CN101585111A - Laser processing control device and laser processing device - Google Patents
Laser processing control device and laser processing device Download PDFInfo
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- CN101585111A CN101585111A CNA200910203228XA CN200910203228A CN101585111A CN 101585111 A CN101585111 A CN 101585111A CN A200910203228X A CNA200910203228X A CN A200910203228XA CN 200910203228 A CN200910203228 A CN 200910203228A CN 101585111 A CN101585111 A CN 101585111A
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- 230000000149 penetrating effect Effects 0.000 claims description 16
- 230000001678 irradiating effect Effects 0.000 claims description 13
- 230000005855 radiation Effects 0.000 abstract 3
- 230000010354 integration Effects 0.000 description 54
- 230000009471 action Effects 0.000 description 39
- 238000000034 method Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 15
- 238000003860 storage Methods 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000284 extract Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention obtains a laser processing control device for controlling the radiation of pulse laser and a laser processing device thereof. The laser processing control device has: a laser power measuring part, measuring the laser power of pulse laser; an offset voltage calculating part (12), calculating the offset of the laser power measured by the laser power measuring part based on the output value outputted by the laser power measuring part without radiating the timing of the pulse laser; an offset voltage output part (13), outputting the offset calculated by the offset voltage calculating part (12) to the laser power measuring part; an energy calculating part (16), calculating the energy total value of the pulse laser radiated onto an article to be processed at each position of laser radiation based on the laser power measured by the offset of the laser power measuring part; and a laser pulse output indicating part (15), controlling the radiation of the pulse laser radiated by a laser oscillator based on the total value calculated by the energy calculating part (16).
Description
Technical field
The present invention relates to a kind of laser processing control device and laser processing device that the ejaculation of the pulse laser that uses in the Laser Processing is controlled.
Background technology
The short-pulse laser processing unit (plant) is a kind of by to machined object pulse irradiations such as the printed base plate wide pulse laser of 1～100 microsecond for example, and can form diameter on printed base plate is the work mechanism of the through hole (hole) of tens of μ m～hundreds of μ m degree.
In above-mentioned laser processing device, depart from setting if be radiated at energy (intensity) total value of 1 laser on the machining hole, the quality in the hole that forms on the printed base plate is worsened.For example the energy total value at laser departs under the situation of setting, take place formed bore dia produce unusual, can't perforate, laser penetrates from the hole, and the residual such problem of processing bits.Therefore, in existing laser processing device, extract from the part of the laser of laser oscillator ejaculation, simultaneously, be electric parameter with the laser beam transformation that extracts and carry out integration, calculate the energy that is radiated at 1 laser on the machining hole based on this integrated value by integrating circuit.And, under the energy total value that the calculates situation different, stop Laser Processing or append the umber of pulse of emission with predefined setting.
In addition, in patent documentation 1 described laser processing device, in order to calculate the energy be radiated at the laser on the printed base plate exactly, and calculate the energy that is radiated at the laser on the printed base plate at per 1 pulse laser.In addition,, integrating circuit is reset, measure the pulse energy of each pulse laser in the timing synchronous with the frequency of oscillation of pulse laser.
Patent documentation 1: Japanese kokai publication hei 11-261146 communique
Summary of the invention
But, in above-mentioned prior art,, also can't measure and proofread and correct with sensor to laser power even integrating circuit is reset.Therefore, have following problems, that is, be accompanied by the ejaculation of laser, laser power is measured with producing in the sensor under the situation of temperature drift, and laser power is measured can't measure laser power exactly with sensor.
The present invention proposes in view of the above problems, and its purpose is, obtains a kind of laser processing control device and laser processing device, and it can measure the laser power of laser exactly, and ejaculation has the laser of energy accurately.
In order to solve above-mentioned problem, achieve the goal, the invention provides a kind of laser processing control device, it is to penetrating control from laser oscillator to the pulse laser that the machined object as the Laser Processing object shines, it is characterized in that, have: the laser power determination part, it measures the laser power of described pulse laser; The side-play amount calculating part, it calculates the side-play amount of the laser power of being measured by described laser power determination part based in the output valve of the timing of not penetrating described pulse laser by described laser power determination part output; The side-play amount efferent, it will be exported to described laser power determination part by the side-play amount that described side-play amount calculating part calculates; The energy calculating part, the laser power that it determines based on using described side-play amount by described laser power determination part is calculated the total value of the energy that is radiated at the pulse laser on the described machined object at each laser irradiating position; And control part, it is based on the total value that is calculated by described energy calculating part, and the pulse laser that described laser oscillator is penetrated penetrates control.
The effect of invention
According to the present invention, owing to, calculate the side-play amount of laser power,, that is, can measure the laser power of laser exactly, and penetrate and have the laser of energy accurately so have following effect based on the output valve of the laser power of the timing of not penetrating pulse laser.
Description of drawings
Fig. 1 is the figure that the summary of the related laser processing device of expression embodiments of the present invention 1 constitutes.
Fig. 2 is the figure of the structure of the related integrated signal calculation element of expression embodiment 1.
Fig. 3 is the functional block diagram of the structure of the related laser processing control device of expression embodiment 1.
