CN103857263B - 散热装置 - Google Patents
散热装置 Download PDFInfo
- Publication number
- CN103857263B CN103857263B CN201210522010.2A CN201210522010A CN103857263B CN 103857263 B CN103857263 B CN 103857263B CN 201210522010 A CN201210522010 A CN 201210522010A CN 103857263 B CN103857263 B CN 103857263B
- Authority
- CN
- China
- Prior art keywords
- radiator
- hole
- heat abstractor
- connector
- flanging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title abstract 2
- 238000005452 bending Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052759 nickel Inorganic materials 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract 2
- 230000000149 penetrating effect Effects 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 3
- 238000010079 rubber tapping Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/007—Auxiliary supports for elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210522010.2A CN103857263B (zh) | 2012-12-07 | 2012-12-07 | 散热装置 |
TW101146758A TWI566674B (zh) | 2012-12-07 | 2012-12-11 | 散熱裝置 |
US13/728,943 US9134077B2 (en) | 2012-12-07 | 2012-12-27 | Heat sink assembly with connecting member protruding from heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210522010.2A CN103857263B (zh) | 2012-12-07 | 2012-12-07 | 散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103857263A CN103857263A (zh) | 2014-06-11 |
CN103857263B true CN103857263B (zh) | 2017-05-10 |
Family
ID=50864313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210522010.2A Expired - Fee Related CN103857263B (zh) | 2012-12-07 | 2012-12-07 | 散热装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9134077B2 (zh) |
CN (1) | CN103857263B (zh) |
TW (1) | TWI566674B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103295983B (zh) * | 2013-06-08 | 2016-06-01 | 台达电子电源(东莞)有限公司 | 电子元器件散热器组件 |
KR101794007B1 (ko) * | 2016-04-06 | 2017-11-07 | (주)휴맥스 | 방열모듈 조립체 및 이를 갖는 셋탑박스 |
JP6735664B2 (ja) * | 2016-12-28 | 2020-08-05 | 昭和電工株式会社 | 液冷式冷却装置用放熱器およびその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4765397A (en) * | 1986-11-28 | 1988-08-23 | International Business Machines Corp. | Immersion cooled circuit module with improved fins |
US5969950A (en) * | 1998-11-04 | 1999-10-19 | Sun Microsystems, Inc. | Enhanced heat sink attachment |
CN101621909A (zh) * | 2008-07-04 | 2010-01-06 | 富准精密工业(深圳)有限公司 | 散热装置 |
TWM431545U (en) * | 2012-03-02 | 2012-06-11 | Asia Vital Components Co Ltd | Heat dissipation device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5932925A (en) * | 1996-09-09 | 1999-08-03 | Intricast, Inc. | Adjustable-pressure mount heatsink system |
US5847452A (en) * | 1997-06-30 | 1998-12-08 | Sun Microsystems, Inc. | Post mounted heat sink method and apparatus |
US20030094273A1 (en) * | 2001-11-21 | 2003-05-22 | Toth Jerome E. | Corrugated fin assembly |
KR100457220B1 (ko) * | 2002-02-27 | 2004-11-16 | 잘만테크 주식회사 | 칩셋 냉각용 히트싱크장치 |
CN101605446B (zh) * | 2008-06-11 | 2012-09-05 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN101808490A (zh) * | 2009-02-17 | 2010-08-18 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101930951A (zh) * | 2009-06-25 | 2010-12-29 | 鸿富锦精密工业(深圳)有限公司 | 散热器组合 |
-
2012
- 2012-12-07 CN CN201210522010.2A patent/CN103857263B/zh not_active Expired - Fee Related
- 2012-12-11 TW TW101146758A patent/TWI566674B/zh not_active IP Right Cessation
- 2012-12-27 US US13/728,943 patent/US9134077B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4765397A (en) * | 1986-11-28 | 1988-08-23 | International Business Machines Corp. | Immersion cooled circuit module with improved fins |
US5969950A (en) * | 1998-11-04 | 1999-10-19 | Sun Microsystems, Inc. | Enhanced heat sink attachment |
CN101621909A (zh) * | 2008-07-04 | 2010-01-06 | 富准精密工业(深圳)有限公司 | 散热装置 |
TWM431545U (en) * | 2012-03-02 | 2012-06-11 | Asia Vital Components Co Ltd | Heat dissipation device |
Also Published As
Publication number | Publication date |
---|---|
TWI566674B (zh) | 2017-01-11 |
CN103857263A (zh) | 2014-06-11 |
US20140158323A1 (en) | 2014-06-12 |
US9134077B2 (en) | 2015-09-15 |
TW201429375A (zh) | 2014-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170922 Address after: No. 7, phreatic East Road, Hefei hi tech Zone, Anhui, Hefei Patentee after: ANHUI JIETAI INTELLIGENT TECHNOLOGY CO., LTD. Address before: 215316 Suzhou City, Kunshan Province Development Zone hi tech Industrial Park, Foxconn Road, No. 635 Co-patentee before: Foxconn Precision Industry Co., Ltd. Patentee before: Fu Rui (Kunshan) Co., Ltd. precision components |
|
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Wang Jiatai Inventor after: Chen Yingbin Inventor before: Tang Zhen Inventor before: Zhou Jinhuai |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170510 Termination date: 20201207 |