JP2010176926A - Vehicular lighting fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vehicular lighting fixture capable of: improving heat dissipation properties thereof by ensuring longer radiation fins without increasing a length in a direction of the optical axis of the lighting fixture; using a semiconductor light-emitting element having high output power as a light source; and achieving reduction of the number of components and thin thickness. <P>SOLUTION: The vehicular lighting fixture includes: a circuit board 12 on which an light-emitting diode 11 is mounted; a reflector 13 having an opening 19, through which the light-emitting diode is inserted and which penetrates between front and back faces, provided with a mounting seat 21 for mounting the circuit board 12 and a plurality of radiation fins 22 integrally formed on the rear surface side, and provided with a reflecting surface 20 for reflecting light from the light-emitting diode 11 forward on the front surface side; and a projection lens 14 arranged on the front surface of the reflector 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a vehicular lamp, and in particular, a semiconductor light-emitting element such as a light-emitting diode (commonly referred to as “LED”) is used as a light source, and heat generated by the light source is efficiently released (heat dissipation). The present invention relates to a vehicular lamp.

  In recent years, instead of a light bulb, a vehicle lamp using a semiconductor light emitting element such as a light emitting diode characterized by low power consumption, low heat generation, and maintenance free as a light source has begun to be used (for example, see Patent Document 1).

  This type of vehicle lamp uses a semiconductor light emitting element such as a light emitting diode. However, the semiconductor light emitting element itself generates heat and is easily damaged by the influence of heat. Further, the amount of heat generated by the semiconductor light emitting device increases as the output increases. For this reason, a heat sink is attached to a vehicular lamp using a semiconductor light emitting element as a light source in order to efficiently release heat generated by the light source to the outside of the lamp.

  FIG. 3 shows an example of a conventional vehicular lamp using a light emitting diode as a light source. In the figure, a vehicular lamp 101 includes a light emitting diode 102 as a light source, a circuit board 103 on which the light emitting diode 102 is mounted, a reflector 104, a projection lens (condensing lens) 105, a shade 106, a frame, A member 107, a heat sink 108, a lamp housing (not shown), and a lamp lens (not shown) (for example, a transparent outer lens) are provided.

  In the vehicular lamp 101 configured as described above, when the circuit board 103 generates heat due to light emission of the light emitting diode 102, the heat is transmitted to the heat sink 108 side and can be released to the outside through the heat sink 108.

JP 2002-163912 A

  However, in the above-mentioned Patent Document 1 and the vehicular lamp as shown in FIG. 3, the heat radiation fin of the heat sink has a structure that protrudes rearward from the back side of the circuit board. There is a possibility that the length in the axial direction becomes large and the lamp itself becomes large and interferes with peripheral components such as a harness provided on the back side of the lamp. Moreover, if the protrusion of the heat sink is made small in order to avoid interference with peripheral parts, etc., there is a problem in that heat dissipation is reduced and it is not possible to cope with a high output light emitting diode.

  The present invention has been made in view of the above circumstances, and the object of the present invention is to ensure a large length of the heat dissipating fin without increasing the length of the lamp in the optical axis direction. An object of the present invention is to provide a vehicular lamp that can use a high-power semiconductor light-emitting element as a light source, can reduce the number of components, and can be thinned.

  In order to solve the above-described problems, a vehicle lamp according to the present invention includes a circuit board on which the semiconductor light emitting element is mounted and a front and rear surface through which the semiconductor light emitting element is inserted in the vehicle lamp using the semiconductor light emitting element as a light source. A mounting seat portion to which the circuit board is attached and a plurality of heat radiation fins are integrally provided on the back side, and light from the semiconductor light emitting element is provided on the front side. The reflector is provided with a reflecting surface that reflects the light toward the front, and a lens disposed on the front surface of the reflector.

