CN101568224A - 电路板及具有该电路板的电子装置 - Google Patents

电路板及具有该电路板的电子装置 Download PDF

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CN101568224A
CN101568224A CNA2008103012310A CN200810301231A CN101568224A CN 101568224 A CN101568224 A CN 101568224A CN A2008103012310 A CNA2008103012310 A CN A2008103012310A CN 200810301231 A CN200810301231 A CN 200810301231A CN 101568224 A CN101568224 A CN 101568224A
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circuit board
pad
breach
edge
electronic component
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CN101568224B (zh
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廖昌德
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Singapore Shanghong Yunke Co ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US12/189,802 priority patent/US7995353B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明涉及一种电路板及具有该电路板的电子装置。所述电路板，其表面形成有多个用于焊接电子元件的焊盘，所述电路板还包括多个定位孔。所述焊盘具有缺口。所述缺口的边缘到所述定位孔的边缘的最短距离为0.2毫米到0.5毫米。另，本发明还涉及一种具有所述电路板的电子装置。在电路板的焊盘上开设缺口，该缺口与定位孔相距一定间隔，可避免出现漏锡。

Description

电路板及具有该电路板的电子装置
技术领域
本发明涉及一种电路板，尤其涉及一种可避免漏锡的电路板及具有该电路板的电子装置。
背景技术
随着科技的不断发展，各种各样的电子装置如移动电话，应用日益广泛，同时也日渐趋向于美观和多功能化，其中尤其以电子装置小型化得到了飞速的发展。
目前，为实现电子装置的小型化，表面贴装技术(SMT)被越来越广泛的运用到电子装置的制程中，用于将各种细小而精密的电子元件组装到电路板上。其中，所述电子元件一般具有多个引脚与所述电路板上的多个焊盘通过锡膏焊接实现两者间的电连接。
目前使用之电路板是根据已有零件的位置以及焊接强度等要求确定其定位孔与焊盘的位置，而这样确定下来的某些定位孔与焊盘之间的距离太近，有的甚至连接在一起，而在进行焊锡时会出现焊盘的焊锡漏到定位孔的现象。
发明内容
有鉴于此，有必要提供一种可避免出现漏锡的电路板及具有该电路板的电子装置。
一种电路板，其表面形成有多个用于焊接电子元件的焊盘，所述电路板还包括多个定位孔。所述焊盘具有缺口，所述缺口的边缘到所述定位孔的边缘的最短距离为0.2毫米到0.5毫米。
一种电子装置，其包括一个上述电路板及至少一个电子元件。所述至少一个电子元件具有多个引脚，所述多个引脚通过焊接与多个焊盘电连接。
上述电路板及具有该电路板的电子装置，在电路板的焊盘上开设缺口，焊盘与定位孔相距一定间隔，可避免出现漏锡。
附图说明
图1是本发明提供的一种电子装置的立体分解示意图。
图2是图1中的电子装置组装后的立体示意图。
图3是图1电子装置的电路板的平面示意图。
具体实施方式
为了对本发明的电路板及具有该电路板的电子装置做进一步的说明，举以下实施方式并配合附图进行详细说明如下。
请一并参阅图1和图2，为本发明提供的一种电子装置100，该电子装置100包括一个电路板10及至少一个焊接在所述电路板10上的电子元件20。所述电子元件20具有一个主体21及多个从所述主体21延伸而出的引脚22。所述电路板10与电子元件20之间通过焊接的方式形成电连接。
所述电子元件20可为电阻、电容、集成电路元件、按键或卡座等。优选地，所述电子元件20为一些对机械定位要求高的元件，如某些集成电路元件、按键或卡座等。本实施方式中，所述电子元件20为集成电路元件。所述主体21是通过树脂将集成电路密封而成。引脚22与所述电子元件20的内部电路(图未示)电连接。
本实施方式中，所述电路板10包括四个定位孔12，所述电路板10表面形成有多个用于焊接所述引脚22的焊盘11。可以理解，焊盘11及引脚22的个数相等，本实施方式中，所述焊盘11及引脚22均为四个。所述焊盘11一般为裸铜。所述电路板10未裸露焊盘11的区域为阻焊材料，该阻焊材料一般为环氧树脂等材料。
请参阅图3，所述电路板10上的焊盘11可以为圆形，也可以为方形，本实施方式中，所述焊盘11为方形，并具有一个缺口111，所述缺口111覆盖有阻焊材料。所述缺口111为弧形，且所述缺口111的边缘到所述定位孔12的边缘的最短距离为0.2毫米到0.5毫米。若该最短距离小于0.2毫米则不能起到阻隔效果，若该最短距离大于0.5毫米则焊盘11面积减小会影响到焊接强度。本实施方式中，该最短距离为0.3毫米。
所述电子装置100在组装过程中，会首先在电路板10的焊盘11上涂布上锡膏等焊接材料，然后通过表面贴装技术将电子元件20贴装到电路板10上，并使电子元件20的多个引脚22位于对应的多个焊盘11上，而后经过回焊炉将电子元件20焊接到电路板10上，从而形成电子装置100。
上述电路板及具有该电路板的电子装置，在电路板的焊盘上开设缺口，该缺口覆盖有阻焊材料且与定位孔离开一定距离，可避免出现漏锡。而且通过所述焊盘上开设缺口，也可避免整个焊盘的面积缩小太多，导致出现焊盘与电子元件引脚之间的焊锡量不足的问题。
可以理解的是，对于本领域的普通技术人员来说，可以根据本发明的技术构思做出其它各种相应的改变与变形，而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (9)

