CN101625455B - 投影光学系统、曝光装置以及器件制造方法 - Google Patents

投影光学系统、曝光装置以及器件制造方法 Download PDF

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Publication number
CN101625455B
CN101625455B CN200910140242XA CN200910140242A CN101625455B CN 101625455 B CN101625455 B CN 101625455B CN 200910140242X A CN200910140242X A CN 200910140242XA CN 200910140242 A CN200910140242 A CN 200910140242A CN 101625455 B CN101625455 B CN 101625455B
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China
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mentioned
dioptrics
unit
optical system
projection
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CN200910140242XA
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Chinese (zh)
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CN101625455A (zh
Inventor
福岗亮介
深见清司
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Canon Inc
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Canon Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Lenses (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN200910140242XA 2008-07-09 2009-07-09 投影光学系统、曝光装置以及器件制造方法 Active CN101625455B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-179465 2008-07-09
JP2008179465 2008-07-09
JP2008179465A JP5398185B2 (ja) 2008-07-09 2008-07-09 投影光学系、露光装置およびデバイス製造方法

Publications (2)

Publication Number Publication Date
CN101625455A CN101625455A (zh) 2010-01-13
CN101625455B true CN101625455B (zh) 2011-11-02

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CN200910140242XA Active CN101625455B (zh) 2008-07-09 2009-07-09 投影光学系统、曝光装置以及器件制造方法

Country Status (4)

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JP (1) JP5398185B2 (https=)
KR (1) KR101121029B1 (https=)
CN (1) CN101625455B (https=)
TW (1) TWI414822B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5220136B2 (ja) 2011-01-01 2013-06-26 キヤノン株式会社 照明光学系、露光装置およびデバイス製造方法
JP6041541B2 (ja) * 2012-06-04 2016-12-07 キヤノン株式会社 露光装置及びデバイス製造方法
JP6410406B2 (ja) * 2012-11-16 2018-10-24 キヤノン株式会社 投影光学系、露光装置および物品の製造方法
JP6386896B2 (ja) * 2014-12-02 2018-09-05 キヤノン株式会社 投影光学系、露光装置、および、デバイス製造方法
JP6896404B2 (ja) * 2016-11-30 2021-06-30 キヤノン株式会社 露光装置及び物品の製造方法
JP6882053B2 (ja) 2016-12-05 2021-06-02 キヤノン株式会社 カタディオプトリック光学系、照明光学系、露光装置および物品製造方法
JP7357488B2 (ja) * 2019-09-04 2023-10-06 キヤノン株式会社 露光装置、および物品製造方法
JP7332415B2 (ja) * 2019-10-01 2023-08-23 キヤノン株式会社 投影光学系、走査露光装置および物品製造方法
JP2023004358A (ja) * 2021-06-25 2023-01-17 キヤノン株式会社 投影光学系、露光装置、および物品の製造方法
JP7614962B2 (ja) * 2021-07-08 2025-01-16 キヤノン株式会社 投影光学系、露光装置、および物品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US555629A (en) * 1896-03-03 Scourer and polisher
US5781346A (en) * 1995-03-22 1998-07-14 Etec System, Inc. Magnification correction for small field scanning
CN1573405A (zh) * 2003-05-30 2005-02-02 株式会社Orc制作所 投影光学系统
CN1784623A (zh) * 2003-05-06 2006-06-07 株式会社尼康 投影光学系统、曝光装置及曝光方法

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Publication number Priority date Publication date Assignee Title
JPH06331932A (ja) * 1993-05-19 1994-12-02 Topcon Corp 投影光学装置
JP3445021B2 (ja) * 1995-04-28 2003-09-08 キヤノン株式会社 光学装置
AU2747899A (en) * 1998-03-20 1999-10-18 Nikon Corporation Photomask and projection exposure system
JP2003222795A (ja) * 2001-11-21 2003-08-08 Adtec Engineeng Co Ltd 倍率補正光学系
TWI232347B (en) 2001-12-26 2005-05-11 Pentax Corp Projection aligner
JP2003178971A (ja) * 2002-10-24 2003-06-27 Nikon Corp 投影露光装置及び投影露光方法
KR101419192B1 (ko) * 2003-08-29 2014-07-15 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
EP1705694A4 (en) * 2004-01-06 2007-10-31 Nikon Corp EXPOSURE METHOD AND DEVICE AND COMPONENTS MANUFACTURING METHOD
JP2005345582A (ja) * 2004-06-01 2005-12-15 Dainippon Screen Mfg Co Ltd 投影光学系およびパターン描画装置
DE102006022958A1 (de) * 2006-05-11 2007-11-22 Carl Zeiss Smt Ag Projektionsbelichtungsanlage, Projektionsbelichtungsverfahren und Verwendung eines Projektionsobjektivs
EP2020679A4 (en) * 2006-05-25 2011-04-13 Nikon Corp OPTICAL LIGHTING DEVICE, EXPOSURE DEVICE AND DEVICE MANUFACTURING METHOD

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US555629A (en) * 1896-03-03 Scourer and polisher
US5781346A (en) * 1995-03-22 1998-07-14 Etec System, Inc. Magnification correction for small field scanning
CN1784623A (zh) * 2003-05-06 2006-06-07 株式会社尼康 投影光学系统、曝光装置及曝光方法
CN1573405A (zh) * 2003-05-30 2005-02-02 株式会社Orc制作所 投影光学系统

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2008-26695A 2008.02.07

Also Published As

Publication number Publication date
JP2010020017A (ja) 2010-01-28
KR101121029B1 (ko) 2012-03-19
KR20100006533A (ko) 2010-01-19
TWI414822B (zh) 2013-11-11
CN101625455A (zh) 2010-01-13
JP5398185B2 (ja) 2014-01-29
TW201003119A (en) 2010-01-16

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