CN105824330A - Semiconductor technology based temperature control method and device - Google Patents
Semiconductor technology based temperature control method and device Download PDFInfo
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- CN105824330A CN105824330A CN201610145513.0A CN201610145513A CN105824330A CN 105824330 A CN105824330 A CN 105824330A CN 201610145513 A CN201610145513 A CN 201610145513A CN 105824330 A CN105824330 A CN 105824330A
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- temperature
- semiconductor
- scm
- chilling plate
- semiconductor technology
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
Abstract
The invention relates to a semiconductor technology based temperature control method and device, and belongs to the technical field of heat radiation of computers. According to the method and device, a semiconductor cooling technology is used, part of a control circuit is designed in a targeted manner, heating or cooling of a semiconductor is adjusted automatically according to different temperature environments, and a special computer can start and work in the different temperature environments. Software is combined with hardware, and the problem that the special computer is limited by the ambient temperature is solved.
Description
Technical field
The present invention relates to computer technical field of heat dissipation, particularly to a kind of temperature-controlled process based on semiconductor technology and device.
Background technology
Along with the demand of informatization on nation defence development, military computer is had higher requirement by the most harsh adverse circumstances.Such as ambient temperature, military computer generally needs to reach technical grade (-40 DEG C-55 DEG C) requirement, (-40 DEG C-70 DEG C) are even had higher requirement in certain fields (such as Aero-Space), special computer multiselect technical grade chip when hardware designs carrys out adaptive temperature environment, but there is also the uneven situation of chip performance.Especially under the overall situation of production domesticization, this problem is the most prominent, seriously constrains the development process of computer production domesticization.
The military computer mode using patch heating film or laying heater circuit improves the start-up temperature of acp chip more at present, uses wind-cooling heat dissipating or heat loss through conduction to strengthen the radiating effect of board.Not only increase the design difficulty of circuit, also thermal design is had higher requirement.
Summary of the invention
In order to solve problem of the prior art, the invention provides a kind of temperature-controlled process based on semiconductor technology and device, it can solve to restrict the ambient temperature problem that special computer uses simultaneously.
The technical solution adopted in the present invention is as follows:
A kind of temperature-controlled process based on semiconductor technology, comprises the following steps:
A, semiconductor chilling plate and temperature sensor are set in computer fin；
Temperature in B, temperature sensor collecting computer fin, and feed back to processor；
C, processor, according to the temperature collected, carry out thermostatic control by Single Chip Microcomputer (SCM) system to semiconductor chilling plate.
It is set by CPU between thermostatically controlled temperature-controlled area, and reads the real time temperature of the fin of key chip at any time, in order to as the standard set.
Size and Orientation according to the electric current flowing through described semiconductor chilling plate determines its duty, and sense of current determines refrigeration or heats, and the size of electric current determines refrigeration or the degree heated and effect.
A kind of temperature control equipment based on semiconductor technology, including the semiconductor chilling plate being arranged in computer fin, it is characterized in that, described semiconductor chilling plate connects Single Chip Microcomputer (SCM) system by drive circuit, described Single Chip Microcomputer (SCM) system connects CPU, temperature sensor, the described Single Chip Microcomputer (SCM) system described in temperature sensor connection it is additionally provided with in described computer fin.
Single Chip Microcomputer (SCM) system includes digital IIR filters chip and modulus conversion chip, the described temperature sensor described in the connection of modulus conversion chip side, digital IIR filters chip described in the connection of side, the described CPU described in the connection of digital IIR filters chip, and by the drive circuit described in the connection of pulsewidth modulation output module.
The technical scheme that the present invention provides has the benefit that
A kind of based on semiconductor technology the temperature-controlled process of the present invention and device, it uses semiconductor refrigerating technology, design member control circuit targetedly, heating or the refrigeration of quasiconductor it is automatically adjusted according to different temperature environments, special computer startup under different temperatures environment and work can be met, this technology uses the mode of software and hardware combining, can solve to restrict the ambient temperature problem that special computer uses simultaneously.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in describing embodiment below, the required accompanying drawing used is briefly described, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structured flowchart of a kind of based on semiconductor technology the temperature control equipment of the present invention；
Fig. 2 is the circuit theory diagrams of the semiconductor refrigeration plate drive circuit of a kind of based on semiconductor technology the temperature control equipment of the present invention；
Fig. 3 is the method flow diagram of a kind of based on semiconductor technology the temperature-controlled process of the present invention.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
Embodiment one
The present embodiment uses the mode of software and hardware combining, by heating computer key chip or refrigeration so that it is have good starting characteristic and operating characteristic.Under cryogenic conditions in addition to natural heat dissipation, cold drawing also can take away substantial amounts of heat, and when caloric value and the heat dissipation capacity of key chip reach thermal balance and be less than chip start-up temperature, chip will be unable to start；The most in high temperature environments, when ambient temperature is higher than the operating temperature of chip, chip is stuck by high temperature, will burn chip time serious.
