KR101035199B1 - Laser processing controlling apparatus and laser processing apparatus - Google Patents

Abstract

The laser processing control apparatus which controls the output of a laser pulsed light is obtained.

A laser power measuring unit measuring laser power of laser pulsed light; An offset voltage calculator 12 that calculates an offset amount of laser power measured by the laser power measurement unit based on an output value outputted by the laser power measurement unit at a timing when the laser pulse light is not emitted; An offset voltage output unit 13 outputting the offset amount calculated by the offset voltage calculator 12 to the laser power measurement unit; An energy amount calculating unit 16 for calculating, for each laser irradiation position, the total value of the amount of energy of the laser pulsed light irradiated to the workpiece based on the laser power measured by the laser power measuring unit using the offset amount; On the basis of the total value calculated by the energy amount calculating unit 16, a laser pulse output instruction unit 15 for controlling the emission of the laser pulsed light emitted by the laser oscillator is provided.

Description

LASER PROCESSING CONTROLLING APPARATUS AND LASER PROCESSING APPARATUS}

This invention relates to the laser processing control apparatus and laser processing apparatus which control the emission of the laser pulsed light used for laser processing.

The short pulse laser processing apparatus is a through hole (hole) having a diameter of about several tens of micrometers to several hundreds of micrometers, for example, by irradiating a workpiece such as a printed circuit board with laser pulsed light having a width of 1 to 100 microseconds. ) Can be formed on a printed board.

In such a laser processing apparatus, if the total value of the amount of energy (intensity) of laser light irradiated to one processing hole deviates from the prescribed value, the quality of the hole formed on the printed board is deteriorated. For example, when the total value of the amount of energy of the laser light deviates from the prescribed value, there is a problem that an abnormality occurs in the hole diameter to be formed, the hole is not formed, the laser light penetrates the hole, or the processing waste remains. Occurs. For this reason, the conventional laser processing apparatus extracts a part of the laser light emitted from the laser oscillator, converts the extracted laser light into an electric quantity, integrates it in the integrating circuit, and integrates it into one processing hole based on this integration value. The amount of energy of the irradiated laser light was calculated. When the total value of the calculated amount of energy is different from the preset value, the number of pulses for stopping or firing laser processing is added.

Moreover, the laser processing apparatus of patent document 1 calculates the energy amount of the laser light irradiated to the printed board every step of a laser pulse light, in order to calculate the energy amount of the laser light irradiated to a printed board correctly. The integrating circuit is reset at a timing synchronized with the oscillation frequency of the laser pulsed light, and the pulse energy of each laser pulsed light is measured.

Patent Document 1: Japanese Patent Application Laid-Open No. 11-261146

However, in the above prior art, it was impossible to calibrate the sensor for measuring laser power even after resetting the integration circuit. For this reason, when temperature drift occurs in the laser power measuring sensor with the emission of the laser light, there is a problem that the laser power measuring sensor cannot measure the accurate laser power.

This invention is made | formed in view of the above, Comprising: It aims at obtaining the laser processing control apparatus and laser processing apparatus which can measure the laser power of a laser beam accurately, and can output the laser beam of an accurate energy amount.

MEANS TO SOLVE THE PROBLEM In order to solve the above-mentioned subject and achieve the objective, this invention WHEREIN: The laser processing control apparatus which emits and controls the laser pulsed light irradiated to the to-be-processed object from a laser oscillator, The laser power of the said laser pulsed light is measured. A laser power measurement unit; An offset amount calculating unit for calculating an offset amount of laser power measured by the laser power measuring unit based on an output value output by the laser power measuring unit at a timing when the laser pulse light is not emitted; An offset amount output unit configured to output the offset amount calculated by the offset amount calculation unit to the laser power measurement unit; An energy amount calculating unit that calculates, for each laser irradiation position, the total value of the energy amounts of the laser pulsed light irradiated to the workpiece based on the laser power measured by the laser power measuring unit using the offset amount; Based on the total value calculated by the energy amount calculation unit. And a control unit for controlling the emission of the laser pulsed light emitted from the laser oscillator.

According to the present invention, since the offset amount of the laser power is calculated based on the output value of the laser power at the timing at which the laser pulse light is not emitted, it is possible to accurately measure the laser power of the laser light and to emit the laser light of the correct amount of energy. It shows the effect that it becomes.

EMBODIMENT OF THE INVENTION Below, embodiment of the laser processing control apparatus and laser processing apparatus concerning this invention is described in detail based on drawing. In addition, this invention is not limited by this embodiment.

Embodiment 1.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the laser processing apparatus which concerns on Embodiment 1 of this invention. The laser processing apparatus 101 is an apparatus which performs perforation processing of a to-be-processed object, etc. by pulse-irradiating a laser beam to a to-be-processed object, such as a printed board, and is controlled by the laser processing control apparatus 10. FIG.