Fig. 4 is used for illustrating the figure that does not have the integrated signal under the situation of occurrence temperature drift at infrared ray sensor.
Fig. 5 is the figure that is used for illustrating the integrated signal under the situation of infrared ray sensor occurrence temperature drift.
Fig. 6 is the flow chart of the computing flow process of expression offset voltage.
Fig. 7 is the figure that is used to illustrate the computing flow process of offset voltage.
Fig. 8 is the figure that is used to illustrate the timing of the corrective action that carries out pulse ejaculation number.
Fig. 9 is used for illustrating the figure that carries out the laser pulse under the situation of corrective action at the interval that pulse ejaculation and pulse are penetrated.
Figure 10 is the figure of the structure of the related integrated signal determinator of expression embodiment 2.
Figure 11 is the functional block diagram of the structure of the related laser processing control device of expression embodiment 2.
Figure 12 is the flow chart of the computing flow process of expression integrated signal.
The specific embodiment
Below, describe the laser processing control device involved in the present invention and the embodiment of laser processing device with reference to the accompanying drawings in detail.In addition, the present invention is not limited to this embodiment.
Fig. 1 is the figure that the summary of the related laser processing device of expression embodiments of the present invention 1 constitutes.Laser processing device 101 is the devices that carry out perforate processing etc. by pulse irradiation laser on machined objects such as printed base plate on machined object, controls by laser processing control device 10.
Laser processing device 101 has laser oscillator 1, speculum 4, f θ lens 5, electrical scanner 6X, 6Y, electric scanning mirror 61X, 61Y, XY worktable 8, partially reflecting mirror (partially transmitting mirror) 31, integrated signal calculation element 20 described later and laser processing control device 10.Laser oscillator 1 penetrates for example wide pulse laser (laser 2) of 1～100 μ sec with the frequency of oscillation pulse of for example 100～10000Hz, is incident to speculum 4 via partially reflecting mirror 31.The part of the laser 2 that penetrates from laser oscillator 1 is delivered to the integrated signal calculation element 20 by partially reflecting mirror 31.Integrated signal calculation element 20 is connected with laser processing control device 10, and laser processing control device 10 is connected with laser oscillator 1.Carry integrated signal a3 described later from integrated signal calculation element 20 to laser processing control device 10, carry integration instruction b3 described later and offset voltage b1 to integrated signal calculation element 20 from laser processing control device 10.In addition, carry vibration indication b2 described later from laser processing control device 10 to laser oscillator 1.
Speculum 4 reflector lasers 2, and it is guided to light path.Laser 2 is directed to electric scanning mirror 61X, 61Y by being reflected by a plurality of speculums 4.Electric scanning mirror 61X, 61Y reflector laser 2 also guide to f θ lens 5 with it.F θ lens 5 make laser 2 optically focused on the machined object on the XY worktable 87.
Electrical scanner 6X, 6Y are the servomotors that laser 2 is scanned in the square scope of for example 50mm, make laser 2 swings by utilizing electric scanning mirror 61X, 61Y, at high speed the irradiation position of laser 2 are positioned on the hole site of machined object 7 thus.
Electrical scanner 6X makes the irradiation position of laser on machined object 7 move along directions X, and electrical scanner 6Y makes the irradiation position of laser on machined object 7 move along the Y direction.XY worktable 8 mountings are the square machined object 7 of 300mm for example, simultaneously, machined object 7 is moved along the XY direction.
Laser processing device 101 is by making XY worktable 8 repeatedly and move (carrying out stepping to Working position) and to machined object 7 irradiating lasers, for example carrying out on a plurality of positions of machined object 7, diameter being the hole processing of tens of～hundreds of μ m.In laser processing device 101, during making that XY worktable 8 moves, stop to machined object 7 irradiating lasers, after XY worktable 8 arrives the position of expectation and stops, to machined object 7 irradiating lasers.
In the present embodiment, integrated signal calculation element 20 uses from the part of the laser 2 of laser oscillator 1 ejaculation, measures the integrated signal of pulse laser.In addition, laser processing control device 10 calculates the energy (laser power) that is radiated at the laser 2 on the machined object 7 based on the integrated signal in stopping during machined object 7 irradiating lasers.Laser processing control device 10 is controlled laser oscillator 1 based on the energy that calculates, and the laser of umber of pulse that will be corresponding with energy is radiated on the machined object 7.
In addition, in laser processing device 101, also can in light path, insert optical element except laser oscillator 1, speculum 4, f θ lens 5, electrical scanner 6X, 6Y, electric scanning mirror 61X, 61Y, XY worktable 8 etc., also can adopt the structure of omitting certain element.
Here, structure and the action to integrated signal calculation element (laser power determination part) 20 describes.Fig. 2 is the figure of the structure of the related integrated signal calculation element of expression embodiment 1.Integrated signal calculation element 20 constitutes and comprises infrared ray sensor 22, amplifying circuit 23 and integrating circuit 24, is used to calculate the integrated signal a3 corresponding with the laser power of pulse laser.
