CN101507376B - 声音输出装置 - Google Patents

声音输出装置 Download PDF

Info

Publication number
CN101507376B
CN101507376B CN2007800309009A CN200780030900A CN101507376B CN 101507376 B CN101507376 B CN 101507376B CN 2007800309009 A CN2007800309009 A CN 2007800309009A CN 200780030900 A CN200780030900 A CN 200780030900A CN 101507376 B CN101507376 B CN 101507376B
Authority
CN
China
Prior art keywords
signal processing
signal
voice
sound
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800309009A
Other languages
English (en)
Other versions
CN101507376A (zh
Inventor
小林充
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of CN101507376A publication Critical patent/CN101507376A/zh
Application granted granted Critical
Publication of CN101507376B publication Critical patent/CN101507376B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0208—Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/06—Receivers
    • H04B1/08—Constructional details, e.g. cabinet
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Security & Cryptography (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Receivers (AREA)
  • Casings For Electric Apparatus (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

本发明提供一种可以消除组装工序的复杂性，保证设备的品质和可靠性且实现小型形状的声音输出装置。具体而言，声音输出装置具备：电源(5)，其向各功能模块提供电源；信号处理模块(3)，其对从外部获得的声音信号实施规定的信号处理，且将已被信号处理过的声音信号放大；扬声器模块(4)，其将已被放大的声音信号作为声音输出；立体电路基板(10)，其具备在组装电源(5)、信号处理模块(3)、扬声器模块(4)时与各形状对应的组装部位，且形成有通过组装而电压接的电极部位。

