CN101659749B - 表面具有悬挂粘合剂聚合物链的形状记忆聚合物及其制备和使用方法 - Google Patents

表面具有悬挂粘合剂聚合物链的形状记忆聚合物及其制备和使用方法 Download PDF

Info

Publication number
CN101659749B
CN101659749B CN200910173340.3A CN200910173340A CN101659749B CN 101659749 B CN101659749 B CN 101659749B CN 200910173340 A CN200910173340 A CN 200910173340A CN 101659749 B CN101659749 B CN 101659749B
Authority
CN
China
Prior art keywords
shape
memory polymer
tackiness agent
polymer
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200910173340.3A
Other languages
English (en)
Other versions
CN101659749A (zh
Inventor
T·谢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GM Global Technology Operations LLC
Original Assignee
GM Global Technology Operations LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GM Global Technology Operations LLC filed Critical GM Global Technology Operations LLC
Publication of CN101659749A publication Critical patent/CN101659749A/zh
Application granted granted Critical
Publication of CN101659749B publication Critical patent/CN101659749B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F218/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
    • C08F218/02—Esters of monocarboxylic acids
    • C08F218/04—Vinyl esters
    • C08F218/08—Vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2431/00—Characterised by the use of copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, or carbonic acid, or of a haloformic acid
    • C08J2431/02—Characterised by the use of omopolymers or copolymers of esters of monocarboxylic acids
    • C08J2431/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/261—In terms of molecular thickness or light wave length
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

