CN102430855A - Energy time domain accumulating method for multiple laser pulse sequences - Google Patents
Energy time domain accumulating method for multiple laser pulse sequences Download PDFInfo
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- CN102430855A CN102430855A CN2011102818567A CN201110281856A CN102430855A CN 102430855 A CN102430855 A CN 102430855A CN 2011102818567 A CN2011102818567 A CN 2011102818567A CN 201110281856 A CN201110281856 A CN 201110281856A CN 102430855 A CN102430855 A CN 102430855A
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Abstract
An energy time domain accumulating method for multiple laser pulse sequences is disclosed, and belongs to the technical field of laser processing. In current variable energy submicron rapid laser processing method, energy storage capacitors in different capacities are used to supply power to a laser pump so as to obtain the laser pulses with different amplitudes and pulse widths. However, the laser output is not stable due to unstable electro-optic conversion efficiency. The current method puts high requirements on hardware and is short of flexibility. The invention is characterized by comprising the steps of: using a continuous laser to generate a plurality of laser pulse sequences with different pulse frequencies and widths but same amplitude by Q-modulation; providing larger laser processing energy by the laser pulse sequences with high pulse frequency and small pulse width; providing smaller laser processing energy by the laser pulse sequences with low pulse frequency and great pulse width; and forming a laser pulse sequence string by multiple laser pulse sequences with different pulse frequencies and widths but same amplitude, wherein the energy absorbed by the workpiece correspondingly is consistent with an energy time domain accumulating curve.
Description
Technical field
The present invention relates to a kind of many laser pulse sequence energy time domain accumulation method; Can obtain to control can accuracy of measurement high, action time laser beam accurately; Be used for the laser retrofit,, belong to technical field of laser processing like sub-micron laser weld, punching, cutting etc.
Background technology
In existing laser processing procedure, it is constant that workpiece absorbs energy E, see shown in Figure 1, at processing time domain t
1In, workpiece absorbs energy E and is always e
1For the laser retrofit, like the quick laser weld of sub-micron, punching, cutting etc., this processing mode can't be obtained gratifying effect, as in the welding process of filament, is fused into pearl or gasification phenomenon inevitably, and welding almost can't be carried out.Given this, a kind of change energy laser processing occurred in the quick technical field of laser processing of sub-micron, the corresponding energy that absorbs of workpiece changes according to energy time domain accumulation curve; And; Laser processing mode is different, like welding, punching, cutting etc., different energy time domain accumulation curve is arranged.As become the quick laser boring of energy sub-micron, and its energy time domain accumulation curve is a peak energy at the beginning, intermittence moment, the back laser energy changed ascendingly; Reaching a maximum, progressively be reduced to zero again, is again a peak energy subsequently; Accomplish processing, see shown in Figure 2.In the method, use pulse laser that processing laser is provided.The variation of Laser Processing energy realizes through Laser Power Devices.Zhang Qiue is published in one piece of article that is entitled as " system controlled by computer of Laser Power Devices waveform " of " photoelectron technology and information " Vol.1 in 2003 the 6th phase P102 and this has been done introduction.In Laser Power Devices, parallel connection is provided with the different storage capacitor of a plurality of capacity, and each storage capacitor all has an electronic switch, and these electronic switches are by a Single-chip Controlling.According to the difference of required Laser Processing energy, be the laser pumping power supply by the different storage capacitor of capacity, obtain amplitude, the pulse of pulsewidth different laser, the line of these laser pulses is identical with sub-micron Laser Processing energy time domain accumulation curve.Yet there are problems in this quick laser processing of sub-micron through continuous change laser pulse amplitude, pulsewidth acquisition different laser machining energy.At first, because electro-optical efficiency is unstable, laser output is unstable, therefore, is difficult to the accurately size of the Laser Processing energy of control output, for this meticulous Laser Processing of the quick Laser Processing of sub-micron, certainly will cause decrease in yield.Secondly, this method is very high to the requirement of hardware.Because of storage capacitor with the discharge, charging modes work, always have a bigger time difference, for the high repetition frequency Laser Processing, like 100～200Hz, this method be difficult to the reply.The 3rd, the pulse laser special plane that this method adopted is special-purpose, and to specific workpiece and processing mode, pulse laser fixed in hardware, the Laser Processing energy waveform of output are confirmed, therefore, lack flexible.