Carry to partially reflecting mirror (partially transmitting mirror) 31 from the laser 2 that laser oscillator 1 penetrates.Do not have the laser 2 of transmission to reflect in 31 pairs of laser 2 of partially reflecting mirror, and carry to electric scanning mirror 61X, 61Y side.In addition, partially reflecting mirror 31 makes a part of transmission of laser 2, and carries to integrated signal calculation element 20 (infrared ray sensor 22).Integrated signal calculation element 20 uses the laser from partially reflecting mirror 31, calculated product sub-signal a3, and the integrated signal a3 that calculates sent to laser processing control device 10.Laser processing control device 10 calculates the energy that is radiated at the laser 2 on the machined object 7 based on integrated signal a3.In addition, the offset voltage b1 that laser processing control device 10 will be corresponding with the energy that calculates sends to amplifying circuit 23.
Thus, amplifying circuit 23 sends as the signal of telecommunication a2 signal after the addition signal of telecommunication a1 and offset voltage b1 addition to integrating circuit 24.Laser processing control device 10 uses this signal of telecommunication a2, calculated product sub-signal a3, and the integrated signal a3 that calculates sent to laser processing control device 10.In addition, laser processing control device 10 calculates the energy that is radiated at the laser 2 on the machined object 7 based on the integrated signal a3 that uses signal of telecommunication a2 to calculate.Laser processing control device 10 will be corresponding with the energy that calculates offset voltage b1 send to amplifying circuit 23, simultaneously, the indication (vibration indication b2) that will penetrate the laser corresponding with the energy that calculates is to laser oscillator 1 transmission.
Below, the structure of the laser processing control device 10 in the embodiment 1 is described.Laser processing control device 10 for example is made of CPU, ROM, RAM, gate array etc.Fig. 3 is the functional block diagram of the structure of the related laser processing control device of expression embodiment 1.Laser processing control device 10 has integrated signal input part 11, offset voltage calculating part (side-play amount calculating part) 12, offset voltage efferent (side-play amount efferent) 13, integration instruction efferent 14, laser pulse output instruction unit (control part) 15 and energy calculating part 16.
Integrated signal input part 11 makes the integrated signal a3 input of sending from integrating circuit 24, and sends to offset voltage calculating part 12 and energy calculating part 16.Offset voltage calculating part 12 calculates the offset voltage b1 that sends to amplifying circuit 23 thus by integrated signal a3 and deviation ratio k described later are multiplied each other.
Laser pulse output instruction unit 15 stops indication penetrating laser or appends the vibration indication b2 that penetrates laser sending to laser oscillator 1 based on the comparative result of energy.Under the situation of actual energy less than the energy reference value, laser pulse output instruction unit 15 will send to laser oscillator 1 to append the vibration indication b2 that penetrates laser with the poor corresponding umber of pulse of energy.Judging the moment of actual energy greater than the energy reference value, laser pulse output instruction unit 15 will stop to penetrate the vibration indication b2 of laser to laser oscillator 1 transmission.
Below, laser pulse (signal of telecommunication a2) and integrated signal a3 after amplifying from infrared ray sensor 22 output and by amplifying circuit 23 are described.Fig. 4 is used for illustrating the figure that does not have the integrated signal under the situation of occurrence temperature drift at infrared ray sensor, and Fig. 5 is used for illustrating the figure that the integrated signal under the situation of temperature drift has taken place at infrared ray sensor.
In infrared ray sensor 22, do not have under the situation of occurrence temperature drift, do not have the laser pulse (signal of telecommunication a1) of skew from infrared ray sensor 22 outputs.In the case, in the timing of not penetrating laser, be the laser pulse a1 of " 0 " from infrared ray sensor 22 output reference values.In addition, if not from laser processing control device 10 to amplifying circuit 23 input off-set voltage b1, then as shown in Figure 4, do not have the laser pulse (signal of telecommunication a2) of skew from amplifying circuit 23 output.
The integration of laser processing control device 10 instruction efferent 14 makes the signal of integration instruction (being used to measure the integration instruction of the energy of laser) (hereinafter referred to as integration instruction bx) rise before pulse is risen.Here, integration instruction bx is the integration instruction identical with integration instruction b3, and integration instruction b3 is the integration instruction that is used for the Observed Drift value, and relative therewith, integration instruction bx is the integration instruction that is used to measure energy.Integration instruction efferent 14 makes the signal of integration instruction bx fall after pulse is fallen.Above-mentioned integration instruction bx sends to integrating circuit 24 from integration instruction efferent 14.Integrating circuit 24 carries out integration (calculating the area of signal of telecommunication a2) with the time paired pulses laser that integration instruction bx is in rising.Thus, integrating circuit 24 obtains normal integrated signal a3 (energy) as integral result.
On the other hand, in infrared ray sensor 22, under the situation of occurrence temperature drift, the laser pulse a1 of skew is arranged from infrared ray sensor 22 outputs.In the case, even in the timing of not penetrating laser, also from infrared ray sensor 22 output less than the laser pulse a1 of a reference value " 0 " or greater than the laser pulse a1 of " 0 ".In addition, if not from laser processing control device 10 to amplifying circuit 23 input off-set voltage b1, then as shown in Figure 5, have the laser pulse of "+" skew or have the laser pulse of "-" skew from amplifying circuit 23 output.Therefore, integrating circuit 24 obtains as integral result to the integrated signal a3 of positive side drift or the integrated signal a3 that drifts about to minus side.
