CN101644950A - Improved electronic refrigeration type water cooling system for display card - Google Patents
Improved electronic refrigeration type water cooling system for display card Download PDFInfo
- Publication number
- CN101644950A CN101644950A CN200910027473A CN200910027473A CN101644950A CN 101644950 A CN101644950 A CN 101644950A CN 200910027473 A CN200910027473 A CN 200910027473A CN 200910027473 A CN200910027473 A CN 200910027473A CN 101644950 A CN101644950 A CN 101644950A
- Authority
- CN
- China
- Prior art keywords
- copper plate
- water cooling
- display card
- semiconductor chilling
- abaculus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 238000001816 cooling Methods 0.000 title claims abstract description 21
- 238000005057 refrigeration Methods 0.000 title claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000010949 copper Substances 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000002826 coolant Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 235000012149 noodles Nutrition 0.000 description 2
- 102000010637 Aquaporins Human genes 0.000 description 1
- 108010063290 Aquaporins Proteins 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Abstract
The invention relates to an improved electronic refrigeration type water cooling system for a display card, which can lower the temperature of a heating device to the temperature lower than ambient temperature, be suitable for various environmental occasions and achieve large application range. The improved electronic refrigeration type water cooling system for a display card comprises a cooling module, a water pump, a draining radiator, a fan and a pipeline and is characterized in that the cooling module is concretely formed by combining a red copper plate, a semiconductor refrigerating sheetand a heat exchanger, wherein the red copper plate is in contact with the plane of the heating device; the refrigerating surface of the semiconductor refrigerating sheet is in contact with the planeof the red copper plate; the hot surface of the semiconductor refrigerating sheet is in contact with the heat exchanger, and the heat exchanger is respectively connected with the water pump and the draining radiator by pipelines.
Description
(1) technical field
The present invention relates to the cooling technology field of computer display card, be specially a kind of electronic refrigeration type water cooling system for display card of improvement.
(2) background technology
Present computer display card water-cooled cooling system, it is by the water-cooled head, water pump, water row heating radiator, fan, pipeline is formed.The water-cooled head is the derby that water channel is left in an inside, be made of copper, contact and will absorb the heat of heater element with heater element, it can only be reduced to environment temperature with temperature at most, it is unsuitable in environment temperature than higher application scenario (especially summer), so its scope of application is little.
(3) summary of the invention
At the problems referred to above, the invention provides a kind of electronic refrigeration type water cooling system for display card of improvement, it can drop to the temperature of heater members and be lower than environment temperature, and it can be applicable to various environment occasions, and the scope of application is big.
A kind of electronic refrigeration type water cooling system for display card of improvement, its technical scheme is such: it comprises refrigerating module, water pump, water row heating radiator, fan, pipeline, it is characterized in that: described refrigerating module is specially copper plate, semiconductor chilling plate, the heat interchanger combination forms, described copper plate and heater members plane contact, the chill surface of described semiconductor chilling plate and described copper plate plane contact, the hot side of described semiconductor chilling plate contacts with described heat interchanger, and described heat interchanger is by connecting described water pump, described water row heating radiator by pipeline respectively.
It is further characterized in that: non-video card surface of contact one side in the described hollow out place, middle part of abaculus down is equipped with described copper plate, one side of described copper plate protrudes from the described part of abaculus hollow out down and contacts described video card chip, described copper plate opposite side is mounted on the chill surface of semiconductor chilling plate, the hot side of described semiconductor chilling plate and interchanger plane contact, described interchanger is equipped with the exterior line interface.
It further is characterised in that: the part that described copper plate one side is protruded is coated with heat-conducting glue is housed, described heat-conducting glue opposite side and described video card chip plane contact, described copper plate connects described abaculus down by the screw that is with spring, described interchanger, described semiconductor chilling plate, described copper plate three by clip, screw is fastening is fitted and connected, described abaculus material down is an aluminium, described abaculus down is connected with described video card by installing and fixing the hole, and the described non-video card surface of contact of abaculus down is equipped with fin.
