TWI398060B - Laser processing controlling device and laser processing device - Google Patents

Description

Laser processing control device and laser processing device

The present invention relates to a laser processing control apparatus and a laser processing apparatus for controlling injection of laser pulse light for laser processing.

The short pulse wave laser processing apparatus irradiates laser light of a width of, for example, 1 microsecond to 100 microseconds, to a workpiece such as a printed circuit board by a pulse wave, whereby a diameter can be formed on the printed substrate. A working machine for through holes of several tens of μm to several hundreds of μm.

In such a laser processing apparatus, when the total value of the energy (intensity) of the laser light irradiated to one processing hole deviates from a predetermined value, the quality of the hole formed in the printed circuit board is deteriorated. For example, when the total value of the energy of the laser light deviates from the predetermined value, there is a problem that the formed aperture has an abnormality, an un-opened hole, a laser light-through hole, and a residual machining chip. Therefore, in the conventional laser processing apparatus, a part of the laser light emitted by the laser oscillator is taken out, and the extracted laser light is converted into an electrical quantity and integrated by an integrating circuit, and the irradiation is calculated according to the integrated value. The energy of the laser light of the hole. Next, when the total value of the calculated energy is different from the predetermined value set in advance, the number of pulses of the laser processing or the additional transmission is stopped.

Further, in the laser processing apparatus described in the following Patent Document 1, in order to accurately calculate the energy of the laser light irradiated onto the printed circuit board, the energy of the laser light irradiated onto the printed circuit board is calculated for each of the laser pulse wave lights. Next, the integrating circuit is reset at a timing synchronized with the oscillation frequency of the laser pulse light, and the pulse wave energy of each laser pulse light is measured.

Patent Document 1: Japanese Patent Laid-Open No. Hei 11-261146

However, in the above-described conventional technique, the sensor for laser power measurement cannot be corrected even if the integration circuit is reset. Therefore, there is a problem that the laser power measuring sensor cannot measure the correct laser power when a temperature drift occurs with the laser light for the laser power measuring sensor.

The present invention has been made in view of the above problems, and an object of the invention is to provide a laser processing control device and a laser processing device capable of accurately measuring laser power of laser light and emitting laser light with correct energy.

In order to achieve the above object, the present invention is directed to a laser processing control device for controlling the emission of laser pulse light from a laser oscillator to a workpiece to be processed by a laser beam, and is characterized in that: The radiation power measuring unit measures the laser power of the laser pulse wave; the offset calculating unit calculates the output value of the laser power measuring unit based on the timing at which the laser pulse light is not emitted. The offset amount of the laser power measured by the laser power measuring unit; the offset output unit outputs the offset calculated by the offset calculating unit to the laser power measuring unit and the energy calculating unit; And a control unit that calculates a total value of energy of the laser pulse light that is irradiated to the workpiece at each of the laser irradiation positions, based on the laser power measured by the aforementioned laser power measurement unit using the offset amount; and a control unit, The emission control of the laser pulse light emitted from the laser oscillator is performed based on the total value calculated by the energy calculation unit.

According to the present invention, since the offset amount of the laser power is calculated based on the output value of the laser power at which the laser pulse light is not emitted, the laser light that can accurately measure the laser power of the laser light and emit the correct energy is obtained. The effect.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a laser processing control device and a laser processing device according to the present invention will be described in detail with reference to the accompanying drawings. Further, the following embodiments are not intended to limit the invention.

Embodiment 1

Fig. 1 is a schematic block diagram showing a laser processing apparatus according to a first embodiment of the present invention. The laser processing apparatus 101 is a device that performs laser beam irradiation on a workpiece such as a printed circuit board to perform processing such as drilling of a workpiece, and is controlled by the laser processing control device 10.

The laser processing apparatus 101 has a laser oscillator 1, a mirror 4, an fθ lens 5, a galvano scanner 6X, 6Y, a galvano mirror 61X, a 61Y, an XY table 8, and a partial mirror ( The partial transmission mirror 31, the integrated signal calculation device 20 to be described later, and the laser processing control device 10. The laser oscillator 1 emits laser pulse light (laser light 2) having a width of, for example, 1 μsec to 100 μsec, at a oscillation frequency of, for example, 100 Hz to 10000 Hz, and is incident on the mirror 4 via the partial mirror 31. A portion of the laser light 2 emitted from the laser oscillator 1 is transmitted to the integrated signal computing device 20 by the partial mirror 31. The integral signal calculation device 20 is connected to the laser machining control device 10, and the laser machining control device 10 is connected to the laser oscillator 1. The integration signal a3 to be described later is transmitted from the integral signal calculation device 20 to the laser machining control device 10, and the integration command b3 and the offset voltage b1, which will be described later, are transmitted from the laser machining control device 10 to the integral signal calculation device 20. Further, an oscillation command b2 to be described later is transmitted from the laser machining control device 10 to the laser oscillator 1.