Description

声音输出装置
技术领域
本发明涉及放大声音信号而作为声音向外部输出的声音输出装置。
背景技术
伴随着电子设备的小型化，要求设备内的组装合理化、省空间化。伴随着这样的要求，越来越多的电子设备无法与以现有的玻璃环氧印制电路板为代表的平面形状的印制配线基板匹配。作为应对这种现象的方法，提出了在注塑成型品的表面上立体地形成直接电路的注塑成型电路部件(MID：Molded Interconnect Device)技术。具体而言，提出了在注塑成型的基板的表面上立体地形成精细电路的精细复合加工技术(MIPTEC：Microscopic Integrated Processing Technology)，例如在日本特开平7-66533号公报等中公开。
精细复合加工技术是制造在注塑成型的基板上组装电路或者机械电气功能的部件的技术(注塑成型电路部件的制造技术)，尤其是，通过采用激光加工，可以形成超精细的3维电路，可以提高在基板上形成的图案的变换自由度。
这里，放大从外部收集的声音且输出的助听器，或是放大与传播的电波重叠的声音信号且作为声音输出的接收器，或是安装了存储声音信号的存储装置且读出并作为声音输出的再生装置等声音输出装置，由于直接在耳中放置或是悬挂在耳上，因此非常优选小型形状，从用户角度也强烈希望采用这种小型形状。
因而，如采用如上所述的平面形状的印制配线基板，则存在难于制成小型形状的问题。另外，会存在如下问题：必须通过导线连接印制配线基板和各功能部件，引起组装工序的复杂化，且由于布线错误、断路等而导致设备的品质和可靠性下降。
发明内容
本发明鉴于如上所述的实际情况而提出，目的在于提供一种消除组装工序的复杂化，保证设备的品质、可靠性且做成小型形状的声音输出装置。
本发明的声音输出装置具备：电源，其向该声音输出装置提供电源；信号处理机构，其对从外部获得的声音信号实施规定的信号处理；放大机构，其将已被所述信号处理机构信号处理过的声音信号放大；输出机构，其将已被所述放大机构放大的声音信号作为声音输出；立体电路基板，其具备在组装所述电源、所述放大机构、所述输出机构时与各形状对应的组装部位，且形成有通过组装而电压接的电极部位，因此能解决所述问题。
另外，本发明的声音输出装置具备从外部收集声音的集音机构，所述信号处理机构对由所述集音机构从外部收集的声音实施规定的声音信号处理，因此能解决所述问题。
另外，本发明的声音输出装置具备接收向外部传播的电波的接收机构，所述信号处理机构对与由所述接收机构接收的电波重叠的声音信号实施规定的声音信号处理，因此能解决所述问题。
进而，本发明的声音输出装置具备安装机构，所述安装机构对存储有声音信号的存储装置进行安装，所述信号处理机构从安装于所述安装机构的存储装置中读出声音信号，且对读出的声音信号实施规定的声音信号处理，因此能解决所述问题。
附图说明
图1是用于说明作为本发明的第1实施方式表示的助听器的分解立体图。
图2是表示组装同样作为本发明的第1实施方式表示的助听器时的状态的图。
具体实施方式
以下，参照附图说明本发明的实施方式。
[第1实施方式]
首先，利用图1说明作为本发明的第1实施方式表示的助听器1的内部结构。如图1所示的助听器1具备：话筒模块2、信号处理模块3、扬声器模块4、电源5和立体电路基板10。图1表示在立体电路基板10上组装各功能模块前的状态，图2表示在立体电路基板10上组装各功能模块后的状态。
如图1所示，话筒模块2具备收集来自外部的声音的话筒21。话筒模块2具备用于在立体电路基板10上组装的凸部2A。另外，在凸部2A上，在凸部2A的侧面以相互对置的方式形成有圆筒状的圆筒凹部2a。此外，在凸部2A的侧面形成有在组装于立体电路基板10上时电压接的电极15。
信号处理模块3按照由话筒21收集的声音成为与使用该助听器1的使用者的听觉特性对应的频率特性的方式进行声音信号处理。因此，信号处理模块3根据该助听器1的使用者定制。另外，在信号处理模块3的侧面以相互对置的方式形成有圆筒状的圆筒凹部3a。此外，在信号处理模块3的侧面形成有在组装于立体电路基板10上时电压接的电极15。
另外，也可以通过在信号处理模块3上配备消除噪音的噪音消除功能而去除噪音。
扬声器模块4具备未图示的扬声器，将由信号处理模块3进行了声音信号处理的声音信号作为声音输出。扬声器模块4具备用于在立体电路基板10上组装的凸部4A。另外，在凸部4A上，在凸部4A的侧面以相互对置的方式形成有圆筒状的圆筒凹部4a。此外，在凸部4A的侧面形成有在组装于立体电路基板10上时电压接的电极15。
电源5是向构成该助听器1的各模块提供电源的例如电池等。电源5也可以是随着供给电源的下降而更换使用的1次电池或者能充电的蓄电池(2次电池)等。
立体电路基板10由以下步骤形成：将绝缘性基体材料11注塑成型为目标形状；形成薄膜；通过激光束去除需要的图案的轮廓部分的薄膜；在需要的图案部分电镀铜；通过软蚀刻去除多余的薄膜部分；按照镍、金的顺序电镀等而形成电路。还有，关于立体电路基板10之类的3维立体形状的基板的制造方法，已在日本特开平7-66533号公报中记载，因此省略详细的说明。
立体电路基板10通过注塑成型绝缘基体材料11，形成分别与话筒模块2的凸部2A、信号处理模块3、扬声器模块4的凸部4A相互组装的凹部10A、10B和10C。
在凹部10A的内壁上，形成有与话筒模块2的凸部2A的圆筒凹部2a嵌合的凸部10A1。由此，在凹部10A的内壁上形成的电极15和在凸部2A的侧面上形成的电极15彼此压接，同时立体电路基板10的凹部10A和话筒模块2的凸部2A嵌合。
另外，在凹部10B的内壁上，形成有与信号处理模块3的圆筒凹部3a嵌合的圆筒凸部10B1。由此，在凹部10B的内壁上形成的电极15和在信号处理模块3的侧面上形成的电极15彼此压接，同时立体电路基板10的凹部10B和信号处理模块3嵌合。
进而，在凹部10C的内壁上，形成有与扬声器模块4的凸部4A的圆筒凹部4a嵌合的圆筒凸部10C1。由此，在凹部10C的内壁上形成的电极15和在凸部4A的侧面上形成的电极15彼此压接，同时立体电路基板10的凹部10C和扬声器模块4的凸部4A嵌合。
另外，在立体电路基板10上形成有凹部10D，能够安装电池等电源5。此外，虽然没在图中表示，但是在立体电路基板10上形成有若干用于在立体电路基板10内延长连接电极15的通孔。由此，确保在立体电路基板10上组装的各模块间的电连接。
[第1实施方式的效果]
这样，作为本发明的第1实施方式表示的助听器1由于具备立体电路基板10，因此能够采用向立体电路基板10上组装各功能模块这一非常简易的方法形成。由于组装的方法简易，因此能够提高设备的品质和设备的可靠性。另外，由于不需要导线，因此不需要确保导线的空间，能够实现小型形状。
另外，信号处理模块3需要按照成为与使用者的听觉特性对应的频率特性的方式进行定制。因而，由于能够在不需要连接导线的立体电路基板10上简易组装，所以可以大幅缩短对用户检查听觉特性后才可作为商品输出的交付期。
[第2实施方式]
其次，说明作为本发明的第2实施方式表示的无线电接收器。虽然没在图中表示，但是作为本发明的第2实施方式表示的无线电接收器通过以下方式实现：将用图1、2说明的助听器1的话筒模块2作为接收向外部传播的电波的天线模块，将信号处理模块3作为接收任意频率的电波且能够解调所接收的电波的调谐模块。
当然，也可以直接在立体电路基板10上形成作为天线的电路，减少部件的数量且提高组装性。
[第2实施方式的效果]
这样，作为本发明的第2实施方式表示的无线电接收器由于具备立体电路基板10，因此能够采用向立体电路基板10上组装各功能模块这一非常简易的方法形成。由于组装的方法简易，因此能够提高设备的品质和设备的可靠性。另外，由于不需要导线，因此不需要确保导线的空间，能够实现小型形状。
[第3实施方式]
接着，说明作为本发明的第3实施方式表示的声音再生装置。虽然没在图中表示，但是作为本发明的第3实施方式表示的声音再生装置通过以下方式实现：将用图1、2说明的助听器1的话筒模块2作为安装模块，该安装模块具有可以安装能够存储声音信号的存储媒介的槽；将信号处理模块3作为再生模块，该再生模块读出在存储媒介中存储的声音信号，且能够解调所读出的声音信号并放大。
[第3实施方式的效果]
这样，作为本发明的第3实施方式表示的声音再生装置由于具备立体电路基板10，因此能够采用向立体电路基板10上组装各功能模块这一非常简易的方法形成。由于组装的方法简易，因此能够提高设备的品质和设备的可靠性。另外，由于不需要导线，因此不需要确保导线的空间，能够实现小型形状。
还有，所述实施方式是本发明的一个例子。因此，本发明并不局限于所述实施方式，也可以采用所述实施方式以外的方式，只要在不脱离本发明的技术思想的范围内，当然可以根据设计等做出各种变换。
产业上的可利用性
根据本发明，可以消除组装工序的复杂性，保证设备的品质和可靠性且实现小型形状。

