CN101621053A - 系统级封装模块及具有其的移动终端 - Google Patents

系统级封装模块及具有其的移动终端 Download PDF

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Publication number
CN101621053A
CN101621053A CN200810212082A CN200810212082A CN101621053A CN 101621053 A CN101621053 A CN 101621053A CN 200810212082 A CN200810212082 A CN 200810212082A CN 200810212082 A CN200810212082 A CN 200810212082A CN 101621053 A CN101621053 A CN 101621053A
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China
Prior art keywords
circuit board
package module
system circuit
electrically connected
portable terminal
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Granted
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CN200810212082A
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CN101621053B (zh
Inventor
金泰贤
权星泽
李泰河
金东局
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication of CN101621053A publication Critical patent/CN101621053A/zh
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Abstract

提供了一种系统级封装模块，包括：系统电路板；第一元件，其设置在系统电路板上；第二元件，其在第一元件上设置为从第一元件的中央偏向一侧，而部分地露出第一元件；第三元件，其电连接至系统电路板，并设置在第二元件上；以及多个隆起焊盘，其设置在系统电路板的底面上。

Description

系统级封装模块及具有其的移动终端
相关申请的交叉参考
该申请要求于2008年7月4日向韩国知识产权局提交的第10-2008-0064878号韩国专利申请的优先权，通过引证将其公开的内容结合于此。
技术领域
本发明涉及系统级封装模块和具有其的移动终端，在该移动终端中，将具有层压在其中的至少三个元件的该系统级封装模块安装在主板上，从而减少了主板的层数。
背景技术
随着电子和信息业的快速发展，移动通信领域中的移动终端的得到了显著发展。除了基本的通信功能以外，移动终端还包括诸如游戏、数码相机、显示器等的附加功能。因此，移动终端被大量用户广泛使用。
移动终端包括安装在主板上的有源元件和无源元件，例如，RFIC，PM IC，存储器等。由于主板包括用于向各元件施加信号的多条信号导线，因此主板具有至少六层或更多层的结构。
因此，增加了主板的制造成本，从而不可避免地增加了移动终端的制造成本。此外，由于移动终端业的竞争变得更加激烈，因此应该顾及到移动终端的价格。
此外，由于有源元件和无源元件是单独安排在主板上的，因此增加了这些元件的安装面积。因此，增加了主板的尺寸。
发明内容
本发明的优点在于其提供了一种系统级封装模块及一种具有其的移动终端，在该移动终端中，将具有层压在其中的至少三个元件的该系统级封装模块安装在主板上，从而减少了主板的层数。因此，减少移动终端的尺寸和成本是可能的。
本发明的总的发明构思的其他方面和优点将在下面的说明书中部分地进行阐述，并且部分地将从说明书中变得显而易见，或可以通过实施该总的发明构思来了解。
根据本发明的一个方面，一种系统级封装模块包括：系统电路板；第一元件，其设置在系统电路板上；第二元件，其在第一元件上被设置为从第一元件的中央偏向一侧，而部分地露出第一元件；第三元件，其电连接至系统电路板，并设置在第二元件上；以及多个隆起焊盘，其设置在系统电路板的底面上。
第一元件可以是芯片，该芯片包括RF(射频)信号处理单元、基带处理单元、和电源管理单元，第二元件可以是闪存，以及第三元件可以是PSRAM(伪静态随机存取存储器)。
第一元件的露出部分可以是形成RF信号处理单元的区域。
第一元件和系统电路板可以通过倒装接合而彼此电连接。
第二元件和系统电路板可以通过导线接合而彼此电连接。
第三元件和系统电路板可以通过导线接合而彼此电连接。
多个隆起焊盘可以安排为两行或三行。
根据本发明的另一个方面，一种移动终端包括系统级封装模块，而该系统级封装模块包括：系统电路板；第一元件，其设置在系统电路板上；第二元件，其在第一元件上被设置为从第一元件的中央偏向一侧，而部分地露出第一元件；第三元件，其电连接至系统电路板，并设置在第二元件上；以及多个隆起焊盘，其设置在系统电路板的底面上；以及具有在其顶面和底面上都设置有电路图样的双面结构的主板，这些电路图样电连接至多个隆起焊盘。
附图说明
通过结合附图对实施例的下述描述，本发明的总的构思的这些和/或其他方面和优点将变得显而易见，并更加易于理解，附图中：
图1是根据本发明实施例的移动终端的框图；
图2是根据本发明的系统级封装模块的平面图；
图3是根据本发明的系统级封装模块的截面图；
图4是根据本发明的系统级封装模块的底平面图；以及
图5是移动终端的截面图。
具体实施方式
下面将对本发明的总的构思的实施例进行详细地参考，附图中示出了其实例，其中，通篇中相同的参考标号表示相同的元件。下面描述实施例旨在通过参照附图来说明本发明的总的构思。
下文中，将参照附图详细描述根据本发明的系统级封装模块和具有其的移动终端。
图1是根据本发明实施例的移动终端的框图。
参照图1，移动终端100包括安装在主板110上的多个电子部件。多个电子部件可以包括多个元件、显示面板连接器130、小键盘模块140、天线150等。
主板110具有形成于其上的信号和电源线，信号和电源线向多个电子部件传送信号和电能。
多个元件包括前端模块(FEM)160、系统级封装模块120、无源元件170等。
FEM 160是控制用在移动终端100中的无线电信号的收发器装置。
在系统级封装模块120中，RF信号处理单元、基带处理单元、电源管理单元、和存储器单元安装在一个系统电路板上。即，可以在一个封装中实现各个单元，这使得减少I/O端子的数量以及信号和电源导线的数量成为可能。因此，将主板110的层数从六层减少到两层是可能的。
