JP5223121B2 - Light source unit for vehicles - Google Patents

Light source unit for vehicles Download PDF

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JP5223121B2
JP5223121B2 JP2009281809A JP2009281809A JP5223121B2 JP 5223121 B2 JP5223121 B2 JP 5223121B2 JP 2009281809 A JP2009281809 A JP 2009281809A JP 2009281809 A JP2009281809 A JP 2009281809A JP 5223121 B2 JP5223121 B2 JP 5223121B2
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light source
housing
source unit
circuit case
circuit
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JP2011124140A (en
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義治 田中
明弘 三沢
浩樹 柘植
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Toyoda Gosei Co Ltd
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Description

本発明は車輌用光源ユニットに関する。   The present invention relates to a vehicle light source unit.

従来、ヘッドランプ等の車輌用灯具の光源として、自発光半導体型光源(例えばLED光源など)を有する光源ユニットが利用されている。このような車輌用光源ユニットの例として、特許文献1および2に開示される光源ユニットが挙げられる。特許文献1に開示の構成では、灯具本体の外部に光源ユニットの回路とヒートシンクを備える。特許文献2に開示の構成では、リフレクタの背後の空きスペースに光源ユニットの回路が灯具本体と一体的に設けられると共に、灯具本体の底部に放熱フィンが備えられる。   Conventionally, a light source unit having a self-luminous semiconductor type light source (for example, an LED light source) has been used as a light source of a vehicle lamp such as a headlamp. Examples of such a vehicle light source unit include the light source units disclosed in Patent Documents 1 and 2. In the configuration disclosed in Patent Document 1, a light source unit circuit and a heat sink are provided outside the lamp body. In the configuration disclosed in Patent Document 2, the circuit of the light source unit is provided integrally with the lamp body in an empty space behind the reflector, and a heat radiation fin is provided at the bottom of the lamp body.

特許第4258321号公報Japanese Patent No. 4258321 特開2006−302713号公報JP 2006-302713 A

特許文献1の構成では、灯具本体の外部に光源ユニットの回路及びヒートシンクが設けられるため装置が大型化している。
特許文献2の構成では、回路が灯具本体に一体的に設けられるため、回路と灯具本体の分離が困難である。そのため、部材の一部に不具合が生じた際には灯具全体を交換する必要があり、またメンテナンス時の作業性が低下する。また、放熱フィンが備えられることにより装置が大型化している。
そこで、本発明は、小型であって、交換等のメンテナンスが容易となる車輌用光源ユニットの構成を提供することを目的とする。
In the configuration of Patent Document 1, since the circuit of the light source unit and the heat sink are provided outside the lamp body, the apparatus is enlarged.
In the configuration of Patent Document 2, since the circuit is provided integrally with the lamp body, it is difficult to separate the circuit and the lamp body. Therefore, when a problem occurs in a part of the member, it is necessary to replace the entire lamp, and workability during maintenance is reduced. Moreover, the apparatus is increased in size by providing the heat radiation fins.
Therefore, an object of the present invention is to provide a configuration of a vehicle light source unit that is small in size and facilitates maintenance such as replacement.

本発明者らは上記課題を解決するために鋭意検討を重ねた結果、下記の本発明に想到した。すなわち、本発明の第1の局面は、
アウタレンズ、ハウジング、回路ケース部、光源部を備える車輌用光源ユニットであって、
前記回路ケース部はその周壁が前記ハウジングよりも熱伝導性の高い材料で形成されて、前記ハウジングに形成された開口部の周縁に取り付けられ、
前記光源部は、自発光半導体型光源、放熱板、回路基板を備え、
前記自発光半導体型光源は前記ハウジングの開口部から前記ハウジング内へ表出し、
前記放熱板は前記自発光半導体型光源および前記回路ケース部の周壁に熱的に連結され、
前記回路基板は前記回路ケース部の周壁と前記放熱板との間に収納される車輌用光源ユニットである。
As a result of intensive studies to solve the above problems, the present inventors have arrived at the present invention described below. That is, the first aspect of the present invention is
A vehicle light source unit comprising an outer lens, a housing, a circuit case part, and a light source part,
The circuit case part has a peripheral wall formed of a material having higher thermal conductivity than the housing, and is attached to the periphery of the opening formed in the housing.
The light source unit includes a self-luminous semiconductor light source, a heat sink, and a circuit board.
The self-luminous semiconductor type light source is exposed from the opening of the housing into the housing,
The heat dissipation plate is thermally connected to a peripheral wall of the light emitting semiconductor light source and the circuit case part,
The circuit board is a vehicle light source unit housed between a peripheral wall of the circuit case portion and the heat radiating plate.