Claims (4)

1.一种声音输出装置，其特征在于，具备：
电源，其向该声音输出装置提供电源；
信号处理机构，其具有第一电极，对从外部获得的声音信号实施规定的信号处理；
放大机构，其将已被所述信号处理机构信号处理过的声音信号放大；
输出机构，其具有第二电极，将已被所述放大机构放大的声音信号作为声音输出；
立体电路基板，其具备在组装所述电源、所述信号处理机构、所述放大机构、所述输出机构时与各形状对应的组装部位，且所述立体电路基板在所述组装部位具有电极，并且通过所述信号处理机构及所述输出机构向所述立体电路基板组装，而使该电极与所述第一电极及所述第二电极电压接。
2.根据权利要求1所述的声音输出装置，其特征在于，
具备从外部收集声音的集音机构，
所述信号处理机构对由所述集音机构从外部收集的声音实施规定的声音信号处理。
3.根据权利要求1所述的声音输出装置，其特征在于，
具备接收向外部传播的电波的接收机构，
所述信号处理机构对与由所述接收机构接收的电波重叠的声音信号实施规定的声音信号处理。
4.根据权利要求1所述的声音输出装置，其特征在于，
具备安装机构，所述安装机构对存储有声音信号的存储装置进行安装，
所述信号处理机构从安装于所述安装机构的存储装置中读出声音信号，且对读出的声音信号实施规定的声音信号处理。
CN2007800309009A 2006-09-29 2007-09-19 声音输出装置 Expired - Fee Related CN101507376B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006269767A JP2008091554A (ja) 2006-09-29 2006-09-29 音声出力装置
JP269767/2006 2006-09-29
PCT/JP2007/068125 WO2008041479A1 (fr) 2006-09-29 2007-09-19 Dispositif de sortie audio