If use from the integrated signal a3 of normal value to positive side or minus side drift, calculate the energy that is radiated at the laser on the machined object 7, then can't correctly calculate actual energy.Therefore, in the present embodiment, the offset voltage b1 that laser processing control device 10 will be corresponding with integrated signal a3 inputs to amplifying circuit 23.Thus,, then can export under the situation of laser pulse, not have the laser pulse that is offset from amplifying circuit 23 outputs from amplifying circuit 23 with "+" skew or "-" skew if can offset voltage b1 not inputed to amplifying circuit 23.
Below, the computing flow process of offset voltage b1 is described.Fig. 6 is the flow chart of computing flow process of expression offset voltage, and Fig. 7 is the figure that is used to illustrate the computing flow process of offset voltage.
After Laser Processing began, laser processing device 101 moved by making XY worktable 8, and machined object 7 is moved on the Working position (laser irradiating position) of machined object 7.Then, by making electrical scanner 6X, 6Y and electric scanning mirror 61X, 61Y action, adjust the Working position of machined object 7 thus.Then, penetrate laser 2 from laser oscillator 1.The laser 2 that penetrates from laser oscillator 1, only a part is carried to infrared ray sensor 22 from partially reflecting mirror 31 transmissions.
In addition, after Laser Processing began, integration instruction efferent 14 confirmed whether penetrate laser (whether being in the processing) (step S110) to machined object 7.Specifically, judge whether to be in electrical scanner 6X, 6Y and stop action, and penetrate the state (regularly) of laser to machined object 7.
If penetrate laser (step S110: be) to machined object 7, then integration instruction efferent 14 is not exported integration instruction b3 and end process.If not to machined object 7 penetrate laser (step S110: not), then integration instruction efferent 14 for example the integration instruction b3 during the 100 μ sec to integrating circuit 24 outputs.Integrating circuit 24 carries out integration with the time that integration instruction b3 is in rising to each laser pulse (signal of telecommunication a2), and calculated product sub-signal a3 (step S120).Then, integrating circuit 24 sends integrated signal a3 to laser processing control device 10.This integrated signal a3 sends to offset voltage calculating part 12 and energy calculating part 16 via integrated signal input part 11.
Offset voltage calculating part 12 is transformed to integral voltage d with integrated signal a3.Here, integral voltage d is the voltage corresponding with integrated signal a3, is each peak value of integrated signal a3.In addition, offset voltage calculating part 12 is judged integral voltage d whether in setting range, and specifically, offset voltage calculating part 12 judges whether to satisfy | integral voltage d|≤qualified threshold value (step S130).Here, qualified threshold value is based on the processing quality of Laser Processing and predefined value, when | integral voltage d|≤qualified threshold value, can carry out the qualified Laser Processing of quality.Qualified threshold value is the scope of the integral voltage that for example calculates when laser oscillator 1 penetrates laser ± 10%.
| under the situation of integral voltage d|≤qualified threshold value (step S130: be), offset voltage calculating part 12 does not calculate offset voltage b1 and end process.Not satisfying | (step S130: not), offset voltage calculating part 12 calculates offset voltage b1 (step S140) thus by integral voltage d and deviation ratio k are multiplied each other under the situation of integral voltage d|≤qualified threshold value.Offset voltage efferent 13 will be exported (step S150) to amplifying circuit 23 by the offset voltage b1 that offset voltage calculating part 12 calculates.Then, the signal of telecommunication a2 that after integrating circuit 24 sends signal of telecommunication a1 and offset voltage b1 addition, obtains of amplifying circuit 23.
Laser pulse output instruction unit 15 is poor based on energy, indication is stopped to penetrate laser or append the vibration indication b2 that penetrates laser sending to laser oscillator 1.Under the situation of actual energy less than the energy reference value, laser pulse output instruction unit 15 will be used to indicate to append the vibration of penetrating laser with the poor corresponding umber of pulse of energy indicates b2 to send to laser oscillator 1.Actual energy greater than the situation of energy reference value under or be judged as under the situation of actual energy that next calculates greater than the energy reference value, the vibration indication b2 that laser pulse output instruction unit 15 will be used to stop to penetrate laser sends to laser oscillator 1.
In laser processing device 101, if do not penetrate laser (step S110: not), then carry out the processing (corrective action of signal of telecommunication a2) of step S120～S150 repeatedly to machined object 7.
The timing of the corrective action that carries out signal of telecommunication a2 here, is described.Fig. 8 is the figure that is used to illustrate the timing of the corrective action that carries out pulse ejaculation number.As noted above, laser processing device 101 by mobile XY worktable 8 repeatedly with to machined object 7 irradiating lasers, carries out hole processing in a plurality of positions of machined object 7.Laser processing device 101 stops to machined object 7 irradiating lasers during making that XY worktable 8 moves.The traveling time of XY worktable 8 for example is set at 300msec.In addition,, be set at for example each position 1～10sec for to the irradiation of the laser of machined object 7, during this 1～10sec in, make multiple pulsed light carry out the laser irradiation.