本発明の第1の局面における車輌用光源ユニットでは、ハウジングより熱伝導性の高い材料で周壁が形成された回路ケース部がハウジングの開口部の周縁に取り付けられ、光源部の自発光半導体型光源が該開口部内に表出すると共に、自発光半導体型光源および回路ケース部と放熱板とが熱的に連結されるため、自発光半導体型光源の熱は放熱板を介して回路ケース部に伝導されて外部へ放出されることとなる。これにより、別途放熱フィン等を設ける必要が無いため小型の車輌用光源ユニットとなる。さらに、回路ケース部はハウジングと別体で構成されるため、分離が容易であり自発光半導体型光源の交換などのメンテナンスが容易となる。   In the vehicle light source unit according to the first aspect of the present invention, a circuit case portion having a peripheral wall formed of a material having higher thermal conductivity than the housing is attached to the periphery of the opening of the housing, and the light emitting semiconductor light source of the light source portion Appears in the opening, and the self-luminous semiconductor light source and the circuit case portion and the heat sink are thermally connected, so that the heat of the self-luminous semiconductor light source is conducted to the circuit case portion through the heat sink. Will be released to the outside. As a result, there is no need to provide a separate radiating fin or the like, so that a small vehicle light source unit is obtained. Furthermore, since the circuit case portion is configured separately from the housing, it is easy to separate and maintenance such as replacement of the self-luminous semiconductor light source is facilitated.

本発明の第2の局面は、上記第1の局面の構成に加え、回路ケース部は回路基板を収納する凹部を備え、放熱板は該凹部の開口部周縁のフランジ部へ連結される車輌用光源ユニットである。そのため、簡易な構成で回路基板の収納、および、回路ケース部と放熱板との熱的連結が可能となり、車両用光源ユニットを一層小型化できる。   According to a second aspect of the present invention, in addition to the configuration of the first aspect, the circuit case portion includes a concave portion that accommodates the circuit board, and the heat radiating plate is connected to a flange portion around the opening portion of the concave portion. It is a light source unit. Therefore, the circuit board can be stored and the circuit case portion and the heat radiating plate can be thermally connected with a simple configuration, and the vehicle light source unit can be further downsized.

本発明の第3の局面は、上記第1の局面の構成に加え、放熱板には回路基板を収納する凹部が形成され、該凹部の周縁部が回路ケース部の周壁へ連結される車輌用光源ユニットである。そのため、簡易な構成で回路基板の収納、および、回路ケース部と放熱板との熱的連結が可能となり、車両用光源ユニットを一層小型化できる。   According to a third aspect of the present invention, in addition to the configuration of the first aspect described above, for a vehicle in which a recess for housing a circuit board is formed in the heat radiating plate, and a peripheral portion of the recess is connected to a peripheral wall of the circuit case portion. It is a light source unit. Therefore, the circuit board can be stored and the circuit case portion and the heat radiating plate can be thermally connected with a simple configuration, and the vehicle light source unit can be further downsized.

本発明の第1実施形態である車輌用光源ユニット10の縦断面図。1 is a longitudinal sectional view of a vehicle light source unit 10 according to a first embodiment of the present invention. 本発明の第2実施形態である車輌用光源ユニット30の縦断面図。The longitudinal cross-sectional view of the vehicle light source unit 30 which is 2nd Embodiment of this invention.