It is automatically adjusted heating or the refrigeration of refrigeration semiconductor according to temperature environment for realizing computer, the present embodiment is designed with a MCU to realize the detection of ambient temperature, temperature control etc., semiconductor chilling plate is electric current conversion type sheet, just can realize accurate temperature by the circuit of input to control, additionally the thermal inertia of semiconductor chilling plate is the least, the cooling and warming time quickly, can reach maximum temperature difference in one minute, not interfere with the toggle speed of computer.
As shown in Figure 2, TEC is semiconductor chilling plate, its duty can be determined according to the size and Orientation of the electric current flowing through quasiconductor, sense of current determines refrigeration or heats, the size of electric current determines refrigeration or the degree heated and effect, semiconductor chilling plate is embedded in fin by the present invention, board Primary Component is heated or freezes.
In the control principle block diagram shown in Fig. 1, provide a kind of temperature control equipment based on semiconductor technology, including the semiconductor chilling plate being arranged in computer fin, semiconductor chilling plate connects Single Chip Microcomputer (SCM) system by drive circuit, described Single Chip Microcomputer (SCM) system connects CPU, temperature sensor, the described Single Chip Microcomputer (SCM) system described in temperature sensor connection it is additionally provided with in described computer fin.
Single Chip Microcomputer (SCM) system includes digital IIR filters chip and modulus conversion chip, the described temperature sensor described in the connection of modulus conversion chip side, digital IIR filters chip described in the connection of side, the described CPU described in the connection of digital IIR filters chip, and by the drive circuit described in the connection of pulsewidth modulation output module.
By a piece of single-chip microcomputer, semiconductor chilling plate being carried out thermostatic control, control strategy uses the PID that current precision is higher to control technology, can be controlled the electric current of semiconductor chilling plate, it is achieved high-precision temperature control effect.Actual temp control interval can be set by CPU, and reads the real time temperature of key chip at any time.
In the drive circuit shown in Fig. 2, being high level when arranging OUT1, OUT2 is low level, and OUT3 is high level and time OUT4 is low level, Q1 and Q3 turns on, Q2 Yu Q4 disconnection, electric current is flowed to TEC right-hand member by TEC left end；Being low level when arranging OUT1, OUT2 is high level, and OUT3 is low level and time OUT4 is high level, Q1 and Q3 disconnects, Q2 Yu Q4 conducting, electric current is flowed to TEC left end by TEC right-hand member.
By the PWM duty cycle of single-chip microcomputer PID control design case OUT1 or OUT4, the ON time controlling Q1 or Q4 controls the working time of TEC, thus reaches the effect of temperature control, it is achieved the heating of Primary Component and refrigeration.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (5)
1. a temperature-controlled process based on semiconductor technology, comprises the following steps:
A, semiconductor chilling plate and temperature sensor are set in computer fin；
Temperature in B, temperature sensor collecting computer fin, and feed back to processor；
C, processor, according to the temperature collected, carry out thermostatic control by Single Chip Microcomputer (SCM) system to semiconductor chilling plate.
A kind of temperature-controlled process based on semiconductor technology the most according to claim 1, it is characterized in that, it is set by CPU between described thermostatically controlled temperature-controlled area, and reads the real time temperature of the fin of key chip at any time, in order to as the standard set.
A kind of temperature-controlled process based on semiconductor technology the most according to claim 1, it is characterized in that, size and Orientation according to the electric current flowing through described semiconductor chilling plate determines its duty, sense of current determines refrigeration or heats, and the size of electric current determines refrigeration or the degree heated and effect.
