CN101625988A - 镜头支撑件和键合线保护器 - Google Patents

镜头支撑件和键合线保护器 Download PDF

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CN101625988A
CN101625988A CN200910146249A CN200910146249A CN101625988A CN 101625988 A CN101625988 A CN 101625988A CN 200910146249 A CN200910146249 A CN 200910146249A CN 200910146249 A CN200910146249 A CN 200910146249A CN 101625988 A CN101625988 A CN 101625988A
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wirebond
wirebond protector
protector
bonding line
substrate
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CN101625988B (zh
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大卫·J·K·麦都卡夫特
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Avago Technologies International Sales Pte Ltd
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Avago Technologies Fiber IP Singapore Pte Ltd
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Abstract

本发明公开了镜头支撑件和键合线保护器。一种键合线保护器沿着微电子器件的边缘具有与细长的键合线阵列相对应的细长的形状，键合线将半导体管芯与基板上的电导体相连接。在制造具有键合线保护的微电子器件时，首先以传统方式形成键合线。然后以沿着键合线阵列延伸的方位将键合线保护器附接到该器件，以至少部分地覆盖键合线。

Description

镜头支撑件和键合线保护器
技术领域
本发明涉及镜头支撑件和键合线(wirebond)保护器。
背景技术
在光通信网络中，使用光学发送器模块、光学接收器模块和光学收发器模块来通过光纤发送和接收光信号。在这种光学模块的发送部分中，激光器生成表示数据的经调制光信号，这些经调制光信号然后被通过光纤发送。激光器例如可以是垂直腔表面发射激光器(VCSEL)或边缘发射激光器。在这种模块的接收部分中，光学系统将从光纤末端中传播出的光定向到光学检测器或光电检测器，该检测器将光能转换成电能。光电检测器通常是半导体光电二极管器件，例如PIN(p型/本征/n型)光电二极管。光学收发器模块通常包括用于发送多个数据信号的多个激光器和用于接收多个数据信号的多个光电二极管。
光学模块通常是通过将光学器件(即，激光器或光学检测器)安装在基板(也称为引线框)上而组装的。因为光学器件通常包括微电子半导体管芯，所以管芯和基板上的导体之间的电连接是通过已知的引线键合(wirebonding)技术实现的。引线键合是这样的技术：利用热能或超声能将非常细微的线的一端键合到管芯上的焊盘，并将另一端键合到基板上的导体之一。镜头组件可与管芯的发送或接收光学端口对准，并相对于管芯和基板固定安装。
因为线是极其细微的，即直径很细，所以键合线是极其易损坏的。对光学组件的粗糙处理可能容易地破坏或者移走键合线。在一些光学组件中，键合线受围绕整个光学组件的机壳或模块体的保护。在一些组件中，键合线被封装在电介质树脂中以受到保护。
发明内容
本发明的实施例涉及键合线保护器、微电子器件和用于保护键合线的方法。键合线保护器沿着微电子器件的边缘具有与细长的键合线阵列相对应的细长的形状，键合线将半导体管芯与基板上的电连接件相连接。在制造微电子器件时，首先以传统方式形成键合线。然后以沿着键合线阵列延伸的方位将键合线保护器附接到微电子器件，以至少部分地覆盖并从而保护键合线。
在查看了附图和详细描述之后，其他系统、方法、特征和优点对于本领域技术人员而言将是或将变得显而易见。希望所有这种其他的系统、方法、特征和优点包括在该描述中、在说明书的范围内并受所附权利要求保护。
附图说明