1.一种电路板，其表面形成有多个用于焊接电子元件的焊盘，所述电路板还包括多个定位孔，其特征在于：所述焊盘具有缺口，所述缺口的边缘到所述定位孔的边缘的最短距离为0.2毫米到0.5毫米。
2.如权利要求1所述的电路板，其特征在于：所述焊盘上的缺口为弧形。
3.如权利要求1所述的电路板，其特征在于：所述焊盘为圆形。
4.如权利要求1所述的电路板，其特征在于：所述焊盘为方形。
5.如权利要求1所述的电路板，其特征在于：所述阻焊材料为环氧树脂。
6.如权利要求1所述的电路板，其特征在于：所述定位孔为圆形。
7.如权利要求1所述的电路板，其特征在于：所述缺口的边缘到所述定位孔的边缘的最短距离为0.3毫米。
8.如权利要求1所述的电路板，其特征在于：所述缺口覆盖有阻焊材料。
9.一种电子装置，其包括一个电路板及至少一个电子元件，所述至少一个电子元件具有多个引脚，所述引脚通过焊接与多个焊盘电连接，所述电路板为如权利要求1~8任一项所述的电路板。
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US12/189,802 US7995353B2 (en) 2008-04-22 2008-08-12 Circuit board and electronic device using the same

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CN111200906A (zh) * 2020-02-09 2020-05-26 苏州浪潮智能科技有限公司 一种pcb板
CN111952271A (zh) * 2020-08-20 2020-11-17 上海天马微电子有限公司 电路板、发光面板及显示装置

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Publication number Priority date Publication date Assignee Title
CN106535467A (zh) * 2016-12-05 2017-03-22 西南交通大学 一种易于定位的邮票孔pcb板
CN111200906A (zh) * 2020-02-09 2020-05-26 苏州浪潮智能科技有限公司 一种pcb板
CN111200906B (zh) * 2020-02-09 2021-06-29 苏州浪潮智能科技有限公司 一种pcb板
CN111952271A (zh) * 2020-08-20 2020-11-17 上海天马微电子有限公司 电路板、发光面板及显示装置

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US7995353B2 (en) 2011-08-09
CN101568224B (zh) 2012-01-25

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