<第1実施形態>
本発明の第1実施形態の車輌用光源ユニット10について、図1を参照しながら説明する。尚、以下の説明において、「前方側」とは車輌用光源ユニット10の正面側(図示左側)である。
車輌用光源ユニット10は、車輌の前照灯であり、プロジェクタ型のユニット構造を成しており、アウタレンズ11(係合突起11a)、ハウジング12(係合凹部12a、開口部12b、係合凹部12c、反射面12d)、回路ケース部13(凹部13a、フランジ部13b)、光源部20、自発光半導体型光源21(リード線21a)、放熱板22(台座部22a)、回路基板23、シール材24,25などから構成される。
<First Embodiment>
A vehicle light source unit 10 according to a first embodiment of the present invention will be described with reference to FIG. In the following description, the “front side” is the front side (left side in the figure) of the vehicle light source unit 10.
The vehicle light source unit 10 is a vehicle headlamp and has a projector-type unit structure, and includes an outer lens 11 (engagement protrusion 11a), a housing 12 (engagement recess 12a, opening 12b, engagement recess). 12c, reflecting surface 12d), circuit case 13 (recess 13a, flange 13b), light source 20, self-luminous semiconductor light source 21 (lead wire 21a), heat sink 22 (pedestal 22a), circuit board 23, seal It consists of materials 24, 25, etc.

アウタレンズ11は、無色透明な合成樹脂材料の射出成形により一体形成されており、略一定肉厚で略球面状を成し、周縁部には係合突起11aが突設されている。
ハウジング12は、合成樹脂材料の射出成形や金属板のプレス成形などにより一体形成されており、前方側がアウタレンズ11に合致するような形状に開口され、前方側の周縁には係合凹部12aが形成され、前方側から中央部分を経て後方側までが閉塞して略ドーム状を成し、下方側には開口部12bが形成され、開口部12bの周縁下側には係合凹部12cが形成されている。
ハウジング12の内壁面において自発光半導体型光源21の光が投射される部分には、自発光半導体型光源21の光を反射するリフレクタとしての反射面12dが設けられている。尚、反射面12dを設けるには、例えば、反射性の高い微粉末材料が添加された塗料の塗装、反射性の高い金属材料(例えば、アルミニウム、クロムなど)のメッキや蒸着などを用いればよい。
回路ケース部13は、少なくともその周壁がハウジング12よりも熱伝導性の高い材料で形成されており(例えば、合成樹脂材料の射出成形、アルミニウム合金などの金属材料のダイカストやプレス成形など)、略中央部には凹部13aが形成され、凹部13aの開口部周縁は外方に延出されてフランジ部13bが形成されている。
The outer lens 11 is integrally formed by injection molding of a colorless and transparent synthetic resin material. The outer lens 11 has a substantially spherical shape with a substantially constant thickness, and an engaging protrusion 11a is provided on the periphery.
The housing 12 is integrally formed by injection molding of a synthetic resin material or press molding of a metal plate. The housing 12 is opened in a shape that matches the outer lens 11 on the front side, and an engagement recess 12a is formed on the peripheral edge on the front side. Then, from the front side to the rear side through the central portion is closed to form a substantially dome shape, an opening 12b is formed on the lower side, and an engagement recess 12c is formed on the lower peripheral edge of the opening 12b. ing.
A reflection surface 12 d as a reflector that reflects the light of the self-light-emitting semiconductor light source 21 is provided on the inner wall surface of the housing 12 where the light of the self-light-emitting semiconductor light source 21 is projected. In order to provide the reflecting surface 12d, for example, coating with a paint to which a highly reflective fine powder material is added, plating or vapor deposition of a highly reflective metal material (for example, aluminum, chromium, etc.) may be used. .
The circuit case portion 13 is formed of a material having at least a peripheral wall that is more thermally conductive than the housing 12 (for example, injection molding of a synthetic resin material, die casting or press molding of a metal material such as an aluminum alloy), and the like. A concave portion 13a is formed in the central portion, and the periphery of the opening of the concave portion 13a extends outward to form a flange portion 13b.

光源部20は、自発光半導体型光源21、放熱板22、回路基板23を備える。
自発光半導体型光源21は、例えばLED光源や有機EL光源などから構成され、リード線21aが接続されている。
放熱板22は、熱伝導性の高い材料で形成されており(例えば、合成樹脂材料の射出成形、アルミニウム合金などの金属材料のダイカストやプレス成形など)、略平板状を成し、上面側に台座部22aが立設されている。
回路基板23は、自発光半導体型光源21を点灯させるための電子回路を構成する電子部品(図示略)が搭載されたプリント回路基板である。
The light source unit 20 includes a self-luminous semiconductor light source 21, a heat sink 22, and a circuit board 23.
The self-light-emitting semiconductor light source 21 is composed of, for example, an LED light source or an organic EL light source, and is connected to a lead wire 21a.
The heat radiating plate 22 is formed of a material having high thermal conductivity (for example, injection molding of a synthetic resin material, die casting or press molding of a metal material such as an aluminum alloy), and has a substantially flat plate shape on the upper surface side. A pedestal portion 22a is erected.
The circuit board 23 is a printed circuit board on which electronic components (not shown) constituting an electronic circuit for lighting the self-light-emitting semiconductor light source 21 are mounted.