The laser processing apparatus 101 includes a laser oscillator 1, a mirror 4, an fθ lens 5, a galvano scanner 6X, 6Y, a galvano mirror 61X, 61Y, an XY table 8 And a partial reflecting mirror (partial transmission mirror) 31, an integrated signal calculating device 20 and a laser processing control device 10 described later. The laser oscillator 1 pulses laser pulsed light (laser light 2) having a width of, for example, 1 to 100 µsec, for example, at an oscillation frequency of 100 to 10000 Hz, and through the partial reflector 31. It enters into the mirror 4. A part of the laser light 2 emitted from the laser oscillator 1 is sent to the integrated signal calculating device 20 by a partial reflector 31. The integrated signal calculation device 20 is connected to the laser processing control device 10, and the laser processing control device 10 is connected to the laser oscillator 1. The integral signal a3 described later is sent from the integrated signal calculating device 20 to the laser processing control device 10, and the integral command b3 and offset voltage b1 described later from the laser processing control device 10 to the integrated signal calculating device 20. This is sent. Moreover, the oscillation instruction b2 mentioned later is sent from the laser processing control apparatus 10 to the laser oscillator 1.

The mirror 4 reflects the laser light 2 and guides it to the optical path. The laser light 2 is guided to the galvano mirrors 61X and 61Y by being reflected by the plurality of mirrors 4. The galvano mirrors 61X and 61Y reflect the laser light 2 and guide it to the fθ lens 5. The fθ lens 5 condenses the laser light 2 onto the workpiece 7 on the XY table 8.

The galvano scanners 6X and 6Y are servomotors that scan the laser light 2 in a range of, for example, 50 mm, and swing the laser light 2 in the galvano mirrors 61X and 61Y. By making it move, the irradiation position of the laser light 2 is positioned at the high speed in the hole position of the to-be-processed object 7.

The galvano scanner 6X moves the irradiation position of the laser light with respect to the workpiece 7 in the X direction, and the galvano scanner 6Y moves the irradiation position of the laser light with respect to the workpiece 7 in the Y direction. The XY table 8 mounts the workpiece 7 of 300 mm square, for example, and moves the workpiece 7 in the XY direction.

The laser processing apparatus 101 repeats the movement (step to a machining position) of the XY table 8, and the laser irradiation to the to-be-processed object 7, and the example is given to the several places of the to-be-processed object 7, For example, a hole with a diameter of several tens to several hundreds of micrometers is subjected. In the laser processing apparatus 101, the laser irradiation to the workpiece 7 is stopped while the XY table 8 is moved, and after the XY table 8 reaches the desired position and the XY table 8 stops, Laser irradiation to the to-be-processed object 7 is performed.

In this embodiment, the integrated signal calculating device 20 measures the integrated signal of the laser pulsed light using a part of the laser light 2 emitted from the laser oscillator 1. And the amount of energy (laser power) of the laser beam 2 irradiated to the to-be-processed object 7, based on the integral signal while the laser processing control apparatus 10 stops laser irradiation to the to-be-processed object 7, ) Is calculated. The laser processing control apparatus 10 controls the laser oscillator 1 based on the calculated energy amount, and irradiates the workpiece | work 7 with the laser light of the pulse number according to an energy amount.

Moreover, in the laser processing apparatus 101, it is other than the laser oscillator 1, the mirror 4, f (theta) lens 5, the galvano scanners 6X and 6Y, the galvano mirrors 61X and 61Y, and the XY table 8. May be inserted into an optical path, or may be configured to omit either.

Here, the configuration and operation of the integrated signal calculating device (laser power measuring unit) 20 will be described. 2 is a diagram illustrating a configuration of an integrated signal calculating device according to the first embodiment. The integrated signal calculating device 20 includes an infrared sensor 22, an amplifier circuit 23, and an integrated circuit 24, and calculates an integrated signal a3 corresponding to the laser power of the laser pulsed light.

The infrared sensor 22 is a sensor which converts the light intensity of the incident laser light 2 into an electrical signal a1 (electric amount such as voltage or resistance value) and outputs it. The amplifying circuit 23 is a circuit for amplifying the electric signal a1 sent from the infrared sensor 22 and sends the amplified signal to the integrating circuit 24. The amplification circuit 23 of this embodiment is connected with the laser processing control apparatus 10, and the offset voltage b1 (voltage value for canceling the humidity drift of the infrared sensor 22) from the laser processing control apparatus 10 is It is sent. The amplifying circuit 23 adds the electric signal a1 and the offset voltage b1, and sends the added signal to the integrating circuit 24 as the electric signal a2 (electrical signal after correction).

The integrating circuit 24 is a circuit for integrating the electrical signal a2 for a predetermined time to calculate the integrated signal a3. The integration command b3 (integration time designation signal) is sent from the laser processing control device 10 to the integration circuit 24. The integration circuit 24 integrates the electrical signal a2 at a time corresponding to the integration command b3, calculates an integration signal a3 (signal according to the laser power), and sends it to the laser processing control device 10.

The laser light 2 emitted from the laser oscillator 1 is sent to the partial reflector (partial transmission mirror) 31. The partial reflector 31 reflects the laser light 2 which does not transmit in the laser light 2 and sends it to the galvano mirrors 61X and 61Y. In addition, the partial reflector 31 transmits a part of the laser light 2 to the integrated signal calculating device 20 (infrared sensor 22). The integrated signal calculating device 20 calculates the integrated signal a3 using the laser light from the partial reflector 31 and sends the calculated integrated signal a3 to the laser processing control device 10. The laser processing control apparatus 10 calculates the amount of energy of the laser light 2 irradiated to the workpiece 7 based on the integrated signal a3. And the laser processing control apparatus 10 sends the offset voltage b1 based on the calculated energy amount to the amplifier circuit 23.