参考附图可更好地理解本发明。附图中的组件不一定是按比例的，而是将终点放在清楚地图示本发明的原理上。
图1是根据本发明示例性实施例的键合线保护器的透视图。
图2是图1的键合线保护器的侧视图。
图3是图1-2的键合线保护器的末端视图。
图4是图1-3的键合线保护器的底视图。
图5是沿图2的线5-5获得的键合线保护器的剖视图。
图6示出将图1-5的键合线保护器附接到微电子器件的其余部分以保护键合线。
图7是包括图1-5的键合线保护器的微电子器件的透视图。
图8是图7的微电子器件的顶视图。
图9是图7的微电子器件的侧视图。
图10是沿图8的线10-10获得的图7的微电子器件的剖视图。
图11是与图7类似的透视图，其中在键合线保护器上安装了附加器件。
图12是示出一种制作具有键合线保护器的微电子器件的示例性方法的流程图。
具体实施方式
如图1-5所示，在一个示例性实施例中，键合线保护器100具有由上壁102和侧壁104定义的细长形状。在键合线保护器100的相对末端上是脚106和108，脚106和108共同定义键合线保护器100的底部。在键合线保护器100的相应末端处的凹口110和112有利于对准和附接键合线保护器100，如以下所述。应当注意，上壁102和侧壁104相交，在键合线保护器100中定义了内部空间或腔114。
键合线保护器100可由任何适当材料制成，包括塑料、环氧树脂或其他树脂、金属等等。可通过注模、铸造、挤压或任何其他适当传统工艺来形成键合线保护器100。键合线保护器100例如可以是从透明、半透明或者不透明的液晶聚合物(LCP)所注模的。
如图6所示，可通过附接键合线保护器100来保护微电子器件组件118的键合线阵列116。键合线阵列116包括沿着基板120的边缘延伸的多条键合线。如本领域中所熟知的(因此为了清楚起见未详细示出)，每条键合线包括一条细线，该细线的一端键合到半导体管芯122的焊盘并且另一端键合到基板120的导体。键合线阵列116是由键合线的线条定义的，如本发明的所示实施例中那样，线条通常是直的或线性的，但也可以具有一个或多个弯曲。注意，键合线保护器100的细长形状与键合线阵列116的细长形状相对应或者相一致。因此，在要保护具有非线性形状的键合线阵列的实施例中，键合线保护器将具有相应的或者相一致的形状。例如，在一种替代实施例(未示出)中，键合线保护器可以是L形的，以保护L形的键合线阵列。
在该示例性实施例中，基板120包括引线框124和附接到引线框124的上表面的安装核心125。尽管术语“基板”和“引线框”在本领域中有时被可互换地使用，但是在本专利说明书(“这里”)所使用的术语“基板”不限于引线框；而是，术语“基板”在其含义的范围内广泛地包括任何适当元件和元件的组件。在该示例性实施例中，数个半导体管芯122由于被安装在安装核心125上、安装核心125又被安装在基板120的引线框124上而被安装在基板120上。尽管在该示例性实施例中，基板120包括引线框124和安装核心125，但是在其他实施例中，基板可具有任何其他适当结构。
半导体管芯122可包括本领域中已知的任何适当类型的器件。例如，在微电子器件组件118是光学收发器模块的一部分的实施例中，半导体管芯可以是光学发送器(例如VCSEL)和接收器(例如光电二极管)。尽管该示例性实施例包括多个半导体管芯122，其中一些是光学发送器，另一些是光学接收器，但是其他实施例可具有少至单个管芯。
可通过一般在图6所示的箭头方向上将键合线保护器100移动至与微电子器件组件118对准，来将键合线保护器100附接到微电子器件组件118。当键合线保护器100接近微电子器件组件118时，凹口110和112中锥形的或有角度的表面引导基板120(的安装核心125)上的相应凸起126和128。凸起126和128以扣合(snap)啮合或者按压配合(也称为干涉配合)方式与凹口110和112(见图1、2和5)配对。这种引导动作防止在键合线保护器100移至对准时键合线保护器100的一些部分与键合线相碰撞和损坏键合线。当键合线保护器100完全与微电子器件组件118配对时，脚106和108靠在基板120(的引线框124)的表面上以稳定该结构使其不做不希望的移动。脚106和108的凸起部分还用作限位器，从而在键合线保护器100完全与微电子器件组件118配对时与基板120的一些部分邻接。
在一些实施例中，也可以替代上述机械配对部件而使用适当的粘合剂或者除了上述机械配对部件之外还使用适当的粘合剂，以将键合线保护器100紧固到微电子器件组件118。注意，尽管在该示例性实施例中，键合线保护器100附接到安装核心125，但是在其他实施例中，键合线保护器可附接到基板的任何其他元件或部分。