The mirror 4 reflects and directs the laser light 2 to the light path. The laser light 2 is reflected by a plurality of mirrors 4 and guided to current mirrors 61X, 61Y. The current mirrors 61X, 61Y reflect and guide the laser light 2 to the fθ lens 5. The fθ lens 5 condenses the laser light 2 onto the workpiece 7 on the XY table 8.

The current scanners 6X, 6Y are laser motors that scan the laser light 2, for example, in a range of 50 mm square, and shake the laser light 2 with current mirrors 61X, 61Y, thereby positioning the irradiation position of the laser light 2 at a high speed to the workpiece. 7 hole position.

The current scanner 6X moves the irradiation position of the laser light in the X direction with respect to the workpiece 7, and the current scanner 6Y moves the irradiation position of the laser light in the Y direction with respect to the workpiece 7. The XY table 8 mounts a workpiece 7 of, for example, 300 mm square, and moves the workpiece 7 in the XY direction.

The laser processing apparatus 101 repeats the movement of the XY table 8 (step toward the processing position) and the laser irradiation of the workpiece 7, thereby performing, for example, several tens of diameters on a plurality of portions of the workpiece 7. Hole processing from μm to several hundred μm. In the laser processing apparatus 101, the laser irradiation of the workpiece 7 is stopped while the XY table 8 is being moved, and after the XY table 8 reaches the desired position and the XY table 8 is stopped, the workpiece 7 is processed. Laser exposure.

In the present embodiment, the integral signal calculation device 20 measures the integral signal of the laser pulse wave light using a part of the laser light 2 emitted from the laser oscillator 1. Next, the laser processing control device 10 calculates the energy (laser power) of the laser light 2 irradiated to the workpiece 7 based on the integration signal during the period of stopping the laser irradiation of the workpiece 7. The laser processing control device 10 controls the laser oscillator 1 based on the calculated energy, and irradiates the workpiece 7 with laser light having a pulse wave number corresponding to the energy.

Further, in the laser processing apparatus 101, the laser oscillator 1, the mirror 4, the fθ lens 5, the current scanners 6X, 6Y, the current mirrors 61X, 61Y, and the optical elements other than the XY table 8 may be inserted. The light path can also be configured to omit some of them.

Here, the configuration and operation of the integrated signal calculation device (the laser power measurement unit) 20 will be described. Fig. 2 is a view showing the configuration of an integrated signal calculation device according to the first embodiment. The integral signal calculation device 20 includes an infrared sensor 22, an amplification circuit 23, and an integration circuit 24, and calculates an integration signal a3 corresponding to the laser power of the laser pulse light.

The infrared sensor 22 is a sensor that converts the light intensity of the incident laser light 2 into an electrical signal a1 (voltage or resistance value, etc.) and outputs it. The amplifying circuit 23 is a circuit that amplifies the electrical signal a1 transmitted from the infrared sensor 22, and transmits the amplified signal to the integrating circuit 24. The amplifier circuit 23 of the present embodiment is connected to the laser processing control device 10, and transmits an offset voltage b1 (a voltage value for canceling the temperature drift of the infrared sensor 22) from the laser processing control device 10. The amplifier circuit 23 adds the electrical signal a1 and the offset voltage b1, and transmits the added signal to the integrating circuit 24 as the electrical signal a2 (the corrected electrical signal).

The integrating circuit 24 is a circuit that integrates the electrical signal a2 for a predetermined time to calculate the integrated signal a3. The integral command b3 (signal specifying the integration time) is transmitted from the laser machining control device 10 to the integrating circuit 24. The integrating circuit 24 integrates the electrical signal a2 at a time corresponding to the integral command b3 to calculate an integrated signal a3 (a signal corresponding to the laser power), and transmits it to the laser processing control device 10.

The laser light 2 emitted from the laser oscillator 1 is transmitted to a partial mirror (partial transmission mirror) 31. The partial mirror 31 reflects the unpenetrated laser light 2 of the laser light 2 and transmits it to the current mirrors 61X, 61Y side. Further, the partial mirror 31 penetrates a part of the laser light 2 and transmits it to the integrated signal calculation device 20 (infrared sensor 22). The integrated signal calculation device 20 calculates the integrated signal a3 using the laser light from the partial mirror 31, and transmits the calculated integrated signal a3 to the laser processing control device 10. The laser processing control device 10 calculates the energy of the laser light 2 irradiated to the workpiece 7 based on the integration signal a3. Next, the laser processing control device 10 transmits the offset voltage b1 corresponding to the calculated energy to the amplifying circuit 23.