In the prior art; Q-regulating technique combines to obtain high repeat frequency pulsed laser output with continuous wave laser; Just adjust the signal of telecommunication frequency and the pulsewidth of Q driver; Through adjusting Q crystal, convert continuous laser into pulse laser with corresponding pulses frequency and pulsewidth, transfer the use of Q driver and adjusting Q crystal to eliminate the many deficiency of existing pulse laser because of using storage capacitor and pumping to bring.If adopt this high repeat frequency pulsed laser to carry out the quick Laser Processing of sub-micron; The machining energy that is provided continues constant; Be not consistent, see shown in Figure 3ly, can not be used for the quick Laser Processing of sub-micron simply with the quick Laser Processing energy of sub-micron time domain accumulation curve.But; Say as preceding text; Can be through the signal of telecommunication frequency and the pulsewidth of adjustment Q driver; Again through adjusting Q crystal, convert continuous laser the pulse laser of required pulse frequency and pulsewidth into, the signal of telecommunication frequency of Q driver and the adjustment of pulsewidth are then by controlling from Q driver bit machine that computer interface connects.
Summary of the invention
Existing in order to overcome through constantly changing the existing deficiency of the quick laser processing of sub-micron of laser pulse amplitude, pulsewidth acquisition different laser machining energy; Realize the accurate control of Laser Processing energy; Acquisition meets the Laser Processing energy output of energy time domain accumulation curve and high repetition frequency; Make that simultaneously the hardware components that is adopted is that laser instrument has adaptability widely; Promptly be fit to the Laser Processing of different workpieces, different modes, we have invented a kind of many laser pulse sequence energy time domain accumulation method.
The present invention's method is the quick laser processing of a kind of sub-micron; Become energy processing by laser pulse; It is characterized in that, adopt continuous wave laser, produce pulse frequency and pulsewidth is different, amplitude is identical some laser pulse sequence through transferring Q; Laser pulse sequence high by pulse frequency, pulse width provides bigger Laser Processing energy; The laser pulse sequence low by pulse frequency, that pulsewidth is wide provides less Laser Processing energy, in the Laser Processing time domain, forms a laser pulse sequence string by the laser pulse sequence that multistage pulse frequency and pulsewidth are different, amplitude is identical, and the energy of the corresponding absorption of workpiece is consistent with energy time domain accumulation curve.
Its technique effect of the present invention's method is; Insert host computer through Q driver computer interface; Signal of telecommunication frequency and pulsewidth according to software control Q driver; Convert continuous laser into corresponding pulses frequency and pulsewidth pulse laser through adjusting Q crystal, this pulse laser has the characteristics of high repetition frequency.And; According to processing work and the pairing energy time domain of processing mode accumulation curve thereof; Adjust the signal of telecommunication frequency and the pulsewidth of Q driver in real time by host computer, the pulse laser of output then is several laser pulse sequence that pulse frequency and pulsewidth are different, amplitude is identical, and they form a laser pulse sequence string in the Laser Processing time domain; Realize laser energy emulation, the energy that workpiece can absorb is consistent with energy time domain accumulation curve.Compared with prior art, the present invention is a kind of change energy processing method equally, still; Different is that the Laser Processing energy is different from pulse frequency and pulsewidth, amplitude same laser pulse sequence, and such laser pulse sequence results from Q-regulating technique, has the high repetition frequency characteristics; Therefore; Can accurately control the Laser Processing energy, cooperate the laser energy emulation technology to process, improve crudy in strict accordance with energy time domain accumulation curve.In addition; For different processing works and processing mode, its energy time domain accumulation curve is different, adopts the present invention's method; Only need energy time domain accumulation curve input host computer; Draw the parameters of laser pulse sequence string through real time algorithm, output is fit to current processing work and the required Laser Processing energy of processing mode, a tractor serves several purposes.
Description of drawings
Fig. 1 is existing constant its machining energy of energy laser processing and processing time domain graph of a relation.Fig. 2 is existing its machining energy of energy laser processing and the processing time domain graph of a relation of becoming.Fig. 3 existing has a high repeat frequency pulsed laser oscillogram through what Q-regulating technique combined with continuous wave laser to be obtained.Fig. 4 becomes a kind of workpiece absorption energy time domain cumulative curve chart that the quick laser processing of energy sub-micron need be followed usually.Fig. 5 is a laser pulse sequence string sketch map more than the present invention's method the energy time domain accumulation curve that the quick laser processing of strain energy sub-micron is followed usually.Fig. 6 becomes a kind of workpiece absorption energy time domain cumulative curve chart that the quick laser filament of energy sub-micron welding method is followed.Fig. 7 is a laser pulse sequence string sketch map more than the present invention's method the energy time domain accumulation curve that the quick laser filament of strain energy sub-micron welding method is followed, and this figure double as is a Figure of abstract.Fig. 8 becomes a kind of workpiece absorption energy time domain cumulative curve chart that the meticulous drilling method of the quick laser of energy sub-micron is followed.Fig. 9 is a laser pulse sequence string sketch map more than the present invention's method the energy time domain accumulation curve that the meticulous drilling method of the quick laser of strain energy sub-micron is followed.