Adopt water-cooling system of the present invention, because described refrigerating module is specially copper plate, semiconductor chilling plate, the heat interchanger combination forms, described copper plate and heater members plane contact, the chill surface of described semiconductor chilling plate and described copper plate plane contact, the hot side of described semiconductor chilling plate contacts with described heat interchanger, described heat interchanger is by connecting described water pump by pipeline respectively, described water row heating radiator, when described video card is worked, its chip heating, the heat of chip conducts to described copper plate, described copper plate conducts to heat the chill surface of described semiconductor chilling plate, its heat with the chill surface of described semiconductor chilling plate moves on to the hot side of described semiconductor chilling plate, the heat of the hot side of described semiconductor chilling plate shifts by described water cycle heat interchanger, finish the heat radiation of video card, because semiconductor chilling plate energy quick heat radiating, radiating effect is strong, it can be guaranteed that temperature with heater members drops to and be lower than environment temperature, so native system can be applicable to various environment occasions, the scope of application is big.
(4) description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the structural representation stereographic map (front) of refrigerating module of the present invention;
Fig. 3 is the structural representation stereographic map (reverse side) of refrigerating module of the present invention.
(5) embodiment
See Fig. 1, Fig. 2, Fig. 3, it comprises refrigerating module 17, water pump 15, water row heating radiator 14, fan 13, pipeline 16, refrigerating module 17 is specially copper plate 2, semiconductor chilling plate 5, heat interchanger 7 and combines, copper plate 2 and heater members plane contact, the chill surface of semiconductor chilling plate 5 and copper plate 2 plane contact, the hot side of semiconductor chilling plate 5 contacts with heat interchanger 7, and heat interchanger 7 is by connecting water pump 15, water row heating radiator 14 by pipeline 16 respectively.
Copper plate 2 connects abaculus 1 down by the screw 4 that is with spring 3, non-video card surface of contact one side in hollow out place, following abaculus 1 middle part is equipped with copper plate 2, one side of copper plate 2 protrudes from down the part contact video card chip of abaculus hollow out, copper plate 2 opposite sides are mounted on the chill surface of semiconductor chilling plate 5, the hot side of semiconductor chilling plate 5 and interchanger 7 plane contact, interchanger 7 is equipped with exterior line interface 11.The part that copper plate 2 one sides are protruded is coated with heat-conducting glue 10 is housed, heat-conducting glue 10 opposite sides and video card chip plane contact, copper plate 2 connects abaculus 1 down by the screw 4 that is with spring 3, interchanger 7, semiconductor chilling plate 5, copper plate 2 threes are by clip 8, screw 6 fastening being fitted and connected, following abaculus 1 material is an aluminium, following abaculus 1 is connected with video card by installing and fixing hole 9, and the non-video card surface of contact of following abaculus 2 is equipped with fin 12.
Semiconductor chilling plate is a prior art, a kind of cooling device of forming by semiconductor, it is a kind of electronic refrigeration plant, its principle of work is: after the energising, the heat of closed-loop path huyashi-chuuka (cold chinese-style noodles) just is moved to the hot junction, thereby cause the reduction of semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) temperature, working properly in order to guarantee semiconductor chilling plate, must be in time the heat of hot side be loose.
Its principle of work is as follows: water pump 15 promotes liquid coolant and flows in system, copper plate 2 on the refrigerating module 17 contacts with heater members, the chill surface of semiconductor chilling plate 5 contacts with copper plate 2, the heating face of semiconductor chilling plate 5 contacts with heat interchanger 7, and the liquid coolant that a large amount of heats is flow through heat interchanger 7 is taken away.When the liquid coolant that has a heat is flowed through water row heating radiator 14, will the flow through liquid coolant cooling of water row heating radiator 14 of fan 13, the liquid coolant that is cooled from water row heating radiator 14 flows out flow back in the water pump 15, forms a circulation.
Claims (7)
1, a kind of electronic refrigeration type water cooling system for display card of improvement, it comprises refrigerating module, water pump, water row heating radiator, fan, pipeline, it is characterized in that: described refrigerating module is specially copper plate, semiconductor chilling plate, the heat interchanger combination forms, described copper plate and heater members plane contact, the chill surface of described semiconductor chilling plate and described copper plate plane contact, the hot side of described semiconductor chilling plate contacts with described heat interchanger, and described heat interchanger is by connecting described water pump, described water row heating radiator by pipeline respectively.