For this reason, the amplifier circuit 23 adds the electric signal a1 and the offset voltage b1, and sends the signal after addition to the integration circuit 24 as an electric signal a2. The laser processing control apparatus 10 calculates an integrated signal a3 using this electric signal a2, and sends the calculated integrated signal a3 to the laser processing control apparatus 10. FIG. And the laser processing control apparatus 10 calculates the energy amount of the laser beam 2 irradiated to the to-be-processed object 7 based on the integral signal a3 calculated using the electric signal a2. The laser processing control device 10 sends an offset voltage b1 corresponding to the calculated amount of energy to the amplifying circuit 23, and generates an instruction (oscillation instruction b2) for emitting the laser light according to the calculated amount of energy. Send to)

Next, the structure of the laser processing control apparatus 10 of Embodiment 1 is demonstrated. The laser processing control apparatus 10 is comprised by CPU, ROM, RAM, a gate array, etc., for example. 3 is a functional block diagram showing a configuration of a laser processing control device according to the first embodiment. The laser processing control device 10 includes an integrated signal input unit 11, an offset voltage calculating unit (offset amount calculating unit; 12), an offset voltage output unit (offset amount output unit; 13), an integration command output unit 14, and a laser And a pulse output indicating unit (control unit) 15 and an energy amount calculating unit 16.

The integrated signal input unit 11 inputs the integrated signal a3 sent from the integration circuit 24 and sends it to the offset voltage calculator 12 and the energy amount calculator 16. The offset voltage calculating part 12 calculates the offset voltage b1 sent to the amplifier circuit 23 by multiplying the integral signal a3 with the offset coefficient k mentioned later.

The offset voltage output unit 13 outputs the offset voltage b1 calculated by the offset voltage calculator 12 to the amplifier circuit 23. The integration command output unit 14 outputs the integration command b3 for specifying the integration time to the integration circuit 24. The integration command output unit 14 outputs the integration command b3 for measuring the offset value to the integration circuit 24 after the XY table 8 reaches the desired position and the XY table 8 stops.

The energy amount calculating unit 16 calculates the energy amount of the laser light 2 for each pulse based on the integrated signal a3. The energy amount calculator 16 calculates the total value of the amount of energy set in advance for each processing hole (the total value of the energy amount for each pulse set in each processing hole; hereafter referred to as the energy amount reference value) and the calculated actual energy. The amount (hereinafter referred to as the actual amount of energy) is compared and the comparison result (the difference in the amount of energy) is sent to the laser pulse output indicating unit 15.

The laser pulse output instruction unit 15 sends the oscillation instruction b2 to the laser oscillator 1 instructing the output of the laser light to stop or further emit based on the result of comparing the amount of energy. When the amount of actual energy is smaller than the energy amount reference value, the laser pulse output indicating unit 15 sends the oscillation instruction b2 to the laser oscillator 1 which additionally emits laser light by the number of pulses according to the difference in energy amount. The laser pulse output instruction unit 15 sends the oscillation instruction b2 to the laser oscillator 1 at which it is determined that the actual energy amount becomes larger than the energy amount reference value.

Next, the laser pulse (electric signal a2) and the integrated signal a3 output from the infrared sensor 22 and amplified by the amplifying circuit 23 will be described. 4 is a diagram illustrating an integrated signal when a temperature drift does not occur in the infrared sensor, and FIG. 5 is a diagram illustrating an integrated signal when a temperature drift occurs in the infrared sensor.

When no temperature drift occurs in the infrared sensor 22, a laser pulse (electric signal a1) without offset is output from the infrared sensor 22. In this case, the laser pulse a1 of "O" which is a reference value is output from the infrared sensor 22 at the timing which a laser light is not emitted. And if there is no input of the offset voltage b1 from the laser processing control apparatus 10 to the amplifier circuit 23, as shown in FIG. 4, the laser pulse (electric signal a2) without an offset will be output from the amplifier circuit 23 as shown in FIG. do.

The integration command output unit 14 of the laser processing control device 10 raises the signal of the integration command (integration command for measuring the amount of energy of laser light; hereafter referred to as integration command bx) before the pulse rises. The integration command bx here is an integration command of the integration command b3 and the East, while the integration command b3 is an integration command for measuring the offset value, whereas the integration command bx is an integration command for measuring the amount of energy. The integration command output section 14 lowers the signal of the integration command bx after the pulse falls. This integration command bx is sent from the integration command output unit 14 to the integration circuit 24. The integrating circuit 24 integrates the laser pulsed light (calculates the area of the electric signal a2) for the amount of time that the integration command bx is rising. For this reason, the integration circuit 24 obtains the normal integration signal a3 (amount of energy) as a result of the integration.

On the other hand, when temperature drift occurs in the infrared sensor 22, the laser pulse a1 with an offset is output from the infrared sensor 22. FIG. In this case, even when the laser light is not emitted, the laser pulse a1 smaller than the reference value "0" or the laser pulse a1 larger than "O" is output from the infrared sensor 22. And if there is no input of the offset voltage b1 from the laser processing control apparatus 10 to the amplifying circuit 23, as shown in FIG. 5, the laser pulse which has an offset of "+" from the amplifying circuit 23, or " A laser pulse with an offset of-"is output. For this reason, the integration circuit 24 obtains the integration signal a3 shifted to the plus side and the integration signal a3 shifted to the minus side as an integration result.