Publications (2)

Publication Number Publication Date
CN101507376A CN101507376A (zh) 2009-08-12
CN101507376B true CN101507376B (zh) 2012-03-28

Family

ID=39268341

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800309009A Expired - Fee Related CN101507376B (zh) 2006-09-29 2007-09-19 声音输出装置

Country Status (6)

Country Link
US (1) US8150071B2 (zh)
EP (1) EP2063694A4 (zh)
JP (1) JP2008091554A (zh)
KR (1) KR101133796B1 (zh)
CN (1) CN101507376B (zh)
WO (1) WO2008041479A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007025080A1 (de) * 2007-05-30 2008-12-11 Siemens Medical Instruments Pte. Ltd. Hörgerätbauelementeträger mit Batterieaussparung
EP2910034B1 (en) 2012-10-22 2016-10-19 Sivantos Pte. Ltd. Routing building block for complex mid structures in hearing instruments
US9980062B2 (en) 2012-12-12 2018-05-22 Sivantos Pte. Ltd. Hearing aid and method for producing a hearing aid
EP2932559B1 (de) 2012-12-12 2021-09-22 Sivantos Pte. Ltd. Modulare antenne für hörgeräte
DE102013223209A1 (de) * 2013-11-14 2015-05-21 Siemens Aktiengesellschaft Basisleiterplatte, Modulleiterplatte und Leiterplattenanordnung mit einer Basisleiterplatte und einer Modulleiterplatte
US9906879B2 (en) * 2013-11-27 2018-02-27 Starkey Laboratories, Inc. Solderless module connector for a hearing assistance device assembly
US9913052B2 (en) * 2013-11-27 2018-03-06 Starkey Laboratories, Inc. Solderless hearing assistance device assembly and method
CN104363534B (zh) * 2014-10-20 2019-03-29 佳禾智能科技股份有限公司 一种新型耳机线控及其制备方法
JP6358132B2 (ja) * 2015-03-03 2018-07-18 オムロン株式会社 立体回路構造体
EP3086576B1 (en) * 2015-04-22 2021-09-01 Starkey Laboratories, Inc. Solderless module connector for a hearing assistance device assembly
CN106304718A (zh) * 2016-07-10 2017-01-04 安徽省挺辉钢管有限公司 具有绝缘功能的信号柜连接板
US11206499B2 (en) 2016-08-18 2021-12-21 Qualcomm Incorporated Hearable device comprising integrated device and wireless functionality
WO2020153937A1 (en) * 2019-01-22 2020-07-30 Siemens Aktiengesellschaft Integrated no-solder snap-fit electronic component bays for non-traditional pcbs and am structures
JP2022526373A (ja) * 2019-03-29 2022-05-24 ナノ ディメンション テクノロジーズ，リミテッド 側部取付された構成部品を有する付加製造電子（ａｍｅ）回路
CN110996512B (zh) * 2019-12-30 2022-03-04 展讯通信（上海）有限公司 一种印制电路板及其制作方法、终端
JP2022160334A (ja) * 2021-04-06 2022-10-19 キヤノン株式会社 ベース部材

