CN101516170A - 散热装置 - Google Patents

散热装置 Download PDF

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CN101516170A
CN101516170A CN200810065409.6A CN200810065409A CN101516170A CN 101516170 A CN101516170 A CN 101516170A CN 200810065409 A CN200810065409 A CN 200810065409A CN 101516170 A CN101516170 A CN 101516170A
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radiator
heat pipe
heat
section
radiating fin
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CN101516170B (zh
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周世文
许寿标
陈俊吉
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QUANYIDA TECHNOLOGY (FOSHAN) Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置，用于散发一电子元件产生的热量，其包括一与该电子元件接触的散热器、一远离该散热器的散热鳍片组、一连接所述散热器与散热鳍片组的一热管、及一支撑件，该支撑件一端具有一固定部固定于所述散热器上，另一端具有一收容部以套设所述热管并靠近所述散热鳍片组，该支撑件的收容部设有一供热管穿设的通孔，该收容部在该通孔边缘延伸一卡掣部，该卡掣部与收容部倾斜并紧靠在热管表面。由于所述散热装置的支撑件很好地支撑保护热管的同时，支撑件的卡掣部有效地减少了支撑件与热管之间的间隙，减少了热管与支撑件之间的相对晃动及可能产生的噪音。

Description

散热装置
技术领域
本发明涉及一种散热装置，尤其涉及一种用于电子元件散热的散热装置。
背景技术
随着电子信息业不断发展，电子元件(尤为中央处理器)运行频率和速度在不断提升。但是，高频高速将使电子元件产生的热量随之增多，使得其温度不断升高，严重威胁着电子元件运行时的性能，为确保电子元件能正常运作，必须及时排出电子元件所产生的大量热量。
为此，业界通常使用一种包括一散热器的散热装置固定在电子元件上为其散热。随着机箱体积越来越小型化，机箱内留给散热装置的空间也越来越小，尤其是在笔记本电脑和平板电脑中，散热装置所占空间有限，结构上往往都是使用一固定在电子元件上的吸热板、一远离电子元件的散热器及一较长的热管连接吸热板及散热器，以将电子元件的热量传导至散热器以使其满足整体布局的需要。然而，离电子元件较远的散热器仅仅靠热管的连接支撑容易将热管压弯变形。为了避免热管受损，业界通常增加一强度较高的金属支架，该支撑件一端固定在吸热板上，另外一端套设在靠近散热器的热管一端。为了避免支撑件与热管产生干涉，一般不将支撑件与热管焊接在一起。为了能够顺利组装，支撑件一端与热管配合时不可避免地预留一定的空隙，而这些空隙使得组装后热管将相对支撑件晃动而产生噪音及磨损，从而影响整个散热装置的散热性能及其可靠性。
发明内容
有鉴于此，实有必要提供一种将很好地保护热管的散热装置。
一种散热装置，用于散发一电子元件产生的热量，其包括一与该电子元件接触的散热器、一远离该散热器的散热鳍片组、一连接所述散热器与散热鳍片组的一热管、及一支撑件，该支撑件一端具有一固定部固定于所述散热器上，另一端具有一收容部以套设所述热管并靠近所述散热鳍片组，该支撑件的收容部设有一供热管穿设的通孔，该收容部在该通孔边缘延伸一卡掣部，该卡掣部与收容部倾斜并紧靠在热管表面。
与现有技术相比，由于所述散热装置的支撑件很好地支撑保护热管的同时，支撑件的卡掣部有效地减少了支撑件与热管之间的间隙，减少了热管与支撑件之间的相对晃动及可能产生的噪音。
下面参照附图结合实施例对本发明作进一步的描述。
附图说明
图1是本发明散热装置的立体分解图。
图2是图1散热装置的组装图。
图3是图1散热装置中的支撑件与热管紧密结合的组装图。
具体实施方式
请参阅图1与图2，本发明散热装置安装于一电路板(图未示)上的电子元件(图未示)上对其进行散热。该散热装置包括一固定在电子元件上的第一散热器10、一第二散热器20、一散热鳍片组30、一连接第一、第二散热器10、20与散热鳍片组30的热管40、及架设于第二散热器20与散热鳍片组30之间的一支撑件50。该支撑件50一端固定在第二散热器20上，另一端设有通孔以套设于热管40上并靠近于散热鳍片组30上。
第一散热器10由导热性能良好的金属材料一体制成，在本实施例中为铝挤型散热器。该第一散热器10包括一呈矩形的底板11。该底板11具有一平整的下表面(图未标)以贴合电子元件的顶面。该底板11上表面中部设有一凹槽115。底板11自凹槽115两侧的上表面向上垂直延伸若干相互平行的第一散热鳍片13。这些第一散热鳍片13将底板11上表面中部围成一以凹槽115为中心的收容空间。
第二散热器20亦为铝挤型散热器，具有一长方形的基座21。该基座21的底部设有一凹槽215以对应第一散热器10的底板11上表面的凹槽115，二凹槽115、215共同组成一通道以部分收容热管40。该基座21的上表面一端设有二螺孔26，以固定支撑件50。基座21上表面的其它部分向上延伸若干相互平行的第二散热鳍片28。第二散热器20焊接在第一散热器10上表面上并置于所述收容空间中，所述第二散热鳍片28与第一散热鳍片13相互平行。
散热鳍片组30由若干矩形片状散热鳍片33并排组合而成。每一散热鳍片33的上下边缘两端同向设置有卡扣结构(图未标)，以与相邻的散热鳍片33相互卡扣并使各散热鳍片33均匀间隔设置。散热鳍片组33中部设有一通道330以部分收容热管40。
热管40包括一吸热段41、一放热段43及一连接吸热段41及放热段43的连接段42。该吸热段41呈直线型，收容于第一散热器10与第二散热器20之间形成的凹槽115、215中；该放热段43亦呈直线型，垂直于吸热段41并收容于散热鳍片组30的通道330中；连接段42呈弯曲设置，分别垂直连接吸热段41与放热段43。
支撑件50由强度较高的金属片体一体冲压而成，包括一固定部51、一连接固定部51的连接部52、及一自连接部52自由端垂直向上延伸的收容部53。该固定部51呈矩形设置，其上设有二通孔510，二螺钉60穿过通孔510与第二散热器20的基座21的螺孔26螺合。该收容部53大致呈一正方形设置。收容部53中间设有一通孔530，该通孔530的内径稍大于热管40的外径。该收容部53朝向连接部52一侧面在通孔530圆周垂直凸设置的不连续的一加强部533与一卡掣部537。在本实施例中，该加强部533呈四分之三圆周的周长，设置于靠近连接部52处。该卡掣部537与加强部533之间设有空隙，并置于远离连接部52处。
组装时，将热管40的放热段43穿过支撑件50的收容部53，将热管40的吸热段41与第一、第二散热器10、20焊接；放热段插入散热鳍片组30的通道330中并与散热鳍片组30焊接在一起。此时支撑件50的固定部51安装在第二散热器20上，其收容部53套设在热管40的放热段43与连接段42的连接处，并且靠近散热鳍片组30。此时散热装置如图2所示，其中加强部533与卡掣部537背向散热鳍片组30。为了使收容部53与热管40的放热段43顺利装配，收容部53的加强部533、卡掣部537与热管40之间预留了一定的空隙。最后，通过使用工具，将原来垂直于收容部53的卡掣部537朝热管40的方向压，并且控制好压弯的程度，使得卡掣部537朝向热管40倾斜刚好将抵靠在热管40的表面上，如图3所示，这样热管40与收容部53之间的空隙得到了消除，热管40与收容部53之间不会发生相对晃动，也就避免了热管40的磨损及噪音的产生。
由于支撑件50对散热鳍片组30的支撑作用，大大减少了散热鳍片组30对热管40的连接段42的压力。另外，支撑件50上卡掣部537的设置使得支撑件50可以通过与热管40之间预留的空隙顺利套设于热管40以后，消除支撑件50与热管40之间的空隙。可以理解地，在其它实施例中，卡掣部537的数量可以是二或者大于二，以更好地减少热管40与支撑间之间的空隙。