If the energy amount of the laser light irradiated to the workpiece 7 is calculated using the integral signal a3 shifted from the normal value to the plus side or the minus side, the actual amount of energy cannot be calculated accurately. Therefore, in the present embodiment, the laser processing control device 10 inputs the offset voltage b1 corresponding to the integrated signal a3 to the amplifier circuit 23. For this reason, when the offset voltage b1 is not input to the amplifying circuit 23, when the laser pulse with an offset of "+" or "-" is output from the amplifying circuit 23, the laser pulse without an offset is made into an amplifying circuit ( 23) it becomes possible to output.

Next, the calculation processing procedure of the offset voltage b1 is demonstrated. FIG. 6 is a flowchart showing a procedure for calculating an offset voltage, and FIG. 7 is a diagram for explaining a procedure for calculating an offset voltage.

When the laser processing is started, the laser processing apparatus 101 moves the workpiece 7 to the processing position (laser irradiation position) of the workpiece 7 by moving the XY table 8. Thereafter, the machining position of the workpiece 7 is adjusted by operating the galvano scanners 6X and 6Y and the galvano mirrors 61X and 61Y. Then, the laser light 2 is emitted from the laser oscillator 1. The laser light 2 emitted from the laser oscillator 1 is partially transmitted by the partial reflector 31 and sent to the infrared sensor 22.

The infrared sensor 22 converts the light intensity of the laser light 2 into an electrical signal a1 and sends it to the amplifying circuit 23. The amplifying circuit 23 sends an electric signal a2 (laser pulse) obtained by amplifying the electric signal a1 to the integrating circuit 24.

Moreover, when laser processing starts, the integration command output part 14 confirms whether laser light is output to the to-be-processed object 7 (whether it is processing) (step S110). Specifically, the operation of the galvano scanners 6X and 6Y is stopped to determine whether or not the laser light is emitted to the workpiece 7 (timing).

If the laser beam is emitted to the workpiece 7 (step S110, YES), the integration command output unit 14 ends the processing without outputting the integration command b3. If no laser light is emitted to the workpiece 7 (step S110, NO), the integration command output unit 14 outputs the integration circuit b3 for 100 μsec to the integration circuit 24, for example. The integrating circuit 24 integrates each laser pulse (electrical signal a2) by the time that the integrating command b3 is rising to calculate the integral signal a3 (step S120). The integrating circuit 24 then sends the integral signal a3 to the laser processing control device 10. The integrated signal a3 is sent to the offset voltage calculator 12 and the energy amount calculator 16 via the integral signal input unit 11.

합격 문턱값인지의 여부를 판단한다(단계 S130). 여기서의 합격 문턱값은 레이저 가공의 가공 품질에 기초하여 미리 설정되는 값이고, |적분 전압 d|

합격 문턱값일 때에 합격 품질의 레이저 가공을 행할 수 있는 것이다. 합격 문턱값은, 예를 들어 레이저 발진기(1)로부터 레이저 광이 출사되었을 때에 산출되는 적분 전압의 ±10%의 범위이다. The offset voltage calculator 12 converts the integrated signal a3 into an integrated voltage d. The integrated voltage d here is a voltage corresponding to the integrated signal a3, and is each peak value of the integrated signal a3. Then, the offset voltage calculator 12 determines whether the integrated voltage d is within a set range. Specifically, the offset voltage calculator 12 determines | integrated voltage d |

It is determined whether or not it is the pass threshold (step S130). The pass threshold here is a value preset based on the processing quality of laser processing, and | integrated voltage d |

When it is a pass threshold, laser processing of pass quality can be performed. The pass threshold is, for example, a range of ± 10% of the integral voltage calculated when the laser light is emitted from the laser oscillator 1.

합격 문턱값인 경우(단계 S130, 예), 오프셋 전압 산출부(12)는 오프셋 전압 b1을 산출하지 않고 처리를 종료한다. |적분 전압 d|

합격 문턱값이 아닌 경우(단계 S130, 아니오), 오프셋 전압 산출부(12)는 적분 전압 d에 오프셋 계수 k를 곱하는 것에 의해 오프셋 전압 b1을 산출한다(단계 S140). 오프셋 전압 출력부(13)는 오프셋 전압 산출부(12)가 산출한 오프셋 전압 b1을 증폭 회로(23)에 출력한다(단계 S150). 이 후, 증폭 회로(23)는 전기 신호 a1에 오프셋 전압 b1을 가산한 전기 신호 a2를 적분 회로(24)에 보낸다. | Integrated voltage d |

If it is the pass threshold (step S130, YES), the offset voltage calculator 12 ends the process without calculating the offset voltage b1. | Integrated voltage d |

If it is not the pass threshold (step S130, NO), the offset voltage calculation unit 12 calculates the offset voltage b1 by multiplying the integral voltage d by the offset coefficient k (step S140). The offset voltage output unit 13 outputs the offset voltage b1 calculated by the offset voltage calculator 12 to the amplifier circuit 23 (step S150). Thereafter, the amplifying circuit 23 sends the electric signal a2 obtained by adding the offset voltage b1 to the electric signal a1 to the integrating circuit 24.

