dissipating path 176 upper sheds, and with through hole as air entry.
And then, be formed on a plurality of through holes of thermal dissipating path 176 upper sheds at an end of heat insulation outer cover 108, and above-mentioned through hole replaced the exhaust outlet 177 of formation in lamp socket 107 as exhaust outlet.
Secondly, the assembling sequence with regard to lamp 100 is illustrated.
At first, embed insulating components 106 in the resettlement section 11 of outer component 101, and the resettlement section 116 inboard collecting point circuit for lamp 105 that cover at insulating component 106 thus.Secondly, will import to from two wire 162a, the 162b that lamp circuit 105 is drawn through hole 122a, the 122b of light source support 113 from the through hole of the 163b of closure wall section.
After this, heat transfer plate 135 is loaded on the supporting surface 114 of light source support 113, and the bottom 125 of light source 102 is overlapped on the heat transfer plate 135.At this moment, protuberance 123a, the 123b of light source support 113 embedded the 1st buckling parts 132a, the 132b of light source 102 by sliding part 136c, the 136d of heat transfer plate 135.Thus, determined the relative position of light source 102 with light source support 113.And then, wire 162a, the 162b that imports to through hole 122a, 122b imported to two island areas 129 of adjacency by wire insertion portion 131a, the 131b of light source 102, and be welded in above-mentioned island areas 129.
Secondly, light source outer cover 103 is loaded on the distributing board 126 of light source 102.At this moment, make the 2nd buckling parts 133a, the 133b that is fitted to light source 102 from lens fixture 139 outstanding protuberance 151a, 151b.Chimeric by this, determined the relative position of light source 102 with light source outer cover 103.Thereby the optical axis X2 of lens 138 will be consistent with the center of light-emitting component 127, and the receiving portion 150 meeting conflicts of lens fixture 139 are to the peripheral part of distributing board 126.
Secondly, the male screw portion 121 by the box thread section 158 with outer cover fixator 104 is screwed into outer component 102 is connected in outer component 101 with this outer cover fixator 104 with coaxial shape thus.Follow the connection of outer cover fixator 104, will a conflict end of lens fixture 139 of the press section 155 of outer cover fixator 104, and with lens fixture 139 extruding to light source support 113.Its result, light source 102 scioptics fixators 139 are expressed to the supporting surface 114 of light source support 113, and heat transfer plate 135 is clipped between the bottom 125 of supporting surface 114 and light source 102 securely.
Because heat transfer plate 135 produces strain, therefore will be close to this supporting surface 114 and bottom 125.Thus, get rid of the heat conducting space of 125 of overslaugh supporting surface 114 and bottoms, and heat is conducted between supporting surface 114 and bottom 125 well.In other words, compare with the situation of not using heat transfer plate 135, can improve from light source 102 to light source support 113 heat conductivility.
Meanwhile, return to the bounce of original form by making heat transfer plate 135 elasticity, make the interlock of box thread section 158 and male screw portion 121 become strong.Thus, outer cover fixator 104 will be difficult to relax.
During situation that for example precision in supporting surface 114 and bottom 125 is higher, can save heat transfer plate 135.And then, also can use with silicon for example to replace heat transfer plate 135 as the electric conductivity grease of principal component.
When light source 102 is pressed to light source support 113, with outer cover fixator 104 be screwed into and revolving force, will act on light source outer cover 103 and light source 102.Light source 102 as mentioned above, chimeric by protuberance 123a, 123b and the 1st buckling parts 132a, 132b, determine and light source support 113 between relative position.Equally, even be light source outer cover 103, also can be by the chimeric relative position that decides light source 102 of protuberance 151a, 151b and the 2nd buckling parts 133a, 133b.
Therefore, light source outer cover 103 and light source 102 can not rotate along with outer cover fixator 104.Thereby the excessive strength that causes producing broken string and crack can not be applied to the island areas 129 of light source 102 and the welding portion of wire 162a, 162b.Thereby the welding portion stress application of guiding line 162a, 162b and island areas 129 also can not assembled this lamp 100.
Secondly, lamp socket 107 is installed in outer component 101.Installation exercise carries out as follows,, the leading section 169 of lamp socket 107 is embedded the openend 116 of outer components 101 that is, and makes and fasten projection 170 and be fastened on and end groove 118.
When lamp socket 107 was installed in outer component 101, lamp circuit 105 was subject to sometimes by the strength of connecting portion material 168 extruding of lamp socket 107 to light source support 113 directions.This power is delivered to light source 102 by wire 162a, 162b.
Light source 102 is clipped between light source outer cover 103 and the light source support 113.Therefore, namely exerting all one's strength is applied to light source 102 by wire 162a, 162b, and light source 102 also can not break away from the supporting surface 114 of light source support 113.Therefore, can keep the compactness between light source 102 and the light source support 113, and also can make the optical axis X2 of lens 138 can not depart from luminous sub-prime 127 centers.
At last, heat insulation outer cover 108 is mounted and fixed on the outside of outer component 101 and outer cover fixator 104, and the box thread section 174 of heat insulation outer cover 108 is screwed into the male screw portion 173 of connecting elements 168.Be screwed into by this, the buckling parts 175 of heat insulation outer cover 108 can be stuck in an end of outer cover fixator 104.Its result surrounds the outer position 101 of heat insulation outer cover 108 and the stateful connection lamp socket 107 of outer cover fixator 104 with coaxial shape, thereby finishes the assembling of lamp 100.
Under the state of finishing assembling lamp 100, the thermal dissipating path 176 that will be arranged in heat insulation outer cover 108 inboards is opened in atmosphere by air entry 178 and exhaust outlet 177.
