CN115629658A - A water-cooled chip radiator - Google Patents

Abstract

The invention discloses a water-cooled chip radiator, which comprises a heat dissipation installation frame, a heat dissipation circulation chamber, a circulation pipe group and a refrigerator. The refrigerator includes a refrigeration frame, a liquid storage chamber arranged inside the refrigeration frame, and a liquid storage chamber The water pump on one side is set at the bottom of the liquid storage chamber, and there are cooling semiconductor chips, heat conduction copper sheets, heat dissipation fins and cooling fans in turn. On the side of the liquid storage chamber, there is also a power supply for the water pump, cooling semiconductor chips and cooling fans. In the present invention, the cooling liquid is stored in the liquid storage chamber, and the cooling semiconductor chip can cool the cooling liquid so that the temperature of the cooling liquid is lower than normal temperature. Cool down; the cooling fan can strengthen the air flow between the cooling fins, dissipate heat and cool down the cooling semiconductor chip, and ensure that the cooling semiconductor chip keeps cooling the cooling liquid; and then realize the low-temperature heat dissipation of the cooling liquid computer chip.

Description

A water-cooled chip radiator

technical field

The invention relates to the technical field of computer chip heat dissipation, in particular to a water-cooled chip radiator.

Background technique

Electronic components will generate heat during work. In recent years, with the gradual improvement of the performance of computer systems, the heat generated by the operation of electronic components such as CPU will inevitably increase. In order to avoid reducing the life or damage of electronic components due to overheating. The existing heat dissipation systems mainly include air-cooled heat dissipation systems and water-cooled heat dissipation systems, among which water-cooled heat dissipation systems have been widely used in CPU heat dissipation processing due to their remarkable heat dissipation performance and low noise, and have become an important development of computer cooling systems. one of the trends.

The existing patent is a water-cooled radiator, and the patent application number is: 201410058972.6, which specifically discloses a water-cooled radiator, which includes: a heat dissipation part, on which a water inlet and a water outlet are arranged; a heat-absorbing part, on which a water inlet is arranged and water outlet, the inside of the heat absorbing part is provided with a water pump; the pipe part includes a first pipe and a second pipe, and one end of the first and second pipe is respectively connected to the water inlet and the water outlet of the heat dissipation part, and the first and second The other end of the pipeline is respectively connected to the water outlet and water inlet of the heat absorbing part. Under the action of the water pump, the cooling liquid circulates between the heat dissipation part, the pipeline part and the heat absorbing part; the pipe joint, the other end of the first and second pipes One end is sealed and connected with the water outlet and the water inlet of the heat absorbing part through the pipe joint; and the installation part is provided with multiple sets of installation positions to install the heat absorbing part on different types of main boards. The beneficial effect of the invention is that the water-cooling radiator has good sealing performance and can prevent leakage of cooling liquid; it can be applied to various types of main boards, has a wide application range, and is easy and convenient to install and disassemble.

However, the invention patent only discloses that the cooling liquid circulates between the heat dissipation part and the heat absorption part, but it cannot lower the temperature of the cooling liquid below normal temperature, and the liquid temperature of the cooling liquid will gradually increase after long-term circulation; The cooling liquid flowing through the heat dissipation part, although it has undergone a short heat dissipation, the temperature of the cooling liquid is still higher than normal temperature, so the temperature of the cooling liquid will gradually accumulate to a certain value during the long-term use, even if it passes through the heat dissipation part. It will not reduce the temperature of the coolant to normal temperature, which will lead to the gradual deterioration of the water cooling effect, especially the current computer chips are mostly dual-core, quad-core and other multi-core chips are commonly used. The heat generated by the core mainly depends on the core process of the chip, and the heat generated by the multi-core of the chip of the same generation is greater than that of the single-core.

Therefore, there is an urgent need for a high-efficiency water-cooled chip radiator.

Contents of the invention

In view of this, the object of the present invention is to provide a water-cooled chip radiator.

In order to solve the above technical problems, the technical solution of the present invention is: a water-cooled chip radiator, including a heat dissipation installation frame, a heat dissipation circulation chamber arranged above the heat dissipation installation frame, and a circulation pipe group is installed in the heat dissipation circulation chamber, And the refrigerating machine connected with the radiating circulation chamber through a circulation pipeline group, the refrigerating machine includes a refrigerating frame, a liquid storage chamber arranged inside the refrigerating frame, and a device on one side of the liquid storage chamber for driving water-liquid circulation The water pump is arranged on the bottom of the liquid storage chamber and is provided with a cooling semiconductor chip, a heat conducting copper sheet, a cooling fin and a cooling fan in sequence, and one side of the liquid storage room is also provided with a water supply pump, a cooling semiconductor chip and a cooling fan. power supply.