在该示例性实施例中，两个这种键合线保护器100和100’被附接到基板120的相对边缘，以相应地保护相对的键合线阵列116和116’，如图6-10所示。注意，阵列116和116’的各键合线分别被腔114和114’覆盖或者分别半封在腔114和114’内。尽管在该示例性实施例中，键合线保护器100和100’几乎完全遮蔽或者保护键合线阵列116和116’，但是在其他实施例中，键合线保护器至少部分地覆盖键合线也是合适的。
在图6-10中可见，附接了键合线保护器100和100’的微电子器件组件118保护键合线不受粗糙处理的不利影响。应当注意，键合线保护器100和100’还用来保护半导体管芯122和其他元件不受诸如污垢和尘粒之类的污染物的污染。
除了保护键合线不受损坏并保护键合线和其他区域不受污染物污染的键合线保护器100之外，键合线保护器100的上壁102的平坦表面(flatsurface)也可用作附加器件或辅助器件的安装或承受表面。如图11所示，在微电子器件组件118是光学收发器模块的一部分的示例性实施例中，这种附加器件可以是镜头组件130。本领域中已知，光学镜头常常被包括在光学收发器模块中，以在光学检测器上聚焦由诸如VCSEL之类的光学发送器所产生的光或者聚焦所接收的光。
如上所述，例如一些或全部管芯122可以是VCSEL。镜头组件130可被安装为使其相对边缘在相应键合线保护器100和100’的上壁102和102’的平坦表面上，而镜头组件130的主体跨越微电子器件组件118的内部。在键合线保护器100和100’上支撑镜头组件130有利于将镜头组件130的镜头(未示出)与VCSEL端口(未示出)光学对准。施加到上壁102和102’的平坦表面的环氧树脂或其他适当粘合剂可用于将镜头组件130紧固到键合线保护器100和100’。因为环氧树脂被布置在与VCSEL端口的光轴垂直或正交的平面中，所以环氧树脂固化所造成的力并不沿着试图拉出镜头组件130的镜头使其不与VCSEL端口光学对准的方向上。还应注意，在镜头组件130覆盖微电子器件组件118内部的情况下，键合线保护器100和100’与镜头组件130的组合还用来密封内部使其不受污染物的污染，在使用环氧树脂或其他密封剂的情况下尤其如此。
还应当注意，在键合线保护器100和100’是透明的或者至少半透明的实施例中，即使在键合线保护器100和100’已被附接到微电子器件组件118之后，或者即使在镜头组件130或其他这种辅助器件已被附接之后，制造人员也可以在视觉上检查键合线。
例如通过执行图12所示的方法可根据本发明来保护微电子器件的键合线。如步骤132所示，首先在半导体管芯122和基板120之间形成键合线阵列116。如本领域所熟知的，引线键合伴随着用热能或超声能将非常细微的线的一端键合到管芯122上的焊盘(未示出)，并将线的另一端键合到基板120的导体(未示出)之一。
各种其他步骤可包括在该方法的一些实施例中。例如，如步骤134所示，树脂、粘合剂或其他材料可被施加到键合线保护器100的一部分或者半导体器件组件118的配对元件。该材料可用于将键合线保护器100粘合到半导体器件组件118的配对部分，以封装键合线或者用于其他适当目的。例如，材料可被施加到内部或腔114以封装键合线，或者施加到上壁102的表面以粘附镜头组件130。
如步骤136所示，然后以至少部分地覆盖键合线阵列116的方位来附接键合线保护器100。在要保护两个或更多个相应的键合线阵列的实施例中，可以附接两个或更多个这样的键合线保护器。如图6-10所最佳示出的，阵列116和116’的键合线因此分别封在腔114和114’内。
如步骤138所示，在施加粘合剂或其他材料的实施例中，这些材料可被固化以使其变硬或者使之固定。在键合线保护器100是透明的或者能以其它方式透过紫外(UV)光的实施例中，材料可以是可由UV光固化的树脂或环氧树脂。注意，在环氧树脂和键合线保护器100足够透明或清澈的实施例中，可在视觉上检查键合线。
如步骤140所示，在一些实施例中，辅助器件可被安装在一个或多个键合线保护器100上。如上所述，在该示例性实施例中，镜头组件130被安装在两个键合线保护器100和100’之间。尽管在该示例性实施例中，该辅助器件是镜头组件，但是在其他实施例中，也可以是任何其他适当类型的器件。
任何适当的传统步骤也可被包括，例如将整个组件安装在适当的收发器模块封装或机壳中。此外，应当认识到，并非所有实施例都需要包括所有上述步骤。例如，一些实施例不包括步骤134、138和140中的一些或全部。此外，除非以其他方式明确声明，否则可按任何适当顺序执行步骤。
以上描述了本发明的一个或多个说明性实施例。然而，将会了解，本发明由所附权利要求限定，且不限于所描述的具体实施例。

