CN101611659B - 电路连接用粘接薄膜、连接结构体以及其制造方法 - Google Patents

电路连接用粘接薄膜、连接结构体以及其制造方法 Download PDF

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Publication number
CN101611659B
CN101611659B CN2008800049491A CN200880004949A CN101611659B CN 101611659 B CN101611659 B CN 101611659B CN 2008800049491 A CN2008800049491 A CN 2008800049491A CN 200880004949 A CN200880004949 A CN 200880004949A CN 101611659 B CN101611659 B CN 101611659B
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CN
China
Prior art keywords
circuit
splicing ear
bond layer
adhesive film
circuit block
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CN2008800049491A
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English (en)
Chinese (zh)
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CN101611659A (zh
Inventor
有福征宏
望月日臣
小林宏治
小岛和良
中泽孝
广泽幸寿
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication date
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Priority claimed from PCT/JP2008/057534 external-priority patent/WO2008133186A1/ja
Publication of CN101611659A publication Critical patent/CN101611659A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CN2008800049491A 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法 Active CN101611659B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP110385/2007 2007-04-19
JP2007110385 2007-04-19
JP002577/2008 2008-01-09
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法
PCT/JP2008/057534 WO2008133186A1 (ja) 2007-04-19 2008-04-17 回路接続用接着フィルム、接続構造体及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201210096198.9A Division CN102638944B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法

Publications (2)

Publication Number Publication Date
CN101611659A CN101611659A (zh) 2009-12-23
CN101611659B true CN101611659B (zh) 2012-05-23

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CN2008800049491A Active CN101611659B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法
CN201210096198.9A Active CN102638944B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法

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Country Link
JP (1) JP5181220B2 (cg-RX-API-DMAC7.html)
KR (1) KR101139073B1 (cg-RX-API-DMAC7.html)
CN (2) CN101611659B (cg-RX-API-DMAC7.html)
TW (1) TWI399420B (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521848B2 (ja) * 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
JP5823117B2 (ja) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 異方性導電フィルム、接合体、及び接合体の製造方法
JP5972009B2 (ja) * 2012-03-30 2016-08-17 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
CN105225729B (zh) * 2015-08-26 2017-02-22 京东方科技集团股份有限公司 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法
JP2017098077A (ja) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体
JP2007027712A (ja) * 1997-02-27 2007-02-01 Seiko Epson Corp 接着方法及び液晶装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643640B1 (ko) * 1997-02-27 2007-06-07 세이코 엡슨 가부시키가이샤 접속구조체,액정장치,전자기기와이방도전성접착제및그제조방법
JP4011157B2 (ja) * 1997-08-08 2007-11-21 日立化成フィルテック株式会社 包装用ラップフィルムの収納ケース
JP3915512B2 (ja) * 2000-04-25 2007-05-16 日立化成工業株式会社 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4325379B2 (ja) * 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027712A (ja) * 1997-02-27 2007-02-01 Seiko Epson Corp 接着方法及び液晶装置の製造方法
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体

Also Published As

Publication number Publication date
CN102638944B (zh) 2014-12-10
JP5181220B2 (ja) 2013-04-10
KR20100002284A (ko) 2010-01-06
TW200911950A (en) 2009-03-16
CN101611659A (zh) 2009-12-23
KR101139073B1 (ko) 2012-04-30
JP2008288551A (ja) 2008-11-27
CN102638944A (zh) 2012-08-15
TWI399420B (zh) 2013-06-21

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Address after: Tokyo, Japan

Patentee after: HITACHI CHEMICAL Co.,Ltd.

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Patentee before: HITACHI CHEMICAL Co.,Ltd.

Address after: Tokyo, Japan

Patentee after: Lishennoco Co.,Ltd.

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Patentee before: HITACHI CHEMICAL Co.,Ltd.