As a preference, a sealed heat dissipation chamber is provided inside the heat dissipation circulation chamber, the sealed heat dissipation chamber is provided with a water outlet and a water inlet connected to the outside, a heat conduction copper plate is provided at the bottom of the sealed heat dissipation chamber, and the heat dissipation chamber Four fixing holes are arranged in an annular array around the warehouse, and the fixing holes on both sides of the water outlet and the water inlet are respectively provided with transverse threaded holes.

As a preference, the heat dissipation circulation chamber and the circulation pipeline group are installed and fixed through pipe joints, and several sealing grooves are arranged annularly on the pipe joints, and sealing gaskets are annularly arranged on the several sealing grooves, and the sealing gaskets The water outlet and the water inlet of the pipe joint and the heat dissipation circulation chamber are connected in a sealed manner.

Preferably, the pipe joint and the heat dissipation circulation chamber are installed and fixed through a fixing plate, and the fixing plate is provided with a groove for embedding the pipe joint, and through holes are also provided on both sides of the fixing plate.

Preferably, the center of the through hole of the fixing plate is aligned with the center of the transverse threaded hole for bolted connection.

Preferably, the circulation pipe set is provided with a water outlet pipe and a water inlet pipe.

Preferably, the structural layers of the water outlet pipe are respectively a soft copper pipe layer, a reflective film layer, a pearl bubble film layer and an outer rubber pipe layer from inside to outside.

Preferably, the reflective film layer is composed of an air-cushion film, an ordinary aluminized film or a plastic-coated aluminized film; the two sides of the air-cushion film are laminated with a layer of ordinary aluminized film or a plastic-coated aluminized film by hot-pressing an adhesive layer respectively.

Preferably, the hierarchical structure of the water outlet pipe and the water inlet pipe is the same.

The technical effect of the present invention mainly reflects that the present invention stores cooling liquid through the liquid storage chamber, and the refrigeration semiconductor chip can perform cooling treatment on the cooling liquid, so that the temperature of the cooling liquid is lower than normal temperature, and the water pump sends the low-temperature cooling liquid to the heat dissipation circulation chamber, Further, the computer chip is cooled; the cooling fan can strengthen the air flow between the cooling fins, dissipate heat and cool down the cooling semiconductor chip, and ensure that the cooling semiconductor chip continuously cools the cooling liquid; thereby realizing the low-temperature heat dissipation of the cooling liquid computer chip.

Description of drawings

Fig. 1 is the structure diagram that the present invention relates to a kind of water-cooled chip radiator;

Fig. 2 is a structural diagram of the heat dissipation circulation chamber and pipe joints in Fig. 1;

Fig. 3 is an internal structural diagram of the refrigerator in Fig. 1;

Fig. 4 is a structural diagram of the water outlet pipe and the water inlet pipe shown in Fig. 1 .

Detailed ways

The specific implementation manners of the present invention will be further described below in conjunction with the accompanying drawings, so as to make the technical solution of the present invention easier to understand and grasp.

In this embodiment, it should be understood that the terms "middle", "upper", "lower", "top", "right side", "left end", "above", "back", "middle", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation , and therefore cannot be construed as a limitation of the present invention.

In addition, in this specific embodiment, if the connection or fixing method between the components is not specified in particular, the connection or fixing method can be fixed by bolts or pins commonly used in the prior art, or connected by pin shafts, etc. Therefore, it will not be described in detail in this embodiment.

A water-cooled chip radiator, as shown in Figure 1-2, includes a heat dissipation installation frame 1, a heat dissipation circulation chamber 2 arranged above the heat dissipation installation frame 1, and a circulation pipe group 3 is installed in the heat dissipation circulation chamber 2, And the refrigerating machine 4 connected with the heat dissipation circulation chamber 2 through the circulation pipeline group 3 .

The inside of the heat dissipation circulation chamber 2 is provided with a sealed heat dissipation chamber warehouse 21, and the sealed heat dissipation chamber chamber 21 is provided with a water outlet 22 and a water inlet 23 connected to the outside, and the bottom of the sealed heat dissipation chamber warehouse 21 is provided with a heat conduction copper plate 24, Specifically, the bottom of the heat dissipation circulation chamber 2 is connected to the computer chip through heat dissipation silica gel, and the heat conduction copper plate 24 can accelerate the heat exchange between the cooling liquid inside the sealed heat dissipation chamber warehouse 21 and the computer chip, and accelerate the cooling of the computer. Chip cooling. Four fixing holes 25 are arranged in an annular array around the cooling chamber 21 . Specifically, the four fixing holes 25 can make the cooling chamber 21 fixedly installed on the computer chip. The fixing holes 25 located on both sides of the water outlet 22 and the water inlet 23 are respectively provided with transverse threaded holes 26 . Specifically, the transverse threaded hole 26 is used for installing the fixing plate 27 .

