CN201417618Y - High power cooling module combining air cooling, water cooling and electronic refrigeration - Google Patents
High power cooling module combining air cooling, water cooling and electronic refrigeration Download PDFInfo
- Publication number
- CN201417618Y CN201417618Y CN2009200451481U CN200920045148U CN201417618Y CN 201417618 Y CN201417618 Y CN 201417618Y CN 2009200451481 U CN2009200451481 U CN 2009200451481U CN 200920045148 U CN200920045148 U CN 200920045148U CN 201417618 Y CN201417618 Y CN 201417618Y
- Authority
- CN
- China
- Prior art keywords
- cooled
- water
- cooling
- heating radiator
- interchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 238000005057 refrigeration Methods 0.000 title abstract 2
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 239000004065 semiconductor Substances 0.000 claims abstract description 26
- 235000012149 noodles Nutrition 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a high power cooling module combining air cooling, water cooling and electronic refrigeration. The cooling module can lower the temperature of heating components to be lower than the environment temperature, has excellent cooling effect, can be applied in various environment occasions, and has wide applicable range. The cooling module comprises fans, a water pump, a pipeline and a water cooling head, wherein the water cooling head is contacted with the heating components. The cooling module is characterized in that the cooling module is concretely composed of a heat radiator, an exchanger, a semi-conductor refrigerating plate which are combined, the cross section of the heat radiator is in a rectangle shape with four fillet corners, the heating surface of the semi-conductor refrigerating plate is connected with an outer end plane of the rectangular heat radiator, the cooling surface of the semi-conductor refrigerating plate is connected with the exchanger,the exchanger, the water pump and the water cooling head form a circulating loop, and the fans is installed on two sides of the shaft end surface of the rectangular heat radiator.
Description
(1) technical field
The utility model relates to efficient cooling technology device field, is specially the high-power refrigerating module that a kind of air-cooled, water-cooled and electronic cooling combine.
(2) background technology
Present water-cooled cooling system, it is by the water-cooled head, water pump, water row heating radiator, fan, pipeline is formed, its refrigerating module is exactly a water-cooled head, it can only be reduced to environment temperature with temperature at most, and it is unsuitable in environment temperature than higher application scenario and the lower device of working temperature, so its scope of application is little.
(3) summary of the invention
At the problems referred to above, the high-power refrigerating module that the utility model provides a kind of air-cooled, water-cooled and electronic cooling to combine, it can drop to the temperature of heater members and be lower than environment temperature, good cooling results, can be applicable to various environment occasions, the scope of application is big.
A kind of air-cooled, the high-power refrigerating module that water-cooled and electronic cooling combine, its technical scheme is such: it comprises fan, water pump, pipeline, the water-cooled head, a described water-cooled contact heating element, it is characterized in that: described refrigerating module is specially heating radiator, interchanger, semiconductor chilling plate combines, described heating radiator cross section is the rectangle of four rounding of angle, the hot side of described semiconductor chilling plate connects the outer transverse plane of described rectangle heating radiator, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate connects described interchanger, described interchanger and described water pump, described water-cooled head constitutes a closed circuit, and described fan is installed on the both sides of the axial end of described rectangle heating radiator.
It is further characterized in that: described rectangle heating radiator is specifically for the rectangular aluminum heat radiator soldering of multi-disc intermediate hollow forms, and the core of described rectangle heating radiator connects; Described mounting plane is distributed on four outer faces of described rectangle heating radiator, and described semiconductor chilling plate is four, and described interchanger is four, described interchanger, semiconductor chilling plate, mounting plane by clip, screw is fastening is fitted and connected;
Temperature sensor is fitted and connected described exchanger surfaces by sensor clip, screw are fastening;
Described four interchangers are communicated with by described pipeline, and one in described four interchangers is communicated with described water pump, and another in described four interchangers is communicated with described water-cooled head, and described water pump is communicated with described water-cooled head; Described interchanger inside is equipped with the multi-disc radiating fin; Screw connects an end face of support, described fan, fan installing plate, described rectangle shape heating radiator successively.