The specific embodiment
Embodiment 1:
This embodiment is the quick laser processing of a kind of sub-micron, becomes energy processing by laser pulse, and related energy time domain accumulation curve is t in process time
1The place has a peak value e
1, the laser energy that surface of the work absorbs is at peak value e
1Both sides are approximate Gaussian distribution, see shown in Figure 4ly, and transverse axis is represented T process time of laser pulse among the figure, and the longitudinal axis is represented the Laser Processing energy E that surface of the work absorbs.Adopt continuous wave laser, the continuous laser power P is 40W, produces pulse frequency and pulsewidth is different, amplitude is identical two laser pulse sequence through transferring Q, and each laser pulse sequence parameter sees the following form:
At 0～t
1Laser pulse sequence high by pulse frequency in process time, pulse width provides bigger Laser Processing energy, and pulse frequency is f
1, pulsewidth is δ/f
1, δ is the laser pulse dutycycle, the processing laser pulse number is n
1Confirm time interval t
2-t
1, change so that the machining energy that surface of the work absorbs is pressed the descending branch of energy time domain accumulation curve.Afterwards at t
2-t
3Laser pulse sequence low by pulse frequency, that pulsewidth is wide provides less Laser Processing energy in process time, and pulse frequency is f
2, pulsewidth is δ/f
2, δ is the laser pulse dutycycle, the processing laser pulse number is n
2, t
3Constantly corresponding with energy time domain accumulation curve tail end; See shown in Figure 5; Transverse axis is represented T process time of laser pulse sequence string among the figure, and the longitudinal axis is represented the Laser Processing energy E from the laser pulse sequence string that workpiece absorbs, and dashed curve is an energy time domain accumulation curve among the figure.In the whole machining process process, in the Laser Processing time domain, forms a laser pulse sequence string by the laser pulse sequence that two sections pulse frequencies and pulsewidth are different, amplitude is identical, become energy processing, the energy of the corresponding absorption of workpiece is consistent with the time domain accumulation curve.
Embodiment 2:
This embodiment is the quick method for laser welding of a kind of sub-micron, and fine wire welding is connected on the substrate, becomes energy processing by laser pulse, and related energy time domain accumulation curve characteristic has following performance, at 0～t
1Process time section, laser energy slowly increases; Be one afterwards and be positioned at t
2Constantly, peak value is e
2The Gaussian distribution laser energy, origin and destination are t
1, t
3Be one afterwards and be positioned at t
4Constantly, peak value is e
4And be higher than e
2The Gaussian distribution laser energy, origin and destination are t
3, t
5Afterwards, laser energy slowly reduces, and sees shown in Figure 6ly, and transverse axis is represented T process time of laser pulse among the figure, and the longitudinal axis is represented the Laser Processing energy E that surface of the work absorbs.Adopt continuous wave laser, the continuous laser power P is 43.52W, produces pulse frequency and pulsewidth is different, amplitude is identical three laser pulse sequence through transferring Q, and each laser pulse sequence parameter sees the following form:
At 0～t
3Laser pulse sequence higher by pulse frequency, that pulsewidth is narrower provides bigger Laser Processing energy in process time, and pulse frequency is f
1, pulsewidth is δ/f
1, δ is the laser pulse dutycycle, the processing laser pulse number is n
1, during this period, at t
1Constantly, the filament cladding layer absorbs energy e
1After begin fusing, and continue to t
2Constantly.Confirm time interval t
3-t
2, so that pressing the descending branch of energy time domain accumulation curve, the machining energy that surface of the work absorbs changes, during this period, and cladding layer preheating filament.Afterwards at t
3-t
4Laser pulse sequence higher by pulse frequency, that pulsewidth is narrower provides bigger Laser Processing energy in process time, and pulse frequency is f
2, pulsewidth is δ/f
2, δ is the laser pulse dutycycle, the processing laser pulse number is n
2, during this period, cladding layer, filament, substrate three are molten mutually.Confirm time interval t afterwards
5-t
4, change so that the machining energy that surface of the work absorbs is pressed the descending branch of energy time domain accumulation curve; At t
5Afterwards, the laser pulse sequence low by pulse frequency, that pulsewidth is wide provides less Laser Processing energy, and pulse frequency is f
3, pulsewidth is δ/f
3, δ is the laser pulse dutycycle, the processing laser pulse number is n
3, from t
4Constantly, workpiece is slowly lowered the temperature, to eliminate stress to greatest extent; See shown in Figure 7; Transverse axis is represented T process time of laser pulse sequence string among the figure, and the longitudinal axis is represented the Laser Processing energy E from the laser pulse sequence string that workpiece absorbs, and dashed curve is an energy time domain accumulation curve among the figure.In the whole machining process process, in the Laser Processing time domain, forms a laser pulse sequence string by the laser pulse sequence that three sections pulse frequencies and pulsewidth are different, amplitude is identical, become energy processing, the energy of the corresponding absorption of workpiece is consistent with the time domain accumulation curve.