  According to this configuration, the reflector itself is used as a heat sink, and the mounting seat for attaching the circuit board on which the semiconductor light emitting element is mounted on the back side of the reflector and the plurality of heat radiation fins are integrally provided. The heat of the circuit board generated by the light emission is transmitted from the mounting seat portion to the heat radiating fin through the inside of the reflector, and can be efficiently discharged (heat dissipation). Therefore, the amount of protrusion of the heat dissipating fin can be absorbed by the shape protruding rearward of the reflector, and the heat dissipation fin extending rearward from the rear side of the reflector without increasing the length of the vehicle lamp in the optical axis direction. It is possible to secure a large amount of fin protrusion and improve heat dissipation. Further, the number of parts can be reduced and the thickness can be reduced.

  The said structure can employ | adopt the structure which the said fin for heat radiation protrudes back rather than the said circuit board installed in the said mounting seat part.

  According to this configuration, the circuit board is provided inside the projecting tip of the heat radiating fin, absorbed in the region of the heat radiating fin, and recessed toward the reflector main body than the heat radiating fin, It can protect so that a circuit board may not interfere with peripheral parts, such as a harness.

  In the above configuration, the lens is a projection lens, and a shade that forms a predetermined light distribution pattern between the projection lens and the reflector by blocking a part of reflected light from the reflector toward the projection lens. It is possible to adopt the configuration provided.

  According to this configuration, a predetermined light distribution pattern is formed by the shade, and the light distribution pattern is projected by the projection lens, so that it can be used as a vehicle marker lamp, a vehicle headlamp, or the like.

  According to the present invention, the reflector itself is used as a heat sink, and the mounting seat for attaching the circuit board on which the semiconductor light emitting element is mounted on the back side of the reflector and the plurality of heat radiation fins are integrally provided, and the semiconductor light emitting element emits light. The generated heat of the circuit board is transferred from the mounting seat to the heat-dissipating fins so that it can be efficiently released (heat dissipation), so the amount of protrusion of the heat-dissipating fins is absorbed by the protruding shape behind the reflector. Without increasing the length of the vehicle lamp in the optical axis direction, it is possible to ensure a large amount of protrusion of the heat dissipating fins extending from the back surface side of the reflector and improve the heat dissipation. As a result, it can be applied to a vehicular lamp using a high-power semiconductor light-emitting element, the number of parts can be reduced, and the entire lamp can be thinned.

It is sectional drawing of the vertical direction (vertical direction) of the vehicle lamp shown as embodiment of this invention. It is the figure seen from the back side of the vehicle lamp same as the above. It is sectional drawing of the conventional vehicle lamp.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the invention will be described with reference to the accompanying drawings. 1 and 2 show a vehicular lamp according to an embodiment of the present invention. FIG. 1 is a sectional view in the longitudinal direction (vertical direction), and FIG. 2 is a view as seen from the back side. In the following description, the left and right direction left side of FIG. 1 is assumed to be the front, the right side is the rear side, the up and down direction is the top and bottom, and the direction perpendicular to the paper surface is the left and right.

  1 and 2, the vehicular lamp 10 according to the present embodiment is, for example, a projector-type headlamp that is provided on each of the left and right sides of the front portion of an automobile (vehicle).

  As shown in FIG. 1, the vehicle headlamp 10 includes a light emitting diode 11 as a light source, a circuit board 12 on which the light emitting diode 11 is mounted, a reflector 13, a projection lens 14, a shade 15, A frame member 16, a lamp housing (not shown), and a lamp lens (not shown) (for example, a transparent outer lens) are provided.

  The light emitting diode 11, the circuit board 12, the reflector 13, the projection lens 14, the shade 15, and the frame member 16 constitute a lamp unit. The lamp unit is disposed, for example, via an optical axis adjusting mechanism (not shown) in a lamp chamber (not shown) defined by the lamp housing and the lamp lens.