The heat dissipation circulation chamber 2 and the circulation pipeline group 3 are installed and fixed through the pipe joint 6, and the pipe joint 6 is provided with several sealing grooves 61 annularly, and the several sealing grooves 61 are provided with sealing gaskets 62 annularly, The sealing washer 62 enables the pipe joint 6 to achieve a sealed connection with the water outlet 22 and the water inlet 23 of the heat dissipation circulation chamber 2 . Specifically, the sealing gasket 62 enables the pipe joint 6 to perform an interference fit with the water outlet 22 and the water inlet 23 respectively, so as to prevent liquid leakage.

The pipe joint 6 and the heat dissipation circulation chamber 2 are installed and fixed through the fixing plate 27 , the fixing plate 27 is provided with a groove 271 for inserting the pipe joint 6 , and the two sides of the fixing plate 27 are also provided with through holes 272 . The through hole 272 of the fixing plate 27 is aligned with the center of the transverse threaded hole 26 for bolt-fixed connection. Specifically, the fixing plate 27 reinforces the connection between the pipe joint 6 and the heat dissipation circulation chamber 2, and prevents the pipe joint 6 from being washed away from the heat dissipation circulation chamber 2 due to hydraulic impact force, resulting in liquid leakage.

As shown in FIG. 3 , the refrigerator 4 includes a refrigeration frame 41 and a liquid storage chamber 42 disposed inside the refrigeration frame 41 , specifically, the liquid storage chamber 42 is used to store cooling liquid. And set the water pump 43 on the side of the liquid storage chamber 42 for driving water circulation. Specifically, the water pump 43 is connected with the circulation pipeline group 3, and the cooling liquid in the liquid storage chamber 42 is pumped and sent to the In the heat dissipation chamber storehouse 21 of sealing. At the bottom of the liquid storage chamber 42 , there are sequentially disposed cooling semiconductor chips 43 downwards. Specifically, the cooling semiconductor chips 43 can cool down the cooling liquid in the liquid storage chamber 42 . The heat conduction copper sheet 44 , specifically, the heat conduction copper sheet 44 can guide the thermal energy at the bottom of the cooling semiconductor sheet 43 to the heat dissipation fin 45 . The heat dissipation fins 45 and the heat dissipation fan 46 , specifically, the heat dissipation fan 46 speeds up the air flow between the heat dissipation fins 45 and enhances the heat dissipation effect of the heat dissipation fins 45 . A power supply 47 for supplying power to the water pump 43 , the cooling semiconductor chip 43 and the cooling fan 46 may be provided on one side of the liquid storage chamber 42 .

Specifically, the semiconductor cooling chip is a tool for heat transfer. When a current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends, and the heat will be transferred from one end to the other end, thereby generating a temperature difference to form cold and heat. end. However, the semiconductor itself has resistance. When the current passes through the semiconductor, heat will be generated, which will affect the heat transfer. Moreover, the heat between the two plates is also reversely transferred through the air and the semiconductor material itself. When the hot and cold ends reach a certain temperature difference and the two kinds of heat transfer are equal, a balance point will be reached, and the forward and reverse heat transfer will cancel each other out. At this time, the temperature at the hot and cold ends will not continue to change. In order to achieve a lower temperature, heat dissipation and other methods can be used to reduce the temperature of the hot end.

As shown in FIG. 4 , the circulation pipe set 3 is provided with a water outlet pipe 31 and a water inlet pipe 32 . The structural layers of the water outlet pipe 31 are respectively a soft copper pipe layer 311 , a reflective film layer 312 , a pearl bubble film layer 313 and an outer rubber pipe layer 314 from inside to outside. The reflective film layer 312 is composed of an air-cushion film, an ordinary aluminized film or a plastic-coated aluminized film; the two sides of the air-cushion film are laminated with a layer of ordinary aluminized film or a plastic-coated aluminized film by hot-pressing an adhesive layer respectively. The hierarchical structure of the water outlet pipe 31 and the water inlet pipe 32 is the same. Concretely, by inputting cooling liquid in the water outlet pipe 31 and the water inlet pipe 3 and sending it to the sealed heat dissipation chamber warehouse 21, and blocking the external radiation of heat through the reflective film layer 312, combined with the use of the pearl bubble film layer 313, heat preservation can be achieved. Effect; the outside of the water outlet pipe 31 and the water inlet pipe 3 will not condense with water droplets because the air is cold.

