CN103855290A - White light LED light source structure - Google Patents
White light LED light source structure Download PDFInfo
- Publication number
- CN103855290A CN103855290A CN201210521669.6A CN201210521669A CN103855290A CN 103855290 A CN103855290 A CN 103855290A CN 201210521669 A CN201210521669 A CN 201210521669A CN 103855290 A CN103855290 A CN 103855290A
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- CN
- China
- Prior art keywords
- light source
- led
- transparent glass
- light
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- 239000003292 glue Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a white light LED light source structure which comprises a light source component (16) arranged in a reflecting cup (10). A crystal-fixing plate (5) is arranged on the upper portion of the light source component (16). A fixing clamping base (13) is arranged on the lower portion of the light source component (16). Outer pins (11) and (12) are arranged on the bottom of the light source component (16). A plurality of LED wafers which are fixed in a bonding mode by the fact that bonding wires (6) are connected with transparent bonding glue (7) are arranged on the crystal-fixing plate (5). The upper side circle of the reflecting cup (10) is connected with a transparent glass piece (3). A light-transmitting cover (1) is arranged outside the transparent glass piece (3) in a covering mode. A fluorescent powder layer (2) is arranged on the outer surface of the transparent glass piece (3). A transparent protecting rubber layer (4) is arranged on the surface of each LED wafer (8). A mirror face reflecting layer (9) is arranged on the inner wall of the reflecting cup (10). According to the white light LED light source structure, a traditional white light LED packaging structure is changed, the technology difficulty of LED packaging is greatly lowered, and light-out efficiency of a white light LED is improved.
Description
Technical field
The present invention relates to white LED light source structure.
Background technology
[0002] LED is as a kind of novel light-emitting device, gradually by the whole world is familiar with.Along with LED is in the large-scale application of every field, the particularly progressively popularization of LED illumination application, LED crystal grain technology is maked rapid progress, but LED encapsulation technology really makes little progress, and current white light LEDs patent-blue-ray LED wafer excites that yellow fluorescent powder technology mainly rests in day, the international business such as sub-.Along with LED is in the progressively popularization of lighting field, more and more draw attention for the LED packaged type of high light efficiency.
Summary of the invention
The object of the invention is to: provide a kind of white LED light source structure that optical efficiency is high.
It is included in the light source assembly (16) arranging in reflector (10); : the top of light source assembly (16) arranges die bond plate (5), and bottom arranges Fixing clamp-seat (13), and bottom arranges outer pin (11), (12); Several are set on die bond plate (5) and connect by bonding line (6) the LED wafer (8) that transparent bonded adhesives (7) is adhesively fixed; Reflector (10) top circle connects transparent glass sheet (3), transparent glass sheet (3) outer cover diffuser (1).
The outer surface of transparent glass sheet (3) arranges phosphor powder layer (2).
The surface of each LED wafer (8) arranges transparency protected glue-line (4).
Specular layer (9) is set on the inwall of reflector (10).
The present invention has changed traditional White-light LED package structure, significantly reduces the technology difficulty of LED encapsulation, has improved the light extraction efficiency of white light LEDs.
Brief description of the drawings:
Accompanying drawing 1 is the front view of true qualities light source assembly of the present invention;
Accompanying drawing 2 is true qualities light source assembly vertical views of the present invention;
Accompanying drawing 3 is that the master of curved surface reflector of the present invention looks cutaway view;
Accompanying drawing 4 is that finished product of the present invention does not add the main pseudosection before diffuser;
Accompanying drawing 5 is finished product front views of the present invention;
Accompanying drawing 6 is finished product upward views of the present invention;
Accompanying drawing 7 is white LED light source light transduction pathway schematic diagrames of the present invention.