4. a temperature control equipment based on semiconductor technology, including the semiconductor chilling plate being arranged in computer fin, it is characterized in that, described semiconductor chilling plate connects Single Chip Microcomputer (SCM) system by drive circuit, described Single Chip Microcomputer (SCM) system connects CPU, temperature sensor, the described Single Chip Microcomputer (SCM) system described in temperature sensor connection it is additionally provided with in described computer fin.
A kind of temperature control equipment based on semiconductor technology the most according to claim 4, it is characterized in that, described Single Chip Microcomputer (SCM) system includes digital IIR filters chip and modulus conversion chip, the described temperature sensor described in the connection of modulus conversion chip side, digital IIR filters chip described in the connection of side, the described CPU described in the connection of digital IIR filters chip, and by the drive circuit described in the connection of pulsewidth modulation output module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610145513.0A CN105824330A (en) | 2016-03-15 | 2016-03-15 | Semiconductor technology based temperature control method and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610145513.0A CN105824330A (en) | 2016-03-15 | 2016-03-15 | Semiconductor technology based temperature control method and device |
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| CN105824330A true CN105824330A (en) | 2016-08-03 |
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| CN201610145513.0A Pending CN105824330A (en) | 2016-03-15 | 2016-03-15 | Semiconductor technology based temperature control method and device |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106681396A (en) * | 2016-12-02 | 2017-05-17 | 安徽波维电子科技有限公司 | Far-infrared intelligent temperature control system |
| CN106708122A (en) * | 2016-11-20 | 2017-05-24 | 广西大学 | Laboratory petri dish integrated temperature detection and management system |
| CN106774504A (en) * | 2016-12-02 | 2017-05-31 | 安徽波维电子科技有限公司 | A kind of low noise temperature control system based on digital PID |
| CN106774492A (en) * | 2016-12-02 | 2017-05-31 | 安徽波维电子科技有限公司 | A kind of small-sized quick high accuracy constant temperature system based on TEC |
| CN108628365A (en) * | 2018-05-11 | 2018-10-09 | 深圳技术大学（筹） | TEC temperature control circuits |
| CN108712847A (en) * | 2018-06-04 | 2018-10-26 | 珠海格力电器股份有限公司 | A kind of electric cabinet and its temperature control method, device |
| CN109815596A (en) * | 2019-01-26 | 2019-05-28 | 上海交通大学 | Semiconductor devices environment temperature simulation system and method based on temperature-controlled radiator |
| CN114326851A (en) * | 2021-11-17 | 2022-04-12 | 苏州浪潮智能科技有限公司 | Edge intelligent temperature control method and system based on TEC |
| CN114460988A (en) * | 2022-03-07 | 2022-05-10 | 重庆紫光华山智安科技有限公司 | Temperature control method, device, equipment and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106708122A (en) * | 2016-11-20 | 2017-05-24 | 广西大学 | Laboratory petri dish integrated temperature detection and management system |
| CN106681396A (en) * | 2016-12-02 | 2017-05-17 | 安徽波维电子科技有限公司 | Far-infrared intelligent temperature control system |
| CN106774504A (en) * | 2016-12-02 | 2017-05-31 | 安徽波维电子科技有限公司 | A kind of low noise temperature control system based on digital PID |
| CN106774492A (en) * | 2016-12-02 | 2017-05-31 | 安徽波维电子科技有限公司 | A kind of small-sized quick high accuracy constant temperature system based on TEC |
| CN108628365A (en) * | 2018-05-11 | 2018-10-09 | 深圳技术大学（筹） | TEC temperature control circuits |
| CN108712847A (en) * | 2018-06-04 | 2018-10-26 | 珠海格力电器股份有限公司 | A kind of electric cabinet and its temperature control method, device |
| CN109815596A (en) * | 2019-01-26 | 2019-05-28 | 上海交通大学 | Semiconductor devices environment temperature simulation system and method based on temperature-controlled radiator |
| CN109815596B (en) * | 2019-01-26 | 2021-02-12 | 上海交通大学 | Semiconductor device environment temperature simulation system and method based on temperature control radiator |
| CN114326851A (en) * | 2021-11-17 | 2022-04-12 | 苏州浪潮智能科技有限公司 | Edge intelligent temperature control method and system based on TEC |
| CN114460988A (en) * | 2022-03-07 | 2022-05-10 | 重庆紫光华山智安科技有限公司 | Temperature control method, device, equipment and storage medium |
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Application publication date: 20160803 |
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