In this manner, the amplifying circuit 23 adds the electrical signal a1 and the offset voltage b1, and transmits the added signal to the integrating circuit 24 as the electrical signal a2. The laser processing control device 10 calculates the integrated signal a3 using the electrical signal a2, and transmits the calculated integrated signal a3 to the laser processing control device 10. Next, the laser processing control device 10 calculates the energy of the laser light 2 irradiated to the workpiece 7 based on the integral signal a3 calculated using the electrical signal a2. The laser processing control device 10 transmits the offset voltage b1 corresponding to the calculated energy to the amplifying circuit 23, and transmits an instruction (oscillation indication b2) for emitting the laser light corresponding to the calculated energy to the laser oscillation. Device 1.

Next, the configuration of the laser processing control device 10 of the first embodiment will be described. The laser processing control device 10 is, for example, a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a gate array, and the like. Composition. Fig. 3 is a functional block diagram showing the configuration of a laser processing control device according to the first embodiment. The laser processing control device 10 includes an integral signal input unit 11, an offset voltage calculation unit (offset calculation unit) 12, an offset voltage output unit (offset output unit) 13, an integral command output unit 14, and a laser. A pulse wave output instructing unit (control unit) 15 and an energy calculating unit 16.

The integral signal input unit 11 receives the integral signal a3 transmitted from the integrating circuit 24, and transmits it to the offset voltage calculating unit 12 and the energy calculating unit 16. The offset voltage calculation unit 12 multiplies the integral signal a3 by an offset coefficient k to be described later to calculate the offset voltage b1 transmitted to the amplifier circuit 23.

The offset voltage output unit 13 outputs the offset voltage b1 calculated by the offset voltage calculation unit 12 to the amplifier circuit 23. The integral command output unit 14 outputs an integral command b3 for specifying the integration time to the integrating circuit 24. The integral command output unit 14 outputs the integral command b3 for measuring the offset value to the integrating circuit 24 after the XY table 8 reaches the desired position and the XY table 8 is stopped.

The energy calculation unit 16 calculates the energy of the laser light 2 for each pulse wave based on the integration signal a3. The energy calculation unit 16 compares the total value of the energy set in advance for each machining hole (the value of the energy of each pulse wave set in each machining hole) (hereinafter referred to as the energy reference value) and the calculated actual energy. (hereinafter referred to as actual energy), and the comparison result (difference in energy) is transmitted to the laser pulse wave output instructing portion 15.

The laser pulse wave output instructing unit 15 transmits an oscillation instruction b2 for instructing the stop emission or the additional emission of the laser light to the laser oscillator 1 based on the comparison result of the energy. When the actual energy is smaller than the energy reference value, the laser pulse wave output instructing unit 15 transmits the oscillation command b2 of the laser light indicating the pulse wave number of the difference in the corresponding energy to the laser oscillator 1. On the other hand, when it is determined that the actual energy becomes greater than the energy reference value, the laser pulse wave output instructing unit 15 transmits the oscillation command b2 for stopping the emission of the laser light to the laser oscillator 1.

Next, the laser pulse wave (electrical signal a2) output from the infrared ray sensor 22 and amplified by the amplifier circuit 23 and the integral signal a3 will be described. Figure 4 is a diagram for explaining the integral signal when the temperature drift of the infrared sensor is not generated. Figure 5 is a diagram for explaining the integral signal when the infrared sensor generates a temperature drift.

In the case where the temperature drift is not generated by the infrared ray sensor 22, the undistorted laser pulse wave (electrical signal a1) is output from the infrared ray sensor 22. In this case, at the timing when the laser light is not emitted, the laser pulse a1 belonging to the reference value "0" is output from the infrared sensor 22. Next, if there is no offset voltage b1 input from the laser processing control device 10 to the amplifier circuit 23, as shown in FIG. 4, the laser pulse (electrical signal a2) having no offset is output from the amplifier circuit 23.

The integral command output unit 14 of the laser machining control device 10 first raises an integral command (an integral command for measuring the energy of the laser light) (hereinafter referred to as an integral command bx) before the pulse wave rises. Here, the integral command bx is the same integral command as the integral command b3, and the integral command b3 is an integral command for measuring the offset value. In contrast, the integral command bx is an integral command for measuring energy. The integral command output unit 14 is a signal that drops the integral command bx after the pulse wave falls. The integral command bx is transmitted from the integral command output unit 14 to the integrating circuit 24. The integrating circuit 24 integrates the laser pulse light only during the period in which the integral command bx rises (calculates the area of the electrical signal a2). Thereby, the integration circuit 24 obtains the normal integral signal a3 (energy) as an integration result.

On the other hand, in the case where the infrared sensor 22 generates a temperature drift, the laser pulse a1 having the offset is output from the infrared sensor 22. In this case, even at the timing when the laser light is not emitted, the laser sensor 22 outputs a laser pulse a1 smaller than the reference value "0" or a laser pulse a1 larger than "0". Next, when the laser processing control device 10 does not input the offset voltage b1 to the amplifier circuit 23, as shown in FIG. 5, the laser pulse having the offset of "+" is output from the amplifier circuit 23 or has "- Offset laser pulse. Therefore, the integrating circuit 24 obtains the integrated signal a3 shifted to the positive side or the integrated signal a3 shifted to the negative side as the integration result.