Adopt water-cooling system of the present utility model, described refrigerating module is specially heating radiator, interchanger, semiconductor chilling plate combines, described heating radiator cross section is the rectangle of four rounding of angle, the hot side of described semiconductor chilling plate connects the outer transverse plane of described rectangle heating radiator, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate connects described interchanger, described interchanger and described water pump, described water-cooled head constitutes a closed circuit, described fan is installed on the both sides of the axial end of described rectangle heating radiator, when described heater element is worked, the heat that distributes conducts to described water-cooled head, liquid coolant with heat transferred to described interchanger inside, the interchanger internal heat is the huyashi-chuuka (cold chinese-style noodles) of heat transferred to described semiconductor chilling plate, its heat is passed to the hot side of described semiconductor chilling plate from the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, the heat of the hot side of described semiconductor chilling plate blows away heat by described fan at last by described rectangle heat sink radiates.Because semiconductor chilling plate can quick heat radiating, its good cooling results, can guarantee that temperature with heater members drops to and be lower than environment temperature that so native system can be applicable to various environment occasions, the scope of application is big.
(4) description of drawings
Fig. 1 is a three-dimensional icon intention of the present utility model;
Fig. 2 is the stereographic map of heating radiator of the present utility model.
(5) embodiment
See Fig. 1, Fig. 2, it comprises fan 3, water pump 12, pipeline 11, water-cooled 1, water-cooled 1 a contact heating element, refrigerating module is specially heating radiator 10, interchanger 5, semiconductor chilling plate 8 and combines, heating radiator 10 cross sections are the rectangle of four rounding of angle, the hot side of semiconductor chilling plate 8 connects the outer transverse plane of rectangle heating radiator 10, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 8 connects interchanger 5, interchanger 5 and water pump 12, water-cooled 1 formation, one closed circuit, fan 3 is installed on the both sides of the axial end of rectangle heating radiator 10.
Rectangular aluminum heat radiator 13 solderings that rectangle heating radiator 10 is specially the multi-disc intermediate hollow form, and the core of rectangle heating radiator 10 connects; Mounting plane 14 is distributed on four outer faces of rectangle heating radiator 10, and semiconductor chilling plate 8 is four, and interchanger 5 is four, interchanger 5, semiconductor chilling plate 8, mounting plane 14 by clip 6, screw is fastening is fitted and connected; Temperature sensor 7 is by sensor clip 8, fastening interchanger 5 surfaces that are fitted and connected of screw.
Four interchangers 5 are communicated with by pipeline 11, and another in 12, four interchangers 5 of a connection water pump in four interchangers 5 is communicated with water-cooled 1, and water pump 12 is communicated with water-cooleds 1; Interchanger 5 inside are equipped with the multi-disc radiating fin; Screw connects an end face of support 2, fan 3, fan installing plate 4, rectangle shape heating radiator 10 successively.
Claims (7)
1, a kind of air-cooled, the high-power refrigerating module that water-cooled and electronic cooling combine, it comprises fan, water pump, pipeline, the water-cooled head, a described water-cooled contact heating element, it is characterized in that: described refrigerating module is specially heating radiator, interchanger, semiconductor chilling plate combines, described heating radiator cross section is the rectangle of four rounding of angle, the hot side of described semiconductor chilling plate connects the outer transverse plane of described rectangle heating radiator, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate connects described interchanger, described interchanger and described water pump, described water-cooled head constitutes a closed circuit, and described fan is installed on the both sides of the axial end of described rectangle heating radiator.
2, the high-power refrigerating module that combines according to described a kind of air-cooled, the water-cooled of claim 1 and electronic cooling, it is characterized in that: described rectangle heating radiator is specifically for the rectangular aluminum heat radiator soldering of multi-disc intermediate hollow forms, and the core of described rectangle heating radiator connects.
3, the high-power refrigerating module that combines according to described a kind of air-cooled, the water-cooled of claim 2 and electronic cooling, it is characterized in that: described mounting plane is distributed on four outer faces of described rectangle heating radiator, described semiconductor chilling plate is four, described interchanger is four, described interchanger, semiconductor chilling plate, mounting plane by clip, screw is fastening is fitted and connected.
