CN101500347A - 电热膜接电方法 - Google Patents

电热膜接电方法 Download PDF

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Publication number
CN101500347A
CN101500347A CNA2009101058066A CN200910105806A CN101500347A CN 101500347 A CN101500347 A CN 101500347A CN A2009101058066 A CNA2009101058066 A CN A2009101058066A CN 200910105806 A CN200910105806 A CN 200910105806A CN 101500347 A CN101500347 A CN 101500347A
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Prior art keywords
heating film
electric heating
film carrier
groove
radiant heating
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CN101500347B (zh
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罗日良
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Guangdong Huijing New Energy Technology Co ltd
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SHENZHEN GTOPS ELECTRIC TECHNOLOGY Co Ltd
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Priority to CN2009101058066A priority Critical patent/CN101500347B/zh
Publication of CN101500347A publication Critical patent/CN101500347A/zh
Priority to US13/254,581 priority patent/US8333315B2/en
Priority to SG2011063807A priority patent/SG174253A1/en
Priority to CA2754265A priority patent/CA2754265A1/en
Priority to PCT/CN2010/000255 priority patent/WO2010099697A1/zh
Priority to RU2011137934/07A priority patent/RU2516240C2/ru
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/84Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016Heaters using particular connecting means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1052Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062Prior to assembly
    • Y10T156/1064Partial cutting [e.g., grooving or incising]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)

Abstract

本发明公开了一种电热膜接电方法,其包括以下步骤:首先在电热膜载体上开槽;接着将连接导线的一端放置于槽内;然后将导电胶灌入槽内;最后对电热膜载体进行加热,使电热膜载体刚好熔化并将连接导线和导电胶融合为一体;待电热膜载体冷却、导电胶固化即可。本发明所述电热膜载体为玻璃、陶瓷、搪瓷、云母、石英、微晶玻璃等各种电介质材料。所述电热膜载体的两侧涂覆有层状电极,所述层状电极与电热膜串联。所述槽设在层状电极中部,该槽为圆环槽。所述连接导线为纯银线。所述导电胶为银胶。通过上述方法制成的电热膜载体与连接导线连接非常牢固,可靠性大幅提高。

Description

电热膜接电方法
【技术领域】
本发明涉及一种电热膜接电方法,尤指一种纳米高温半导体电热膜接电方法。
【背景技术】
连接导线起到对电热膜提供以电源的作用,对整个电路构成回路,其与电热膜载体连接得牢不牢关系到整个产品的可靠性。现有技术,一般是通过连接卡将连接导线卡接在电热膜上,这种卡接方式工艺较复杂,连接导线与电热膜之间连接也不牢靠。
【发明内容】
本发明所要解决的技术问题是:针对现有技术存在的问题,提供一种将连接导线固接在电热膜载体上的方法,它们之间连接更加牢靠。
为解决上述技术问题,本发明所采用的技术方案是:
电热膜接电方法,其包括以下步骤:
a)在电热膜载体上开槽;
b)将连接导线的一端放置于槽内;
c)槽内灌入导电胶;
d)对电热膜载体进行加热,使电热膜载体刚好熔化并将连接导线和导电胶融合为一体;
e)待电热膜载体冷却、导电胶固化即可。
上述技术方案的进一步改进在于:
所述电热膜载体为玻璃、陶瓷、搪瓷、云母、石英、微晶玻璃等各种电介质材料。
所述电热膜载体的两侧涂覆有层状电极,所述层状电极与电热膜串联。
所述槽设在层状电极中部,该槽为圆环槽。
所述连接导线为纯银线。
所述导电胶为银浆。
本发明的有益效果是:通过上述方法制成的电热膜载体与连接导线连接非常牢固,可靠性大幅提高。
【附图说明】
图1为电热膜载体示意图。
图2为电热膜载体开槽后的示意图。
图3为连接导线放置于电热膜载体槽内的示意图。
图4为电热膜载体槽内灌入导电胶后的示意图。
下面结合附图对本发明做进一步描述:
【具体实施方式】
如图所示,电热膜载体1表面涂覆有一层电热膜,所述电热膜载体可以为玻璃、陶瓷、搪瓷、云母、石英、微晶玻璃等各种电介质材料。电热膜载体的两侧涂覆有层状电极2、3,所述层状电极2、3与电热膜串联。
本发明所述方法如下:首先在电热膜载体上层状电极2、3中部开槽,该槽优选圆环槽4,亦可为“V”形槽,或方形槽。接着将连接导线5的一端放置于所述圆环槽4内,本发明所述连接导线5优选纯银线。然后将导电胶6灌入所述圆环槽4内,灌满为止,所述导电胶优选银浆。最后在圆环槽4附近对电热膜载体进行加热,使电热膜载体刚好熔化并将连接导线5的端部和导电胶6融合为一体;待电热膜载体冷却、导电胶固化即可。通过上述方法制成的电热膜载体与连接导线连接非常牢固,可靠性大幅提高。
本发明的保护范围并不限于上述实施例。只要将连接导线的一端放置于电热膜载体的凹槽内,接着将导电胶灌入凹槽,然后通过加热使连接导线的端部与电热膜载体和导电胶融合为一体,最后冷却、固化,就属于本发明的保护范围。

Claims (7)