When the energy of the laser light irradiated to the workpiece 7 is calculated using the integral signal a3 shifted from the normal value to the positive side or the negative side, the actual energy cannot be correctly calculated. Therefore, in the present embodiment, the laser processing control device 10 inputs the offset voltage b1 corresponding to the integration signal a3 to the amplification circuit 23. Accordingly, in the case where the offset pulse b1 is input to the amplifier circuit 23 and the laser pulse having the offset of "+" or "-" is output from the amplifier circuit 23, the output of the amplifier circuit 23 can be output unbiased. Shifted laser pulse.

Next, the calculation processing procedure of the offset voltage b1 will be described. Fig. 6 is a flow chart showing the processing sequence of the offset voltage calculation. Fig. 7 is a diagram for explaining the calculation processing sequence of the offset voltage.

When the laser processing is started, the laser processing apparatus 101 moves the XY table 8 to move the workpiece 7 to the processing position (the laser irradiation position) of the workpiece 7. Thereafter, the current scanners 6X, 6Y and the current mirrors 61X, 61Y are operated to adjust the processing position of the workpiece 7. Next, the laser light 2 is emitted from the laser oscillator 1. The laser light 2 emitted from the laser oscillator 1 is only partially transmitted through the partial mirror 31 to the infrared sensor 22.

The infrared sensor 22 converts the light intensity of the laser light 2 into an electrical signal a1 and transmits it to the amplification circuit 23. The amplifying circuit 23 transmits the electrical signal a2 (laser pulse wave) of the amplified electrical signal a1 to the integrating circuit 24.

Further, when the laser processing is started, the integral command output unit 14 confirms whether or not the laser light is emitted to the workpiece 7 (whether or not it is being processed) (step S110). Specifically, it is determined whether or not the operation of the current scanners 6X, 6Y is stopped and the laser light is emitted to the workpiece (timing).

When the laser light is emitted to the workpiece 7 (Yes in step S110), the integral command output unit 14 does not output the integral command b3, and the processing ends. When the laser beam is not emitted to the workpiece 7 (step S110, No), the integral command output unit 14 outputs an integral command b3 of, for example, 100 μsec to the integrating circuit 24. The integrating circuit 24 integrates each of the laser pulse waves (electrical signal a2) and calculates the integral signal a3 only during the period in which the integral command b3 rises (step S120). Next, the integration circuit 24 transmits the integration signal a3 to the laser processing control device 10. The integral signal a3 is transmitted to the offset voltage calculating unit 12 and the energy calculating unit 16 via the integral signal input unit 11.

The offset voltage calculation unit 12 converts the integral signal a3 into an integrated voltage d. The integral voltage d here corresponds to the voltage of the integrated signal a3 and is the peak value of the integrated signal a3. Next, the offset voltage calculation unit 12 determines whether or not the integrated voltage d is within the set range. Specifically, the offset voltage calculation unit 12 determines whether or not the |integrated voltage d|≦ is qualified (step S130). The pass limit value here is a value set in advance according to the processing quality of the laser processing, and the value of the laser processing of the acceptable quality is performed when the integral voltage d|≦ is qualified. The pass threshold is, for example, a range of ±10% of the integrated voltage calculated when the laser oscillator 1 emits laser light.

In the case of the |integrated voltage d|≦ qualified threshold (Yes in step S130), the offset voltage calculating unit 12 does not calculate the offset voltage b1, and ends the process. In the case where the integral voltage d| is not the ≦ Qualified threshold (step S130, No), the offset voltage calculation unit 12 multiplies the integral voltage d by the offset coefficient k to thereby calculate the offset voltage b1 (step S140). The offset voltage output unit 13 outputs the offset voltage b1 calculated by the offset voltage calculation unit 12 to the amplifier circuit 23 (step S150). Thereafter, the amplifying circuit 23 transmits the electrical signal a2 to which the offset voltage b1 is added to the electrical signal a1 to the integrating circuit 24.

The energy calculation unit 16 calculates the energy of the laser light 2 for each pulse wave based on the integration signal a3. Next, the energy calculating unit 16 calculates the actual energy by summing the energy of each pulse wave. The energy calculation unit 16 compares the energy reference value and the actual energy set in advance in each machining hole, and transmits the difference in energy to the laser pulse wave output instruction unit 15.

The laser pulse wave output instructing unit 15 transmits an oscillation instruction b2 for instructing the stop emission or the additional emission of the laser light to the laser oscillator 1 based on the difference in energy. When the actual energy is smaller than the energy reference value, the laser pulse wave output instructing unit 15 transmits the oscillation command b2 for additionally emitting the laser light having the pulse wave number of the difference of the energy to the laser oscillator 1. In the case where it is determined that the actual energy is greater than the energy reference value or the calculated actual energy becomes greater than the energy reference value, the laser pulse output instructing portion 15 is an oscillation indication b2 for stopping the laser light from being emitted. Transfer to the laser oscillator 1.