The energy amount calculating unit 16 calculates the energy amount of the laser light 2 for each pulse based on the integrated signal a3. The energy amount calculating unit 16 calculates the actual energy amount by adding up the amount of energy for each pulse. The energy amount calculation unit 16 compares the energy amount reference value preset in each processing hole with the actual energy amount, and sends the difference of the energy amount to the laser pulse output indicating unit 15.

The laser pulse output instruction unit 15 sends the oscillation instruction b2 to the laser oscillator 1 instructing the emission stop or further emission of the laser light based on the difference in the amount of energy. When the amount of actual energy is smaller than the energy amount reference value, the laser pulse output indicating unit 15 sends the oscillation instruction b2 to the laser oscillator 1 which additionally emits laser light by the number of pulses according to the difference in energy amount. The laser pulse output instruction unit 15 sends the oscillation instruction b2 to the laser oscillator 1 when the actual energy amount is larger than the energy amount reference value or when it is determined that the actual energy amount to be calculated is larger than the energy amount reference value. .

If the laser processing apparatus 101 does not emit laser light to the to-be-processed object 7 (step S110, NO), the process of the steps S120-S160 (correction | operation of electric signal a2) is repeated.

Here, the timing for performing the corrective operation of the electric signal a2 will be described. 8 is a diagram for explaining the timing of performing a corrective operation on the number of pulse exits. As mentioned above, the laser processing apparatus 101 performs a hole process to several places of the to-be-processed object 7, by repeating the movement of the XY table 8, and laser irradiation to the to-be-processed object 7. As shown in FIG. While the laser processing apparatus 101 moves the XY table 8, the laser irradiation to the workpiece 7 is stopped. As the movement time of the XY table 8, for example, 300 msec is set. In addition, for example, 1 to 10 sec is set for each laser irradiation to the to-be-processed object 7, and a plurality of pulsed lights are laser-radiated during this 1 to 10 sec.

The laser processing apparatus 101 of this embodiment performs a calibration operation | movement when the laser light is not irradiated (while the XY table 8 is moving). Specifically, after the XY table 8 starts moving, the corrective operation is performed after a predetermined time (e.g., 60 msec longer than the time required for the operation of the galvano scanners 6X and 6Y). It starts.

The laser processing apparatus 101 corrects the electric signal a2 by performing the calibration operation described with reference to FIG. 7, for example, 50 times. When the time required for one calibration operation (calculation of one offset voltage b1) is, for example, 100 µsec, the calibration operation is completed in a total time of 5 msec by performing this calibration operation, for example, 50 times.

As described above, since the calibration operation is performed while the XY table 8 is moving, the loss time does not occur in the laser processing. In addition, since the calibration operation is performed only when the XY table 8 moves, the calibration can be performed at a high frequency.

합격 문턱값이 되면, 교정 동작을 종료해도 된다. 이 경우, 다음에 레이저 조사가 행해질 때까지 교정 동작을 정지한다. 또, |적분 전압 d|

합격 문턱값이 되지 않으면, 교정 동작을 50회 이상 행해 도 된다. 이 경우, |적분 전압 d|

합격 문턱값으로 될 때까지 교정 동작을 계속해도 되며, XY 테이블(8)이 이동하고 있는 동안만 교정 동작을 계속해도 된다. |적분 전압 d|

합격 문턱값으로 될 때까지 교정 동작을 계속하는 경우, |적분 전압 d|

합격 문턱값으로 될 때까지 다음의 레이저 조사를 대기시킨다. 그리고, |적분 전압 d|

합격 문턱값으로 된 후, 다음의 레이저 조사를 개시한다. In addition, although the case where the calibration operation is performed 50 times has been described here, after the calibration operation is performed a predetermined number of times, the | integrated voltage d |

If the pass threshold is reached, the calibration operation may be terminated. In this case, the calibration operation is stopped until the next laser irradiation. In addition, | integrated voltage d |

If the pass threshold is not reached, the calibration operation may be performed 50 times or more. In this case, | the integral voltage d |

The calibration operation may be continued until the pass threshold is reached, or the calibration operation may be continued only while the XY table 8 is moving. | Integrated voltage d |

If the calibration operation is continued until the pass threshold is reached, the | integrated voltage d |

The next laser irradiation is awaited until the pass threshold is reached. And | integrated voltage d |

After becoming the pass threshold, the next laser irradiation is started.

In the present embodiment, the case where the calibration operation is performed while the XY table 8 is moving has been described, but the calibration operation may be performed between the pulse emission and the pulse emission (for example, for 1 to 10 seconds shown in FIG. 8). . In this case, after performing one pulse emission, the process (correction operation) of steps S12O-S150 is performed at least once until the next pulse emission is performed (every pulse output). Then, after performing the calibration operation, the next pulse output is performed, and the processes of steps S120 to S150 are performed at least once until the next pulse output is performed. In other words, the laser processing apparatus 101 repeatedly performs one pulse emission and a calibration operation in order. In addition, the laser processing apparatus 101 may perform a correction | amendment operation | movement at the ratio of one time of pulse emission of multiple times.