In the lamp 100 of the 7th example, if lamp 100 is thrown light on, then light-emitting component 127 will generate heat.The heat that light-emitting component 127 sends can be delivered to light source support 113 by heat transfer plate 135 from the bottom 125 of light source 102.The heat that is delivered to light source support 113 is delivered to radiating surface 112 from end wall 110 by perisporium 110, and is dispersed into thermal dissipating path 176 from this radiating surface 112.
Because receive the light source support 113 of the heat that light-emitting component 127 sends, it is shaped to one with the perisporium 110 with radiating surface 112, so do not have the heat conducting bonding part of overslaugh from light source support 113 to radiating surface on 112 the heat conduction path.So, the thermal resistance of heat conduction path can be suppressed for less, and the heat that can expeditiously the light-emitting component 127 that is delivered to this light source support 113 be sent is dispersed into radiating surface 112.Meanwhile, because all surfaces of radiating surface 112 all is exposed to thermal dissipating path 176, therefore can overslaugh not dispel the heat from radiating surface 112.Thereby, can improve the cooling performance of light-emitting component 127.
And then, because metal-made outer cover fixator 104 is screwed into outer component 101, therefore can make outer component 101 and outer cover fixator 104 thermally coupled by the occlusion portion of box thread section 174 and male screw portion 173.So the heat of outer component 101 also can be delivered to outer cover fixator 104, and from then on the outer peripheral face of outer cover fixator 104 is dispersed into thermal dissipating path 176.Therefore, can utilize outer cover fixator 104 to increase the area of dissipation of lamp 100, and can further improve the cooling performance of this light-emitting component 127.
As shown in figure 21, if the heat of light-emitting component 127 is distributed at thermal dissipating path 176, then will produce ascending air at thermal dissipating path 176.Thus, the air of lamp 100 outsides then sucks thermal dissipating path 176 by the air entry 178 that is positioned at lamp 100 lower ends.Suck the air of thermal dissipating path 176, flow through behind the thermal dissipating path 176 in mode from top to bottom, be discharged to the atmosphere from exhaust outlet 177.
The radiating surface 112 of the outer peripheral face of outer cover fixator 104 and outer component 101 is to be exposed to thermal dissipating path 176.So, be delivered to the heat of the light-emitting component 127 of outer cover fixator 104 and outer component 101, will carry out heat exchange by the air with the thermal dissipating path 176 of flowing through and distribute.Thus, can make outer cover fixator 104 and outer component 101 coolings by air, and it is overheated to suppress this light-emitting component 127.Thereby the luminous efficiency that can suppress light-emitting component 127 descends, and can prolong the life-span of light-emitting component 127.
Covering the heat insulation outer cover 108 of outer cover fixator 104 and outer component 101, is the synthetic resin material manufacturing that is lower than outer component 101 by thermal conductivity.Therefore, the heat of outer cover fixator 104 and outer component 101 will be difficult to be delivered to heat insulation outer cover 108, and make the temperature of heat insulation outer cover 108 be lower than outer component 101.
According to the 7th example, the connecting elements 168 that is screwed into heat insulation outer cover 108 is made for synthetic resin, so connecting elements 168 heat insulation between outer component 101 and heat insulation outer cover 108.And then the buckling parts 175 that is contacted with the heat insulation outer cover 108 of outer cover fixator 104 has air entry 178.Thus, even the heat of outer cover fixator 104 is delivered to the buckling parts 175 of heat insulation outer cover 108, buckling parts 175 also can cool off by the air that flows into thermal dissipating path 176 from air entry 178.Thereby heat insulation outer cover 108 will be difficult to be subject to the heat affecting of outer cover fixator 104, and can suppress the temperature rising of heat insulation outer cover 108.
According to the lamp 100 of the 7th example, when carrying out at once the situation of lamp replacing when for example lamp 100 is lit a lamp or after turning off the light, the operator namely uses hand to catch heat insulation outer cover 108, also can not feel boiling hot.Thus, can not produce the operator because too boiling hot and misgivings that lamp 100 will be dropped, and can carry out safely the replacing operation of lamp 100.
In the 7th example, also can form a plurality of minute apertures at heat insulation outer cover 108.And then, also can along heat insulation outer cover 108 axially or circumferencial direction form a plurality of slits and replace the hole.
Figure 26 and Figure 27 have disclosed the present invention's the 8th example.
In the 8th example, the structure that is used for distributing the heat of outer component 101 and outer cover fixator 104 is different from the 7th example.In addition, the structure of the lamp 100 and useful technique effect that obtains of structure is all same with the 7th example thus.Thus, pay same reference marks for the component part identical with the 7th example in the 8th example, and the description thereof will be omitted.
Lamp 100 described in the 8th example replaces the heat insulation outer cover 108 of the 7th example and has following structure.Such as Figure 26 and shown in Figure 27, outer component 101 has a plurality of the 1st fin 200.The 1st fin 200 is given prominence to radial from the radiating surface 112 of outer component 101.The 1st fin 200 extends at the direction of principal axis of outer component 101, and arranged side by side on the circumferencial direction of outer component 101 there to be spaced mode.
Outer cover fixator 104 has a plurality of the 2nd fin 201.The 2nd fin 201 is radial outstanding from the outer peripheral face of outer cover fixator 104.The 2nd fin 201 extends axially along outer cover fixator 104, and to exist spaced mode side by side on the circumferencial direction of outer cover fixator 104.
The 1st fin 200 and the 201 mutual axial continuities along lamp 100 of the 2nd fin.Thus, the 1st and the 2nd fin 200,201 mutually thermally coupled, and directly expose in lamp 100 outsides.