If the laser light is not emitted to the workpiece 7 (step S110, No), the laser processing apparatus 101 repeats the processing of steps S120 to S150 (correction operation of the electrical signal a2).

Here, the timing of performing the correcting operation of the electrical signal a2 will be described. Fig. 8 is a timing chart for explaining a correction operation for performing the pulse wave emission number. As described above, the laser processing apparatus 101 repeats the movement of the XY table 8 and the laser irradiation of the workpiece 7, thereby performing hole processing on a plurality of portions of the workpiece 7. The laser processing apparatus 101 stops the laser irradiation of the workpiece 7 while the XY table 8 is being moved. The moving time of the XY table 8 is set to, for example, 300 msec. Further, the laser irradiation of the workpiece 7 is set to, for example, 1 sec to 10 sec for each portion, and a plurality of pulse wave lights are irradiated by the laser between 1 sec and 10 sec.

The laser processing apparatus 101 of the present embodiment performs a correcting operation when laser light is not irradiated (during the movement of the XY table 8). Specifically, after the XY table 8 starts moving, the correcting operation is started after a predetermined time (for example, longer than the time required for the operation of the current scanners 6X, 6Y, for example, 60 msec).

The laser processing apparatus 101 performs the correcting operation described in Fig. 7, for example, 50 times, thereby correcting the electrical signal a2. When the time required for one correction operation (calculating one offset voltage b1) is, for example, 100 μsec, the correction operation is performed, for example, 50 times, thereby ending the correction operation for a total of 5 msec.

As described above, since the correcting operation is performed while the XY table 8 is moving, no loss time occurs in the laser processing. Further, since the correcting action is performed every time the XY table 8 moves, the correction can be performed extremely frequently.

Although the case where the correction operation is performed 50 times has been described here, the correction operation may be ended when the |integrated voltage d|≦ passes the threshold value after the predetermined number of correction operations are performed. In this case, the correcting action is stopped until the next laser irradiation is performed. Further, if the |integrated voltage d| does not become the ≦qualification threshold, the correction operation may be performed 50 times or more. In this case, the correcting operation can be performed until the |integrated voltage d|≦ is qualified, and the correcting operation can be continued only during the movement of the XY table 8. In the case where the correcting operation is continued until the |integrated voltage d|≦ is qualified, the next laser irradiation is waited until the |integrated voltage d|≦ is qualified. Next, after the |integrated voltage d|≦ qualified threshold, the next laser irradiation is started.

Further, in the present embodiment, the case where the correcting operation is performed while the XY table 8 is moving has been described, but the pulse wave is emitted and the pulse wave is emitted (the period from 1 sec to 10 sec shown in Fig. 8). Etc.) Perform a corrective action. In this case, after one pulse wave is emitted, the processing of steps S120 to S150 (correction operation) is performed at least once until the next pulse wave is emitted (between pulse wave injections). Next, after the correcting operation is performed, the next pulse wave is emitted, and the processes of steps S120 to S150 are performed at least once until the next pulse wave is emitted. In other words, the laser processing apparatus 101 sequentially performs one pulse wave emission and correction operation in sequence. Further, the laser processing apparatus 101 may perform a correcting operation for the pulse wave emission of the plurality of pulses at a ratio of one time.

When the workpiece processing unit 7 is laser-processed by the laser processing apparatus 101, a plurality of pulse wave lights are emitted. Then, the pulse wave light is continuously input to the infrared ray sensor 22. Therefore, there is a case where the correcting operation is not performed between the pulse wave emission and the pulse wave emission, and a case where the laser pulse wave (electrical signal a2) having the characteristic shown by the two-dot chain line of the ninth graph is output from the amplifier circuit 23. . On the other hand, when the correcting operation is performed between the pulse wave emission and the pulse wave emission, the laser pulse (electrical signal a2) having the characteristic shown by the solid line in FIG. 9 is output from the amplifier circuit 23.

Further, in the present embodiment, the integral signal calculation device 20 and the laser processing control device 10 are respectively corrected, but the laser processing device 10 may be configured to have the integral signal calculation device 20.

Further, in the present embodiment, the case where the offset voltage b1 is calculated using the integrated signal a3 (integrated voltage d) obtained by integrating the electrical signal a2 has been described, but the offset voltage can also be calculated using the electrical signal a2. B1. In addition, the electrical signal a2 can also be used to calculate the actual energy.

Further, in the present embodiment, the laser processing control device 10 controls the number of pulse waves of the laser light emitted from the laser oscillator 1, but the laser processing control device 10 can also control the laser oscillator 1. The energy power of the emitted laser light.

As described above, according to the first embodiment, since the correct electrical signal a2 corresponding to the offset voltage b1 is output from the amplifier circuit 23, the laser power of the laser light irradiated to the workpiece 7 can be accurately measured.