Working principle: the heat dissipation circulation chamber 2 is installed on the computer chip through the heat dissipation installation frame 1, heat dissipation silica gel is coated between the heat dissipation circulation chamber 2 and the computer chip, and the heat dissipation circulation chamber 2 and the circulation pipe group 3 are connected through pipe joints 6 for installation and fixing, the refrigerator 4 is placed outside the computer case, the cooling semiconductor chip 43 can cool down the cooling liquid in the liquid storage chamber 42, and then the cooling liquid in the liquid storage chamber 42 is extracted and sent to the computer by the water pump 43. Into the sealed heat dissipation chamber warehouse 21, the heat conduction copper plate 24 can accelerate the heat energy exchange between the cooling liquid inside the sealed heat dissipation chamber warehouse 21 and the computer chip, and accelerate the cooling of the computer chip.

The technical effect of the present invention mainly reflects that the present invention stores cooling liquid through the liquid storage chamber, and the refrigeration semiconductor chip can perform cooling treatment on the cooling liquid, so that the temperature of the cooling liquid is lower than normal temperature, and the water pump sends the low-temperature cooling liquid to the heat dissipation circulation chamber, Further, the computer chip is cooled; the cooling fan can strengthen the air flow between the cooling fins, dissipate heat and cool down the cooling semiconductor chip, and ensure that the cooling semiconductor chip continuously cools the cooling liquid; thereby realizing the low-temperature heat dissipation of the cooling liquid computer chip.

Of course, the above are only typical examples of the present invention. In addition, the present invention can also have other multiple specific implementation modes. All technical solutions formed by equivalent replacement or equivalent transformation all fall within the scope of protection claimed by the present invention. Inside.

Claims (9)

1. The utility model provides a water-cooling type chip radiator, includes the heat dissipation mounting bracket, sets up the heat dissipation circulation chamber of heat dissipation mounting bracket top, circulation pipeline group is installed to the heat dissipation circulation chamber, reaches the refrigerator through circulation pipeline group link with the heat dissipation circulation chamber, a serial communication port, the refrigerator includes the refrigeration frame, sets up at the inside stock solution room of refrigeration frame, and set up stock solution room one side, be used for driving the water pump of water liquid circulation, set up and be in stock solution room bottom has set gradually refrigeration semiconductor piece, heat conduction copper sheet, radiating fin and radiator fan downwards, stock solution room one side still is provided with the power that is used for water-feeding pump, refrigeration semiconductor piece and radiator fan power supply.

2. The water-cooling chip radiator according to claim 1, wherein a sealed radiating chamber is arranged inside the radiating circulation chamber, the sealed radiating chamber is provided with a water outlet and a water inlet which are communicated with the outside, a heat conducting copper disc is arranged at the bottom of the sealed radiating chamber, four fixing holes are distributed in an annular array on the periphery of the radiating chamber, and transverse threaded holes are respectively formed in the fixing holes on two sides of the water outlet and the water inlet.

3. The water-cooled chip radiator according to claim 2, wherein the heat-dissipating circulation chamber and the circulation pipe set are fixed by a pipe joint, the pipe joint is annularly provided with a plurality of sealing grooves, each of the plurality of sealing grooves is annularly provided with a sealing gasket, and the sealing gaskets enable the pipe joint to be hermetically connected with the water outlet and the water inlet of the heat-dissipating circulation chamber.

4. The water-cooled chip heat sink as claimed in claim 3, wherein the pipe joint and the heat-dissipating circulation chamber are fixed by a fixing plate, the fixing plate is provided with a groove for inserting the pipe joint, and through holes are further provided on both sides of the fixing plate.

5. The water-cooled chip heat sink of claim 1, wherein: and the through hole of the fixing plate is aligned with the center of the transverse threaded hole to be fixedly connected with the bolt.

6. The water-cooled chip heat sink of claim 1, wherein: the circulating pipeline group is provided with a water outlet pipe and a water inlet pipe.

7. The water-cooled chip heat sink of claim 6, wherein: the water outlet pipe structure layer is respectively a soft copper pipe layer, a reflection film layer, a pearl bubble film layer and an outer rubber pipe layer from inside to outside.

8. The water-cooled chip heat sink of claim 7, wherein: the reflecting film layer consists of an air cushion film, a common aluminum-plated film or a plastic-coated aluminum-plated film; and a layer of common aluminum-plated film or a plastic-coated aluminum-plated film is compounded on two surfaces of the air cushion film through an adhesive layer in a hot-pressing mode.

9. The water-cooled chip heat sink of claim 6, wherein: the water outlet pipe and the water inlet pipe are identical in hierarchical structure.

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