Embodiment:
Adopt transparent solid-state material as die bond plate (5), light source assembly (16) is inserted in in light source outer pin (11), (12) and is mounted with deck (13), then light source outer pin (11), (12) are sticked on to the correspondence position of transparent die bond plate (5).Adopt transparent bonded adhesives (7) to be fixed on transparent die bond plate (5) correspondence position transparent LED wafer (8).Each counter electrode of wafer is coupled together with bonding line (6), and be connected with the pad on light source outer pin (11), (12).Then connecting the wafer surface spot printing layer of transparent protection glue-line (4) of line, avoiding bonding line (6) to be touched and subside.Manufacture like this true qualities light source assembly.Make reflector (10) with metal or plastic material, and at the specular layer (9) of reflector (10) inner surface spraying high reflectance; The light source insertion curved surface reflector of true qualities light source assembly is mounted with to deck (13) to light source assembly and touches reflector (10) bottom.Be coated with layer of fluorescent powder layer (2) again at curved surface reflector top cover lastblock transparent glass sheet (3), and then in glass sheet surface, phosphor powder layer (2) can be prefabricated flourescent sheet, also can immediately spray.So just complete the making of white LED light source.Finally can on surface of light source, cover again as required various diffusers (1), reach the optic shape needing.
Principle of luminosity is introduced:
LED wafer (8) is the transparent body, by transparent bonded adhesives (7), LED wafer (8) is fixed on transparent die bond plate (5), LED wafer (8) this coloured light sending of switching on is six outgoing, a part is directly through after transparent glass sheet (3), be irradiated on flourescent sheet, then send white light from flourescent sheet surface; A part is by passing transparent glass sheet (3) again after reflector (10) mirror-reflection in addition, be irradiated to flourescent sheet and convert white light outgoing to, light path converting schematic diagram is as Fig. 7, the light that the light (14) that LED wafer sends sends for LED wafer (8), this coloured light change by fluorescent material after the white light of this coloured light of sending into LED wafer (8) of white light (15) after changing by flourescent sheet.
Claims (4)
1. a white LED light source structure, it is included in the light source assembly (16) arranging in reflector (10), it is characterized in that: the top of light source assembly (16) arranges die bond plate (5), bottom arranges Fixing clamp-seat (13), and bottom arranges outer pin (11), (12); Several are set on die bond plate (5) and connect by bonding line (6) the LED wafer (8) that transparent bonded adhesives (7) is adhesively fixed; Reflector (10) top circle connects transparent glass sheet (3), transparent glass sheet (3) outer cover diffuser (1).
2. a kind of white LED light source structure as claimed in claim 1, is characterized in that: the outer surface of transparent glass sheet (3) arranges phosphor powder layer (2).
3. profit requires a kind of white LED light source structure described in 1, it is characterized in that: the surface of each LED wafer (8) arranges transparency protected glue-line (4).
4. a kind of white LED light source structure as claimed in claim 1, is characterized in that: specular layer (9) is set on the inwall of reflector (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210521669.6A CN103855290A (en) | 2012-12-07 | 2012-12-07 | White light LED light source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210521669.6A CN103855290A (en) | 2012-12-07 | 2012-12-07 | White light LED light source structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103855290A true CN103855290A (en) | 2014-06-11 |
Family
ID=50862696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210521669.6A Pending CN103855290A (en) | 2012-12-07 | 2012-12-07 | White light LED light source structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103855290A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1464953A (en) * | 2001-08-09 | 2003-12-31 | 松下电器产业株式会社 | Led illuminator and card type led illuminating light source |
| CN101551067A (en) * | 2009-01-22 | 2009-10-07 | 深圳市成光兴实业发展有限公司 | White light LED light source module adopting COB technology and array interconnecting |
| CN101660739A (en) * | 2005-04-08 | 2010-03-03 | 东芝照明技术株式会社 | Lamp |
-
2012
- 2012-12-07 CN CN201210521669.6A patent/CN103855290A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1464953A (en) * | 2001-08-09 | 2003-12-31 | 松下电器产业株式会社 | Led illuminator and card type led illuminating light source |
| CN101660739A (en) * | 2005-04-08 | 2010-03-03 | 东芝照明技术株式会社 | Lamp |
| CN101551067A (en) * | 2009-01-22 | 2009-10-07 | 深圳市成光兴实业发展有限公司 | White light LED light source module adopting COB technology and array interconnecting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140611 |