The front-end edge of the 1st fin 200 is covered by the 1st edge outer cover 202.Equally, the 2nd fin 201 front-end edges are covered by the 2nd edge outer cover 203.The the 1st and the 2nd edge outer cover 202,203 is made by the synthetic resin material.The the 1st and the 2nd edge outer cover 202,203 thermal conductivity also are lower than outer component 101 and outer cover fixator 104.
According to the lamp 100 of the 8th example, because having the 1st fin 200, and can increase the area of dissipation of the radiating surface 112 of outer component 101.Equally, because there being the 2nd fin 201, and can increase the area of dissipation of the outer peripheral face of outer cover fixator 104.Thus, the heat that is delivered to the light-emitting component 127 of outer component 101 and outer cover fixator 104 can be dispersed into expeditiously lamp 100 outsides.Thereby the luminous efficiency that can suppress light-emitting component 127 descends, and can prolong the life-span of light-emitting component 127.
And then the 1st and the 2nd edge outer cover 202,203 thermal conductivity are lower than outer component 101 and outer cover fixator 104, and the 1st and the 2nd edge outer cover 202,203 is used for covering the 1st and the 2nd fin 200,201 front-end edge.Therefore, the heat of outer component 101 and outer cover fixator 104 will be difficult to be delivered to the 1st and the 2nd edge outer cover 202,203, and can make the 1st and the 2nd edge outer cover 202,203 temperature be lower than outer component 101 and outer cover fixator 104.
The result is when changing lamp at once when for example lamp 100 is lit a lamp or after turning off the light, even the operator catches the 1st and the 2nd fin 200,201 with hand, also can not feel boiling hot.Thereby can there be the operator because feel too boiling hot and misgivings that lamp 100 is dropped, and can changes safely lamp 100.
Figure 28 and Figure 29 disclose the present invention's the 9th example.
The 9th example is the situation that the 8th example further develops, identical in the structure of lamp 100 and the 8th example.Thus, pay identical reference marks for the structure division identical with the 8th example in the 9th example, and the description thereof will be omitted.
Lamp 100 described in the 9th example has and surrounds the 1st and the 2nd fin 200,201 urceolus 220.Urceolus 220 forms diameter greater than the hollow cylindrical of outer component 101 and outer cover fixator 104.Urceolus 220 has the length of crossing over outer cover fixator 104 from the perisporium 110 of outer component 101.The inner peripheral surface of urceolus 220 and the 1st and the 2nd edge outer cover 202,203 join.Thus, urceolus 220 is crossed between adjacent the 1st and the 2nd fin 200,201.
In other words, urceolus 220 clampings the 1st fin 200 and relative with radiating surface 112, and clamping the 2nd fin 201 and relative with the outer peripheral face of outer cover fixator 104.Thus, forming thermal dissipating path 221 between the radiating surface 112 of outer component 101 and the urceolus 220 and between the outer peripheral face of outer cover fixator 104 and the urceolus 220.Thermal dissipating path 221 is in the axially continuity of lamp 100.The the 1st and the 2nd fin 200,201 is exposed to thermal dissipating path 221.Thermal dissipating path 221 has an end 221a and other end 221b.When with lamp socket 107 state up lamp 100 being lit a lamp, an end 221a of thermal dissipating path 221 is from the lower end of the 2nd fin 201 and at the atmosphere split shed.Equally, when with lamp socket 107 state up lamp 100 being lit a lamp, the other end 221b of thermal dissipating path 221 from the upper end of the 1st fin 200 at the atmosphere split shed.
Urceolus 220 is the material manufacturings that are lower than outer component 101 and outer cover fixator 104 by thermal conductivity.Comparatively ideally be, for example, when using heat-shrinkable synthetic resin material to form urceolus 220, urceolus 220 be mounted and fixed on after outer component 101 and outer cover fixator 104 outsides, heat again urceolus 220 and make its thermal contraction.Thus, the inner peripheral surface of urceolus 220 will be extruded to the 1st and the 2nd edge outer cover 202,203, and urceolus 220 will be combined as a whole with outer component 101 and outer cover fixator 104.Thereby, can be easy to carry out the installation exercise of urceolus 220.
In the lamp 100 described in the 9th example, if the heat of light-emitting component 127 is dispersed into thermal dissipating path 221, then will produce ascending air at thermal dissipating path 221.Thus, the air of lamp 100 outsides will be sucked by an end 221a of thermal dissipating path 221.Be drawn into the air in the thermal dissipating path 221, flow through after the thermal dissipating path 221 in mode from bottom to top, be dispersed into the atmosphere from the other end 221b of thermal dissipating path 221.
Thus, be delivered to the heat of the light-emitting component 127 of outer cover fixator 104 and outer component 101, it carries out heat exchange by the air with the thermal dissipating path 221 of flowing through and distributes.Thus, outer cover fixator 104 cooling that can make the outer component 101 with the 1st fin 200 and have the 2nd fin 201 by air, and it is overheated to suppress light-emitting component 127.Thereby the luminous efficiency that can suppress light-emitting component 127 descends, and can prolong the life-span of light-emitting component 127.
Moreover urceolus 220 is synthetic resin system, and its thermal conductivity is lower than outer component 101 and outer cover fixator 104.So the heat of outer component 101 and outer cover fixator 104 will be difficult to be delivered to urceolus 220, and can make the temperature of urceolus 220 be lower than outer component 101 and outer cover fixator 104.
The result is when changing lamp at once when for example lamp 100 is lit a lamp or after turning off the light, even the operator catches urceolus 220 with hand, also can not feel boiling hot.Thus, can there be the operator because too boiling hot and misgivings that lamp 100 is dropped, and can changes safely lamp 100.
Therefore, have the knack of this person and can understand other advantages and modification, in the broadest sense, the present invention is not limited thereto concrete example and the typical example that the place is disclosed and described.So, in the situation of the aim that does not break away from additional claim and corresponding person thereof or scope, can carry out various modifications.