Laser processing device 101 in the present embodiment, (mobile XY worktable 8 during) do not carry out corrective action when having irradiating laser.Specifically, after XY worktable 8 begins to move, after the stipulated time (for example required long time of time, for example 60msec), begin to carry out corrective action than the action of electrical scanner 6X, 6Y.
Laser processing device 101 is by carrying out for example 50 illustrated corrective actions of Fig. 7, and signal of telecommunication a2 is proofreaied and correct.In 1 time corrective action (calculating 1 offset voltage b1) the required time is under the situation of for example 100 μ sec, by carrying out for example 50 these corrective actions, thereby finishes corrective action in the time that adds up to 5msec.
Like this, owing to carry out corrective action in during making that XY worktable 8 moves, so can the time of origin waste in Laser Processing is handled.In addition, owing to when XY worktable 8 is moved, carry out corrective action, so can proofread and correct on high frequency ground.
In addition, here, although understand the situation of carrying out 50 corrective actions, but after carrying out corrective action with stipulated number, if | integral voltage d|≤qualified threshold value, then also can finish corrective action.In the case, before carrying out the laser irradiation next time, stop corrective action.In addition, if do not satisfy | integral voltage d|≤qualified threshold value, then also can carry out the corrective action more than or equal to 50 times.In the case, can continue to carry out corrective action, also can be only continue to carry out corrective action in during making that XY worktable 8 moves until | integral voltage d|≤qualified threshold value.Continue to carry out corrective action until | under the situation of integral voltage d|≤qualified threshold value, make laser irradiation standby next time, until | integral voltage d|≤qualified threshold value.Then, satisfying | after integral voltage d|≤qualified threshold value, beginning laser irradiation next time.
In addition, in the present embodiment, although carry out the situation of corrective action in understanding during making that XY worktable 8 moves, but also can be in the interval that pulse ejaculation and pulse are penetrated (between the 1～10sec shown in Figure 8 etc.) carry out corrective action.In the case, carried out 1 subpulse penetrate after till carry out pulse next time during in (each pulse is penetrated at interval), carry out the processing (corrective action) of 1 step S120～S150 at least.In addition, after carrying out corrective action, carry out pulse next time and penetrate, during till carrying out again pulse next time and penetrating in, carry out the processing of 1 step S120～S150 at least.In other words, laser processing device 101 carries out ejaculation of 1 subpulse and corrective action in order repeatedly.In addition, laser processing device 101 also can carry out corrective action to penetrate the ratio of carrying out 1 corrective action every multiple pulses.
Laser processing device 101 penetrates multiple pulsed light when machined object 7 is carried out Laser Processing.And, this pulsed light is inputed to infrared ray sensor 22 continuously.Therefore, in the interval of pulse ejaculation and pulse ejaculation, do not carry out under the situation of corrective action, export the laser pulse (signal of telecommunication a2) of characteristic shown in the double dot dash line of Fig. 9 sometimes from amplifying circuit 23.On the other hand, if in the interval of pulse ejaculation and pulse ejaculation, carried out corrective action, then export the laser pulse (signal of telecommunication a2) of characteristic shown in the solid line of Fig. 9 from amplifying circuit 23.
In addition, in the present embodiment,, also can adopt laser processing control device 10 to have the structure of integrated signal calculation element 20 though integrated signal calculation element 20 and laser processing control device 10 are constituted separately.
In addition, in the present embodiment, signal of telecommunication a2 is carried out the integrated signal a3 (integral voltage d) that obtains behind the integration, calculate the situation of offset voltage b1, but also can use signal of telecommunication a2 to calculate offset voltage b1 although understand to use.In addition, also can use signal of telecommunication a2 to calculate actual energy.
In addition, in the present embodiment, although understand situation about being controlled by the umber of pulse of the emitted laser of 10 pairs of laser oscillators of laser processing control device 1, but laser processing control device 10 also can be controlled the power of the emitted laser of laser oscillator 1.
According to embodiment as noted above 1, because from the amplifying circuit 23 outputs accurately signal of telecommunication a2 corresponding, so can measure the laser power that is radiated at the laser on the machined object 7 exactly with offset voltage b1.
In addition, owing to carry out the corrective action of signal of telecommunication a2 in during making that XY worktable 8 moves,, the corrective action of signal of telecommunication a2 do not postpone so can not making Laser Processing handle.In addition, owing to when XY worktable 8 is moved, carry out the corrective action of signal of telecommunication a2, so can signal of telecommunication a2 be proofreaied and correct high frequency ground.In addition, owing in each pulse of laser 2 is penetrated at interval, carry out the corrective action of signal of telecommunication a2, so can proofread and correct signal of telecommunication a2 exactly.
Embodiment 2
Below, with reference to Figure 10～Figure 12 embodiments of the present invention 2 are described.In embodiment 2, laser processing control device 10 utilizes software to carry out computing, integrated signal a3 is modified to correct integrated signal (having considered the integrated signal of temperature drift), uses revised integrated signal (integrated signal a4 described later) to calculate the actual energy of pulse laser.
Figure 10 is the figure of the structure of the related integrated signal determinator of expression embodiment 2.In each inscape of Figure 10, for realize with embodiment 1 shown in Figure 2 in the inscape of integrated signal calculation element 20 identical functions, the mark same numeral omits repeat specification.