本发明涉及表面具有悬挂粘合剂聚合物链的形状记忆聚合物及其制备和使用方法，其中本发明的一个示例性实施方案包括接枝热塑生热熔粘合剂材料到形状记忆聚合物表面上。

Description

表面具有悬挂粘合剂聚合物链的形状记忆聚合物及其制备和使用方法
本申请要求2008年8月5日提交的美国临时申请序列号No.61/086,222的权益。技术领域
本申请一般涉及的领域包括形状记忆聚合物和粘合剂。背景技术
迄今为止，人们已经熟知提供形状记忆聚合物并用液体分配体系将热熔粘合剂向其施加，但这可能增加结合过程(bonding process)的费用和复杂性。发明内容
一个实施方案包括产品，其包含表面具有从其悬挂的聚合物链的形状记忆聚合物，由此使得该形状记忆聚合物可以能够粘附到基底上或选择性地粘附到基底上。
本发明的一个示例性实施方案包括将热塑性热熔粘合剂材料接枝到形状记忆聚合物表面上。
本发明的另一个示例性实施方案包括如下方法：提供包含形状记忆聚合物层和接枝到该形状记忆聚合物层上的粘合剂聚合物的组合，在高于该形状记忆聚合物层和该接枝的粘合剂聚合物的热转变温度的温度来加热该组合，将该粘合剂聚合物压向基底，在负载下冷却该粘合剂聚合物，从而将该粘合剂聚合物结合(bond)到基底上。
根据下面的详细描述，本发明的其它示例性实施方案将变得明显。应该理解的是，在公开本发明的示例性实施方案的同时，所述详细描述和具体实施例仅旨在举例说明，并不是要限制本发明的范围。附图说明
本发明的示例性实施方案通过详细描述和附图将更全面地被理解，其中：
图1示出了制备产品的方法，所述产品包含形状记忆聚合物层，所述形状记忆聚合物层的表面上接枝有粘合剂聚合物。具体实施方式
下面关于实施方案的描述本质仅仅是示例性(说明性)的，绝不旨在限制本发明、其应用或用途。
一个示例性实施方案包括提供表面上含未反应基团的形状记忆聚合物(shape memory polymer)。在一个实施方案中，粘合剂聚合物(adhesivepolymer)被直接接枝到该形状记忆聚合物层的该表面上的未反应基团上。在另一个实施方案中，中间基团(intermediate group)被接枝到形状记忆聚合物层上的未反应基团上，然后通过中间接枝材料(intermediate grafting material)和粘合剂聚合物的基团之间的反应，把粘合剂聚合物接枝到形状记忆聚合物表面上。
在一个实施方案中，提供含有未反应的表面环氧基团的基于环氧的形状记忆聚合物。通过环氧形状记忆聚合物表面上的环氧基团和PEI的胺基之间的反应，将含有多个胺基的聚乙烯亚胺(polyethylenimine，PEI)接枝到该环氧形状记忆聚合物表面上。然后，该PEI接枝的环氧形状记忆聚合物可以浸在含具有羧酸基的聚乙酸乙烯酯(PVAc)的溶液中。PEI上的胺基和PVAc上的羧酸基团之间发生反应从而引起了接枝。该反应如图1所示。对于图1应该指出的是，形状记忆聚合物的两个暴露表面(包括底面和侧面)，均被PVAc接枝，后者是典型的热熔热塑性粘合剂(胶)。其它种类的形状记忆聚合物、其它热塑性热熔粘合剂(胶)以及不同的接枝化学可以被使用。另外，热塑性热熔粘合剂(胶)能够被交联而自身变成表面上具有自由悬挂链的形状记忆聚合物，来作为粘合剂(胶)。形状记忆聚合物可以是固体或泡沫，如下所述。粘合剂可以以单分子层接枝到形状记忆聚合物上，或者多层所述粘合剂例如但不限于2至10分子层厚可以接枝到形状记忆聚合物上。
形状记忆聚合物层与接枝于其上的粘合剂聚合物的组合可以用于通过该接枝的粘合剂聚合物可逆地把形状记忆聚合物粘附到基底上。一个实施方案包括方法，其包括：加热该粘合剂接枝的形状记忆聚合物到高于该形状记忆聚合物和该粘合剂聚合物两者的热转变温度之上的温度，将加热的粘合剂聚合物压向基底，然后在压力下(负载)冷却该粘合剂聚合物到低于该形状记忆聚合物层和该粘合剂两者的热转变温度，从而通过该接枝的粘合剂聚合物将形状记忆聚合物层结合到基底上。结合速度可以由冷却该粘合剂聚合物到低于形状记忆聚合物和粘合剂聚合物的热转变温度所需的时间决定。下文中提供了该形状记忆聚合物和该粘合剂聚合物的所选的示例性的化学物质，但并不是限于这些化学物质。
下面的描述是关于形状记忆聚合物和用于接枝到其上的粘合剂的选择。聚合物要具有形状记忆性质，它必须具有冻结相(frozen phase)和可逆相(reversiblephase)。前者负责记忆初始形状，并且通常通过化学交联或物理交联(例如，链缠结和结晶)得到。另一方面，临时形状的固定和改变归因于可逆相，其可以是玻璃化转变或熔融转变。由于大多数聚合物具有玻璃化转变温度(Tg)或熔融温度(Tm)或两者，所以其可以通过引入冻结机理(例如，化学交联)被转变成形状记忆聚合物。通过发现的众多形状记忆聚合物及聚氨酯形状聚合物可得到的宽范围的Tg(从-30℃至+70℃)，举例说明了通过分子设计来创建和定制形状记忆聚合物的形状记忆性质的极大可能性。