Claims (4)

1. lamp is characterized in that described lamp comprises:
Outer component with thermal conductivity, above-mentioned outer component comprise light source support and the radiating surface that exposes in the outside of above-mentioned lamp, and above-mentioned light source support and above-mentioned radiating surface form one with thermally conductive materials;
Be arranged on the lamp socket of above-mentioned outer component;
Wiring substrate, assembling the light source that on above-mentioned light source support, supports, above-mentioned wiring substrate is to utilize screw to be fixed to above-mentioned light source support, and to above-mentioned light source the heating when lighting a lamp to carry out heat conducting mode thermally coupled in above-mentioned light source support, above-mentioned light source is installed on wiring substrate, the rear side of above-mentioned wiring substrate is connected in the smooth surface of above-mentioned light source support, is supported in by this above-mentioned outer component; And
Be arranged on translucent cover on the above-mentioned light source support in the mode that covers above-mentioned light source,
Above-mentioned outer component comprises the resettlement section that is arranged on above-mentioned radiating surface inboard, and the lamp circuit that above-mentioned light source is lit a lamp is taken in above-mentioned resettlement section,
Above-mentioned resettlement section is covered by electric insulation layer,
And above-mentioned outer component comprises above-mentioned light source support and above-mentioned resettlement section end wall spaced apart from each other is provided with the heat insulation space of using between above-mentioned end wall and above-mentioned electric insulation layer.
2. lamp as claimed in claim 1 is characterized in that,
Above-mentioned outer component comprises the recess around above-mentioned light source support, above-mentioned translucent cover comprises the edge that embeds above-mentioned recess, and utilize the bonding agent be filled in above-mentioned recess and the edge of above-mentioned translucent cover is fixed in the above-mentioned recess, the above-mentioned recess that is filled with above-mentioned bonding agent is compared the opposition side of more being partial to above-mentioned translucent cover with above-mentioned light source.
3. lamp as claimed in claim 2 is characterized in that,
Above-mentioned light source support comprises with above-mentioned recess compares the protuberance of more giving prominence to towards above-mentioned translucent cover, and raised part comprises the front end face that exposes in above-mentioned translucent cover inboard, and above-mentioned light source is arranged on above-mentioned front end face.
4. lamp as claimed in claim 1 is characterized in that,
Above-mentioned light source is light emitting diode.
CN2009101761102A 2005-04-08 2006-04-07 Lamp Active CN101660740B (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2005112339 2005-04-08
JP2005112339 2005-04-08
JP2005-112339 2005-04-08
JP2005-221688 2005-07-29
JP2005221688 2005-07-29
JP2005221571A JP4482706B2 (en) 2005-04-08 2005-07-29 Light bulb lamp
JP2005221688A JP4725231B2 (en) 2005-04-08 2005-07-29 Light bulb lamp
JP2005-221571 2005-07-29
JP2005221571 2005-07-29
JP2005-371406 2005-12-26
JP2005371406 2005-12-26
JP2005371406A JP4569465B2 (en) 2005-04-08 2005-12-26 lamp