4, the high-power refrigerating module that combines according to described a kind of air-cooled, the water-cooled of claim 3 and electronic cooling is characterized in that: temperature sensor is fitted and connected described exchanger surfaces by sensor clip, screw are fastening.
5, the high-power refrigerating module that combines according to described a kind of air-cooled, the water-cooled of claim 4 and electronic cooling, it is characterized in that: described four interchangers are communicated with by described pipeline, one in described four interchangers is communicated with described water pump, in described four interchangers another is communicated with described water-cooled head, and described water pump is communicated with described water-cooled head.
6, the high-power refrigerating module that combines according to described a kind of air-cooled, the water-cooled of claim 5 and electronic cooling, it is characterized in that: described interchanger inside is equipped with the multi-disc radiating fin.
7, the high-power refrigerating module that combines according to described a kind of air-cooled, the water-cooled of claim 6 and electronic cooling, it is characterized in that: screw connects an end face of support, described fan, fan installing plate, described rectangle shape heating radiator successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200451481U CN201417618Y (en) | 2009-05-07 | 2009-05-07 | High power cooling module combining air cooling, water cooling and electronic refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200451481U CN201417618Y (en) | 2009-05-07 | 2009-05-07 | High power cooling module combining air cooling, water cooling and electronic refrigeration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201417618Y true CN201417618Y (en) | 2010-03-03 |
Family
ID=41794043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200451481U Expired - Fee Related CN201417618Y (en) | 2009-05-07 | 2009-05-07 | High power cooling module combining air cooling, water cooling and electronic refrigeration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201417618Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115541676A (en) * | 2022-10-17 | 2022-12-30 | 吉林省电力科学研究院有限公司 | Water sample constant temperature device for detecting pH and conductivity of cold water in power plant |
-
2009
- 2009-05-07 CN CN2009200451481U patent/CN201417618Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115541676A (en) * | 2022-10-17 | 2022-12-30 | 吉林省电力科学研究院有限公司 | Water sample constant temperature device for detecting pH and conductivity of cold water in power plant |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202085437U (en) | A cooling device for an inverter air conditioner | |
| CN103699191A (en) | Semiconductor water-cooling central processing unit (CPU) radiator | |
| US7669642B1 (en) | Thermal module | |
| CN101645313A (en) | Improved cooling module structure combining wind cooling, water cooling and electronic cooling | |
| CN208306363U (en) | A kind of radiator and electric car | |
| US20110192572A1 (en) | Heat exchanger | |
| CN101644950A (en) | Improved electronic refrigeration type water cooling system for display card | |
| CN202948389U (en) | Semiconductor central processing unit (CPU) radiator | |
| CN210605614U (en) | Heat abstractor for computer machine case | |
| CN101667464A (en) | Novel high-power cooling module integrating air cooling, water cooling and electronic cooling | |
| CN201417618Y (en) | High power cooling module combining air cooling, water cooling and electronic refrigeration | |
| CN101645312A (en) | Improved high-efficiency semiconductor water cooling system | |
| CN205825570U (en) | A kind of heat abstractor of semiconductor freezer | |
| CN114122873A (en) | Forced air-cooled laser cooling system | |
| CN201417616Y (en) | High-efficient semi-conductor water cooling system | |
| CN202663571U (en) | Heat radiation structure of electromagnetic heating appliance | |
| CN208817633U (en) | Portable semiconductor refrigerating cooling-water machine | |
| CN218915170U (en) | Heat radiation system and air conditioner | |
| CN201417420Y (en) | Electronic refrigeration type water cooling system for display card | |
| CN118714821A (en) | A gas-liquid dual cooling heat dissipation system for radio frequency power supply | |
| CN201417763Y (en) | Semi-conductor water cooling system of computer central processing unit | |
| CN218505614U (en) | Thermal Management System for Hybrid Vehicles | |
| TW201206326A (en) | Devices in series for continuous cooling/ heating | |
| CN101645431A (en) | Improved semiconductor water cooling system of computer central processing unit | |
| CN201417617Y (en) | Cooling module structure combining air cooling, water cooling and electronic refrigeration |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100303 Termination date: 20120507 |