Further, since the correcting operation of the electrical signal a2 is performed while the XY table 8 is moving, the correcting operation of the electrical signal a2 does not delay the laser processing. Further, since the correcting operation of the electrical signal a2 is performed every time the XY table 8 moves, the correction of the electrical signal a2 can be performed extremely frequently. Further, since the correcting operation of the electrical signal a2 is performed every time the pulse wave of the laser light 2 is emitted, the correct electrical signal a2 can be corrected.

Embodiment 2

Next, a second embodiment of the present invention will be described with reference to Figs. 10 to 12 . In the second embodiment, the laser processing control device 10 corrects the integral signal a3 into a correct integrated signal (integrated signal in consideration of temperature drift) by software calculation, and uses the corrected integral signal (integrated signal to be described later). A4) Calculate the actual energy of the laser pulsed light.

Fig. 10 is a view showing the configuration of an integrated signal measuring apparatus according to a second embodiment. The constituent elements of the same functions as those of the integral signal computing device 20 of the first embodiment shown in FIG. 2 are denoted by the same reference numerals as those of the second embodiment, and the overlapping description will be omitted.

The integral signal calculation device 20 includes an infrared sensor 22 and an integration circuit 24. The integrating circuit 24 of the present embodiment is connected to the infrared sensor 22, and integrates the electrical signal a1 output from the infrared sensor 22 for a predetermined time (integration command b3) to calculate the integral signal a3. The integrating circuit 24 transmits the electrical signal a1 integrated with the time corresponding to the integral command b3 to the laser machining control device 10 as the integral signal a3.

Next, the configuration of the laser processing control device 10 of the second embodiment will be described. Fig. 11 is a functional block diagram showing the configuration of a laser processing control device according to a second embodiment. In the respective components of the eleventh embodiment, the same components as those of the laser processing control device 10 of the first embodiment shown in FIG. 3 are denoted by the same reference numerals, and the description thereof will not be repeated.

The laser processing control device 10 includes an integral signal input unit 11, an integral command output unit 14, a laser pulse output instruction unit 15, an energy calculation unit 16, an offset storage unit 17, an integral voltage calculation unit 18, and an offset. The amount calculation unit 19.

The offset amount calculation unit 19 of the present embodiment converts the integral signal a3 into the integrated voltage d, and calculates the offset amount c based on the integrated voltage d. Here, the offset amount c is a correction value for correcting the amount of deviation (offset) of the integral signal a3 due to the temperature drift of the infrared sensor 22. The offset c is used to correct the next integration signal a3 input from the integration circuit 24.

The deviation amount storage unit 17 is the latest offset amount c calculated by the memory offset calculation unit 19. The integrated voltage calculation unit 18 corrects the next integration signal a3 input from the integration circuit 24 using the latest offset c stored by the offset storage unit 17. The integrated voltage calculation unit 18 transmits the integrated signal corrected using the offset c to the energy calculation unit 16 as an integral signal a4 (not shown). The energy calculation unit 16 calculates the energy of the laser light 2 for each pulse wave based on the integration signal a4.

Next, the calculation processing procedure of the integration signal a4 will be described. Fig. 12 is a flow chart showing the calculation processing sequence of the integrated signal. In addition, in the processing procedure shown in FIG. 12, the description of the processing procedure similar to the processing procedure performed by the laser processing apparatus 101 of the first embodiment described in FIG. 6 will be omitted.

When the laser processing is started, the laser processing apparatus 101 emits the laser light 2 from the laser oscillator 1. The laser light 2 emitted from the laser oscillator 1 is only partially transmitted through the partial mirror 31 to the infrared sensor 22. The infrared sensor 22 converts the light intensity of the laser light 2 into an electrical signal a1 (laser pulse wave) and transmits it to the integrating circuit 24.

Further, when the laser processing is started, the integral command output unit 14 confirms whether or not the laser light is emitted to the workpiece 7 (step S210). When the laser light is emitted to the workpiece 7 (Yes in step S210), the integral command output unit 14 does not output the integral command b3, and the processing ends. When the laser light is not emitted to the workpiece 7 (step S210, No), the integral command output unit 14 outputs an integral command b3 of, for example, 100 μsec to the integrating circuit 24. The integrating circuit 24 integrates each of the laser pulse waves (electrical signal a1) to calculate the integral signal a3 only during the rising of the integral command b3 (step S220). Next, the integration circuit 24 transmits the integration signal a3 to the laser processing control device 10. The integral signal a3 is transmitted to the offset amount calculation unit 19 and the integral voltage calculation unit 18 via the integral signal input unit 11.

The offset calculation unit 19 converts the integral signal a3 into an integrated voltage d. The offset calculation unit 19 determines whether or not the integrated voltage d is within the set range. Specifically, the offset calculation unit 19 determines whether or not the |tegral voltage d| is within the compliance threshold (step S230).