アウタレンズ11はハウジング12の前方側に取り付けられ、アウタレンズ11の係合突起11aがハウジング12の係合凹部12aに係合されることにより、ハウジング12に対してアウタレンズ11が着脱可能に取付固定されている。
係合凹部12a内には合成ゴム材料から成るシール材24が装着されており、ハウジング12とアウタレンズ11とはシール材24により液密状態に取り付けられる。
The outer lens 11 is attached to the front side of the housing 12, and the engagement projection 11 a of the outer lens 11 is engaged with the engagement recess 12 a of the housing 12, so that the outer lens 11 is detachably attached and fixed to the housing 12. Yes.
A sealing material 24 made of a synthetic rubber material is mounted in the engaging recess 12a, and the housing 12 and the outer lens 11 are attached in a liquid-tight state by the sealing material 24.

回路ケース部13はハウジング12の下方外側から開口部12bを覆って塞ぐように開口部12bの周縁に取り付けられ、回路ケース部13の周壁の上端部がハウジング12の係合凹部12cに係合されることにより、ハウジング12に対して回路ケース部13が着脱可能に取付固定されている。
係合凹部12c内には合成ゴム材料から成るシール材25が装着されており、ハウジング12と回路ケース部13とはシール材25により液密状態に取り付けられる。
The circuit case portion 13 is attached to the peripheral edge of the opening portion 12b so as to cover and close the opening portion 12b from the lower outer side of the housing 12, and the upper end portion of the peripheral wall of the circuit case portion 13 is engaged with the engagement recess portion 12c of the housing 12. Thus, the circuit case portion 13 is detachably attached to the housing 12.
A sealing material 25 made of a synthetic rubber material is mounted in the engaging recess 12c, and the housing 12 and the circuit case portion 13 are attached in a liquid-tight state by the sealing material 25.

放熱板22の周縁部下側は回路ケース部13のフランジ部13bに連結されて取付固定され、放熱板22は回路ケース部13の周壁に熱的に連結されている。また、放熱板22の台座部22a上には自発光半導体型光源21が熱的に連結されて取付固定され、自発光半導体型光源21はハウジング12の開口部12bからハウジング12内へ表出している。
回路基板23は、回路ケース部13の凹部13aに収納されることにより、回路ケース部13の周壁と放熱板22との間に収納され、回路ケース部13に対して回路基板23が取付固定されている。
自発光半導体型光源21のリード線21aは、放熱板22に形成された貫通孔(図示略)を通って回路基板23に接続されている。
The lower side of the peripheral portion of the heat radiating plate 22 is connected and fixed to the flange portion 13 b of the circuit case portion 13, and the heat radiating plate 22 is thermally connected to the peripheral wall of the circuit case portion 13. In addition, the self-luminous semiconductor light source 21 is thermally connected and fixed on the pedestal 22 a of the heat sink 22, and the self-luminous semiconductor light source 21 is exposed into the housing 12 from the opening 12 b of the housing 12. Yes.
The circuit board 23 is housed between the peripheral wall of the circuit case part 13 and the heat sink 22 by being housed in the recess 13 a of the circuit case part 13, and the circuit board 23 is attached and fixed to the circuit case part 13. ing.
The lead wire 21 a of the self-luminous semiconductor light source 21 is connected to the circuit board 23 through a through hole (not shown) formed in the heat radiating plate 22.

車輌用光源ユニット10において、自発光半導体型光源21を点灯発光させると、自発光半導体型光源21の光は上方に放射されてハウジング12の反射面12dで反射され、その反射光と自発光半導体型光源21の直射光とがアウタレンズ11を透過して前方側へ照射され、車輌の前方側を照明する。ここで、自発光半導体型光源21の光軸は、ハウジング12の反射面12dの光軸(灯体光軸)と略90゜以上の角度で交差するよう構成されている。   In the vehicle light source unit 10, when the self light emitting semiconductor light source 21 is turned on and emitted, the light from the self light emitting semiconductor light source 21 is emitted upward and reflected by the reflecting surface 12 d of the housing 12. The direct light from the mold light source 21 passes through the outer lens 11 and is irradiated to the front side to illuminate the front side of the vehicle. Here, the optical axis of the self-luminous semiconductor light source 21 is configured to intersect the optical axis of the reflecting surface 12d of the housing 12 (lamp optical axis) at an angle of approximately 90 ° or more.