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100667788A Division CN100559073C (en) 2005-04-08 2006-04-07 Lamp

Publications (2)

Publication Number Publication Date
CN101660740A CN101660740A (en) 2010-03-03
CN101660740B true CN101660740B (en) 2013-03-13

Family

ID=37519134

Family Applications (5)

Application Number Title Priority Date Filing Date
CN2009101761117A Active CN101660741B (en) 2005-04-08 2006-04-07 Lamp
CN200910176108A Pending CN101660738A (en) 2005-04-08 2006-04-07 Lamp
CN2009101761102A Active CN101660740B (en) 2005-04-08 2006-04-07 Lamp
CNB2006100667788A Active CN100559073C (en) 2005-04-08 2006-04-07 Lamp
CN200910176109XA Active CN101660739B (en) 2005-04-08 2006-04-07 Lamp

Family Applications Before (2)

Application Number Title Priority Date Filing Date
CN2009101761117A Active CN101660741B (en) 2005-04-08 2006-04-07 Lamp
CN200910176108A Pending CN101660738A (en) 2005-04-08 2006-04-07 Lamp

Family Applications After (2)

Application Number Title Priority Date Filing Date
CNB2006100667788A Active CN100559073C (en) 2005-04-08 2006-04-07 Lamp
CN200910176109XA Active CN101660739B (en) 2005-04-08 2006-04-07 Lamp

Country Status (2)