When the laser processing apparatus 101 laser-processes the to-be-processed object 7, the some pulsed light is output. The pulsed light is subsequently input to the infrared sensor 22. For this reason, when a calibration operation is not performed between pulse emission and pulse emission, the laser circuit (electric signal a2) of the characteristic shown by the dashed-dotted line of FIG. 9 may be output from the amplifier circuit 23 in some cases. On the other hand, when the calibration operation is performed between the pulse emission and the pulse emission, the amplifying circuit 23 outputs a laser pulse (electric signal a2) having a characteristic as indicated by the solid line in FIG.

In addition, in this embodiment, although the integral signal calculation apparatus 20 and the laser processing control apparatus 10 were made into another correction | amendment, the laser processing control apparatus 10 may be set as the structure which has the integral signal calculation apparatus 20. FIG.

In the present embodiment, the case where the offset voltage b1 is calculated using the integrated signal a3 (integrated voltage d) in which the electric signal a2 is integrated has been described. However, the offset voltage b1 may be calculated using the electric signal a2. In addition, the actual energy amount may be calculated using the electric signal a2.

In addition, in this embodiment, the case where the laser processing control apparatus 10 controls the number of pulses of the laser beam which the laser oscillator 1 emits was demonstrated, The laser processing control apparatus 10 outputs the laser oscillator 1 and exits. You may control the energy power of the laser beam.

Thus, according to Embodiment 1, since the accurate electric signal a2 according to the offset voltage b1 is output from the amplifier circuit 23, it becomes possible to measure the laser power of the laser beam irradiated to the to-be-processed object 7 accurately.

In addition, since the correction operation of the electrical signal a2 is performed while the XY table 8 is moving, the correction operation of the electrical signal a2 does not delay the laser machining process. Moreover, since the correction | amendment operation of the electric signal a2 is performed every time the XY table 8 moves, it becomes possible to correct the electric signal a2 with a high frequency. In addition, since the corrective operation of the electric signal a2 is performed during the pulse emission of the laser light 2, it is possible to correct the corrected electric signal a2.

Embodiment 2.

Next, Embodiment 2 of this invention is described with reference to FIGS. 10-12. In Embodiment 2, the laser processing control apparatus 10 correct | amends the integral signal a3 to the correct integral signal (integration signal which considered temperature drift) by calculation on software, and uses the corrected integral signal (integration signal a4 mentioned later). The actual energy amount of the laser pulsed light is calculated.

10 is a diagram illustrating a configuration of an integrated signal measuring apparatus according to the second embodiment. In each component of FIG. 10, the same code | symbol is attached | subjected about the component which achieves the same function as the integrated signal calculation apparatus 20 of Embodiment 1 shown in FIG. 2, and the overlapping description is abbreviate | omitted.

The integrated signal calculation device 20 includes an infrared sensor 22 and an integrated circuit 24. The integrating circuit 24 of this embodiment is connected to the infrared sensor 22, and integrates the electrical signal a1 output from the infrared sensor 22 for a predetermined time (integration command b3) to calculate the integral signal a3. The integration circuit 24 sends the electric signal a1 integrated at the time corresponding to the integration command b3 to the laser processing control device 10 as the integration signal a3.

Next, the structure of the laser processing control apparatus 10 of Embodiment 2 is demonstrated. 11 is a functional block diagram showing the configuration of the laser processing control device according to the second embodiment. Among the components of FIG. 11, the same components as those of the laser processing control device 10 of the first embodiment shown in FIG. 3 achieve the same functions, and the same description is omitted.

The laser processing control device 10 includes an integral signal input unit 11, an integral command output unit 14, a laser pulse output instruction unit 15, an energy amount calculation unit 16, an offset amount storage unit 17, and an integral voltage calculation. The unit 18 has an offset amount calculation unit 19.

The offset amount calculation unit 19 of the present embodiment converts the integrated signal a3 into an integrated voltage d and calculates an offset amount c based on the integrated voltage d. The offset amount c herein is a correction value for correcting the amount of deviation (offset) of the integrated signal a3 due to the temperature drift of the infrared sensor 22. The offset amount c is used to correct the integrated signal a3 input from the integration circuit 24 next.

The offset amount storage unit 17 stores the latest offset amount c calculated by the offset amount calculation unit 19. The integrated voltage calculation unit 18 corrects the integrated signal a3 input from the integration circuit 24 next using the latest offset amount c stored in the offset amount storage unit 17. The integrated voltage calculator 18 sends the integrated signal corrected using the offset amount c to the energy amount calculator 16 as an integrated signal a4 (not shown). The energy amount calculation unit 16 calculates the energy amount of the laser light 2 for each pulse based on the integrated signal a4.

Next, the calculation processing procedure of integrated signal a4 is demonstrated. 12 is a flowchart showing a procedure for calculating an integrated signal. 12, the description is abbreviate | omitted about the processing sequence and the oriental processing sequence which the laser processing apparatus 101 of Embodiment 1 demonstrated in FIG. 6 performs.

When the laser processing apparatus 101 starts laser processing, the laser processing apparatus 101 emits the laser light 2 from the laser oscillator 1. The laser light 2 emitted from the laser oscillator 1 is partially transmitted by the partial reflector 31 and sent to the infrared sensor 22. The infrared sensor 22 converts the light intensity of the laser light 2 into an electrical signal a1 (laser pulse) and sends it to the integrating circuit 24.