  The light emitting diode 11 is a semiconductor light emitting element. The light emitting diode 11 is mounted on the front side of the circuit board 12 and is handled and disposed integrally with the circuit board 12. Circuit wiring (not shown) is exposed on both the front and rear surfaces of the circuit board 12, and a power socket 17 is mounted on the rear surface opposite to the front surface on which the light emitting diode 11 is mounted. The circuit board 12 is provided with two mounting holes 18 and 18 that are separated in the vertical direction.

  The reflector 13 is fixedly held on the frame member 16. The reflector 13 is made of a metal material having excellent thermal conductivity, for example, aluminum, and has a hollow concave shape in which a front side (light irradiation direction of the vehicle lamp 10) is opened and a rear side is closed. Yes. In addition, an opening 19 penetrating the front and rear surfaces through which the light emitting diode 11 is inserted is provided in the center of the closing portion on the rear side of the reflector 13.

  A reflective surface 20 is formed on the inner concave surface (front surface) of the reflector 13 by vapor deposition of aluminum or silver coating. The reflecting surface 20 reflects light from the light emitting diode 11 toward the shade 15 and the projection lens 14, and is composed of an ellipse or a reflecting surface such as a free-form surface based on an ellipse.

  On the outer convex surface (back surface) of the reflector 13, a mounting seat portion 21 to which the circuit board 12 is attached perpendicularly to the optical axis Z and a plurality of heat radiation fins 22, 22,. The mounting seat portion 21 is formed in a quadrangular shape that matches the outer shape of the circuit board 12, and the opening portion 19 that communicates with the inner concave surface side of the reflector 13 is provided in a substantially central portion. . The mounting seat portion 21 is formed with two mounting holes 23 and 23 corresponding to the mounting holes 18 and 18 of the circuit board 12, respectively.

  The heat dissipating fins 22, 22... Of the reflector 13 are formed so as to protrude from the outer convex surface of the reflector 13 toward the rear side so as to surround the outer side of the mounting seat portion 21. Further, as shown in FIG. 1, when the circuit board 12 is attached to the mounting seat portion 21, the amount of protrusion of the heat radiation fins 22, 22 ... is for the power source mounted on the back side of the circuit board 12. The components such as the socket 17 do not protrude rearward from the rear end portions (projecting tip portions) of the heat radiation fins 22 and 22 and are stored and arranged in the state of being absorbed in the region of the heat radiation fins 22, 22. Is set to Further, four mounting holes 24, 24, 24, 24 to which mounting brackets (not shown) are mounted are formed in part of the heat radiation fins 22. The number and shape of the heat radiation fins 22 are arbitrarily set.

  When the circuit board 12 is attached to the attachment seat portion 21 of the reflector 13, the circuit board 12 has the light emitting diode 11 mounted on the front side of the circuit board 12 and the power socket 17 mounted on the rear side. 12 is prepared. Next, the circuit board 12 is arranged on the mounting seat 21 with the light emitting diode 11 corresponding to the opening 19, and the mounting holes 18, 18 of the reflector 13 and the mounting holes 23, 23 of the circuit board 12 are made to correspond to each other. Then, the light emitting diode 11 is inserted into the opening 19. Subsequently, screws 25 and 25 are tightened from the rear side of the circuit board 12 to the mounting holes 18 and 18 through the mounting holes 23 and 23, respectively. As a result, the circuit board 12 is fixedly held on the reflector 13 on the mounting seat 21.

  In the state where the circuit board 12 is attached to the attachment seat portion 21, the light emitting diode 11 is exposed to the inner concave surface (front surface) side of the reflector 13 through the opening 19 as shown in FIG. The circuit board 12 and the power supply socket 17 are also housed in a state where the heat dissipating fins 22, 22... Are recessed toward the reflector 13 from the rear end (projecting front end). Thereby, it can protect so that the circuit board 12 may not interfere with peripheral components, such as a harness. Further, the heat of the circuit board 12 generated by the light emission of the light emitting diode 11 is transmitted from the mounting seat portion 21 to the entire heat radiation fins 22, 22, and can be efficiently discharged (heat dissipation).