[第1実施形態の作用・効果]
第1実施形態の車輌用光源ユニット10によれば、以下の作用・効果が得られる。
[Operations and effects of the first embodiment]
According to the vehicle light source unit 10 of the first embodiment, the following operations and effects can be obtained.

[1]ハウジング12より熱伝導性の高い材料で周壁が形成された回路ケース部13がハウジング12の開口部12bの周縁に取り付けられ、光源部20の自発光半導体型光源21がハウジング12の開口部12b内に表出すると共に、自発光半導体型光源21および回路ケース部13と放熱板22とが熱的に連結されるため、自発光半導体型光源21の熱は放熱板22を介して回路ケース部13に伝導されて外部へ放出されることとなる。これにより、別途放熱フィン等を設ける必要が無いため、車輌用光源ユニット10を小型化できる。   [1] A circuit case portion 13 having a peripheral wall formed of a material having higher thermal conductivity than the housing 12 is attached to the periphery of the opening portion 12 b of the housing 12, and the light-emitting semiconductor light source 21 of the light source portion 20 is an opening of the housing 12. Since the self-light-emitting semiconductor light source 21 and the circuit case 13 and the heat sink 22 are thermally connected to each other, the heat of the self-light-emitting semiconductor light source 21 is connected to the circuit through the heat sink 22. It is conducted to the case part 13 and discharged to the outside. Thereby, since it is not necessary to provide a separate radiation fin etc., the vehicle light source unit 10 can be reduced in size.

[2]回路ケース部13はハウジング12と別体で構成され、回路ケース部13の周壁の上端部がハウジング12の係合凹部12cに係合されているため、ハウジング12から回路ケース部13を分離するのが容易であり、自発光半導体型光源21の交換などのメンテナンスが容易となる。   [2] The circuit case portion 13 is configured separately from the housing 12, and the upper end portion of the peripheral wall of the circuit case portion 13 is engaged with the engagement recess 12 c of the housing 12. It is easy to separate, and maintenance such as replacement of the self-luminous semiconductor light source 21 becomes easy.

[3]回路ケース部13の凹部13aが回路基板23を収納すると共にその開口部周縁のフランジ部13bに放熱板22が接続されるため、簡易な構成で回路基板23の収納、および、回路ケース部13と放熱板22との熱的連結が可能となり、車輌用光源ユニット10を一層小型化できる。
尚、回路ケース部13および放熱板22を導電性材料(例えば、金属材料、導電性樹脂材料など)で形成すれば、回路基板23は回路ケース部13および放熱板22に囲まれて収容されるため、回路基板23に対して電磁シールドを施すことができる。
[3] Since the concave portion 13a of the circuit case portion 13 accommodates the circuit board 23 and the heat radiating plate 22 is connected to the flange portion 13b at the periphery of the opening, the circuit board 23 can be accommodated and the circuit case with a simple configuration. The portion 13 and the heat radiating plate 22 can be thermally connected, and the vehicle light source unit 10 can be further downsized.
In addition, if the circuit case part 13 and the heat sink 22 are formed of a conductive material (for example, a metal material, a conductive resin material, etc.), the circuit board 23 is enclosed and accommodated by the circuit case part 13 and the heat sink 22. Therefore, an electromagnetic shield can be applied to the circuit board 23.