Integrated signal calculation element 20 constitutes and comprises infrared ray sensor 22 and integrating circuit 24.Integrating circuit 24 in the present embodiment is connected with infrared ray sensor 22, and (integration instruction b3) carries out integration, calculated product sub-signal a3 to the signal of telecommunication a1 from infrared ray sensor 22 outputs with official hour.Integrating circuit 24 will send to laser processing control device 10 to carry out signal of telecommunication a1 behind the integration as integrated signal a3 with integration instruction b3 time corresponding.
Below, the structure of the laser processing control device 10 in the embodiment 2 is described.Figure 11 is the functional block diagram of the structure of the related laser processing control device of expression embodiment 2.In each inscape of Figure 11, for realize with embodiment 1 shown in Figure 3 in the inscape of laser processing control device 10 identical functions, the mark same numeral omits repeat specification.
Laser processing control device 10 has integrated signal input part 11, integration instruction efferent 14, laser pulse output instruction unit 15, energy calculating part 16, side-play amount storage part 17, integral voltage calculating part 18 and side-play amount calculating part 19.
Side-play amount calculating part 19 in the present embodiment is transformed to integral voltage d with integrated signal a3, simultaneously, calculates side-play amount c based on integral voltage d.Here, side-play amount c is the correction value that is used to revise the departure (skew) of the integrated signal a3 that the temperature drift by infrared ray sensor 22 causes.Side-play amount c is used for the integrated signal a3 that next time imports from integrating circuit 24 is revised.
The up-to-date side-play amount c that 17 storages of side-play amount storage part are calculated by side-play amount calculating part 19.Integral voltage calculating part 18 uses the up-to-date side-play amount c of storage in the side-play amount storage part 17, and the integrated signal a3 that next time imports from integrating circuit 24 is revised.Integral voltage calculating part 18 will use side-play amount c to carry out revised integrated signal as integrated signal a4 (not shown), send to energy calculating part 16.Energy calculating part 16 calculates the energy of laser 2 based on integrated signal a4 at each pulse.
Below, the computing flow process of integrated signal a4 is described.Figure 12 is the flow chart of the computing flow process of expression integrated signal.In handling process shown in Figure 12, for the handling process identical handling process performed according to the laser processing device in the embodiment 1 of Fig. 6 explanation 101, omit its explanation.
In laser processing device 101, after Laser Processing begins, penetrate laser 2 from laser oscillator 1.The laser 2 that penetrates from laser oscillator 1, only a part is carried to infrared ray sensor 22 from partially reflecting mirror 31 transmissions.Infrared ray sensor 22 is transformed to signal of telecommunication a1 (laser pulse) with the luminous intensity of laser 2, and sends to integrating circuit 24.
In addition, after Laser Processing began, integration instruction efferent 14 confirmed whether penetrate laser (step S210) to machined object 7.If penetrate laser (step S210: be) to machined object 7, then integration instruction efferent 14 is not exported integration instruction b3 and end process.If not to machined object 7 penetrate laser (step S210: not), then integration instruction efferent 14 for example the integration instruction b3 during the 100 μ sec to integrating circuit 24 outputs.Integrating circuit 24 carries out integration with the time that integration instruction b3 is in rising to each laser pulse (signal of telecommunication a1), and calculated product sub-signal a3 (step S220).Then, integrating circuit 24 sends integrated signal a3 to laser processing control device 10.This integrated signal a3 sends to side-play amount calculating part 19 and integral voltage calculating part 18 via integrated signal input part 11.
Side-play amount calculating part 19 is transformed to integral voltage d with integrated signal a3.Side-play amount calculating part 19 is judged integral voltage d whether in setting range, and specifically, side-play amount calculating part 19 judges whether to satisfy | integral voltage d|≤qualified threshold value (step S230).
| under the situation of integral voltage d|≤qualified threshold value (step S230: be), side-play amount calculating part 19 does not calculate side-play amount c and end process.Not satisfying | (step S230: not), side-play amount calculating part 19 calculates side-play amount c based on integral voltage d under the situation of integral voltage d|≤qualified threshold value.
Side-play amount calculating part 19 for example the size of integral voltage d as the size (integral voltage d=side-play amount c) of side-play amount c.At this moment, make the symbol of integral voltage d and the opposite in sign of side-play amount c (with integral voltage d * (1) as side-play amount c).The side-play amount c (step S240) that 17 storages of side-play amount storage part are calculated by side-play amount calculating part 19.
Then, if do not penetrate laser to machined object 7, then integration instruction efferent 14 instructs b3 to integrating circuit 24 outputs integration, integrating circuit 24 calculated product sub-signal a3, and to laser processing control device 10 transmissions.
This integrated signal a3 sends to side-play amount calculating part 19 and integral voltage calculating part 18 via integrated signal input part 11.Integral voltage calculating part 18 calculates revised integrated signal a4 (departure of integrated signal a1, the a3 that the temperature drift by infrared ray sensor 22 is caused is carried out revised integrated signal a4) (step S250) with the up-to-date side-play amount c and the integrated signal a3 addition of storage in the side-play amount storage part 17.
