CN101621909A - 散热装置 - Google Patents

散热装置 Download PDF

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CN101621909A
CN101621909A CN200810068323A CN200810068323A CN101621909A CN 101621909 A CN101621909 A CN 101621909A CN 200810068323 A CN200810068323 A CN 200810068323A CN 200810068323 A CN200810068323 A CN 200810068323A CN 101621909 A CN101621909 A CN 101621909A
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radiating fin
heat
heat abstractor
circuit board
fin group
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CN101621909B (zh
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廉志晟
邓根平
陈俊吉
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to US12/409,502 priority patent/US8109323B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置，用于对一电路板上的电子元件散热，包括一散热鳍片组及将散热鳍片组固定在电路板上的二扣具，该散热鳍片组包括若干相互并排的散热鳍片，每一扣具包括一条形板及二紧固件，每一扣具的条形板贯穿所述每一散热鳍片，所述紧固件穿过每一条形板的二端部并配合安装在电路板上，以将该散热鳍片组固定安装于电路板上。上述散热装置通过二扣具插入至散热鳍片组中，使得二扣具可以充分地与散热鳍片接触，很好地将散热模组固定置电路板上，简单可靠。

Description

散热装置
技术领域
本发明涉及一种散热装置，特别是指一种对电子元件进行散热的散热装置。
背景技术
随着电子信息业不断发展，电子元件(尤为中央处理器)运行频率和速度在不断提升。但是，高频高速将使电子元件产生的热量随之增多，使得其温度不断升高，严重威胁着电子元件运行时的性能，为确保电子元件能正常运作，必须及时排出电子元件所产生的大量热量。
为此，业界通常使用的散热装置一般包括一与电路板上的电子元件接触的底座、设在该底座上的若干散热鳍片及将整个散热装置固定在电路板上的固定件。该固定件是通过焊接与底座连接在一起，如此容易出现焊接不良、定位不准的问题。
发明内容
本发明旨在提供一种具有定位准确的固定件的散热装置。
一种散热装置，用于对一电路板上的电子元件散热，包括一散热鳍片组及将散热鳍片组固定在电路板上的二扣具，该散热鳍片组包括若干相互并排的散热鳍片，每一扣具包括一条形板及二紧固件，每一扣具的条形板贯穿所述每一散热鳍片，所述紧固件穿过每一条形板的二端部并配合安装在电路板上，以将该散热鳍片组固定安装于电路板上。
上述散热装置通过二扣具插入至散热鳍片组中，使二扣具充分地与散热鳍片接触，很好地将散热模组固定置电路板上，简单可靠。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明散热装置的立体分解图。
图2是图1散热装置的部分组合图。
图3是图1散热装置的组合图。
图4是图1散热装置的部分组合图。
具体实施方式
请参阅图1，为本发明实施例的一散热装置。该散热装置安装于一电路板(图未示)上，用以对该电路板上一发热电子元件(图未示)进行散热。该电路板上设有四通孔以固定该散热装置。该散热装置主要包括一散热模组10及二扣具50，这些扣具50穿过散热模组10及电路板的通孔与电路板另一侧的背板(图未示)螺锁以将散热模组10固定在电路板上。所述散热模组10包括一导热板40、一置于导热板40上的散热鳍片组30及二连接散热鳍片组30和导热板40的热管20。
该导热板40呈矩形板状，二截面呈半圆形的相互平行的凹槽426沿导热板40的顶部42横向延伸，该导热板40底部具有一平整底面以与电子元件接触，用以吸收该电子元件产生的热量。
所述每一热管20均呈U形弯曲，其包括一吸热段22及平行于该吸热段22的一放热段24，其中该二热管20的二吸热段22对应置于该导热板40的凹槽426中。
散热鳍片组30由若干散热鳍片32平行间隔排列而成，每一散热鳍片32呈L形设置且垂直于所述导热板40。每一散热鳍片32通过两侧上下部各设有卡扣结构39而与相邻散热鳍片32卡扣组合。每一散热鳍片32包括一第一本体部325及一垂直于该第一本体部325的第二本体部326，其中第二本体部326的高度高于第一本体部325的高度，且第二本体部326相对第一本体部325远离所述电子元件，第一本体部325、第二本体部326均呈矩形，各散热鳍片32堆叠排列，从而在散热鳍片组30顶部形成一阶梯落差。每一散热鳍片32的第一本体部325底部形成有二凹口，这些散热鳍片32的凹口并行排列从而形成沟槽36，该二沟槽36与导热板40的沟槽426相对应形成以收容上述热管20的吸热段22的通道；每一散热鳍片32的第二本体部326上设有二横向延伸的截面呈圆形的通孔34，该二通孔34用以收容上述热管20的放热段24。每一散热鳍片32底部及顶部均设有折缘33，所述卡扣结构39设于折缘33上。这些折缘33使整个散热鳍片组30底部与导热板40顶部42为面接触，提高了散热鳍片组30与导热板40之间的热传递效率。每一散热鳍片32的第一本体部325底部的相对两侧各设有一狭长封闭的方形贯穿孔38，各散热鳍片32的方形孔38共同形成二收容通道以收容扣具50。上述散热鳍片组30、热管20及导热板40通过焊接或胶接而结合。
二扣具50包括穿设散热鳍片组30的二条形板52及四紧固件56，这些紧固件56穿过条形板52以及电路板的通孔与电路板另一侧的背板螺锁以将散热模组10固定在电路板上。每一条形板52包括一定位端54及一与该定位端相对的自由端53。该定位端54及自由端53上各设有二通孔522，这些通孔522与电路板上所设的四通孔对应，所述四紧固件56穿过条形板52的通孔522及电路板上的通孔以将散热模组10紧密贴置该电子元件上。每一条形板52的定位端54的底部垂直向下延伸有一挡止部528。
组装散热模组10及二扣具50时，如图2-3所示，将二固定件56分别穿设在每一条形板52的定位端54的通孔522上，然后将自由端53自散热鳍片组30的方形孔38插入，并置于散热鳍片32的底部折缘33之上。当该自由端53穿过散热鳍片组30后，再将另外二固定件56分别穿设在自由端53的通孔522上。此时，如图4所示，每一条形板52的自由端53及定位端54均伸出两侧最外侧的散热鳍片32。每一条形板52的挡止部528抵靠在散热鳍片组30的最外侧散热鳍片32的底部折缘33，而另一端处于自由状态或者通过点焊的方式将自由端53与另一最外侧散热鳍片32连接。
使用时，由于二扣具50的条形板52插入至散热鳍片组30中，使得二扣具50可以充分地与散热鳍片组30接触，无需与散热模组10焊接即可很好地将散热模组10固定置电路板上，避免了焊接不良，而且简单可靠。