  The projection lens 14 is an aspherical lens convex lens (condensing lens). The projection lens 14 has a convex aspheric surface on the front side and a flat aspheric surface on the rear side. The projection lens 14 is fixedly held on the frame member 16.

  The shade 15 has a plate structure (thin steel plate structure in this embodiment) that is inexpensive to manufacture. The shade 15 is provided with an opening 26. The shade 15 shields a part of the reflected light from the reflecting surface 20 of the reflector 13 toward the projection lens 14 at a portion other than the opening 26 and allows the remaining reflected light to pass through the opening 26 to have a predetermined light distribution pattern. Is formed.

  Therefore, in the vehicle lamp 10 according to this embodiment, the reflector 13 itself is used as a heat sink, and the mounting seat portion 21 to which the circuit board 12 on which the light-emitting diodes 11 and the like are mounted is attached to the back surface of the reflector 13 and a plurality of heat radiating members. Since the fins 22, 22... Are integrally provided, the heat of the circuit board 12 generated by the light emission of the light emitting diode 11 passes through the inside of the reflector 13 from the mounting seat portion 21 to the entire heat radiation fins 22, 22. It will be communicated. Thereby, it is possible to efficiently discharge (heat dissipation) using the reflector 13 without providing a heat sink separately. Further, the amount of protrusion of the heat dissipating fins 22, 22... Is absorbed by the rearward protruding (convex) shape of the reflector 13, so that the length L (see FIG. 1) in the optical axis direction of the vehicle lamp is not increased. A large amount of protrusion of the heat dissipating fins 22 extending from the side can be secured to enhance heat dissipation. As a result, the present invention can be applied to the vehicular lamp 10 that uses the high-power light-emitting diode 11, and the number of parts can be reduced and the thickness can be reduced.

  The preferred embodiments of the present invention have been described above. However, the present invention can be variously modified and changed without departing from the concept of the claims.

  For example, in the above-described embodiment, the vehicular lamp 20 is described as an example of a projector-type headlamp. However, the vehicular lamp 20 can be used as a vehicular marker lamp or the like by changing a lens or the like.

  In a state where the circuit board 12 is attached to the mounting seat portion 21, the circuit board 12 and the power source socket 17 are located on the inner side of the rear end portions (protruding front end portions) of the heat radiation fins 22, 22,. Although the structure in which the fins 22, 22... Are arranged in the absorbed state is disclosed, the power socket 17 may protrude and only the circuit board 12 may be accommodated.

DESCRIPTION OF SYMBOLS 10 Vehicle lamp 11 Light emitting diode (semiconductor light emitting element)
12 circuit board 13 reflector 14 projection lens 15 shade 16 frame member 17 power socket 18 mounting hole 19 opening 20 reflecting surface 21 mounting seat 22 heat radiating fin 23 mounting hole 24 mounting hole 25 opening Z optical axis

Claims (3)

In a vehicle lamp using a semiconductor light emitting element as a light source,
A circuit board on which the semiconductor light emitting element is mounted;
An opening that penetrates through the front and rear surfaces through which the semiconductor light emitting element is inserted, and a mounting seat portion to which the circuit board is attached and a plurality of heat radiation fins are integrally provided on the back surface, and the front surface A reflector provided on the side with a reflective surface that reflects light from the semiconductor light emitting element forward;
A lens disposed in front of the reflector;
A vehicular lamp characterized by comprising:   The vehicular lamp according to claim 1, wherein the heat dissipating fin is provided to project rearward from the circuit board installed on the mounting seat.   The lens is a projection lens, and a shade is formed between the projection lens and the reflector to shield a part of the reflected light from the reflector toward the projection lens to form a predetermined light distribution pattern. The vehicular lamp according to claim 1 or 2.

Images