CN101600815B - 蒸镀装置、蒸镀方法及蒸镀装置的制造方法 - Google Patents

蒸镀装置、蒸镀方法及蒸镀装置的制造方法 Download PDF

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Publication number
CN101600815B
CN101600815B CN2008800037795A CN200880003779A CN101600815B CN 101600815 B CN101600815 B CN 101600815B CN 2008800037795 A CN2008800037795 A CN 2008800037795A CN 200880003779 A CN200880003779 A CN 200880003779A CN 101600815 B CN101600815 B CN 101600815B
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China
Prior art keywords
film
vapor deposition
forming material
film forming
next door
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Expired - Fee Related
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CN2008800037795A
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English (en)
Chinese (zh)
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CN101600815A (zh
Inventor
周藤贤治
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01B—BOILING; BOILING APPARATUS ; EVAPORATION; EVAPORATION APPARATUS
    • B01B1/00—Boiling; Boiling apparatus for physical or chemical purposes ; Evaporation in general
    • B01B1/005—Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN2008800037795A 2007-02-01 2008-01-30 蒸镀装置、蒸镀方法及蒸镀装置的制造方法 Expired - Fee Related CN101600815B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007023402A JP5020650B2 (ja) 2007-02-01 2007-02-01 蒸着装置、蒸着方法および蒸着装置の製造方法
JP023402/2007 2007-02-01
PCT/JP2008/051395 WO2008093726A1 (ja) 2007-02-01 2008-01-30 蒸着装置、蒸着方法および蒸着装置の製造方法

Publications (2)

Publication Number Publication Date
CN101600815A CN101600815A (zh) 2009-12-09
CN101600815B true CN101600815B (zh) 2012-03-28

Family

ID=39674034

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800037795A Expired - Fee Related CN101600815B (zh) 2007-02-01 2008-01-30 蒸镀装置、蒸镀方法及蒸镀装置的制造方法

Country Status (7)

Country Link
US (1) US20100104751A1 (https=)
JP (1) JP5020650B2 (https=)
KR (1) KR101212276B1 (https=)
CN (1) CN101600815B (https=)
DE (1) DE112008000313T5 (https=)
TW (1) TW200907081A (https=)
WO (1) WO2008093726A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5179739B2 (ja) * 2006-09-27 2013-04-10 東京エレクトロン株式会社 蒸着装置、蒸着装置の制御装置、蒸着装置の制御方法および蒸着装置の使用方法
DE112009002374T5 (de) * 2008-09-30 2012-11-29 Tokyo Electron Ltd. Abscheidevorrichtung, Abscheideverfahren sowie Speichermedium mit hierin gespeichertem Programm
JP2012169225A (ja) * 2011-02-16 2012-09-06 Tokyo Electron Ltd 成膜装置
JP2014095131A (ja) * 2012-11-09 2014-05-22 Tokyo Electron Ltd 成膜装置
US20170022605A1 (en) * 2014-03-11 2017-01-26 Joled Inc. Deposition apparatus, method for controlling same, deposition method using deposition apparatus, and device manufacturing method
WO2017051790A1 (ja) * 2015-09-24 2017-03-30 シャープ株式会社 蒸着源および蒸着装置並びに蒸着膜製造方法
CN107604337A (zh) * 2017-08-28 2018-01-19 武汉华星光电半导体显示技术有限公司 一种线性蒸发源侦测装置及其侦测方法
CN107858651B (zh) * 2017-11-27 2020-02-04 合肥鑫晟光电科技有限公司 一种蒸镀设备
KR102229219B1 (ko) * 2019-10-29 2021-03-17 주식회사 파인에바 증착 장비용 가열 어셈블리
JP7473892B2 (ja) * 2020-03-10 2024-04-24 株式会社昭和真空 蒸着源
WO2022040075A1 (en) * 2020-08-21 2022-02-24 Applied Materials, Inc. Processing system for processing a flexible substrate and method of measuring at least one of a property of a flexible substrate and a property of one or more coatings on the flexible substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595606A (en) * 1995-04-20 1997-01-21 Tokyo Electron Limited Shower head and film forming apparatus using the same
CN1910739A (zh) * 2004-01-16 2007-02-07 东京毅力科创株式会社 处理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939665B2 (ja) * 1981-10-06 1984-09-25 工業技術院長 金属箔の表面に太陽熱選拓吸収皮膜を形成する方法
JPS62230966A (ja) * 1986-04-01 1987-10-09 Canon Inc 結晶成長装置
JPS63230966A (ja) 1987-03-19 1988-09-27 Nkk Corp 光化学原動装置
US6337102B1 (en) * 1997-11-17 2002-01-08 The Trustees Of Princeton University Low pressure vapor phase deposition of organic thin films
JP3734239B2 (ja) 1999-04-02 2006-01-11 キヤノン株式会社 有機膜真空蒸着用マスク再生方法及び装置
JP2003077662A (ja) * 2001-06-22 2003-03-14 Junji Kido 有機エレクトロルミネッセンス素子の製造方法および製造装置
JP4911555B2 (ja) * 2005-04-07 2012-04-04 国立大学法人東北大学 成膜装置および成膜方法
JP5173175B2 (ja) * 2006-09-29 2013-03-27 東京エレクトロン株式会社 蒸着装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595606A (en) * 1995-04-20 1997-01-21 Tokyo Electron Limited Shower head and film forming apparatus using the same
CN1910739A (zh) * 2004-01-16 2007-02-07 东京毅力科创株式会社 处理装置

Also Published As

Publication number Publication date
DE112008000313T5 (de) 2009-12-17
WO2008093726A1 (ja) 2008-08-07
KR20090106649A (ko) 2009-10-09
JP2008189951A (ja) 2008-08-21
KR101212276B1 (ko) 2012-12-14
JP5020650B2 (ja) 2012-09-05
CN101600815A (zh) 2009-12-09
TW200907081A (en) 2009-02-16
US20100104751A1 (en) 2010-04-29

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