RF信号处理单元选择性地对从FEM 160传送的信号进行挑选，然后将挑选出的信号转换成中频带信号。基带处理单元将中频带信号解调为基带信号。存储器单元用于存储用于处理基带处理单元的信号的数据。电源管理单元用于提供对应于各个电子部件的电能。
系统级封装模块120可以进一步包括用于对RF信号进行切换以选择性地进行发送和接收的切换单元、以相应的频带对RF信号进行滤波的声表面波滤波器、和无源元件。
由于系统级封装模块120设置在主板110上，因此可以实现主板110的集成化。因此，缩短了信号路径，从而可以增强电特性。
参照图2至图4，将更加详细地描述安装在图1所示的移动终端上的系统级封装模块。
图2是根据本发明的系统级封装模块的平面图。图3是根据本发明的系统级封装模块的截面图。
如图2和图3所示，系统级封装模块120包括：系统电路板121；第一元件122a，安装在系统电路板121上；第二元件122b，设置在第一元件122a上；第三元件122c，设置在第二元件122b上；以及成型树脂(molding resin)131，其设置在系统电路板121上以保护第一至第三元件122a至122c。
系统电路板121包括设置于其中并且位于其两个表面上的电路图样121a。电路图样121a可以由金属形成。
系统电路板121可以进一步包括形成在其顶面上的第一焊盘125、第二焊盘126a、和第三焊盘126b。第一焊盘125电连接至第一元件122a。第二焊盘126b可以电连接至第二元件122b。
第一元件122a设置在系统电路板121的顶面上。第一元件122a可以是芯片，在该芯片中，RF信号处理单元、基带处理单元、和电源管理单元被构造为一个模块。第一元件122a可以进一步包括切换单元、声表面波滤波器、无源元件等。至于无源元件，可以以电阻器和电容器为例。
在第一元件122a的底面上，形成有第一芯片焊盘(未示出)。在这种情况中，在将诸如焊球或金属的连接件129夹置在第一芯片焊盘和系统电路板121的第一焊盘125之间后，通过倒装接合方法将第一元件122a安装在系统电路板121上。
在第一元件122a和系统电路板121之间，可以填充底层填料树脂132以将第一元件122a可靠地固定至系统电路板121。底层填料树脂132可以是环氧树脂或环氧-酸-酐-树脂。
第二元件122b通过设置在第一元件122a上的非导电粘合件133接合在第一元件122a上。第二元件122b具有形成在其顶面上的第二芯片焊盘(未示出)。
第二芯片焊盘可以使用第一导线124a来通过导线接合而电连接至第二焊盘126a。
第二元件122b可以是闪存。
第二元件122b可以以露出第一元件122a的RF信号处理单元的方式进行安装。第二元件122b没有设置在第一元件122a的中央，而是设置为从第一元件122a的中央偏向一侧。例如，第二元件122b可以在第一元件122a上设置为使得第一元件122a的一侧与第二元件122b的一侧对齐。因此，由于多条第一导线124a可以集中到一侧，因此可以增加系统电路板121的利用率，并且可以减小系统级封装模块120的尺寸。
第三元件122c通过设置在第二元件122b上的非导电粘合件133而接合到第二元件122b上。第三元件122c可以是PSRAM(伪静态随机存取存储器)。
第三元件122c具有形成在其顶面上的第三芯片焊盘(未示出)。第三芯片焊盘可以使用第二导线124b通过导线接合而与第三焊盘126b电连接。
与第二元件122b相同，第三元件122c可以以露出第一元件122a的RF信号处理单元的方式来形成。即，第三元件122b不设置在第一元件122a的中央，而是设置为从第一元件122a的中央偏向一侧。例如，第三元件122c可以在第一元件122a上设置为使得第一元件122a的一侧与第三元件122c的一侧对齐。因此，第一至第三元件122a至122c的一侧可以相互对齐。
因此，由于多条第一导线124a和多条第二导线124b可以集中至一侧，因此可以提高系统电路板121的利用率，并且可以减小系统级封装模块120的尺寸。
成型树脂131用于保护系统电路板121上的第一至第三元件122a至122c。至于成型树脂131，可以使用硅基树脂或环氧模塑料(epoxy molding compound)。
由于将多个元件封装为一个模块，从而这多个元件在系统级封装模块120内部彼此连接。因此，与现有技术不同，不需要用于连接多个元件的多条信号导线和多个I/O端子。因此，可以减小系统级封装模块120的尺寸，这使得提高元件安装率成为可能。
图4是根据本发明的系统级封装模块的底平面图。
参照图4，系统电路板121可以进一步包括形成在其底面上的多个隆起焊盘127，这些隆起焊盘127通过焊球接合至主板110。
这些隆起焊盘127电连接至主板110以将信号从系统级封装模块120输出至外部。
这些隆起焊盘127可以通过过孔直接连接至形成在系统电路板中或系统电路板顶面上的电路图样。可替换的，这些隆起焊盘127可以通过分离的导线电连接至设置在系统电路板121的底面上的电路图样。
这些隆起焊盘127可以安排为划分(mark off)第一至第三元件122a至122c的四周。在这种情况中，这些隆起焊盘127可以安排为至少两行或三行。和在系统级封装模块120中一样，多个元件在一个封装中实现。因此，减少I/O端子的数量是可能的。
图5是移动终端的截面图。
如图5所示，当将多个隆起焊盘127安排为两行时，可以将电连接至这些隆起焊盘127的主板110用作具有两层结构的双面板。
主板110可以包括绝缘层110a、设置在绝缘层110a两面上的第一和第二电路图样111和112、以及阻焊剂110b。
第一电路图样111可以设置在绝缘层110a的顶面上。此外，第二电路图样112可以设置在绝缘层110a的顶面和底面上。第一和第二电路图样111和112可以通过设置在绝缘层110a中的过孔而彼此电连接。
阻焊剂110b覆盖这些电路图样，同时部分地露出将电连接至系统级封装模块120的电路图样。此时，可以以阻焊剂110b填充过孔。阻焊剂110b用于保护电路图样111和112，以及用于使第一和第二电路图样111和112彼此绝缘。
第一电路图样111可以通过焊球128电连接至设置在第一行中的多个隆起焊盘127a，从而这些隆起焊盘127a可以将第一信号传送至第一电路图样111。第二电路图样112可以通过焊球128电连接至设置在第二行中的多个隆起焊盘127b，从而这些隆起焊盘127可以将第二信号传送至第二电路图样112。
在该实施例中，已经描述了将多个隆起焊盘127安排为两行的情况。然而，这些隆起焊盘127的安排不限于此。即，当将多个隆起焊盘127安排为三行时，可以将电连接至这些隆起焊盘127的主板110用作具有三层结构的双面板。
因此，当将系统级封装模块安装在主板上时，可以以具有两层或三层结构的双面板来代替六层的主板。因此，可以减小具有系统级封装模块的移动终端的厚度，这使得减少制造成本成为可能。
尽管已经示出并描述了本发明的总的构思的一些实施例，但是本领域的技术人员应该理解，在不背离本发明的总的构思的原理和精神的条件下，可以对这些实施例进行改变，本发明构思的范围由所附权利要求书及其等同物限定。

Claims (11)

1.一种系统级封装模块，包括：
系统电路板；
第一元件，其设置在所述系统电路板上；
第二元件，其在所述第一元件上设置为从所述第一元件的中央偏向一侧，而部分地露出所述第一元件；
第三元件，其电连接至所述系统电路板，并设置在所述第二元件上；以及
多个隆起焊盘，其设置在所述系统电路板的底面上。
2.根据权利要求1所述的系统级封装模块，其中，所述第一元件是包括RF(射频)信号处理单元、基带处理单元、和电源管理单元的芯片，
所述第二元件是闪存，以及
所述第三元件是PSRAM(伪静态随机存取存储器)。
3.根据权利要求2所述的系统级封装模块，其中，所述第一元件的露出部分是形成所述RF信号处理单元的区域。
4.根据权利要求1所述的系统级封装模块，其中，所述第一元件和所述系统电路板通过倒装接合而彼此电连接。
5.根据权利要求1所述的系统级封装模块，其中，所述第二元件和所述系统电路板通过导线接合而彼此电连接。
6.根据权利要求1所述的系统级封装模块，其中，所述第三元件和所述系统电路板通过导线接合而彼此电连接。
7.根据权利要求1所述的系统级封装模块，其中，所述多个隆起焊盘安排为两行或三行。
8.一种移动终端，包括：
系统级封装模块，其包括：
系统电路板；
第一元件，其设置在所述系统电路板上；
第二元件，其在所述第一元件上设置为从所述第一元件的中央偏向一侧，而部分地露出所述第一元件；
第三元件，其电连接至所述系统电路板，并设置在所述第二元件上；以及
多个隆起焊盘，其设置在所述系统电路板的底面上；
以及
具有双面结构的主板，在其顶面和底面上设置有电路图样，所述电路图样电连接至所述多个隆起焊盘。
9.根据权利要求8所述的移动终端，其中，所述多个隆起焊盘安排为两行或三行。
10.根据权利要求8所述的移动终端，其中，所述第一元件是包括RF(射频)信号处理单元、基带处理单元、和电源管理单元的芯片，
所述第二元件是闪存，以及
所述第三元件是PSRAM。
11.根据权利要求8所述的移动终端，其中，所述主板具有两层或三层的结构。
CN2008102120820A 2008-07-04 2008-09-12 系统级封装模块及具有其的移动终端 Expired - Fee Related CN101621053B (zh)

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