Country Link
JP (4) JP4465640B2 (en)
CN (5) CN101660741B (en)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101660741B (en) * 2005-04-08 2013-11-06 东芝照明技术株式会社 Lamp
JP4849305B2 (en) * 2005-04-08 2012-01-11 東芝ライテック株式会社 Bulb-type lamp
US7758223B2 (en) 2005-04-08 2010-07-20 Toshiba Lighting & Technology Corporation Lamp having outer shell to radiate heat of light source
US10228093B2 (en) * 2015-08-17 2019-03-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb and LED filament thereof
JP4569683B2 (en) * 2007-10-16 2010-10-27 東芝ライテック株式会社 Light emitting element lamp and lighting apparatus
JP4945433B2 (en) * 2007-12-28 2012-06-06 シャープ株式会社 Lighting device
DE102008039365A1 (en) * 2008-08-22 2010-03-04 Osram Gesellschaft mit beschränkter Haftung lighting device
DE102009008637B4 (en) * 2009-02-12 2022-05-12 Ledvance Gmbh lighting device
JP5333758B2 (en) 2009-02-27 2013-11-06 東芝ライテック株式会社 Lighting device and lighting fixture
US8434883B2 (en) * 2009-05-11 2013-05-07 SemiOptoelectronics Co., Ltd. LLB bulb having light extracting rough surface pattern (LERSP) and method of fabrication
KR20120027401A (en) * 2009-05-28 2012-03-21 코닌클리즈케 필립스 일렉트로닉스 엔.브이. Illumination device and method for assembly of an illumination device
JP4957927B2 (en) * 2009-05-29 2012-06-20 東芝ライテック株式会社 Light bulb shaped lamp and lighting equipment
DE102009024904A1 (en) 2009-06-15 2010-12-16 Osram Gesellschaft mit beschränkter Haftung Heat sink for semiconductor light elements
DE102009024907A1 (en) * 2009-06-15 2010-12-16 Osram Gesellschaft mit beschränkter Haftung Heat sink for semiconductor light elements
JP5348410B2 (en) * 2009-06-30 2013-11-20 東芝ライテック株式会社 Lamp with lamp and lighting equipment
JP5354191B2 (en) * 2009-06-30 2013-11-27 東芝ライテック株式会社 Light bulb shaped lamp and lighting equipment
JP2011049527A (en) 2009-07-29 2011-03-10 Toshiba Lighting & Technology Corp Led lighting equipment
DE102009035515A1 (en) * 2009-07-31 2011-02-03 Osram Gesellschaft mit beschränkter Haftung Lighting device and method for producing a lighting device
JP2011071242A (en) 2009-09-24 2011-04-07 Toshiba Lighting & Technology Corp Light emitting device and illuminating device
WO2011037655A1 (en) 2009-09-24 2011-03-31 Molex Incorporated Light module system
CN102032479B (en) 2009-09-25 2014-05-07 东芝照明技术株式会社 Bulb-shaped lamp and illuminator
JP2011091033A (en) * 2009-09-25 2011-05-06 Toshiba Lighting & Technology Corp Light-emitting module, bulb-shaped lamp and lighting equipment
CN102032481B (en) 2009-09-25 2014-01-08 东芝照明技术株式会社 Lamp with base and lighting equipment
US8678618B2 (en) 2009-09-25 2014-03-25 Toshiba Lighting & Technology Corporation Self-ballasted lamp having a light-transmissive member in contact with light emitting elements and lighting equipment incorporating the same
CN104075294B (en) * 2009-10-12 2017-04-12 莫列斯公司 Light-emitting module system
CN102042517A (en) * 2009-10-16 2011-05-04 富士迈半导体精密工业（上海）有限公司 Lighting device
US8829771B2 (en) 2009-11-09 2014-09-09 Lg Innotek Co., Ltd. Lighting device
US8471443B2 (en) * 2009-11-09 2013-06-25 Lg Innotek Co., Ltd. Lighting device
EP2508797A4 (en) * 2009-12-03 2013-08-28 With Ltd Liability Dis Plus Soc Method for producing a led lamp, led lamp obtained by said method, and radiator for said lamp
JP5223121B2 (en) * 2009-12-11 2013-06-26 豊田合成株式会社 Light source unit for vehicles
US8342733B2 (en) * 2009-12-14 2013-01-01 Tyco Electronics Corporation LED lighting assemblies
US8523411B2 (en) 2010-02-23 2013-09-03 Panasonic Corporation Light source device
JP5257622B2 (en) 2010-02-26 2013-08-07 東芝ライテック株式会社 Light bulb shaped lamp and lighting equipment
DE102010009608A1 (en) * 2010-02-27 2011-09-01 Abb Ag Flush-mounted LED light, especially ceiling light
CN201715285U (en) * 2010-03-10 2011-01-19 南京汉德森科技股份有限公司 Pressure-casting LED energy-saving lamp
CN102213403A (en) * 2010-04-09 2011-10-12 亿光电子工业股份有限公司 Light-emitting diode (LED) lamp
JP5082083B2 (en) * 2010-04-15 2012-11-28 株式会社リキッド・デザイン・システムズ LED lighting device
JP4865051B2 (en) * 2010-04-20 2012-02-01 シャープ株式会社 PAR type lighting device
