CN101613862B - 塑料表面处理方法 - Google Patents

塑料表面处理方法 Download PDF

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CN101613862B
CN101613862B CN2008103023870A CN200810302387A CN101613862B CN 101613862 B CN101613862 B CN 101613862B CN 2008103023870 A CN2008103023870 A CN 2008103023870A CN 200810302387 A CN200810302387 A CN 200810302387A CN 101613862 B CN101613862 B CN 101613862B
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matrix
layer
processing plastic
plastic surface
copper
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CN101613862A (zh
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苏忠义
陈政师
王仁宁
茅云陈
林志锋
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Beijing Zhongcai Wyse Education Technology Co ltd
Nantong nine ring Industry Co.,Ltd.
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Shenzhen Futaihong Precision Industry Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes

Abstract

本发明提供一种塑料表面处理方法，其包括如下步骤：提供一塑料基体；以无电解电镀的方式于该基体表面形成至少一化学金属层；以电解电镀的方式于该化学金属层表面形成一镀铜层，使该化学金属层位于该镀铜层与该塑料基体之间；用激光蚀刻方法于该镀铜层表面进行蚀刻，以于该镀铜层上形成一粗糙区；以电解电镀的方式于该基体的镀铜层表面形成一电镀表层。该塑料表面处理方法可于塑料表面获得亮哑双色的效果。

Description

塑料表面处理方法
技术领域
本发明是关于一种塑料表面处理方法，尤其是关于一种在塑料表面产生亮哑双色的表面处理方法。
背景技术
随着人们对装饰性外观件的外观质量及美观性要求越来越高，多种表面装饰技术应用于外观件的制造。例如，为了获得装饰效果，手机、数码相机、个人数码助理等电子装置的外观件通常会进行电镀或烤漆等表面处理。其中，用电镀方法处理后的外观件产品金属质感强，耐磨性能较好，因而受到人们的青睐。
目前，塑料电镀外观件表面大多为同一光亮度表面，比如产品的整个电镀表面均为亮面，或者均为哑光面，表面光亮度缺乏变化，视觉效果欠佳。
发明内容
有鉴于此，有必要提供一种可于塑料表面获得亮哑双色的表面处理方法。
一种塑料表面处理方法，其包括如下步骤：
提供一塑料基体；
以无电解电镀的方式于该基体表面形成至少一化学金属层；
以电解电镀的方式于该化学金属层表面形成一镀铜层，使该化学金属层位于该镀铜层与该塑料基体之间；
将该形成有电镀铜层的基体置于保护剂溶液中浸置，以防止该电镀铜层氧化；
用激光蚀刻方法于该镀铜层表面进行蚀刻，以于该镀铜层上形成一粗糙区；
以电解电镀的方式于该基体的镀铜层表面形成一电镀表层。
上述塑料表面处理方法在塑料基体上形成一电镀铜层后用激光蚀刻的方法在该电镀铜层的局部区域蚀刻出一粗糙面，然后再于该局部形成有粗糙面的镀铜层上形成一电镀表层，从而使该塑料基体的表面与该粗糙面对应的区域呈哑光面，其余表面呈亮面，整体表面呈现亮哑双色，由此获得较佳的视觉效果。
具体实施方式
本发明较佳实施例塑料表面处理方法包括如下步骤：
首先，提供一塑料基体。该基体的材料可以为丙烯腈-丁二烯-苯乙烯(Acrylonitrile-Butadiene-Styrene，ABS)、聚碳酸酯(polycarbonate，PC)、丙烯腈-丁二烯-苯乙烯与聚碳酸酯混合物及聚甲基丙烯酸甲酯(Polyethylmethacrylate，PMMA)等可进行电镀的塑料材料。
之后，采用常规方法对该基体表面进行前处理。
该前处理包括先对该基体表面进行脱脂，然后对其进行表面粗化处理，以使该基体表面具有良好的附着力，有利于后续金属层的附着。该粗化处理可通过使用含有铬酸、铬酸-硫酸混合酸或者高锰酸钾的化学腐蚀剂腐蚀该基体表面来实现，也可以采用等离子加工的方法处理该基体表面，使其表面粗化。若采用含有铬酸的化学腐蚀剂对该基体进行腐蚀粗化，则可将粗化后的基体用含有盐酸及铬还原剂的溶液进行氧化-还原中和清洗，再用清水冲洗。接下来进一步对上述清水冲洗后的基体浸渍于一含有胶态钯的活化溶液中进行活化处理。然后，将该活化后的基体置于含有草酸及盐酸的解胶处理液中进行解胶处理，使活性的钯晶核充分暴露出来，从而使钯晶核具有非常强而均匀的活性。
其后，将经上述前处理后的基体以无电解电镀的方式于该解胶后的基体表面至少形成一化学金属层。例如，该经上述处理后的基体形成一化学铜层，还可以在该化学铜层上形成一化学镍层。
再以电解电镀的方式形成一电镀铜层于该化学金属层的表面，使该化学金属层位于该电镀铜层与基体之间。形成该电镀铜层时，可将所述基体浸渍于含有硫酸铜或焦磷酸铜的电镀液中。将该塑料基体连接于一电源的负极，同时，将一铜金属块与该电源的正极连接并置于所述电镀液中，接通电源，电解即可获得该电镀铜层。
将上述电镀铜层后的基体置于一保护剂溶液中浸置1～5分钟，以防止该镀铜层氧化后于表面生成一氧化膜而不利于后续镀层附着。该保护剂溶液中含有20～120g/L的重铬酸钾。该基体浸置于该保护剂溶液中时，可同时以基体作为阴极，以石墨或碳板作阳极，以该保护剂溶液作电解液，用0.5～2A/dm2的电流密度进行电解，以此获得更好的保护效果。
之后，对该浸置过保护液的基体表面预形成哑光面的位置进行激光蚀刻，使被蚀刻区域形成一粗糙面。该粗糙面可以为任何图形、标志或文字。
将该激光蚀刻后的基体置于含有氢氧化钠及除油剂的溶液中进行除油，以除去基体表面在激光蚀刻过程中可能沾染的油污及杂质。该除油剂可以选用MAX60。
然后，用含有盐酸及硫酸的溶液清洗上述除油后的基体，以中和除油后基体上残余的碱液。
最后，以电解电镀的方式于该电镀铜层表面形成一电镀表层。该电镀表层可以为铬、铜锡合金、镍、锌或锡等金属层。
上述塑料表面处理方法在塑料基体上形成一电镀铜层后用激光蚀刻的方法在该电镀铜层的局部区域蚀刻出一粗糙面，然后再于该局部形成有粗糙面的镀铜层上形成一电镀表层，从而使该塑料基体的表面与该粗糙面对应的区域呈哑光面，其余表面呈亮面，整体表面呈现亮哑双色，由此获得较佳的视觉效果。

Claims (9)

1.一种塑料表面处理方法，其包括如下步骤：
提供一塑料基体；
以无电解电镀的方式于该基体表面形成至少一化学金属层；
以电解电镀的方式于该化学金属层表面形成一电镀铜层，使该化学金属层位于该电镀铜层与该塑料基体之间；
将该形成有电镀铜层的基体置于保护剂溶液中浸置，以防止该电镀铜层氧化；
用激光蚀刻方法于该电镀铜层表面进行蚀刻，以于该镀铜层上形成一粗糙区；
以电解电镀的方式于该基体的镀铜层表面形成一电镀表层。
2.如权利要求1所述的塑料表面处理方法，其特征在于：该基体浸置于该保护剂溶液的同时，以该基体为阴极，该保护剂溶液作电解液进行电解。
3.如权利要求2所述的塑料表面处理方法，其特征在于：该保护剂溶液中含有重铬酸钾。
4.如权利要求3所述的塑料表面处理方法，其特征在于：所述重铬酸钾的浓度为20～120g/L，浸置或电解的时间为1～5分钟，电解的电流密度为0.5～2A/dm2。
5.如权利要求1所述的塑料表面处理方法，其特征在于：该塑料表面处理方法还包括对该浸置过保护液的基体进行除油处理。
6.如权利要求1所述的塑料表面处理方法，其特征在于：该化学金属层为一化学铜层。
7.如权利要求6所述的塑料表面处理方法，其特征在于：该塑料表面处理方法还包括于该化学铜层表面形成一化学镍层。
8.如权利要求1所述的塑料表面处理方法，其特征在于：该电镀表层为铬、铜锡合金、镍、锌或锡中的一种组成。
9.如权利要求1所述的塑料表面处理方法，其特征在于：形成该化学金属层之前还对该基体表面前处理，该前处理包括对该基体表面依次进行脱脂、粗化、活化及解胶。
CN2008103023870A 2008-06-27 2008-06-27 塑料表面处理方法 Expired - Fee Related CN101613862B (zh)

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CN114919139A (zh) * 2022-05-27 2022-08-19 温州金瑞祥金银制品有限公司 一种工艺品亚光成型方法

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