一个实施方案包括能够可逆地连接两个基底的多层粘合剂系统，其在低于该形状记忆聚合物和粘合剂聚合物的热转变温度的温度的拉离粘合力(pull-off adhesion force)明显(substantially)高于在高于该形状记忆聚合物和粘合剂聚合物的热转变温度的温度时的用于断连接或者脱连接或者脱离(dejoiningor unjoining or decoupling)的剥离力(peel-off force)。
大量的形状记忆聚合物可以应用于本发明的各种实施方案中。例如，从Tg约为90℃的典型的芳香族二环氧/二胺体系开始，芳香族环氧组分系统地被脂肪族二环氧替换，从而得到Tg的范围从3℃至90℃的一系列环氧形状记忆聚合物。这样，形状记忆聚合物可以进行定制以和粘合剂一起使用，这是在一定温度范围内操作的特定应用所需的。这样，粘合剂层可以具有-90℃至200℃的Tg，形状记忆聚合物可以具有25℃至200℃的Tg。
一些实施方案涉及多层环氧粘合剂(multilayer epoxy adhesive)。应该理解可以利用多于两层。例如，可能有两层或更多层的形状记忆聚合物层，其可以是肩并肩关系(side by side relationship)或重叠关系(overlying relationship)。同样地，可能有肩并肩关系或重叠关系的两层或更多层的粘合剂层。这样，可以制造有自定义的或定制的性能的装置。
在多个实施方案中，粘合剂层可以是环氧热塑性粘合剂或苯氧粘合剂。在多种实施方案中，形状记忆聚合物可以是环氧物。在本发明的多种实施方案中，形状记忆聚合物和粘合剂的任何组合均可使用。下面的形状记忆聚合物和粘合剂的例子仅是示例意图。
在许多实施方案中，粘合剂的组分或形状记忆聚合物的组分可以包括刚性环氧物(rigid epoxy)和柔性环氧物(flexible epoxy)。可以用来获得粘合剂或形状记忆聚合物的可能的交联化学物质范围可以包括α，ω-二氨基烷烃、一元胺、有机多羧酸、酸酐或催化(例如咪唑型)交联剂。有多种不同方式来得到分子性质之间的恰当关系。例如，粘合剂或形状记忆聚合物可以包括刚性环氧物、环氧扩增剂和交联剂；或刚性环氧物、柔性交联剂和柔性环氧物；或刚性环氧物、刚性交联剂和柔性环氧物；或刚性环氧物、柔性环氧物和催化固化剂；或刚性环氧物、交联剂和稀释剂；或柔性环氧物、交联剂和稀释剂；或刚性环氧物和柔性交联剂；或柔性环氧物和催化固化剂；或柔性环氧物和交联剂；其中，所述刚性环氧物是具有至少两个环氧基团的芳香族环氧物，所述柔性环氧物是具有至少两个环氧基团的脂肪族环氧物，所述环氧扩增剂有一个环氧基团，所述交联剂是多胺、有机多羧酸或酸酐中的一种，所述稀释剂是一元胺或一元羧酸。在多个实施方案中，所述催化固化剂(或催化固化)促进了环氧基团与环氧基团或环氧基团与羟基之间的反应。催化固化剂可以包括但不限于：叔胺、胺盐、三氟化硼络合物或胺硼酸盐。在一个实施方案中，所述粘合剂的组分可以以如下量存在：所述量足以在所述组合物固化后提供具有-90℃至200℃的玻璃转化温度和1-4000N/cm2的与基底之间的粘合拉伸强度的热塑性粘合剂。在一个实施方案中，形状记忆聚合物组合物的组分可以以如下量存在：所述量足以在所述组合物固化后提供在其玻璃化转变前后储能模量(storagemodulus)发生2到3个数量级变化的环氧形状记忆聚合物。
多种形状记忆聚合物可以用于本发明的多种实施方案中。例如，从Tg约为90℃的典型的芳香族二环氧/二胺体系开始，芳香族环氧组分系统地被脂肪族二环氧替换，从而得到Tg的范围从3℃至90℃的一系列环氧形状记忆聚合物。这样，形状记忆聚合物可以定制以和干粘合剂一起使用，这是在一定温度范围内操作的特定应用所需的。
在另一实施方案中，形状记忆聚合物可以由乙烯和乙酸乙烯酯(EVA)的共聚物制备，所述共聚物是典型的热熔胶(hot melt glue)。EVA聚合物可以是通过电子束辐射、γ射线辐射或有机过氧化物而化学交联的聚合物。该交联的聚合物变为表面上具有悬挂EVA链的形状记忆聚合物。
在另一个实施方案中，热熔胶聚合物通过化学交联转变为表面上具有悬挂热熔胶聚合物链的形状记忆聚合物。该热熔胶链可以包括但不限于下述物质中的一种或多种：EVA、苯氧基、聚氯乙烯、聚酰胺、聚酯、聚乙酸酯或聚缩醛聚合物或它们的共聚物。
上述本发明实施方案的描述本质上仅仅是示例性的，因此，其变体不被认为脱离了本发明的精神和范围。