Moreover, when laser processing is started, the integration command output part 14 confirms whether laser light is output to the to-be-processed object 7 (step S210). If laser light is emitted to the workpiece 7 (step S210, YES), the integration command output unit 14 ends the processing without outputting the integration command b3. If no laser light is emitted to the workpiece 7 (step S210, NO), the integration command output unit 14 outputs the integration command b3 for 100 μsec to the integration circuit 24, for example. The integrating circuit 24 integrates each laser pulse (electrical signal a1) by the time for which the integrating command b3 is rising to calculate the integral signal a3 (step S220). The integrating circuit 24 then sends the integral signal a3 to the laser processing control device 10. The integrated signal a3 is sent to the offset amount calculation unit 19 and the integrated voltage calculation unit 18 via the integration signal input unit 11.

합격 문턱값인지의 여부를 판단한다(단계 S23O). The offset amount calculation unit 19 converts the integrated signal a3 into the integrated voltage d. Specifically, the offset amount calculation unit 19 determines whether or not the integral voltage d is within a setting range. The offset amount calculation unit 19 determines the | integrated voltage d |

It is determined whether or not it is the pass threshold (step S23O).

합격 문턱값인 경우(단계 S23O, 예), 오프셋량 산출부(19)는 오프셋량 c를 산출하지 않고 처리를 종료한다. |적분 전압 d|

합격 문턱값이 아닌 경우(단계 S230, 아니오), 오프셋량 산출부(19)는 적분 전압 d에 기초하여 오프셋량 c를 산출한다. | Integrated voltage d |

If it is the pass threshold (step S23O, YES), the offset amount calculation unit 19 ends the process without calculating the offset amount c. | Integrated voltage d |

If it is not the pass threshold (step S230, NO), the offset amount calculation unit 19 calculates the offset amount c based on the integrated voltage d.

The offset amount calculation unit 19 sets, for example, the magnitude of the integrated voltage d as the magnitude of the offset amount c (integrated voltage d = offset amount c). At this time, the sign of the integral voltage d and the sign of the offset amount c are inverted (integrated voltage d × (-1) is used as the offset amount c). The offset amount storage unit 17 stores the offset amount c calculated by the offset amount calculation unit 19 (step S240).

After that, if no laser light is emitted to the workpiece 7, the integral command output section 14 outputs the integration command b3 to the integration circuit 24, and the integration circuit 24 calculates the integral signal a3. It sends to the laser processing control apparatus 10. FIG.

The integrated signal a3 is sent to the offset amount calculation unit 19 and the integrated voltage calculation unit 18 via the integration signal input unit 11. The integral voltage calculation unit 18 adds and corrects the latest offset amount c stored in the offset amount storage unit 17 to the integral signal a3, thereby integrating the integrated signal a4 (integration due to the temperature graft of the infrared sensor 22). The integrated signal a4) having corrected the deviation amounts of the signals a1 and a3 is calculated (step S250).

The integrated voltage calculating unit 18 then sends the calculated integrated voltage d to the energy amount calculating unit 16. The energy amount calculating unit 16 calculates the energy amount of the laser light 2 for each pulse based on the integrated voltage d. Hereinafter, the laser processing control apparatus 10 controls the laser oscillator 1 by Embodiment 1 and the oriental process.

합격 문턱값이 아니면, 적분 전압 d에 기초하여 새로운 오프셋량 c를 산출한다. 오프셋량 기억부(17)는 오프셋량 산출부(19)가 산출한 새로운 오프셋량 c를 기억해 둔다. In addition, the offset amount calculation unit 19 converts the integrated signal a3 into the integrated voltage d. Then, the offset amount calculation unit 19 | integrates the voltage d |

If it is not a pass threshold, a new offset amount c is calculated based on the integral voltage d. The offset amount storage unit 17 stores the new offset amount c calculated by the offset amount calculation unit 19.

After that, the laser processing apparatus 101 repeats the processing of steps S210 to S250. Specifically, if no laser light is emitted to the workpiece 7, the integral command output section 14 outputs the integral command b3 corresponding to the pulsed light of the n (n is a natural number) pulse to the integrating circuit 24. Then, the integrating circuit 24 calculates the integral signal a3 of the n-th pulse pulse and sends it to the laser processing control device 10.

The offset amount calculation unit 19 converts the integrated signal a3 of the n pulse pulse pulse into the integrated voltage d. The integrated voltage calculation unit 18 then extracts from the offset amount storage unit 17 the offset amount c (the latest offset electrical signal) calculated when the pulsed light of the (n-l) th pulse is irradiated. The integrated voltage calculating unit 18 calculates the integrated signal a4 of the nth pulsed pulse by adding the extracted offset amount c to the integrated signal a3.

The timing for calculating the integrated signal a4 is the same timing as the timing for performing the corrective operation of the electrical signal a2 described in the first embodiment. In other words, the integrated signal a4 may be calculated while the XY table 8 is moving, or the integrated signal a4 may be calculated for each pulse emission of the laser light 2.

As described above, according to the second embodiment, the n-pulse pulsed light is integrated by adding the offset amount c calculated when the pulsed light of the (n-1) th pulse is irradiated to the integrated signal a3 of the n-pulse pulsed light. Since the signal a4 is calculated, it is possible to accurately measure the laser power of the laser light irradiated onto the workpiece 7.

As mentioned above, the laser processing control apparatus and laser processing apparatus which concern on this invention are suitable for the emission control of the laser pulse light used for laser processing.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the laser processing apparatus which concerns on Embodiment 1 of this invention.