In addition, integral voltage calculating part 18 sends the integral voltage d that calculates to energy calculating part 16.Energy calculating part 16 calculates the energy of laser 2 based on integral voltage d at each pulse.Then, laser processing control device 10 is controlled laser oscillator 1 by the processing identical with embodiment 1.
In addition, side-play amount calculating part 19 is transformed to integral voltage d with integrated signal a3.Then, if do not satisfy | integral voltage d|≤qualified threshold value, then side-play amount calculating part 19 calculates new side-play amount c based on integral voltage d.The new side-play amount c that 17 storages of side-play amount storage part are calculated by side-play amount calculating part 19.
Then, laser processing device 101 carries out the processing of step S210～S250 repeatedly.Specifically, if do not penetrate laser to machined object 7, the integration instruction b3 that then integration instruction efferent 14 will be corresponding with the pulsed light of the individual pulse of n (n is a natural number) is to integrating circuit 24 outputs, integrating circuit 24 calculates the integrated signal a3 of the pulsed light of n pulse, and sends to laser processing control device 10.
Side-play amount calculating part 19 is transformed to integral voltage d with the integrated signal a3 of the pulsed light of n pulse.In addition, integral voltage calculating part 18 extracts the side-play amount c (the up-to-date skew signal of telecommunication) that calculates behind the pulsed light of irradiation (n-1) individual pulse from side-play amount storage part 17.The integrated signal a4 of the pulsed light of n pulse is calculated in integral voltage calculating part 18 side-play amount c and the integrated signal a3 addition by extracting.
In addition, the timing of calculated product sub-signal a4 is made as with embodiment 1 in the identical timing of timing of the corrective action that carries out signal of telecommunication a2 of explanation.That is, can be during making that XY worktable 8 moves in calculated product sub-signal a4, also can be in each pulse of laser 2 be penetrated at interval calculated product sub-signal a4.
According to embodiment as noted above 2, because the integrated signal a3 addition of the pulsed light by will shining the side-play amount c that calculates behind the pulsed light of (n-1) individual pulse and n pulse, calculate the integrated signal a4 of the pulsed light of n pulse thus, so can measure the laser power that is radiated at the laser on the machined object 7 exactly.
Industrial applicibility
As noted above, laser processing control device involved in the present invention and laser processing device Put, be applicable to the ejaculation control of the pulse laser that uses in the Laser Processing.
Claims (6)
1. laser processing control device, it is to penetrating control from laser oscillator to the pulse laser as the machined object irradiation of Laser Processing object,
It is characterized in that having:
The laser power determination part, it measures the laser power of described pulse laser;
The side-play amount calculating part, it calculates the side-play amount of the laser power of being measured by described laser power determination part based in the output valve of the timing of not penetrating described pulse laser by described laser power determination part output;
The side-play amount efferent, it will be exported to described laser power determination part by the side-play amount that described side-play amount calculating part calculates;
The energy calculating part, the laser power that it determines based on using described side-play amount by described laser power determination part is calculated the total value of the energy that is radiated at the pulse laser on the described machined object at each laser irradiating position; And
Control part, it is based on the total value that is calculated by described energy calculating part, and the pulse laser that described laser oscillator is penetrated penetrates control.
2. laser processing control device, it is to penetrating control from laser oscillator to the pulse laser as the machined object irradiation of Laser Processing object,
It is characterized in that having:
The laser power determination part, it measures the laser power of described pulse laser;
The side-play amount calculating part, it calculates the side-play amount of the laser power of being measured by described laser power determination part based in the output valve of the timing of not penetrating described pulse laser by described laser power determination part output;
The energy calculating part, it calculates the total value of the energy that is radiated at the pulse laser on the described machined object based on laser power that is determined by described laser power determination part and the side-play amount that calculated by described side-play amount calculating part at each laser irradiating position; And
Control part, it is based on the total value that is calculated by described energy calculating part, and the pulse laser that described laser oscillator is penetrated penetrates control.
3. laser processing control device according to claim 1 and 2 is characterized in that,
Described side-play amount calculating part described machined object to the Working position of regulation move during in, calculate the side-play amount of described laser power.
4. laser processing control device according to claim 1 and 2 is characterized in that,
Described side-play amount calculating part calculates the side-play amount of described laser power in the pulse of described pulse laser is penetrated at interval.
5. laser processing device, it carries out Laser Processing to penetrating control from laser oscillator to the pulse laser of machined object irradiation to described machined object,
It is characterized in that having:
Laser oscillator, it penetrates described pulse laser; And
Laser processing control device, it penetrates control to described pulse laser,
Described laser processing control device has:
The laser power determination part, it measures the laser power of described pulse laser;
The side-play amount calculating part, it calculates the side-play amount of the laser power of being measured by described laser power determination part based in the output valve of the timing of not penetrating described pulse laser by described laser power determination part output;
The side-play amount efferent, it will be exported to described laser power determination part by the side-play amount that described side-play amount calculating part calculates;
The energy calculating part, the laser power that it determines based on using described side-play amount by described laser power determination part is calculated the total value of the energy that is radiated at the pulse laser on the described machined object at each laser irradiating position; And
Control part, it is based on the total value that is calculated by described energy calculating part, and the pulse laser that described laser oscillator is penetrated penetrates control.