JP4854798B2 (en) * 2010-05-31 2012-01-18 シャープ株式会社 Lighting device
JP4926262B2 (en) * 2010-05-31 2012-05-09 シャープ株式会社 Lighting device
SE534698C2 (en) * 2010-06-08 2011-11-22 Rocan System Ab Device and method for indicating whether a fastening element when fastened in one piece has reached a tensile limit load
CN102374418B (en) * 2010-08-20 2014-08-20 光宝电子(广州)有限公司 Luminous diode light fixture
CN102374419A (en) * 2010-08-20 2012-03-14 光宝科技股份有限公司 Led lamp
JP2012059475A (en) * 2010-09-07 2012-03-22 Toshiba Lighting & Technology Corp Lighting fixture
JP5565583B2 (en) * 2010-09-27 2014-08-06 東芝ライテック株式会社 Light bulb shaped lamp and lighting equipment
CN102454889A (en) * 2010-10-22 2012-05-16 苏州盟泰励宝光电有限公司 LED lighting lamp
CN102454885A (en) * 2010-10-22 2012-05-16 苏州盟泰励宝光电有限公司 ED (light emitting diode) illuminating lamp
CN102454890A (en) * 2010-10-22 2012-05-16 苏州盟泰励宝光电有限公司 Light-emitting diode (LED) illuminating lamp
EP2450613B1 (en) 2010-11-08 2015-01-28 LG Innotek Co., Ltd. Lighting device
CN102022656B (en) * 2010-12-25 2013-08-21 鸿富锦精密工业（深圳）有限公司 LED illuminating lamp
TWI416045B (en) * 2010-12-30 2013-11-21 Hon Hai Prec Ind Co Ltd Led lamp
KR101713059B1 (en) * 2011-01-25 2017-03-08 삼성전자 주식회사 Illumination apparatus employing light emitting device
US8922108B2 (en) * 2011-03-01 2014-12-30 Cree, Inc. Remote component devices, systems, and methods for use with light emitting devices
KR101823677B1 (en) * 2011-04-21 2018-01-30 엘지이노텍 주식회사 Led lighting apparatus
KR101827717B1 (en) 2011-07-08 2018-02-09 엘지이노텍 주식회사 Lighting device
KR101847048B1 (en) 2011-07-08 2018-04-09 엘지이노텍 주식회사 Lighting device
JP5066304B1 (en) * 2011-07-22 2012-11-07 パナソニック株式会社 lamp
WO2013014819A1 (en) * 2011-07-22 2013-01-31 パナソニック株式会社 Lamp
US9127817B2 (en) 2011-08-26 2015-09-08 Lg Innotek Co., Ltd. Lighting device with removable heat sink housing a power supply
KR101892708B1 (en) 2011-09-21 2018-08-28 엘지이노텍 주식회사 Lighting device
KR101971124B1 (en) 2011-09-21 2019-04-22 엘지이노텍 주식회사 Lighting device
KR101879215B1 (en) 2011-10-21 2018-07-17 엘지이노텍 주식회사 Light Source Segregation Type Lighting Device
KR101944045B1 (en) 2011-12-26 2019-01-30 엘지이노텍 주식회사 A wide-angle lens for lighting and lighting device using the same
JP5451947B2 (en) * 2012-01-12 2014-03-26 パナソニック株式会社 Lamp part, lamp and method of manufacturing lamp
CN103206694A (en) * 2012-01-16 2013-07-17 欧司朗股份有限公司 Driver casing, luminous device and lamp
CN102588780A (en) * 2012-01-18 2012-07-18 漳州市立达信绿色照明有限公司 Large-angle LED lamp
CN103216737B (en) * 2012-01-18 2016-09-07 欧司朗股份有限公司 Lighting device
KR102017538B1 (en) 2012-01-31 2019-10-21 엘지이노텍 주식회사 Lighting device
US9175813B2 (en) * 2012-03-30 2015-11-03 3M Innovative Properties Company Electrical connectors for solid state light
EP3135994B1 (en) * 2012-04-13 2019-12-18 LG Innotek Co., Ltd. Lighting device
JP5637543B2 (en) * 2012-07-09 2014-12-10 加美電機株式会社 LED lamp that can select the switch and the function of the switch in the spherical object etc. by operating the operation rod protruding from the spherical object etc.
CN103672481B (en) * 2012-09-24 2015-12-09 亿光电子工业股份有限公司 Light fixture
CN103855290A (en) * 2012-12-07 2014-06-11 深圳市蓝科电子有限公司 White light LED light source structure
US8894252B2 (en) * 2013-04-19 2014-11-25 Technical Consumer Products, Inc. Filament LED lamp
JP6296738B2 (en) * 2013-09-24 2018-03-20 三菱電機株式会社 LIGHTING LAMP AND LIGHTING DEVICE HAVING THE SAME
CN103824929B (en) * 2014-03-24 2016-09-21 武汉和光照明科技有限公司 Make the formula of light-transmitting substrate, light-transmitting substrate, LED light module and lamp
CN103982826A (en) * 2014-05-28 2014-08-13 昆山生态屋建筑技术有限公司 Reflector lamp with semiconductor chilling plate arranged on heat conduction pillar
CN104214740B (en) * 2014-08-27 2017-01-18 苏州骏发精密机械有限公司 Car lamp radiator
JP6045662B2 (en) * 2015-04-28 2016-12-14 三菱電機株式会社 Power unit for lighting and lighting device
JP6508469B2 (en) * 2015-07-28 2019-05-08 東芝ライテック株式会社 Lamp device and lighting device
JP6944648B2 (en) * 2018-02-05 2021-10-06 東芝ライテック株式会社 How to make vehicle lighting, vehicle lighting, and sockets