Claims (24)

1.形状记忆聚合物，其表面具有聚合物链，由此使得该形状记忆聚合物可以能够粘附到基底上，其中所述链包括化学接枝到该形状记忆聚合物表面的粘合剂。
2.如权利要求1所述的形状记忆聚合物，其中，所述链包括乙烯和乙酸乙烯酯的交联共聚物。
3.如权利要求1所述的形状记忆聚合物，其中，所述链包括交联的热熔胶聚合物。
4.如权利要求1所述的形状记忆聚合物，其中，所述链包括苯氧基聚合物、聚氯乙烯、聚酰胺、聚酯、聚乙酸酯、聚缩醛、或乙烯和乙酸乙烯酯共聚物的至少之一。
5.如权利要求1所述的形状记忆聚合物，其中，该粘合剂是厚度等于一分子厚度的粘合剂聚合物。
6.如权利要求1所述的形状记忆聚合物，其中，该粘合剂是粘合剂聚合物的层，其厚度为2-10个分子层厚度。
7.如权利要求1所述的形状记忆聚合物，其中，该形状记忆聚合物包括环氧聚合物。
8.如权利要求1所述的形状记忆聚合物，其中，该形状记忆聚合物包括聚氨酯聚合物。
9.如权利要求1所述的形状记忆聚合物，其中，该粘合剂包括聚乙酸乙烯酯或其共聚物。
10.如权利要求1所述的形状记忆聚合物，其中，该粘合剂包括聚乙烯醇或其共聚物。
11.如权利要求1所述的形状记忆聚合物，其中，该粘合剂包括苯氧基聚合物。
12.如权利要求1所述的形状记忆聚合物，其中，该粘合剂包括热塑生环氧聚合物。
13.如权利要求1所述的形状记忆聚合物，其中，该粘合剂包括聚氯乙烯或其共聚物。
14.制备形状记忆聚合物层与接枝于其上的接枝粘合剂聚合物的组合的方法，包括：
提供形状记忆聚合物层，并且在该形状记忆聚合物层上接枝粘合剂聚合物。
15.如权利要求14所述的方法，进一步包括：在接枝该粘合剂之前，接枝中间材料到该形状记忆聚合物层上。
16.如权利要求14所述的方法，其中，该形状记忆聚合物层包括环氧聚合物。
17.如权利要求14所述的方法，其中，该粘合剂包括聚乙酸乙烯酯或其共聚物。
18.如权利要求14所述的方法，其中，该粘合剂包括聚乙烯醇或其共聚物。
19.如权利要求14所述的方法，其中，该粘合剂包括苯氧基聚合物。
20.如权利要求14所述的方法，其中，该粘合剂包括热塑生环氧聚合物。
21.如权利要求14所述的方法，其中，该粘合剂包括聚氯乙烯或其共聚物。
22.如权利要求15所述的方法，其中，该中间材料包括聚乙烯亚胺。
23.如权利要求14所述的方法，其中，该形状记忆聚合物层是泡沫。
24.如权利要求14所述的方法，包括：
提供表面上包含未反应的环氧基团的环氧形状记忆聚合物层，通过该形状记忆聚合物层的环氧基团与聚乙烯亚胺的胺之间的反应，将包含多个胺基团的聚乙烯亚胺接枝到该环氧形状记忆聚合物层的表面上，然后，通过聚乙烯亚胺的胺与聚乙酸乙烯酯的羧酸基团之间的反应，将具有羧酸基团的聚乙酸乙烯酯接枝到该形状记忆聚合物层上。
CN200910173340.3A 2008-08-05 2009-08-05 表面具有悬挂粘合剂聚合物链的形状记忆聚合物及其制备和使用方法 Active CN101659749B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US8622208P 2008-08-05 2008-08-05
US61/086222 2008-08-05
US61/086,222 2008-08-05
US12/432211 2009-04-29
US12/432,211 US8198369B2 (en) 2008-08-05 2009-04-29 Shape memory polymers with surface having dangling adhesive polymeric chains and methods of making and using the same
US12/432,211 2009-04-29

Publications (2)

Publication Number Publication Date
CN101659749A CN101659749A (zh) 2010-03-03
CN101659749B true CN101659749B (zh) 2014-05-07

Family

ID=41501552

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910173340.3A Active CN101659749B (zh) 2008-08-05 2009-08-05 表面具有悬挂粘合剂聚合物链的形状记忆聚合物及其制备和使用方法

Country Status (3)