2 is a diagram illustrating a configuration of an integrated signal calculating device according to the first embodiment.

3 is a functional block diagram showing the configuration of the laser processing control device according to the first embodiment.

4 is a view for explaining an integrated signal when a temperature drift does not occur in the infrared sensor.

5 is a view for explaining an integrated signal when a temperature drift occurs in the infrared sensor.

6 is a flowchart showing a procedure for calculating an offset voltage.

7 is a diagram for explaining a processing procedure for calculating an offset voltage.

8 is a diagram for explaining the timing of performing a corrective operation on the number of pulse exits.

FIG. 9 is a diagram for explaining a laser pulse when a calibration operation is performed between pulse emission and pulse emission.

10 is a diagram illustrating a configuration of an integrated signal measuring device according to the second embodiment.

11 is a functional block diagram showing the configuration of the laser processing control device according to the second embodiment.

12 is a flowchart showing a procedure for calculating an integrated signal.

<Code description>

1 laser oscillator

2 laser light

4 mirrors

5 fθ lens

6X, 6Y Galvano Scanner

7 Workpiece

8 XY table

1O laser processing control device

11 Integral signal input

12 offset voltage calculator

13 offset voltage output

14 Integral command output section

15 Laser pulse output indicator

16 energy quantity calculation department

17 offset amount storage

18 integral voltage calculator

19 offset amount calculation unit

20 integral signal output device

22 infrared sensor

23 amplifier circuit

24 integral circuit

31 partial reflector

61X, 61Y Galvano Mirror

1O1 laser processing device

Claims (6)

In the laser processing control apparatus which emits and controls the laser pulsed light irradiated to the to-be-processed object from a laser oscillator, A laser power measuring unit for measuring laser power of the laser pulsed light; An offset amount calculation unit for calculating an offset amount of laser power measured by the laser power measurement unit based on an output value output by the laser power measurement unit at a timing when the laser pulse light is not emitted; An offset amount output unit for outputting the offset amount calculated by the offset amount calculation unit to the laser power measurement unit; An energy amount calculating unit for calculating, for each laser irradiation position, a total value of energy amounts of laser pulsed light irradiated to the workpiece, based on the laser power measured by the laser power measuring unit using the offset amount; And a control unit for controlling the emission control of the laser pulsed light emitted from the laser oscillator based on the total value calculated by the energy amount calculating unit. In the laser processing control apparatus which emits and controls the laser pulsed light irradiated to the to-be-processed object from a laser oscillator, A laser power measuring unit for measuring laser power of the laser pulsed light; An offset amount calculation unit for calculating an offset amount of laser power measured by the laser power measurement unit based on an output value output by the laser power measurement unit at a timing when the laser pulse light is not emitted; An energy amount calculating unit that calculates, for each laser irradiation position, the total value of the amount of energy of laser pulsed light irradiated to the workpiece based on the laser power measured by the laser power measuring unit and the offset amount calculated by the offset amount calculating unit; , And a control unit for controlling the emission control of the laser pulsed light emitted from the laser oscillator based on the total value calculated by the energy amount calculating unit. The method according to claim 1 or 2, And said offset amount calculating portion calculates an offset amount of said laser power while said workpiece is moved to a predetermined processing position. The method according to claim 1 or 2, And the offset amount calculation unit calculates an offset amount of the laser power during pulse emission of the laser pulsed light. In the laser processing apparatus which performs laser processing of the to-be-processed object by output-controlling the laser pulse light irradiated to a to-be-processed object from a laser oscillator, A laser oscillator for emitting the laser pulsed light; It has a laser processing control apparatus which performs the emission control of the said laser pulse light, The laser processing control device A laser power measuring unit for measuring laser power of the laser pulsed light; An offset amount calculation unit for calculating an offset amount of laser power measured by the laser power measurement unit based on an output value output by the laser power measurement unit at a timing when the laser pulse light is not emitted; An offset amount output unit for outputting the offset amount calculated by the offset amount calculation unit to the laser power measurement unit; An energy amount calculating unit for calculating, for each laser irradiation position, a total value of energy amounts of laser pulsed light irradiated to the workpiece, based on the laser power measured by the laser power measuring unit using the offset amount; And a control unit which performs emission control of the laser pulsed light emitted from the laser oscillator, based on the total value calculated by the energy amount calculating unit. In the laser processing apparatus which performs laser processing of the to-be-processed object by output-controlling the laser pulse light irradiated to a to-be-processed object from a laser oscillator, A laser oscillator for emitting the laser pulsed light; It has a laser processing control apparatus which performs the emission control of the said laser pulse light, The laser processing control device A laser power measuring unit for measuring laser power of the laser pulsed light; An offset amount calculation unit for calculating an offset amount of laser power measured by the laser power measurement unit based on an output value output by the laser power measurement unit at a timing when the laser pulse light is not emitted; An energy amount calculating unit that calculates, for each laser irradiation position, the total value of the amount of energy of laser pulsed light irradiated to the workpiece based on the laser power measured by the laser power measuring unit and the offset amount calculated by the offset amount calculating unit; , And a control unit which performs emission control of the laser pulsed light emitted from the laser oscillator, based on the total value calculated by the energy amount calculating unit.

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