<第2実施形態>
本発明の第2実施形態の車輌用光源ユニット30について、図2を参照しながら説明する。尚、第2実施形態において、第1実施形態と共通の構成部材については符号を等しくして説明を省略してある。
車輌用光源ユニット30は、アウタレンズ11(係合突起11a)、ハウジング12(係合凹部12a、開口部12b、係合凹部12c、反射面12d)、光源部20、自発光半導体型光源21(リード線21a)、回路基板23、シール材24,25、回路ケース部31、放熱板32(台座部32a、凹部32b)などから構成される。
第2実施形態の車輌用光源ユニット30において、図1に示した第1実施形態の車輌用光源ユニット10と異なるのは、以下の点だけである。
Second Embodiment
A vehicle light source unit 30 according to a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
The vehicle light source unit 30 includes an outer lens 11 (engagement protrusion 11a), a housing 12 (engagement recess 12a, opening 12b, engagement recess 12c, reflection surface 12d), a light source unit 20, a self-luminous semiconductor light source 21 (lead). Line 21a), circuit board 23, sealing materials 24 and 25, circuit case part 31, heat sink 32 (pedestal part 32a, recess 32b), and the like.
The vehicle light source unit 30 of the second embodiment is different from the vehicle light source unit 10 of the first embodiment shown in FIG. 1 only in the following points.

[ア]回路ケース部31は、第1実施形態の回路ケース部13と同様の材料で形成されているが、回路ケース部13のような凹部13aおよびフランジ部13bは形成されていない。
回路ケース部31はハウジング12の下方側から開口部12bの周縁に取り付けられ、回路ケース部31の周壁の上端部がハウジング12の係合凹部12cに係合されることにより、ハウジング12に対して回路ケース部31が着脱可能に取付固定され、ハウジング12と回路ケース部31とはシール材25により液密状態に取り付けられている。
[A] The circuit case portion 31 is formed of the same material as that of the circuit case portion 13 of the first embodiment, but the concave portion 13a and the flange portion 13b as in the circuit case portion 13 are not formed.
The circuit case portion 31 is attached to the peripheral edge of the opening 12b from the lower side of the housing 12, and the upper end portion of the peripheral wall of the circuit case portion 31 is engaged with the engagement recess 12c of the housing 12, thereby The circuit case portion 31 is detachably attached and fixed, and the housing 12 and the circuit case portion 31 are attached in a liquid-tight state by a sealing material 25.

[イ]放熱板32は、第1実施形態の放熱板22と同様の材料で形成され、上面側に台座部32aが立設され、下面側に凹部32bが形成されている。放熱板32の凹部32bの周縁部は、回路ケース部31の周壁に熱的に連結されて取付固定されている。   [A] The heat radiating plate 32 is formed of the same material as the heat radiating plate 22 of the first embodiment. A pedestal portion 32a is erected on the upper surface side, and a concave portion 32b is formed on the lower surface side. The peripheral edge of the recess 32b of the heat radiating plate 32 is thermally connected to and fixed to the peripheral wall of the circuit case 31.

[ウ]回路基板23は、第1実施形態のように回路ケース部13の凹部13aに収納されるのではなく、放熱板32の凹部32bに収納されることにより、回路ケース部31の周壁と放熱板32との間に収納されている。   [C] The circuit board 23 is not housed in the recess 13a of the circuit case portion 13 as in the first embodiment, but is housed in the recess 32b of the heat radiating plate 32. It is accommodated between the heat sink 32.

従って、第2実施形態によれば、第1実施形態の前記[1]の作用・効果に加え、以下の作用・効果が得られる。   Therefore, according to the second embodiment, in addition to the operation / effect of [1] of the first embodiment, the following operation / effect can be obtained.

[A]回路ケース部31はハウジング12と別体で構成され、回路ケース部31の周壁の上端部がハウジング12の係合凹部12cに係合されているため、ハウジング12から回路ケース部31を分離するのが容易であり、自発光半導体型光源21の交換などのメンテナンスが容易となる。   [A] The circuit case portion 31 is formed separately from the housing 12, and the upper end portion of the peripheral wall of the circuit case portion 31 is engaged with the engagement recess 12 c of the housing 12. It is easy to separate, and maintenance such as replacement of the self-luminous semiconductor light source 21 becomes easy.

[B]放熱板32に回路基板23を収納する凹部32bが形成され、放熱板32の凹部32bの周縁部が回路ケース部31の周壁へ連結されるため、簡易な構成で回路基板23の収納、および、回路ケース部31と放熱板32との熱的連結が可能となり、車輌用光源ユニット30を一層小型化できる。   [B] Since the concave portion 32b for accommodating the circuit board 23 is formed in the heat radiating plate 32 and the peripheral edge portion of the concave portion 32b of the heat radiating plate 32 is connected to the peripheral wall of the circuit case portion 31, the circuit board 23 can be accommodated with a simple configuration. In addition, the circuit case portion 31 and the heat radiating plate 32 can be thermally connected, and the vehicle light source unit 30 can be further reduced in size.