Country Link
US (1) US8198369B2 (zh)
CN (1) CN101659749B (zh)
DE (1) DE102009035595B4 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2570450A1 (de) * 2011-09-14 2013-03-20 Sika Technology AG Formgedächtnis-Material auf Basis eines Strukturklebstoffs
US20130078452A1 (en) * 2011-09-23 2013-03-28 GM Global Technology Operations LLC Quick drying semi-solid glues
US9525194B2 (en) 2011-12-14 2016-12-20 GM Global Technology Operations LLC Reversible electrical connector and method
US9527947B2 (en) 2012-10-11 2016-12-27 The Hong Kong Polytechnic University Semi-crystalline shape memory polymer and production method thereof
WO2014138049A2 (en) * 2013-03-04 2014-09-12 Syracuse University Reversible shape memory polymers exhibiting ambient actuation triggering
US9708441B2 (en) * 2014-10-06 2017-07-18 Plactis Industry Development Center Low temperature shape memory thermosetting epoxy, film material and producing method thereof
CN104927025A (zh) * 2015-05-07 2015-09-23 清华大学 一种具有形状记忆的环氧化物聚合物泡沫的制备方法
US11302561B2 (en) * 2019-11-12 2022-04-12 Palo Alto Research Center Incorporated Transfer elements that selectably hold and release objects based on changes in stiffness
US11348905B2 (en) 2020-03-02 2022-05-31 Palo Alto Research Center Incorporated Method and system for assembly of micro-LEDs onto a substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1299395A (zh) * 1998-03-11 2001-06-13 陶氏化学公司 由α－烯烃/乙烯基或亚乙烯基芳族单体和/或位阻脂族乙烯基或亚乙烯基共聚体制成的具有形状记忆的结构和制品
US6753379B1 (en) * 1999-11-05 2004-06-22 3M Innovative Properties Company Heat activated adhesive
JP2005002269A (ja) * 2003-06-13 2005-01-06 Three M Innovative Properties Co 粘着テープ
WO2005063906A1 (de) * 2003-12-23 2005-07-14 Lohmann Gmbh & Co. Kg Dichtungsband zur klebung von damfsperren- und dampfbremsfolien sowie verfahren zur herstellung
CN101045797A (zh) * 2007-03-30 2007-10-03 东华大学 一种透湿可控聚合物复合薄膜的制备及其应用

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216074A (en) 1989-07-17 1993-06-01 Japan Synthetic Rubber Co., Ltd. Thermoplastic elastomer composition
US5755913A (en) * 1996-12-06 1998-05-26 Liaw; Der-Jang Adhesive-free adhesion between polymer surfaces
US6240630B1 (en) * 1997-12-03 2001-06-05 The Regents Of The University Of California Apparatus for loading shape memory gripper mechanisms
US6160084A (en) 1998-02-23 2000-12-12 Massachusetts Institute Of Technology Biodegradable shape memory polymers
US6827325B2 (en) * 2000-08-28 2004-12-07 Johnson & Johnson Vision Care, Inc. Shape memory polymer or alloy ophthalmic lens mold and methods of forming ophthalmic products
JP2004530573A (ja) * 2001-01-24 2004-10-07 ジョンソン・アンド・ジョンソン・ビジョン・ケア・インコーポレイテッド 形状記憶ポリマー或いは形状記憶合金を用いる眼科用レンズの型及びその型を用いた眼科製品の製造方法
US6986855B1 (en) * 2001-01-24 2006-01-17 Cornerstone Research Group Structural and optical applications for shape memory polymers (SMP)
US7823845B2 (en) * 2002-05-09 2010-11-02 Dmr Holding Group, Llc Corner climber
US6773535B1 (en) * 2003-03-03 2004-08-10 The United States Of America As Represented By The Secretary Of The Army Article and method for controlled debonding of elements using shape memory alloy actuators
US7689260B2 (en) * 2003-11-06 2010-03-30 The Regents Of The University Of Colorado Shape-memory polymer coated electrodes
WO2005068137A1 (en) * 2004-01-05 2005-07-28 Lewis & Clark College Self-cleaning adhesive structure and methods
US7985222B2 (en) * 2004-04-21 2011-07-26 Medshape Solutions, Inc. Osteosynthetic implants and methods of use and manufacture
US7981229B2 (en) * 2004-06-04 2011-07-19 Cornerstone Research Group, Inc Method of making and using shape memory polymer patches
US20050274455A1 (en) * 2004-06-09 2005-12-15 Extrand Charles W Electro-active adhesive systems
US20060036045A1 (en) * 2004-08-16 2006-02-16 The Regents Of The University Of California Shape memory polymers
US7188498B2 (en) * 2004-12-23 2007-03-13 Gm Global Technology Operations, Inc. Reconfigurable tools and/or dies, reconfigurable inserts for tools and/or dies, and methods of use
US7761974B2 (en) * 2005-01-19 2010-07-27 Gm Global Technology Operations, Inc. Reconfigurable fixture device and methods of use
US7762362B2 (en) * 2006-04-17 2010-07-27 The Board Of Trustees Of The Leland Stanford Junior University Climbing with dry adhesives
US8685528B2 (en) * 2007-04-20 2014-04-01 GM Global Technology Operations LLC Shape memory polymer and adhesive combination and methods of making and using the same
US7976665B2 (en) * 2007-10-04 2011-07-12 GM Global Technology Operations LLC Method of minimizing residue adhesion for thermo-reversible dry adhesives
US8093340B2 (en) * 2008-07-24 2012-01-10 GM Global Technology Operations LLC High strength reversible noncovalent adhesion methods for a solid polymer-polymer interface