Embodiment 3:
This embodiment is the quick laser boring method of a kind of sub-micron, and meticulous punching on workpiece becomes energy processing by laser pulse, and related energy time domain accumulation curve characteristic has following performance, at 0～t
1The individual sharp-pointed peak energy of Duan Weiyi process time, peak value e
1Be positioned at
1/
2t
1Constantly; Intermittence moment, the back laser energy changed ascendingly, reached a maximum e
2, progressively be reduced to zero again, corresponding is t constantly
4Be again one and 0～t subsequently
1The identical peak energy of the sharp-pointed peak energy of section process time is accomplished processing, sees shown in Figure 8ly, and transverse axis is represented T process time of laser pulse among the figure, and the longitudinal axis is represented the Laser Processing energy E that surface of the work absorbs.Adopt continuous wave laser; The continuous laser power P is 35W; Through transferring Q to produce pulse frequency and pulsewidth is different, amplitude is identical three laser pulse sequence in succession, wherein first laser pulse sequence is identical with the 3rd laser pulse sequence, and the parameter of each laser pulse sequence sees the following form:
0～
1/
2t
1Laser pulse sequence higher by pulse frequency, that pulsewidth is narrower provides bigger Laser Processing energy in process time, and pulse frequency is f
1, pulsewidth is δ/f
1, δ is the laser pulse dutycycle, the processing laser pulse number is n
1, during this period, Laser Processing energy preheating workpiece.Confirm time interval t
1-
1/
2t
1, change so that the machining energy that surface of the work absorbs is pressed the descending branch of energy time domain accumulation curve.Afterwards at t
1-t
3Laser pulse sequence low by pulse frequency, that pulsewidth is wide provides less Laser Processing energy in process time, and pulse frequency is f
2, pulsewidth is δ/f
2, δ is the laser pulse dutycycle, the processing laser pulse number is n
2, during this period, form the hole vestige at surface of the work, but the aperture is irregular.Confirm time interval t afterwards
4-t
3, change so that the machining energy that surface of the work absorbs is pressed the descending branch of energy time domain accumulation curve.At t
4-t
5In process time, apply one and 0 again～
1/
2t
1The laser pulse sequence that the laser pulse sequence that applies in process time is identical; So that the aperture is optimized; See shown in Figure 9; Transverse axis is represented T process time of laser pulse sequence string among the figure, and the longitudinal axis is represented the Laser Processing energy E from the laser pulse sequence string that workpiece absorbs, and dashed curve is an energy time domain accumulation curve among the figure.In the whole machining process process, in the Laser Processing time domain, forms a laser pulse sequence string by the laser pulse sequence that three sections pulse frequencies and pulsewidth are different, amplitude is identical, become energy processing, the energy of the corresponding absorption of workpiece is consistent with the time domain accumulation curve.
Claims (2)
1. the time domain of laser pulse sequence energy more than kind accumulation method; It is the quick laser processing of a kind of sub-micron; Become energy processing by laser pulse; It is characterized in that, adopt continuous wave laser, produce pulse frequency and pulsewidth is different, amplitude is identical some laser pulse sequence through transferring Q; Laser pulse sequence high by pulse frequency, pulse width provides bigger Laser Processing energy; The laser pulse sequence low by pulse frequency, that pulsewidth is wide provides less Laser Processing energy, in the Laser Processing time domain, forms a laser pulse sequence string by the laser pulse sequence that multistage pulse frequency and pulsewidth are different, amplitude is identical, and the energy of the corresponding absorption of workpiece is consistent with energy time domain accumulation curve.
2. many laser pulse sequence energy time domain accumulation method according to claim 1; It is characterized in that; Said laser pulse sequence string is made up of 2～3 differences or the identical described laser pulse sequence of part, has the time interval between each laser pulse sequence.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106312311A (en) * | 2016-09-23 | 2017-01-11 | 佛山市宏石激光技术有限公司 | Laser welding power control device and method |
| CN106413370A (en) * | 2016-11-17 | 2017-02-15 | 中国工程物理研究院流体物理研究所 | Optoelectronic isolation shielding box with strong electromagnetic interference resisting performance, system and method |
| CN112496571A (en) * | 2020-11-25 | 2021-03-16 | 杭州银湖激光科技有限公司 | Processing method and device of ultrafast green laser PCB material |
| CN112582871A (en) * | 2020-12-14 | 2021-03-30 | 中国科学院合肥物质科学研究院 | Pulse laser sequence energy correction system and method |
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| CN112496571A (en) * | 2020-11-25 | 2021-03-16 | 杭州银湖激光科技有限公司 | Processing method and device of ultrafast green laser PCB material |
| CN112582871A (en) * | 2020-12-14 | 2021-03-30 | 中国科学院合肥物质科学研究院 | Pulse laser sequence energy correction system and method |
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Application publication date: 20120502 |