<別の実施形態>
上記各実施形態では、回路ケース部13,31の周壁の上端部をハウジング12の係合凹部12cに係合させているが、ハウジング12に対して回路ケース部13,31を着脱可能に取付固定できるならば、どのような取付方法を用いてもよく、例えば、ネジ止めや、クリップによる係合などを用いればよい。
<Another embodiment>
In each of the above embodiments, the upper ends of the peripheral walls of the circuit case portions 13 and 31 are engaged with the engagement recesses 12c of the housing 12, but the circuit case portions 13 and 31 are detachably attached and fixed to the housing 12. If possible, any attachment method may be used. For example, screwing or engagement with a clip may be used.

本発明は、上記各実施形態の説明に何ら限定されるものではない。特許請求の範囲の記載を逸脱せず、当業者が容易に想到できる範囲で種々の変形態様も本発明に含まれる。本明細書の中で明示した論文、公開特許公報、特許公報などの内容は、その全ての内容を援用によって引用することとする。   The present invention is not limited to the description of the above embodiments. Various modifications are also included in the present invention as long as those skilled in the art can easily conceive without departing from the scope of the claims. The contents of papers, published patent gazettes, patent gazettes, etc. specified in this specification are incorporated by reference in their entirety.

10,30…車輌用光源ユニット
11…アウタレンズ
12…ハウジング
12b…ハウジングの開口部
13,31…回路ケース部
13a…回路ケース部の凹部
13b…回路ケース部のフランジ部
20…光源部
21…自発光半導体型光源
22,32…放熱板
32b…放熱板の凹部
23…回路基板

DESCRIPTION OF SYMBOLS 10, 30 ... Vehicle light source unit 11 ... Outer lens 12 ... Housing 12b ... Housing opening part 13, 31 ... Circuit case part 13a ... Circuit case part recessed part 13b ... Circuit case part flange part 20 ... Light source part 21 ... Self light emission Semiconductor type light sources 22, 32 ... radiator plate 32b ... recess of radiator plate 23 ... circuit board

Claims (3)

アウタレンズ、ハウジング、回路ケース部、光源部を備える車輌用光源ユニットであって、
前記回路ケース部はその周壁が前記ハウジングよりも熱伝導性の高い材料で形成されて、前記ハウジングに形成された開口部の周縁に取り付けられ、
前記光源部は、自発光半導体型光源、放熱板、回路基板を備え、
前記自発光半導体型光源は前記ハウジングの開口部から前記ハウジング内へ表出し、
前記放熱板は前記自発光半導体型光源および前記回路ケース部の周壁に熱的に連結され、
前記回路基板は前記回路ケース部の周壁と前記放熱板との間に収納される車輌用光源ユニット。
A vehicle light source unit comprising an outer lens, a housing, a circuit case part, and a light source part,
The circuit case part has a peripheral wall formed of a material having higher thermal conductivity than the housing, and is attached to the periphery of the opening formed in the housing.
The light source unit includes a self-luminous semiconductor light source, a heat sink, and a circuit board.
The self-luminous semiconductor type light source is exposed from the opening of the housing into the housing,
The heat dissipation plate is thermally connected to a peripheral wall of the light emitting semiconductor light source and the circuit case part,
The circuit board is a vehicle light source unit housed between a peripheral wall of the circuit case portion and the heat radiating plate.
前記回路ケース部は前記回路基板を収納する凹部を備え、前記放熱板は該凹部の開口部周縁のフランジ部へ連結される、請求項1に記載の車輌用光源ユニット。   2. The vehicle light source unit according to claim 1, wherein the circuit case portion includes a concave portion that accommodates the circuit board, and the heat radiating plate is coupled to a flange portion at a peripheral edge of the opening portion of the concave portion. 前記放熱板には前記回路基板を収納する凹部が形成され、該凹部の周縁部が前記回路ケース部の周壁へ連結される、請求項1に記載の車輌用光源ユニット。


2. The vehicle light source unit according to claim 1, wherein the heat radiating plate is formed with a concave portion for housing the circuit board, and a peripheral portion of the concave portion is connected to a peripheral wall of the circuit case portion.


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