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2165579Y (zh) * 1993-07-22 1994-05-18 朱一兵 无线电子语音导游装置
CN2591913Y (zh) * 2002-12-16 2003-12-10 四川微迪数字技术有限公司 全数字助听器
CN1619610A (zh) * 2004-11-18 2005-05-25 李振刚 自动语音讲解系统
CN1681278A (zh) * 2004-04-07 2005-10-12 明基电通股份有限公司 具有音量调整助听器功能的移动通讯耳机及其方法
CN2847765Y (zh) * 2004-11-22 2006-12-13 丁晋辰 大功率耳背式助听器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB357171A (en) 1930-06-10 1931-09-10 Paragon Rubber Mfg Company Ltd Improvements in and relating to wireless and like electrical apparatus
JPH05335995A (ja) * 1992-06-02 1993-12-17 Fujitsu Ltd 携帯形通信装置
JP3153682B2 (ja) 1993-08-26 2001-04-09 松下電工株式会社 回路板の製造方法
US20010040973A1 (en) * 1997-03-12 2001-11-15 Sarnoff Corporation Hearing aid with tinted components
DE19825998C2 (de) * 1998-06-10 2003-01-30 Siemens Audiologische Technik Am Kopf tragbares Hörgerät
JP2001068867A (ja) * 1999-08-30 2001-03-16 Hitachi Kokusai Electric Inc 光中継器の構造
US6456720B1 (en) 1999-12-10 2002-09-24 Sonic Innovations Flexible circuit board assembly for a hearing aid
JP2002076649A (ja) * 2000-08-30 2002-03-15 Pentel Corp 指向性電子機器の位置決め機構
EP1966852B1 (en) * 2005-12-19 2010-09-01 Nxp B.V. Radio receiver, radio transmitter, and hearing aid
JP4103920B2 (ja) 2006-07-31 2008-06-18 松下電工株式会社 立体回路基板並びに指紋センサ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2165579Y (zh) * 1993-07-22 1994-05-18 朱一兵 无线电子语音导游装置
CN2591913Y (zh) * 2002-12-16 2003-12-10 四川微迪数字技术有限公司 全数字助听器
CN1681278A (zh) * 2004-04-07 2005-10-12 明基电通股份有限公司 具有音量调整助听器功能的移动通讯耳机及其方法
CN1619610A (zh) * 2004-11-18 2005-05-25 李振刚 自动语音讲解系统
CN2847765Y (zh) * 2004-11-22 2006-12-13 丁晋辰 大功率耳背式助听器

Also Published As

Publication number Publication date
US20100183169A1 (en) 2010-07-22
EP2063694A1 (en) 2009-05-27
KR101133796B1 (ko) 2012-04-05
US8150071B2 (en) 2012-04-03
JP2008091554A (ja) 2008-04-17
KR20090031632A (ko) 2009-03-26
WO2008041479A1 (fr) 2008-04-10
EP2063694A4 (en) 2010-09-22
CN101507376A (zh) 2009-08-12

Similar Documents

Publication Publication Date Title
CN101507376B (zh) 声音输出装置
KR100795306B1 (ko) 귓속 보청기용 페이스 플레이트의 제조방법
EP1303164A3 (en) Microphone having a flexible printed circuit board for mounting components
US9439007B2 (en) Hearing instrument having a routing building block for complex mid structures
US20130148837A1 (en) Multi-functional microphone assembly and method of manufacturing the same
US20080192967A1 (en) Circuit arrangement with bonded SMD component
CN1669355B (zh) 助听器或类似听觉装置和助听器制造方法
US20110188694A1 (en) variable directional microphone assembly and method of making the microphone assembly
CN109348385A (zh) 一种具有回声消声系统的麦克风及电子设备
KR101476401B1 (ko) 일체형 전자부품 모듈을 갖는 보청기
CN209390369U (zh) 一种具有回声消声系统的麦克风及电子设备
US20080298617A1 (en) Hearing aid component holder with battery cavity
EP1688015B1 (en) Electro-acoustic transducer comprising an electronic circuit
CN217721438U (zh) 入耳式耳机的电路结构及入耳式耳机
EP2324643B1 (en) Hearing aid faceplate arrangement
CN219697860U (zh) 一种mems半导体多单元喇叭模组及耳机
CN214507384U (zh) 颈挂式音箱助听器
CN218587330U (zh) 一种硅麦克风
US20180317032A1 (en) Method for producing a supporting frame of a hearing aid, supporting frame and hearing aid
CN218772363U (zh) 入耳式耳机
JP4359600B2 (ja) 接続モジュールと耳かけ形補聴器
US20230300546A1 (en) Hearing device
US8548183B2 (en) Hearing device with individually aligned electronic component and production method
US5056151A (en) Electrical component connection and combinations of electrical components
JPWO2019197568A5 (zh)

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120328

Termination date: 20210919