Claims (10)

1.一种散热装置，用于散发一电子元件产生的热量，其包括一与该电子元件接触的散热器、一远离该散热器的散热鳍片组、一连接所述散热器与散热鳍片组的一热管、及一支撑件，该支撑件一端具有一固定部固定于所述散热器上，另一端具有一收容部以套设所述热管并靠近所述散热鳍片组，其特征在于：该支撑件的收容部设有一供热管穿设的通孔，该收容部在该通孔边缘延伸一卡掣部，该卡掣部与收容部倾斜并紧靠在热管表面。
2.如权利要求1所述的散热装置，其特征在于：所述收容部的通孔的内径稍大于热管的外径。
3.如权利要求1所述的散热装置，其特征在于：所述收容部在该通孔的边缘上垂直延伸一加强部，所述卡掣部与该加强部相隔。
4.如权利要求3所述的散热装置，其特征在于：所述卡掣部与加强部背向所述散热鳍片组延伸。
5.如权利要求1所述的散热装置，其特征在于：所述支撑件还包括一固定在散热器上的固定部及连接该固定部与收容部的连接部。
6.如权利要求5所述的散热装置，其特征在于：所述收容部垂直于该连接部。
7.如权利要求1所述的散热装置，其特征在于：所述支撑件由强度较高的金属片体冲压而成。
8.如权利要求1所述的散热装置，其特征在于：所述热管包括一连接所述散热器的吸热段、一连接散热鳍片组的放热段及一连接该吸热段与放热段的连接段，该吸热段及放热段相互垂直。
9.如权利要求8所述的散热装置，其特征在于：所述散热器包括一第一散热器及一第二散热器，所述热管的吸热段夹设于第一散热器及第二散热器之间。
10.如权利要求9所述的散热装置，其特征在于：所述第一散热器包括一与所述电子元件接触的底板及自该底板向上延伸的若干第一散热鳍片，该第二散热器包括一与该底板接触的基座及若干自该基座向上延伸的若干第二散热鳍片，所述热管的吸热段夹设于第一散热器的底板与第二散热器的基座，所述第二散热鳍片与第一散热鳍片相互平行。
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US12/143,846 US20090211730A1 (en) 2008-02-22 2008-06-23 Heat dissipation device having a bracket

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CN105744798A (zh) * 2014-12-08 2016-07-06 鸿富锦精密工业(武汉)有限公司 散热装置

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