6. laser processing device, it carries out Laser Processing to penetrating control from laser oscillator to the pulse laser of machined object irradiation to described machined object,
It is characterized in that having:
Laser oscillator, it penetrates described pulse laser; And
Laser processing control device, it penetrates control to described pulse laser,
Described laser processing control device has:
The laser power determination part, it measures the laser power of described pulse laser;
The side-play amount calculating part, it calculates the side-play amount of the laser power of being measured by described laser power determination part based in the output valve of the timing of not penetrating described pulse laser by described laser power determination part output;
The energy calculating part, it calculates the total value of the energy that is radiated at the pulse laser on the described machined object based on laser power that is determined by described laser power determination part and the side-play amount that calculated by described side-play amount calculating part at each laser irradiating position; And
Control part, it is based on the total value that is calculated by described energy calculating part, and the pulse laser that described laser oscillator is penetrated penetrates control.
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| JP2008-135932 | 2008-05-23 | ||
| JP2008135932 | 2008-05-23 | ||
| JP2008135932A JP5219623B2 (en) | 2008-05-23 | 2008-05-23 | Laser processing control device and laser processing device |
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| CN101585111A true CN101585111A (en) | 2009-11-25 |
| CN101585111B CN101585111B (en) | 2012-06-27 |
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| JP (1) | JP5219623B2 (en) |
| KR (1) | KR101035199B1 (en) |
| CN (1) | CN101585111B (en) |
| TW (1) | TWI398060B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102430855A (en) * | 2011-09-21 | 2012-05-02 | 长春理工大学 | Energy time domain accumulating method for multiple laser pulse sequences |
| CN110099768A (en) * | 2017-09-22 | 2019-08-06 | 三菱电机株式会社 | Laser processing device |
| CN110202257A (en) * | 2019-07-01 | 2019-09-06 | 武汉先河激光技术有限公司 | A kind of laser control apparatus |
| CN111618421A (en) * | 2019-02-26 | 2020-09-04 | 发那科株式会社 | Machine learning device, laser processing device, and laser processing system |
| CN112630983A (en) * | 2020-12-24 | 2021-04-09 | 中国工程物理研究院激光聚变研究中心 | Laser system, laser-induced damage testing system and method |
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| CN102858489B (en) * | 2010-04-12 | 2014-12-31 | 三菱电机株式会社 | Laser-cutting method and laser-cutting device |
| KR101511483B1 (en) * | 2013-01-04 | 2015-04-10 | 미쓰비시덴키 가부시키가이샤 | Processing controller, laser processing apparatus and processing control method |
| DE102018201508B4 (en) * | 2018-02-01 | 2021-03-18 | Robert Bosch Gmbh | Use in a LiDAR system of a method for operating a LiDAR system by emitting laser light in the form of laser pulses |
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| JP2804027B2 (en) * | 1987-07-13 | 1998-09-24 | ファナック 株式会社 | Laser output correction method |
| US5822343A (en) * | 1994-08-26 | 1998-10-13 | Psc Inc. | Operating and control system for lasers useful in bar code scanners |
| JP2724993B2 (en) * | 1995-08-31 | 1998-03-09 | 株式会社小松製作所 | Laser processing device and laser device |
| JPH10301052A (en) * | 1997-05-02 | 1998-11-13 | Sumitomo Heavy Ind Ltd | Method of correcting machining position deviation of laser beam machine |
| JP2001287059A (en) * | 2000-04-10 | 2001-10-16 | Amada Eng Center Co Ltd | Method and device for detecting machining defect for laser beam machining device |
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- 2009-05-19 TW TW098116504A patent/TWI398060B/en not_active IP Right Cessation
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102430855A (en) * | 2011-09-21 | 2012-05-02 | 长春理工大学 | Energy time domain accumulating method for multiple laser pulse sequences |
| CN110099768A (en) * | 2017-09-22 | 2019-08-06 | 三菱电机株式会社 | Laser processing device |
| CN111618421A (en) * | 2019-02-26 | 2020-09-04 | 发那科株式会社 | Machine learning device, laser processing device, and laser processing system |
| US11633812B2 (en) | 2019-02-26 | 2023-04-25 | Fanuc Corporation | Machine learning device, laser machine, and laser machining system |
| CN111618421B (en) * | 2019-02-26 | 2023-06-20 | 发那科株式会社 | Machine learning device, laser processing device, and laser processing system |
| CN110202257A (en) * | 2019-07-01 | 2019-09-06 | 武汉先河激光技术有限公司 | A kind of laser control apparatus |
| CN112630983A (en) * | 2020-12-24 | 2021-04-09 | 中国工程物理研究院激光聚变研究中心 | Laser system, laser-induced damage testing system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201008062A (en) | 2010-02-16 |
| KR101035199B1 (en) | 2011-05-17 |
| KR20090122141A (en) | 2009-11-26 |
| JP2009279631A (en) | 2009-12-03 |
| CN101585111B (en) | 2012-06-27 |
| JP5219623B2 (en) | 2013-06-26 |
| TWI398060B (en) | 2013-06-01 |
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