JP5571330B2 - レンズサポートおよびワイヤボンドプロテクタ - Google Patents
レンズサポートおよびワイヤボンドプロテクタ Download PDFInfo
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- JP5571330B2 JP5571330B2 JP2009159579A JP2009159579A JP5571330B2 JP 5571330 B2 JP5571330 B2 JP 5571330B2 JP 2009159579 A JP2009159579 A JP 2009159579A JP 2009159579 A JP2009159579 A JP 2009159579A JP 5571330 B2 JP5571330 B2 JP 5571330B2
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- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 claims 1
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Description
)とすることができる。また、このようなモジュールの受信部では、光学系(optics system)が光ファイバの端部から伝播する光を光学検出器すなわち光検出器に導き、この光検出器は光エネルギーを電気エネルギーに変換する。光検出器は、一般にPIN(p-type/intrinsic/n-type)フォトダイオードなどの半導体フォトダイオードデバイスである。光送受信モジュールは、一般に、複数のデータ信号を送信する複数のレーザと、複数のデータ信号を受信する複数のフォトダイオードとを備えている。
102 上壁
104 側壁
106 脚部
110 凹部
114 キャビティ
116 ワイヤボンドのアレイ
118 超小型電子デバイスアセンブリ
120 基板
122 半導体ダイ
124 リードフレーム
125 取り付けコア
126 突起
130 レンズアセンブリ
Claims (16)
- 超小型電子デバイスのワイヤボンドを保護する方法であって、
前記ワイヤボンドの細長いアレイを形成するように、半導体ダイが取り付けられた基板の一部の電気的接続部へ前記半導体ダイのパッドをワイヤボンディングし、
前記ワイヤボンドの細長いアレイを少なくとも部分的に覆うために、細長いワイヤボンドプロテクタを、前記基板の面に対して平行方向に且つ前記ワイヤボンドの細長いアレイの長手方向に直交する方向に外側から動かすことにより、前記ワイヤボンドの細長いアレイに沿って、前記ワイヤボンドの細長いアレイの長手方向と前記細長いワイヤボンドプロテクタの長手方向とが平行となるように前記超小型電子デバイスに取り付け、前記細長いワイヤボンドプロテクタの一部を前記基板の嵌合部へスナップ嵌合させること
を含み、
前記細長いワイヤボンドプロテクタの一部が凹部であり、前記基板の嵌合部が突起である、前記超小型電子デバイスのワイヤボンドを保護する方法。 - 前記スナップ嵌合の後には、前記細長いワイヤボンドプロテクタの両端に設けられている脚部が、前記基板の表面に載っている、請求項1に記載の方法。
- 前記細長いワイヤボンドプロテクタの受け面上に、あるデバイスを取り付けるステップをさらに含む請求項1又は2のいずれか1項に記載の方法。
- 前記あるデバイスを取り付ける前記ステップは、光アセンブリを形成するように、前記あるデバイスが前記半導体ダイと位置合わせされ且つ一方の前記細長いワイヤボンドプロテクタから別の前記細長いワイヤボンドプロテクタへと前記基板を横切って延びる状態となる方向で、前記あるデバイスを複数の前記細長いワイヤボンドプロテクタのそれぞれの受け面上に取り付けるステップを含むものである、請求項3に記載の方法。
- 前記細長いワイヤボンドプロテクタの前記凹部に接着剤を与えるステップをさらに含む請求項1から4のいずれか1項に記載の方法。
- 前記凹部内の接着剤を光硬化させるために前記細長いワイヤボンドプロテクタの光透過性を持つ外面に光を照射するステップをさらに含む請求項5に記載の方法。
- 前記細長いワイヤボンドプロテクタの透明な壁面を通して前記ワイヤボンドを目視により検査するステップをさらに含む請求項1から6のいずれか1項に記載の方法。
- 基板と、
前記基板に取り付けられた半導体ダイと、
前記半導体ダイのパッドと前記基板の一部の電気的接続部との間にあるワイヤボンドの細長いアレイと、
前記ワイヤボンドの細長いアレイに沿って延在し、前記ワイヤボンドの細長いアレイを少なくとも部分的に覆う細長いワイヤボンドプロテクタであって、前記基板の嵌合部とスナップ嵌合した係合部を有するものと
を備え、
前記細長いワイヤボンドプロテクタが、前記基板の面に対して平行方向に且つ前記ワイヤボンドの細長いアレイの長手方向に直交する方向に外側から動かすことにより、前記ワイヤボンドの細長いアレイの長手方向と前記細長いワイヤボンドプロテクタの長手方向とが平行となるように前記基板に取り付けられている、超小型電子デバイスアセンブリ。 - 前記細長いワイヤボンドプロテクタが光透過性を有する材料で形成される、請求項8に記載の超小型電子デバイスアセンブリ。
- 前記細長いワイヤボンドプロテクタが透明である、請求項9に記載の超小型電子デバイスアセンブリ。
- 前記細長いワイヤボンドプロテクタは、その長さに沿って延びるキャビティを有するものである、請求項8に記載の超小型電子デバイスアセンブリ。
- 前記細長いワイヤボンドプロテクタは、その長さに沿って延びる外壁と、前記外壁と同じ広がりを持つ上壁と、前記ワイヤボンドが配置される前記キャビティを画定する前記外壁および前記上壁によって少なくとも部分的に境界が定められる内部とを有するものである、請求項11に記載の超小型電子デバイスアセンブリ。
- 前記細長いワイヤボンドプロテクタが、その両端に脚部を有し、当該脚部が前記基板の表面上に載っている、請求項8から12のいずれか1項に記載の超小型電子デバイスアセンブリ。
- 前記細長いワイヤボンドプロテクタの前記係合部が凹部であり、前記基板の嵌合部が突起である、請求項8から13に記載の超小型電子デバイスアセンブリ。
- 前記細長いワイヤボンドプロテクタの前記上壁がほぼ平坦な表面を有する、請求項14に記載の超小型電子デバイスアセンブリ。
- 前記超小型電子デバイスアセンブリが複数の前記細長いワイヤボンドプロテクタを備え、
前記複数の細長いワイヤボンドプロテクタの前記上壁のそれぞれへ少なくとも部分的に取り付けられたデバイスを更に備える請求項14又は15に記載の超小型電子デバイスアセンブリ。
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US12/169,784 | 2008-07-09 | ||
US12/169,784 US7906372B2 (en) | 2008-07-09 | 2008-07-09 | Lens support and wirebond protector |
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JP2010050443A JP2010050443A (ja) | 2010-03-04 |
JP5571330B2 true JP5571330B2 (ja) | 2014-08-13 |
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US (2) | US7906372B2 (ja) |
JP (1) | JP5571330B2 (ja) |
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CN101842000B (zh) * | 2009-03-19 | 2014-04-30 | 鸿富锦精密工业(深圳)有限公司 | 贴附装置及使用该贴附装置的贴附方法 |