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2441020Y (en) * 2000-09-05 2001-08-01 陈秀武 Explosionproof light

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3946416A (en) * 1973-04-24 1976-03-23 The United States Of America As Represented By The Secretary Of The Army Low impedance diode mounting structure and housing
US4503360A (en) * 1982-07-26 1985-03-05 North American Philips Lighting Corporation Compact fluorescent lamp unit having segregated air-cooling means
JPS62147366A (en) * 1985-12-20 1987-07-01 Nec Corp Frequency measuring circuit
JPS62190366A (en) * 1986-02-13 1987-08-20 日本水産株式会社 Synthetic ice containing air and manufacture thereof
JPS635581A (en) * 1986-06-25 1988-01-11 Semiconductor Res Found Heat dissipation of led indicating lamp with built-in resistor
JPS63102265A (en) * 1986-10-20 1988-05-07 Agency Of Ind Science & Technol Manufacture of semiconductor device
JPS647402A (en) * 1987-06-30 1989-01-11 Toshiba Corp Fluorescent lamp device
JPS6414804A (en) * 1987-07-08 1989-01-19 Toshiba Corp Fluorescent lamp device
JP2819551B2 (en) * 1987-08-12 1998-10-30 日産自動車株式会社 Autonomous traveling vehicle control device
JPH01206505A (en) * 1988-02-12 1989-08-18 Toshiba Corp Fluorescent lamp device
JPH0225108A (en) * 1988-07-14 1990-01-26 Toshiba Corp Semiconductor integrated circuit
JPH0291105A (en) * 1988-09-28 1990-03-30 Japan Synthetic Rubber Co Ltd Polybutadiene
JPH0291105U (en) * 1988-12-28 1990-07-19
JP3753291B2 (en) * 1998-09-30 2006-03-08 東芝ライテック株式会社 Light bulb shaped fluorescent lamp
JP2001243809A (en) * 2000-02-28 2001-09-07 Mitsubishi Electric Lighting Corp Led electric bulb
US6301096B1 (en) * 2000-03-18 2001-10-09 Philips Electronics North America Corporation Tamper-proof ballast enclosure
KR20010069867A (en) * 2001-05-15 2001-07-25 양승순 The Method of illuminating form for the LED light source
JP2003092022A (en) * 2001-09-19 2003-03-28 Yamada Shomei Kk Heat radiation structure of lighting device, and lighting device
EP1467414A4 (en) * 2001-12-29 2007-07-11 Hangzhou Fuyang Xinying Dianzi A led and led lamp
CN2557805Y (en) * 2002-02-20 2003-06-25 葛世潮 High power LED lamp
JP2004006096A (en) * 2002-05-31 2004-01-08 Nippon Seiki Co Ltd Lighting system
JP2004193053A (en) * 2002-12-13 2004-07-08 Toshiba Lighting & Technology Corp Compact self-ballasted fluorescent lamp and lighting equipment
CN2634264Y (en) * 2003-07-11 2004-08-18 严美凤 High power flash light with heat radiation function
TWI329724B (en) * 2003-09-09 2010-09-01 Koninkl Philips Electronics Nv Integrated lamp with feedback and wireless control
JP4236544B2 (en) * 2003-09-12 2009-03-11 三洋電機株式会社 Lighting device
CN2685703Y (en) * 2004-02-12 2005-03-16 安提亚科技股份有限公司 Efficient luminous diode projection lamp
JP2005093067A (en) * 2004-11-01 2005-04-07 Hitachi Ltd Objective lens
JP2005123200A (en) * 2004-11-04 2005-05-12 Toshiba Lighting & Technology Corp Compact self-ballasted fluorescent lamp
CN2767833Y (en) * 2004-12-28 2006-03-29 游木金 Heat radiation structure for bulb
CN101660741B (en) * 2005-04-08 2013-11-06 东芝照明技术株式会社 Lamp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2441020Y (en) * 2000-09-05 2001-08-01 陈秀武 Explosionproof light

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平11-134907A 1999.05.21

Also Published As

Publication number Publication date
CN101660741A (en) 2010-03-03
CN101660738A (en) 2010-03-03
CN101660741B (en) 2013-11-06
JP5246523B2 (en) 2013-07-24
JP4962809B2 (en) 2012-06-27
CN101660739A (en) 2010-03-03
CN101660739B (en) 2012-01-18
CN100559073C (en) 2009-11-11
JP2010086973A (en) 2010-04-15
CN1880844A (en) 2006-12-20
JP4930807B2 (en) 2012-05-16
JP4465640B2 (en) 2010-05-19
JP2010086972A (en) 2010-04-15
CN101660740A (en) 2010-03-03
JP2012054252A (en) 2012-03-15
JP2009206104A (en) 2009-09-10

Similar Documents

Publication Publication Date Title
CN101660740B (en) Lamp
US9080759B2 (en) Lamp having outer shell to radiate heat of light source
CN107534051B (en) Method and apparatus for chip on board encapsulation Flexible light-emitting diodes
US7360925B2 (en) LED light source assembly
US6803607B1 (en) Surface mountable light emitting device
JP2006313718A (en) Compact bulb type lamp
US20080174224A1 (en) Lamp head structure
EP3012516B1 (en) Led light source device and lighting fixture using the same
US20140198495A1 (en) LED Bulb Laterally Installed and Projecting Light Beams onto Ground
KR101230620B1 (en) Led illumination apparatus
JP2007012821A (en) Led bulb with base
CN104696818B (en) LED unit and lighting tool using same
CN103133921A (en) Lamp bulb-shaped lighting device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant