CN101608776B - 导线架料带及其与绝缘壳体的组合及应用该组合的led模组 - Google Patents
导线架料带及其与绝缘壳体的组合及应用该组合的led模组 Download PDFInfo
- Publication number
- CN101608776B CN101608776B CN200910037696.4A CN200910037696A CN101608776B CN 101608776 B CN101608776 B CN 101608776B CN 200910037696 A CN200910037696 A CN 200910037696A CN 101608776 B CN101608776 B CN 101608776B
- Authority
- CN
- China
- Prior art keywords
- conduction
- conduction rack
- combination
- rack
- protuberance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (2)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910037696.4A CN101608776B (zh) | 2009-03-05 | 2009-03-05 | 导线架料带及其与绝缘壳体的组合及应用该组合的led模组 |
US12/585,715 US8089140B2 (en) | 2008-09-25 | 2009-09-23 | Lead frame assembly, lead frame and insulating housing combination, and led module having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910037696.4A CN101608776B (zh) | 2009-03-05 | 2009-03-05 | 导线架料带及其与绝缘壳体的组合及应用该组合的led模组 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101608776A CN101608776A (zh) | 2009-12-23 |
CN101608776B true CN101608776B (zh) | 2015-06-10 |
Family
ID=41482621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910037696.4A Expired - Fee Related CN101608776B (zh) | 2008-09-25 | 2009-03-05 | 导线架料带及其与绝缘壳体的组合及应用该组合的led模组 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101608776B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104835883A (zh) * | 2014-02-08 | 2015-08-12 | 一诠精密电子工业(中国)有限公司 | 发光二极体料带的制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201107810Y (zh) * | 2007-10-26 | 2008-08-27 | 亿光电子工业股份有限公司 | 发光二极管导线架结构 |
CN101364585A (zh) * | 2008-09-25 | 2009-02-11 | 旭丽电子(广州)有限公司 | 一种支架、具有支架的芯片封装结构及其制造方法 |
-
2009
- 2009-03-05 CN CN200910037696.4A patent/CN101608776B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201107810Y (zh) * | 2007-10-26 | 2008-08-27 | 亿光电子工业股份有限公司 | 发光二极管导线架结构 |
CN101364585A (zh) * | 2008-09-25 | 2009-02-11 | 旭丽电子(广州)有限公司 | 一种支架、具有支架的芯片封装结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101608776A (zh) | 2009-12-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101604795B (zh) | 线缆组件 | |
CN103401438B (zh) | 表面贴装桥式整流器及其制造方法 | |
CN102646606A (zh) | Ic卡模块的封装方法 | |
CN102263094A (zh) | 非互联型多芯片封装二极管 | |
US8198800B2 (en) | LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same | |
CN101630716B (zh) | 片式led金属基板和片式led发光装置及制造方法 | |
CN101608776B (zh) | 导线架料带及其与绝缘壳体的组合及应用该组合的led模组 | |
CN211267258U (zh) | 一种led焊盘结构 | |
TWI476885B (zh) | 導電架料帶、導電架料帶與絕緣殼體的組合以及應用該組合的發光二極體模組 | |
US8545053B2 (en) | Light device with multiple LED light sources | |
CN100446230C (zh) | 半导体封装结构及其制法 | |
CN102724812A (zh) | 直接在软性线路板上焊接led制作的外露字和方法 | |
CN106024647A (zh) | 一种cob封装器件低成本生产工艺 | |
CN102724810A (zh) | 能够灵活拆分电路的led电路板及led模组 | |
CN107525048A (zh) | 一种led灯板、其制作方法及一种led条形灯 | |
CN201181700Y (zh) | 导线架及电气连接结构 | |
CN103682063A (zh) | 侧面发光型发光二极管封装结构及其制造方法 | |
CN100583405C (zh) | 小型化芯片模块的接脚制造方法 | |
CN100443248C (zh) | 用于二极管加工焊接的碳精石墨焊接板 | |
CN104347574B (zh) | 引线框架电路及其制作方法 | |
CN202905704U (zh) | 组合型贴片式两极管引线框架件 | |
CN217789956U (zh) | 一种电路板及电子设备 | |
CN215008265U (zh) | Led封装组件 | |
CN209930618U (zh) | 电路板支撑结构 | |
CN203218254U (zh) | 一种dip封装芯片多排阵列铁基引线框 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Applicant after: Lite-On Electronic (Guangzhou) Co., Ltd. Applicant after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Applicant before: Xuli Electronics (Guangzhou) Co., Ltd. Applicant before: Lite-On Technology Corporation |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. TO: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170109 Address after: Wujin, Changzhou province high tech Industrial Development Zone, 88 Yang Lake Road, No. Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Guangbao Sci-Tech Co., Ltd. Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Patentee before: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee before: Guangbao Sci-Tech Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150610 Termination date: 20210305 |