2, according to the electronic refrigeration type water cooling system for display card of the described a kind of improvement of claim 1, it is characterized in that: non-video card surface of contact one side in the described hollow out place, middle part of abaculus down is equipped with described copper plate, one side of described copper plate protrudes from the described part of abaculus hollow out down and contacts described video card chip, described copper plate opposite side is mounted on the chill surface of semiconductor chilling plate, the hot side of described semiconductor chilling plate and interchanger plane contact, described interchanger is equipped with the exterior line interface.
3, according to the semiconductor water cooling module for computer display card of the described a kind of improvement of claim 2, it is characterized in that: the part that described copper plate one side is protruded is coated with and heat-conducting glue is housed, described heat-conducting glue opposite side and described video card chip plane contact.
4, according to the semiconductor water cooling module for computer display card of the described a kind of improvement of claim 3, it is characterized in that: described copper plate connects described abaculus down by the screw that is with spring.
5, according to the semiconductor water cooling module for computer display card of the described a kind of improvement of claim 4, it is characterized in that: described interchanger, described semiconductor chilling plate, described copper plate three by clip, screw is fastening is fitted and connected.
6, according to the semiconductor water cooling module for computer display card of the described a kind of improvement of claim 5, it is characterized in that: described interchanger, described semiconductor chilling plate, described copper plate three by clip, screw is fastening is fitted and connected.
7, according to the semiconductor water cooling module for computer display card of the described a kind of improvement of claim 6, it is characterized in that: described abaculus material down is an aluminium, described abaculus down is connected with described video card by installing and fixing the hole, and the described non-video card surface of contact of abaculus down is equipped with fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910027473A CN101644950A (en) | 2009-05-07 | 2009-05-07 | Improved electronic refrigeration type water cooling system for display card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910027473A CN101644950A (en) | 2009-05-07 | 2009-05-07 | Improved electronic refrigeration type water cooling system for display card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101644950A true CN101644950A (en) | 2010-02-10 |
Family
ID=41656861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910027473A Pending CN101644950A (en) | 2009-05-07 | 2009-05-07 | Improved electronic refrigeration type water cooling system for display card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101644950A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307448A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Radiator for debugging circuit board |
| CN102854960A (en) * | 2012-08-27 | 2013-01-02 | 无锡市福曼科技有限公司 | Water-cooling and wind-cooling hybrid cooling structure for graphic cards |
| CN105068630A (en) * | 2015-09-08 | 2015-11-18 | 唐山天乐智能科技有限公司 | Computer secondary liquid cooling system |
| CN111306975A (en) * | 2020-02-18 | 2020-06-19 | 苏州纵贯线换热器有限公司 | Copper-aluminum welded heat exchange element and machining process thereof |
| CN115250609A (en) * | 2022-09-22 | 2022-10-28 | 江苏泽润新材料有限公司 | 2-channel component-level rapid turn-off system receiving device |
-
2009
- 2009-05-07 CN CN200910027473A patent/CN101644950A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307448A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Radiator for debugging circuit board |
| CN102854960A (en) * | 2012-08-27 | 2013-01-02 | 无锡市福曼科技有限公司 | Water-cooling and wind-cooling hybrid cooling structure for graphic cards |
| CN102854960B (en) * | 2012-08-27 | 2016-05-25 | 无锡市福曼科技有限公司 | The air-cooled combination cooling structure of water-cooled of video card |
| CN105068630A (en) * | 2015-09-08 | 2015-11-18 | 唐山天乐智能科技有限公司 | Computer secondary liquid cooling system |
| CN111306975A (en) * | 2020-02-18 | 2020-06-19 | 苏州纵贯线换热器有限公司 | Copper-aluminum welded heat exchange element and machining process thereof |
| CN115250609A (en) * | 2022-09-22 | 2022-10-28 | 江苏泽润新材料有限公司 | 2-channel component-level rapid turn-off system receiving device |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100210 |