US9086553B2 (en) * | 2011-06-27 | 2015-07-21 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical communications device having electrical bond pads that are protected by a protective coating, and a method for applying the protective coating |
WO2016074300A1 (zh) * | 2014-11-10 | 2016-05-19 | 李德龙 | 具有皮肤冷却功能的高功率vcsel激光治疗装置及其封装结构 |
CN110323377B (zh) | 2018-03-30 | 2020-12-08 | 宁德时代新能源科技股份有限公司 | 防护压板以及电池模组 |
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US4760440A (en) | 1983-10-31 | 1988-07-26 | General Electric Company | Package for solid state image sensors |
US4696526A (en) * | 1985-07-26 | 1987-09-29 | Intel Corporation | Carrier for tape automated bonded semiconductor device |
JPH0777261B2 (ja) | 1989-07-10 | 1995-08-16 | 三菱電機株式会社 | 固体撮像装置及びその組立方法 |
GB2236213A (en) | 1989-09-09 | 1991-03-27 | Ibm | Integral protective enclosure for an assembly mounted on a flexible printed circuit board |
EP0689241A2 (en) * | 1991-10-17 | 1995-12-27 | Fujitsu Limited | Carrier for carrying semiconductor device |
US5436492A (en) * | 1992-06-23 | 1995-07-25 | Sony Corporation | Charge-coupled device image sensor |
JPH06314746A (ja) * | 1993-04-28 | 1994-11-08 | Mitsubishi Electric Corp | 混成集積回路装置及びその製造方法 |
US5579212A (en) * | 1993-07-29 | 1996-11-26 | Sun Microsystems, Inc. | Protective cover for a silicon chip device and method relating thereto |
US5936850A (en) * | 1995-03-03 | 1999-08-10 | Canon Kabushiki Kaisha | Circuit board connection structure and method, and liquid crystal device including the connection structure |
US5956576A (en) | 1996-09-13 | 1999-09-21 | International Business Machines Corporation | Enhanced protection of semiconductors with dual surface seal |
US5907189A (en) * | 1997-05-29 | 1999-05-25 | Lsi Logic Corporation | Conformal diamond coating for thermal improvement of electronic packages |
US6037655A (en) | 1998-01-12 | 2000-03-14 | Eastman Kodak Company | Linear image sensor package assembly |
US6153929A (en) * | 1998-08-21 | 2000-11-28 | Micron Technology, Inc. | Low profile multi-IC package connector |
US6117797A (en) * | 1998-09-03 | 2000-09-12 | Micron Technology, Inc. | Attachment method for heat sinks and devices involving removal of misplaced encapsulant |
US6261868B1 (en) | 1999-04-02 | 2001-07-17 | Motorola, Inc. | Semiconductor component and method for manufacturing the semiconductor component |
JP2001326789A (ja) * | 2000-05-16 | 2001-11-22 | Ricoh Co Ltd | 固体撮像素子の取付け構造 |
JP2003229517A (ja) | 2002-01-31 | 2003-08-15 | Fujitsu Hitachi Plasma Display Ltd | 半導体チップ実装基板及びフラットディスプレイ |
EP1347323A1 (en) | 2002-03-19 | 2003-09-24 | Corning Incorporated | Photonic package based on multi-functional lid |
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JP2006324409A (ja) | 2005-05-18 | 2006-11-30 | Sharp Corp | 半導体レーザ装置およびそれを備えた光ピックアップ装置 |
JP2007005729A (ja) * | 2005-06-27 | 2007-01-11 | Murata Mfg Co Ltd | 樹脂パッケージ |
CN2886983Y (zh) | 2006-02-18 | 2007-04-04 | 鸿富锦精密工业(深圳)有限公司 | 芯片保护装置 |
JP4646960B2 (ja) * | 2007-09-28 | 2011-03-09 | 京セラ株式会社 | 固体撮像素子収納用パッケージ及び撮像装置 |
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GB0910496D0 (en) | 2009-07-29 |
US20100289160A1 (en) | 2010-11-18 |
GB2462164A (en) | 2010-02-03 |
US7955904B2 (en) | 2011-06-07 |
GB2462164B (en) | 2011-02-16 |
CN101625988A (zh) | 2010-01-13 |
US7906372B2 (en) | 2011-03-15 |
US20100007034A1 (en) | 2010-01-14 |
CN101625988B (zh) | 2012-01-11 |
JP2010050443A (ja) | 2010-03-04 |
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