When the integral voltage d|≦ is qualified (step S230, Yes), the offset calculation unit 19 does not calculate the offset c, and ends the processing. When the integral voltage d| is not the ≦ Qualified threshold (No at step S230), the offset calculation unit 19 calculates the offset c based on the integrated voltage d.

The offset calculation unit 19 sets, for example, the magnitude of the integrated voltage d as the magnitude of the offset c (integrated voltage d=offset c). At this time, the sign of the integrated voltage d and the sign of the offset c are inverted (the integrated voltage d × (-1) is taken as the offset c). The offset amount storage unit 17 stores the offset amount c calculated by the offset amount calculation unit 19 (step S240).

Thereafter, if the laser light is not emitted to the workpiece 7, the integral command output unit 14 outputs the integral command b3 to the integrating circuit 24, and the integrating circuit 24 calculates the integral signal a3 and transmits it to the laser machining control device 10.

The integral signal a3 is transmitted to the offset amount calculation unit 19 and the integral voltage calculation unit 18 via the integral signal input unit 11. The integrated voltage calculation unit 18 adds the latest offset amount c stored in the offset storage unit 17 to the integration signal a3, and calculates the corrected integration signal a4 (corrected due to the temperature drift of the infrared sensor 22) The integral signal a4) of the deviation amounts of the integrated signals a1, a3 (step S250).

Next, the integrated voltage calculation unit 18 transmits the calculated integrated voltage d to the energy calculation unit 16. The energy calculating unit 16 calculates the energy of the laser light 2 for each pulse wave based on the integrated voltage d. Hereinafter, the laser processing control device 10 controls the laser oscillator 1 by the same processing as that of the first embodiment.

Further, the offset amount calculation unit 19 converts the integral signal a3 into the integrated voltage d. Next, if the |integrated voltage d| is not the ≦qualification threshold, the offset calculating unit 19 calculates a new offset c based on the integrated voltage d. The offset amount storage unit 17 is a new offset amount c calculated by the memory offset amount calculation unit 19.

Thereafter, the laser processing apparatus 101 repeats the processing of steps S210 to S250. Specifically, when the laser light is not emitted to the workpiece 7, the integral command output unit 14 outputs an integral command b3 corresponding to the n-th (n is a natural number) pulse wave to the integrating circuit 24, and the integrating circuit 24 is The integrated signal a3 of the pulse wave light of the nth pulse wave is calculated and transmitted to the laser processing control device 10.

The offset calculation unit 19 converts the integrated signal a3 of the pulse wave light of the nth pulse into the integrated voltage d. The integrated voltage calculation unit 18 extracts the offset c (the latest offset electrical signal) calculated when the pulse wave light of the (n-1)th pulse wave is irradiated from the offset amount storage unit 17. The integrated voltage calculation unit 18 calculates the integrated signal a4 of the pulse wave light of the nth pulse wave by adding the extracted offset amount c to the integral signal a3.

Further, the timing of calculating the integral signal a4 is set to the same timing as the timing of the correcting operation of the electrical signal a2 described in the first embodiment. That is, the integral signal a4 can be calculated during the movement of the XY table 8, and the integral signal a4 can also be calculated during each pulse wave exit of the laser light 2.

As described above, according to the second embodiment, the n-th pulse is calculated by adding the offset c calculated when the pulse light of the (n-1)th pulse wave is irradiated to the integrated signal a3 of the pulse light of the n-th pulse. The integrated signal a4 of the pulse wave light can accurately measure the laser power of the laser light irradiated to the workpiece 7.

(industrial availability)

As described above, the laser processing control device and the laser processing device of the present invention are applied to the emission control of laser pulse light used in laser processing.

1. . . Laser oscillator

2. . . laser

4. . . mirror

5. . . Fθ lens

6X, 6Y. . . Current scanner 7 processed object

8. . . XY table

10. . . Laser processing control device

11. . . Integral signal input unit

12. . . Offset voltage calculation unit

13. . . Offset voltage output

14. . . Integral instruction output

15. . . Laser pulse output indication

16. . . Energy calculation department

17. . . Offset memory

18. . . Integral voltage calculation unit

19. . . Offset calculation unit

20. . . Integral signal computing device

twenty two. . . Infrared sensor

twenty three. . . amplifying circuit

twenty four. . . Integral circuit

31. . . Partial mirror

61X, 61Y. . . Current mirror

101. . . Laser processing device

A1, a2. . . Electrical signal

A3. . . Integral signal

B1. . . Offset voltage

B2. . . Oscillation indication

B3. . . Integral instruction

Fig. 1 is a schematic block diagram showing a laser processing apparatus according to a first embodiment of the present invention.

Fig. 2 is a view showing the configuration of an integrated signal calculation device according to the first embodiment.

Fig. 3 is a functional block diagram showing the configuration of a laser processing control device according to the first embodiment.