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1299395A (zh) * 1998-03-11 2001-06-13 陶氏化学公司 由α－烯烃/乙烯基或亚乙烯基芳族单体和/或位阻脂族乙烯基或亚乙烯基共聚体制成的具有形状记忆的结构和制品
US6753379B1 (en) * 1999-11-05 2004-06-22 3M Innovative Properties Company Heat activated adhesive
JP2005002269A (ja) * 2003-06-13 2005-01-06 Three M Innovative Properties Co 粘着テープ
WO2005063906A1 (de) * 2003-12-23 2005-07-14 Lohmann Gmbh & Co. Kg Dichtungsband zur klebung von damfsperren- und dampfbremsfolien sowie verfahren zur herstellung
CN101045797A (zh) * 2007-03-30 2007-10-03 东华大学 一种透湿可控聚合物复合薄膜的制备及其应用

Also Published As

Publication number Publication date
US8198369B2 (en) 2012-06-12
DE102009035595A1 (de) 2010-02-11
DE102009035595B4 (de) 2015-01-08
US20100035049A1 (en) 2010-02-11
CN101659749A (zh) 2010-03-03

Similar Documents

Publication Publication Date Title
CN101659749B (zh) 表面具有悬挂粘合剂聚合物链的形状记忆聚合物及其制备和使用方法
JP5597397B2 (ja) 貼合せ用ポリウレタン接着剤
CN105829482B (zh) 粘合剂组合物、粘合剂层、粘合带以及双面粘合带
US8628838B2 (en) Multilayer thermo-reversible dry adhesives
KR102448664B1 (ko) 저 점도, 신속 경화 라미네이팅 접착제 조성물
KR101745041B1 (ko) Tpu 적층용 접착제
JP4872295B2 (ja) 湿気硬化型ポリウレタンホットメルト接着剤
TW202115215A (zh) 接著片
US20140069578A1 (en) Shape memory polymer which functions as a reversible dry adhesive and methods of making and using the same
TW201012655A (en) Adhesives compatible with corrosion sensitive layers
JPWO2011055827A1 (ja) 粘着剤組成物
CN101519569A (zh) 最小化热可逆干粘合剂的残留粘附的方法
JP2006002150A (ja) カード本体中に電気モジュールを埋め込むための電気的の異方性の導電性のホットメルト接着シート
TW200936727A (en) Thermal active and thermosetting adhesive film particularly for the adhesion of electronic components and flexible printed circuits
KR20120076187A (ko) 이방 도전성 필름
JP2016502577A (ja) 未被覆アルミニウムツールへの接着性が低い反応性ポリオレフィンホットメルト接着剤、及び積層ホットメルトとしてのその使用
CN102402896A (zh) 粘着标签及其制作装置
CN108137996B (zh) 切向接合方法
JP4601089B2 (ja) 熱活性接着剤組成物およびフィルム接着剤
TWI813581B (zh) 接著片及其製造方法
JP2012502153A (ja) 二つのプラスチック表面の接着方法
WO2020047031A1 (en) Hot melt adhesive containing phase changing materials
US9263372B2 (en) Anisotropic conductive film and semiconductor device
JP2011084623A (ja) 湿気硬化型反応性ホットメルト接着剤
JP2014208783A (ja) 湿気硬化型ホットメルト接着剤

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant