CN101645313A - Improved cooling module structure combining wind cooling, water cooling and electronic cooling - Google Patents
Improved cooling module structure combining wind cooling, water cooling and electronic cooling Download PDFInfo
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- CN101645313A CN101645313A CN200910027475A CN200910027475A CN101645313A CN 101645313 A CN101645313 A CN 101645313A CN 200910027475 A CN200910027475 A CN 200910027475A CN 200910027475 A CN200910027475 A CN 200910027475A CN 101645313 A CN101645313 A CN 101645313A
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- cooling
- cooled
- water
- heating radiator
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Abstract
The invention relates to an improved cooling module structure combining wind cooling, water cooling and electronic cooling. The improved cooling module structure can lower the temperature of a heatingdevice to be lower than the environmental temperature, can be suitable for occasions of various environments and various devices and can have wide applicable scope. The cooling module structure comprises fans, a water pump, a pipeline and a water block, wherein the water block is in contact with the heating device. The improved cooling module structure is characterized in that the upper surface and the lower surface of an exchanger are respectively connected with the cold surfaces of an upper semiconductor cooling plate and a lower semiconductor cooling plate, and the hot surfaces of the upper semiconductor cooling plate and the lower semiconductor cooling plate are respectively connected with an upper radiator and a lower radiator; the exchanger is connected with the water block and thewater pump, and the fans are arranged at one side of the upper radiator and the lower radiator.
Description
(1) technical field
The present invention relates to efficient cooling technology device field, be specially the cooling module structure that a kind of air-cooled, water-cooled and electronic cooling combine.
(2) background technology
Present water-cooled cooling system, it is by the water-cooled head, water pump, water row heating radiator, fan, pipeline is formed, its refrigerating module is exactly a water-cooled head, it can only be reduced to environment temperature with temperature at most, and it is unsuitable in environment temperature than higher application scenario and the lower device of working temperature, so its scope of application is little.
(3) summary of the invention
At the problems referred to above, the invention provides a kind of air-cooled, water-cooled of improvement and the cooling module structure that electronic cooling combines, it can drop to the temperature of heater members and be lower than environment temperature, and it can be applicable to various environment occasions and all kinds of device, and the scope of application is big.
The cooling module structure that a kind of air-cooled, water-cooled of improvement and electronic cooling combine, its technical scheme is such: it comprises fan, water pump, pipeline, water-cooled head, a described water-cooled contact heating element, it is characterized in that: the upper and lower surface of interchanger connects the huyashi-chuuka (cold chinese-style noodles) of semiconductor-on-insulator cooling piece, following semiconductor chilling plate respectively, the hot side of described semiconductor-on-insulator cooling piece, following semiconductor chilling plate connects heating radiator, following heating radiator respectively, described interchanger connects described water-cooled head, water pump, and described fan is positioned at a described side that goes up heating radiator, following heating radiator.
It is further characterized in that: described upward heating radiator, following heating radiator form with the base plate soldering after being overlaped by multi-disc aluminium radiator fin discount, have mounting hole on the base plate of described upward heating radiator, following heating radiator; Described heating radiator, described semiconductor-on-insulator cooling piece, described interchanger, described semiconductor chilling plate down, the described heating radiator down gone up is by being fastenedly connected by screw, spring; Described screw, spring cooperate installation with described mounting hole; Auxiliary stand is supported on the described base plate of heating radiator down, and a side bearing of temperature sensor is in described auxiliary stand, and its opposite side contacts with the surface of described interchanger.
Adopt cooling module structure of the present invention, because on the interchanger, lower surface connects the semiconductor-on-insulator cooling piece respectively, the huyashi-chuuka (cold chinese-style noodles) of following semiconductor chilling plate, described semiconductor-on-insulator cooling piece, the hot side of following semiconductor chilling plate connects heating radiator respectively, following heating radiator, described interchanger connects described water-cooled head by joint, water pump, described fan is positioned at the described heating radiator of going up, one side of following heating radiator, when described heater element is worked, the heat that distributes conducts to described water-cooled head, liquid coolant with heat transferred to described interchanger inside, the interchanger internal heat heat transferred to described semiconductor-on-insulator cooling piece, the huyashi-chuuka (cold chinese-style noodles) of following semiconductor chilling plate, its heat is from described semiconductor-on-insulator cooling piece, the huyashi-chuuka (cold chinese-style noodles) of following semiconductor chilling plate is passed to described semiconductor-on-insulator cooling piece, the hot side of following semiconductor chilling plate, the heat of the hot side of described semiconductor chilling plate is by the described heating radiator of going up, following heat sink radiates is distributed heat by described fan at last.Because semiconductor chilling plate can quick heat radiating, radiating effect is strong, it can guarantee that temperature with heater members drops to and be lower than environment temperature that so native system can be applicable to various environment occasions, the scope of application is big.
(4) description of drawings
Fig. 1 is a schematic perspective view of the present invention;
Fig. 2 is a sectional perspective signal enlarged drawing of the present invention;
Fig. 3 is the stereographic map of heating radiator.
(5) embodiment
See Fig. 1, Fig. 2, Fig. 3, it comprises fan 6, water pump 13, pipeline 11, water-cooled 12, water-cooled 12 a contact heating element, interchanger 3 upper and lower surfaces connect the huyashi-chuuka (cold chinese-style noodles) of semiconductor-on-insulator cooling piece 4, following semiconductor chilling plate 2 respectively, the hot side of semiconductor-on-insulator cooling piece 4, following semiconductor chilling plate 2 connects heating radiator 5, following heating radiator 1 respectively, interchanger 3 connects water-cooleds 12, water pump 13, and fan 6 is positioned at a side of heating radiator 5, time heating radiator 1.
Last heating radiator 5, following heating radiator 1 form with base plate 15 solderings after being overlaped by multi-disc aluminium radiator fin 14 discounts, have mounting hole 16 on the base plate of last heating radiator 5, following heating radiator 1; Last heating radiator 5, semiconductor-on-insulator cooling piece 4, interchanger 3, following semiconductor chilling plate 2, following heating radiator 1 are by being fastenedly connected by screw 7, spring 8; Screw 7, spring 8 cooperate installation with mounting hole 16; Auxiliary stand 10 is supported on down the base plate 15 of heating radiator 1, and a side bearing of temperature sensor 9 is in auxiliary stand 10, and its opposite side contacts with the surface of interchanger 3.
Semiconductor chilling plate is a prior art, a kind of cooling device of forming by semiconductor, it is a kind of electronic refrigeration plant, its principle of work is: after the energising, the heat of closed-loop path huyashi-chuuka (cold chinese-style noodles) just is moved to the hot junction, thereby cause the reduction of semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) temperature, working properly in order to guarantee semiconductor chilling plate, must be in time the heat of hot side be loose.
Claims (5)
1, the cooling module structure that combines of a kind of air-cooled, water-cooled of improvement and electronic cooling, it comprises fan, water pump, pipeline, water-cooled head, a described water-cooled contact heating element, it is characterized in that: the upper and lower surface of interchanger connects the huyashi-chuuka (cold chinese-style noodles) of semiconductor-on-insulator cooling piece, following semiconductor chilling plate respectively, the hot side of described semiconductor-on-insulator cooling piece, following semiconductor chilling plate connects heating radiator, following heating radiator respectively, described interchanger connects described water-cooled head, water pump, and described fan is positioned at a described side that goes up heating radiator, following heating radiator.
2, the cooling module structure that combines according to air-cooled, the water-cooled and the electronic cooling of the described a kind of improvement of claim 1, it is characterized in that: described upward heating radiator, following heating radiator form with the base plate soldering after being overlaped by multi-disc aluminium radiator fin discount, have mounting hole on the base plate of described upward heating radiator, following heating radiator.
3, the cooling module structure that combines according to air-cooled, the water-cooled and the electronic cooling of the described a kind of improvement of claim 2, it is characterized in that: described heating radiator, described semiconductor-on-insulator cooling piece, described interchanger, described semiconductor chilling plate down, the described heating radiator down gone up is by being fastenedly connected by screw, spring.
4, the cooling module structure that combines according to air-cooled, the water-cooled and the electronic cooling of the described a kind of improvement of claim 3, it is characterized in that: described screw, spring cooperate installation with described mounting hole.
5, the cooling module structure that combines according to air-cooled, the water-cooled and the electronic cooling of the described a kind of improvement of claim 4, it is characterized in that: auxiliary stand is supported on the described base plate of heating radiator down, one side bearing of temperature sensor is in described auxiliary stand, and its opposite side contacts with the surface of described interchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910027475A CN101645313A (en) | 2009-05-07 | 2009-05-07 | Improved cooling module structure combining wind cooling, water cooling and electronic cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910027475A CN101645313A (en) | 2009-05-07 | 2009-05-07 | Improved cooling module structure combining wind cooling, water cooling and electronic cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101645313A true CN101645313A (en) | 2010-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910027475A Pending CN101645313A (en) | 2009-05-07 | 2009-05-07 | Improved cooling module structure combining wind cooling, water cooling and electronic cooling |
Country Status (1)
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| CN (1) | CN101645313A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107461978A (en) * | 2016-06-02 | 2017-12-12 | 中国科学院沈阳自动化研究所 | A kind of semiconductor refrigeration temperature control case |
| CN108679678A (en) * | 2018-08-13 | 2018-10-19 | 佛山市顺德区美的洗涤电器制造有限公司 | Smoke machine |
| CN108800259A (en) * | 2018-08-13 | 2018-11-13 | 佛山市顺德区美的洗涤电器制造有限公司 | Kitchen ventilator |
| CN109000291A (en) * | 2018-08-13 | 2018-12-14 | 佛山市顺德区美的洗涤电器制造有限公司 | Kitchen ventilator |
| CN109028197A (en) * | 2018-08-13 | 2018-12-18 | 佛山市顺德区美的洗涤电器制造有限公司 | The oil-fume separating device and smoke machine of smoke machine |
| CN109140551A (en) * | 2018-08-13 | 2019-01-04 | 佛山市顺德区美的洗涤电器制造有限公司 | Smoke machine |
| CN111366806A (en) * | 2020-04-01 | 2020-07-03 | 成都为辰信息科技有限公司 | Adjustable constant temperature low temperature test equipment of components and parts |
-
2009
- 2009-05-07 CN CN200910027475A patent/CN101645313A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107461978A (en) * | 2016-06-02 | 2017-12-12 | 中国科学院沈阳自动化研究所 | A kind of semiconductor refrigeration temperature control case |
| CN108679678A (en) * | 2018-08-13 | 2018-10-19 | 佛山市顺德区美的洗涤电器制造有限公司 | Smoke machine |
| CN108800259A (en) * | 2018-08-13 | 2018-11-13 | 佛山市顺德区美的洗涤电器制造有限公司 | Kitchen ventilator |
| CN109000291A (en) * | 2018-08-13 | 2018-12-14 | 佛山市顺德区美的洗涤电器制造有限公司 | Kitchen ventilator |
| CN109028197A (en) * | 2018-08-13 | 2018-12-18 | 佛山市顺德区美的洗涤电器制造有限公司 | The oil-fume separating device and smoke machine of smoke machine |
| CN109140551A (en) * | 2018-08-13 | 2019-01-04 | 佛山市顺德区美的洗涤电器制造有限公司 | Smoke machine |
| CN111366806A (en) * | 2020-04-01 | 2020-07-03 | 成都为辰信息科技有限公司 | Adjustable constant temperature low temperature test equipment of components and parts |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100210 |