Claims (17)

1.一种用于保护微电子器件的键合线的方法，包括：
将半导体管芯的焊盘引线键合到安装有该管芯的基板的一部分的电连接件上，以形成细长的键合线阵列；以及
将细长的键合线保护器沿着所述键合线阵列附接到所述微电子器件，以至少部分地覆盖所述键合线。
2.如权利要求1所述的方法，其中，附接细长的键合线保护器的步骤包括将所述键合线保护器的部件与所述基板的配对部件相啮合。
3.如权利要求2所述的方法，其中，啮合步骤包括使所述键合线保护器的部件扣合到所述基板的配对部件。
4.如权利要求1所述的方法，还包括在所述键合线保护器的承受表面上安装器件。
5.如权利要求4所述的方法，其中，安装器件的步骤包括以光学组件在所述基板上从一个键合线保护器到另一个键合线保护器延伸的方位，在多个键合线保护器的相应接收表面上安装该器件。
6.如权利要求1所述的方法，还包括在所述键合线保护器的沟道中提供粘合剂。
7.如权利要求6所述的方法，还包括使光照射在所述键合线保护器的透光外表面上以光学地使所述沟道中的粘合剂固化。
8.如权利要求1所述的方法，还包括通过所述键合线保护器的清澈壁来在视觉上检查所述键合线。
9.一种微电子器件组件，包括：
基板；
安装在所述基板上的半导体管芯；
在所述半导体管芯的焊盘与所述基板的一部分的电连接件之间的细长的键合线阵列；以及
沿着所述键合线阵列延伸并且至少部分地覆盖所述键合线的细长的键合线保护器。
10.如权利要求9所述的微电子器件组件，其中，所述键合线保护器由透光材料制成。
11.如权利要求10所述的微电子器件组件，其中，所述键合线保护器是透明的。
12.如权利要求9所述的微电子器件组件，其中，所述键合线保护器具有沿着其长度方向延伸的腔。
13.如权利要求9所述的微电子器件组件，其中，所述键合线保护器具有可与所述基板的配对部件配对的啮合部件。
14.如权利要求13所述的微电子器件组件，其中，所述啮合部件是扣合啮合件。
15.如权利要求9所述的微电子器件组件，其中，所述键合线保护器具有沿着其长度方向延伸的外壁、与该外壁共同延伸的上壁以及至少部分地由所述上壁和所述外壁限定的内部，所述内部限定了布置所述键合线的沟道。
16.如权利要求15所述的微电子器件组件，其中，所述键合线保护器的上壁具有基本平坦的表面。
17.如权利要求16所述的微电子器件组件，还包括至少部分地安装在键合线保护器的上壁上的器件。
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