Claims (10)

1.一种散热装置，用于对一电路板上的电子元件散热，包括一散热鳍片组及将散热鳍片组固定在电路板上的二扣具，该散热鳍片组包括若干相互并排的散热鳍片，每一扣具包括一条形板及二紧固件，其特征在于：每一扣具的条形板贯穿所述每一散热鳍片，所述紧固件穿过每一条形板的二端部并配合安装在电路板上，以将该散热鳍片组固定安装于电路板上。
2.如权利要求1所述的散热装置，其特征在于：所述每一扣具的条形板包括分别伸出散热鳍片组两侧的一自由端及一定位端，该定位端的底部垂直向下延伸有一挡止部，该挡止部与散热鳍片组的最外侧散热鳍片相卡掣。
3.如权利要求2所述的散热装置，其特征在于：所述每一散热鳍片具有第一本体部及与第一本体部一体的第二本体部，第二本体部高于第一本体部。
4.如权利要求1至3任意一项所述的散热装置，其特征在于：每一散热鳍片靠近底部的位置处设有二封闭的贯穿孔以供所述条形板穿设，所述条形板与所述散热鳍片底部相隔设置。
5.如权利要求3所述的散热装置，其特征在于：所述散热鳍片的底部及顶部均设有折缘，所述贯穿孔呈方形且设置于每一散热鳍片的第一本体部的底部。
6.如权利要求3所述的散热装置，其特征在于：所述散热鳍片的折缘设有卡扣结构以与相邻散热鳍片相互卡扣。
7.如权利要求3所述的散热装置，其特征在于：还包括置于散热鳍片组底部的一导热板及连接该导热板与散热鳍片组的一热管。
8.如权利要求7所述的散热装置，其特征在于：所述第一本体部连接于导热板上，所述第二本体部远离导热板。
9.如权利要求2所述的散热装置，其特征在于：所述条形板的自由端与最外侧散热鳍片焊接。
10.如权利要求1所述的散热装置，其特征在于：所述散热鳍片呈L形。
CN2008100683239A 2008-07-04 2008-07-04 散热装置 Expired - Fee Related CN101621909B (zh)

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US12/409,502 US8109323B2 (en) 2008-07-04 2009-03-24 Heat dissipation device having a clip

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CN102473696A (zh) * 2010-01-18 2012-05-23 古河电气工业株式会社 散热器
CN103857263A (zh) * 2012-12-07 2014-06-11 富瑞精密组件（昆山）有限公司 散热装置
CN112004372A (zh) * 2019-05-27 2020-11-27 酷码科技股份有限公司 散热装置
CN112638110A (zh) * 2019-10-09 2021-04-09 立端科技股份有限公司 具有分层结构的散热装置
TWI728499B (zh) * 2019-10-09 2021-05-21 立端科技股份有限公司 具有分層結構的散熱裝置

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CN103234378B (zh) * 2013-04-23 2015-09-30 东莞汉旭五金塑胶科技有限公司 波浪形散热鳍片及其散热器
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CN103857263A (zh) * 2012-12-07 2014-06-11 富瑞精密组件（昆山）有限公司 散热装置
TWI566674B (zh) * 2012-12-07 2017-01-11 鴻準精密工業股份有限公司 散熱裝置
CN103857263B (zh) * 2012-12-07 2017-05-10 富瑞精密组件（昆山）有限公司 散热装置
CN112004372A (zh) * 2019-05-27 2020-11-27 酷码科技股份有限公司 散热装置
CN112638110A (zh) * 2019-10-09 2021-04-09 立端科技股份有限公司 具有分层结构的散热装置
TWI728499B (zh) * 2019-10-09 2021-05-21 立端科技股份有限公司 具有分層結構的散熱裝置

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