1、电热膜接电方法,其包括以下步骤:
a)在电热膜载体(1)上开槽;
b)将连接导线(5)的一端放置于槽内;
c)槽内灌入导电胶(6);
d)对电热膜载体进行加热,使电热膜载体(1)刚好熔化并将连接导线(5)和导电胶(6)融合为一体;
e)待电热膜载体冷却、导电胶固化即可。
2、如权利要求1所述的电热膜接电方法,其特征在于:所述电热膜载体(1)为玻璃、陶瓷、搪瓷、云母、石英、微晶玻璃等各种电介质材料。
3、如权利要求2所述的电热膜接电方法,其特征在于:所述电热膜载体(1)的两侧涂覆有层状电极(2、3),所述层状电极(2、3)与电热膜串联。
4、如权利要求3所述的电热膜接电方法,其特征在于:所述槽设在层状电极(2、3)中部,该槽为圆环槽(4)。
5、如权利要求1~4中任何一项所述的电热膜接电方法,其特征在于:所述连接导线(5)为纯银线。
6、如权利要求1~4中任何一项所述的电热膜接电方法,其特征在于:所述导电胶(6)为银浆。
7、如权利要求5所述的电热膜接电方法,其特征在于:所述导电胶(6)为银浆。
CN2009101058066A 2009-03-03 2009-03-03 电热膜接电方法 Active CN101500347B (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN2009101058066A CN101500347B (zh) 2009-03-03 2009-03-03 电热膜接电方法
US13/254,581 US8333315B2 (en) 2009-03-03 2010-03-03 Method for connecting conducting wire to electric heating film
SG2011063807A SG174253A1 (en) 2009-03-03 2010-03-03 Method for connecting conducting wire to electric heating film
CA2754265A CA2754265A1 (en) 2009-03-03 2010-03-03 Method for connecting conducting wire to electric heating film
PCT/CN2010/000255 WO2010099697A1 (zh) 2009-03-03 2010-03-03 连接导线到电热膜上的方法
RU2011137934/07A RU2516240C2 (ru) 2009-03-03 2010-03-03 Способ присоединения электрической нагревательной пленки к источнику питания

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CN (1) CN101500347B (zh)
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SG (1) SG174253A1 (zh)
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WO2010099697A1 (zh) * 2009-03-03 2010-09-10 深圳市格普斯纳米电热科技有限公司 连接导线到电热膜上的方法
CN102244944A (zh) * 2011-04-06 2011-11-16 中山市格普斯纳米电热科技有限公司 微晶/陶瓷电热板的导线固定方法
CN103997805A (zh) * 2013-08-26 2014-08-20 Kmt纳米科技有限公司 一种远红外纳米电热膜片加热圈
CN103997800A (zh) * 2013-08-26 2014-08-20 Kmt纳米科技有限公司 一种远红外纳米电热膜电极盲孔与导线连接工艺
CN104105237A (zh) * 2014-07-23 2014-10-15 中国科学院国家天文台南京天文光学技术研究所 望远镜镜面的导电薄膜多相交流电加热方法
CN107277949A (zh) * 2017-07-31 2017-10-20 广东美的环境电器制造有限公司 电热膜接线方法和电热膜
CN107689492A (zh) * 2017-07-25 2018-02-13 深圳安培龙科技股份有限公司 一种应用于传感器的电极银浆封装结构
CN110401989A (zh) * 2019-08-16 2019-11-01 西安工业大学 提高微晶玻璃基底上薄膜电极引出线工作稳定性的方法
CN112229948A (zh) * 2020-09-15 2021-01-15 华帝股份有限公司 一种氧传感器及其制作工艺和家用电器

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WO2010099697A1 (zh) * 2009-03-03 2010-09-10 深圳市格普斯纳米电热科技有限公司 连接导线到电热膜上的方法
CN102244944A (zh) * 2011-04-06 2011-11-16 中山市格普斯纳米电热科技有限公司 微晶/陶瓷电热板的导线固定方法
CN103997805A (zh) * 2013-08-26 2014-08-20 Kmt纳米科技有限公司 一种远红外纳米电热膜片加热圈
CN103997800A (zh) * 2013-08-26 2014-08-20 Kmt纳米科技有限公司 一种远红外纳米电热膜电极盲孔与导线连接工艺
CN104105237A (zh) * 2014-07-23 2014-10-15 中国科学院国家天文台南京天文光学技术研究所 望远镜镜面的导电薄膜多相交流电加热方法
CN107689492A (zh) * 2017-07-25 2018-02-13 深圳安培龙科技股份有限公司 一种应用于传感器的电极银浆封装结构
CN107277949A (zh) * 2017-07-31 2017-10-20 广东美的环境电器制造有限公司 电热膜接线方法和电热膜
CN107277949B (zh) * 2017-07-31 2020-09-01 广东美的环境电器制造有限公司 电热膜接线方法和电热膜
CN110401989A (zh) * 2019-08-16 2019-11-01 西安工业大学 提高微晶玻璃基底上薄膜电极引出线工作稳定性的方法
CN110401989B (zh) * 2019-08-16 2024-01-26 西安工业大学 提高微晶玻璃基底上薄膜电极引出线工作稳定性的方法
CN112229948A (zh) * 2020-09-15 2021-01-15 华帝股份有限公司 一种氧传感器及其制作工艺和家用电器

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US20110315312A1 (en) 2011-12-29
WO2010099697A1 (zh) 2010-09-10
RU2011137934A (ru) 2013-03-20
CN101500347B (zh) 2012-10-31
SG174253A1 (en) 2011-10-28
US8333315B2 (en) 2012-12-18
CA2754265A1 (en) 2010-09-10
RU2516240C2 (ru) 2014-05-20

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