Figure 4 is a diagram for explaining the integral signal when the temperature drift of the infrared sensor is not generated.

Figure 5 is a diagram for explaining the integral signal when the infrared sensor generates a temperature drift.

Fig. 6 is a flow chart showing the processing sequence of the offset voltage calculation.

Fig. 7 is a diagram for explaining the calculation processing sequence of the offset voltage.

Fig. 8 is a view for explaining the timing of the correction operation for performing the pulse wave emission number.

Fig. 9 is a view for explaining a laser pulse wave when a correction operation is performed between pulse wave emission and pulse wave emission.

Fig. 10 is a view showing the configuration of an integrated signal measuring apparatus according to a second embodiment.

Fig. 11 is a functional block diagram showing the configuration of a laser processing control device according to a second embodiment.

Fig. 12 is a flow chart showing the calculation processing sequence of the integrated signal.

10. . . Laser processing control device

11. . . Integral signal input unit

12. . . Offset voltage calculation unit

13. . . Offset voltage output

14. . . Integral instruction output

15. . . Laser pulse output indication

16. . . Energy calculation department

A3. . . Integral signal

B1. . . Offset voltage

B2. . . Oscillation indication

B3. . . Integral instruction

Claims (6)

A laser processing control device for controlling laser beam light emitted from a laser oscillator to a workpiece to be processed by a laser processing apparatus, the laser processing control device comprising: a laser power measuring unit for measuring The laser power of the laser pulse light; the offset calculation unit calculates the measurement by the laser power measurement unit based on an output value output by the laser power measurement unit at a timing when the laser pulse light is not emitted. The offset power output unit outputs the offset amount calculated by the offset amount calculation unit to the laser power measurement unit, and the energy calculation unit measures the laser power according to the foregoing Using the laser power measured by the offset, calculating a total value of the energy of the laser pulse light irradiated to the workpiece for each laser irradiation position; and the control unit according to the energy calculation unit The calculated total value is used to control the emission of the laser pulse light emitted from the laser oscillator. A laser processing control device for controlling laser beam light emitted from a laser oscillator to a workpiece to be processed by a laser processing apparatus, the laser processing control device comprising: a laser power measuring unit for measuring The laser power of the laser pulse light; the offset calculation unit calculates the measurement by the laser power measurement unit based on an output value output by the laser power measurement unit at a timing when the laser pulse light is not emitted. The energy calculation unit calculates the laser power measured by the laser power measurement unit and the offset calculated by the offset calculation unit, and calculates the position of each laser irradiation position. a total value of the energy of the laser pulse light that is irradiated onto the workpiece; and the control unit performs the emission of the laser pulse light emitted by the laser oscillator based on the total value calculated by the energy calculation unit control. The laser processing control device according to the first or second aspect of the invention, wherein the offset calculating unit calculates the offset of the laser power while the workpiece is moved to a predetermined machining position. the amount. The laser processing control device according to the first or second aspect of the invention, wherein the offset calculation unit calculates the offset amount of the laser power during a pulse wave emission period of the laser pulse light. A laser processing apparatus for controlling laser emission of a laser beam irradiated from a laser oscillator to a workpiece to perform laser processing of the workpiece, the laser processing apparatus comprising: a laser oscillator; And emitting the laser pulse light; and the laser processing control device performs the emission control of the laser pulse wave; the laser processing control device includes: a laser power measuring unit that measures the laser pulse light a laser power; an offset calculating unit that calculates a bias of a laser power measured by the laser power measuring unit based on an output value output by the laser power measuring unit at a timing at which the laser pulse light is not emitted. The shift amount output unit outputs the shift amount calculated by the offset amount calculating unit to the laser power measuring unit, and the energy calculating unit uses the offset amount according to the laser power measuring unit. The measured laser power, the total value of the energy of the laser pulse light irradiated to the workpiece is calculated for each laser irradiation position; and the control unit is based on the energy calculation unit The calculated total value for the laser emitted from the laser oscillator pulse waves emitted control. A laser processing apparatus for controlling laser emission of a laser beam irradiated from a laser oscillator to a workpiece to perform laser processing of the workpiece, the laser processing apparatus comprising: a laser oscillator; And emitting the laser pulse light; and the laser processing control device performs the emission control of the laser pulse wave; the laser processing control device includes: a laser power measuring unit that measures the laser pulse light a laser power; an offset calculating unit that calculates a bias of a laser power measured by the laser power measuring unit based on an output value output by the laser power measuring unit at a timing at which the laser pulse light is not emitted. The energy calculation unit calculates the irradiation to the aforementioned processing for each laser irradiation position based on the laser power measured by the laser power measuring unit and the offset amount calculated by the offset amount calculating unit. And a total value of the energy of the laser pulse light of the object; and the control unit performs the laser pulse light emitted by the laser oscillator based on the total value calculated by the energy calculation unit Emission control.