CN101437357B - Welding pad structure for printed circuit board and method for forming the same - Google Patents
Welding pad structure for printed circuit board and method for forming the same Download PDFInfo
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- CN101437357B CN101437357B CN2007101866209A CN200710186620A CN101437357B CN 101437357 B CN101437357 B CN 101437357B CN 2007101866209 A CN2007101866209 A CN 2007101866209A CN 200710186620 A CN200710186620 A CN 200710186620A CN 101437357 B CN101437357 B CN 101437357B
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- circuit board
- pad structure
- printed circuit
- pcb
- weld pad
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Abstract
The invention discloses a weld pad structure for a printed circuit board and a method for forming the same. The weld pad structure is provided with a plurality of extending parts and hollowed-out zones between the extending parts, the prior large-piece copper foils are replaced by a plurality of small-piece copper foils which are mutually spaced, so that the surface of the weld pad structure is even and flat, and the weld pad structure is easy to weld firmly, and can avoid the phenomena of poor welding and tilting of element pins. In addition, the invention also provides a method for forming the weld pad structure of the printed circuit board, wherein the weld pad structure with a preset shape is formed in the prior designing and etching processes of the weld pad structure in the circuit pattern, so that the weld pad structure with the effects for the printed circuit board is formed on the basis of not increasing manufacture cost and time.
Description
Technical field
The present invention relates to a printed circuit board (PCB), more detailed it, relate to and a kind ofly have special shape preventing the welding pad structure of phenomenons such as failure welding, the perk of soldered elements pin, and do not increase the welding pad structure formation method that cost of manufacture and Production Time form this welding pad structure.
Background technology
Along with printed circuit board (PCB) towards high-density wiring (1ayout), composite multi-layer, the structure essence is little, powerful and direction such as thin plateization develops, how in the PCB design process, to fully take into account the formedness of electric connection, integrality during with the transmission of assurance signal, and take effective control measure, become the heat subject in the current PCB design industry.And, more seem particularly important as connection medium--the welding pad structure of printed circuit board (PCB) in order to soldering of electronic components.
Printed circuit board (PCB) is laid one deck Copper Foil in printed circuit board surface earlier by the circuit board supplier usually in manufacturing process at present, forms the circuit pattern that designs in advance with etched mode then on this Copper Foil, for follow-up reprocessing.Wherein, this circuit pattern that is formed by Copper Foil has many welding pad structures in order to soldering of electronic components, sees also Figure 1A and Figure 1B, is to show existing printed circuit board weld pad structural upright sectional view and front plan view.As shown in the figure, printed circuit board (PCB) has substrate 10 and is layed on this substrate 10 for the copper foil layer 11 that forms circuit pattern 110, existing in the above-mentioned welding pad structure needs by large stretch of Copper Foil 114 welding pad structure of weld pad entity 111 with these circuit pattern 110 electric connections, be electrically connected in this circuit pattern 110 to reach the electronic component that to be welded on this welding pad structure, finish predetermined circuit function.
Yet, because circuit board surface that the supplier provides is equipped with the printed circuit board (PCB) of Copper Foil, the Copper Foil that lay on its surface is also evenly smooth inadequately, if directly form welding pad structure in etching with this Copper Foil, carry out soldering of electronic components, can make this electronic component failure welding, even the pin of welding can perk; In addition, because when this welding pad structure that etching is formed is electroplated, the speed and the electric field strength of plated material deposition have direct relation, and electric field strength changes with the graphics shape of plating, the position relation of electrode, the Copper Foil of generally electroplating is thin more, and the end is sharp more, and is just big more with the near more electric field strength of the distance of electrode, so the electrodeposited coating at this position is just thick more.So, these sheet Copper Foil 114 areas are bigger, and large-area Copper Foil is very big at interval with the distance of electrode, and the varied in thickness of Copper Foil is very big, so the uniformity of Copper Foil is not high.So follow-up when this weld pad entity 111 upper surfaces are electroplated, the electrodeposited coating that also can make the surface form is evenly smooth inadequately, thereby make this electronic component failure welding, even the pin of welding meeting perk, form " gravestone " phenomenon, have a strong impact on the electric connection of entire circuit pattern, the quality of whole printed circuit board (PCB) is descended, even scrap.
In addition, if desire is carried out manual setting to situations such as above-mentioned generation failure welding, welding pin perks, then need this welding pad structure is done individual processing, because the monoblock printed circuit board (PCB) can produce multiple welding pad structure usually, so not only increased manpower, and had a strong impact on operating efficiency.
Therefore, how to overcome the defective of above-mentioned background technology, welding pad structure of a kind of printed circuit board (PCB) and forming method thereof is provided, so that the welding pad structure surface is evenly smooth, be easy to welding and firm welding, avoid producing phenomenons such as failure welding, component pin perk and occur; Do not increase cost of manufacture and Production Time, real is present institute problem demanding prompt solution.
Summary of the invention
In view of the defective of above-mentioned prior art, a purpose of the present invention is to provide a kind of welding pad structure of printed circuit board (PCB), makes the welding pad structure surface evenly smooth, is easy to welding and firm welding, avoids producing phenomenons such as failure welding, component pin perk and occurs.
Another object of the present invention is to provide a kind of welding pad structure formation method of printed circuit board (PCB), do not increase cost of manufacture and time.
For reaching above-mentioned and other purpose, the present invention promptly provides a kind of welding pad structure of printed circuit board (PCB), be applied to the printed circuit board (PCB) that has substrate and be located at the circuit pattern on this substrate, the welding pad structure of this printed circuit board (PCB) comprises: the weld pad body, be formed at this substrate surface, and have a plurality of extensions that electrically connect with this circuit pattern; The hollow out zone is formed at respectively between this extension; And electrodeposited coating, be formed at this weld pad body upper surface.
Wherein, this extension is to be " T " font, " individual " font, one of them person of " Y " i section structure; And this electrodeposited coating is the copper material electroplated structural.
For reaching above-mentioned and other purpose, the present invention also provides a kind of welding pad structure formation method of printed circuit board (PCB), be used to form welding pad structure in having substrate and being layed on this substrate printed circuit board (PCB) for the copper foil layer that forms circuit pattern, the step of the welding pad structure method of formationing of this printed circuit board (PCB) comprises: the weld pad pattern that has reservation shape in this copper foil layer surface formation; Form this circuit pattern and form the weld pad body according to this weld pad pattern in the lump in this copper foil layer upper surface simultaneously in this copper foil layer surface, and this weld pad body has a plurality of extensions that electrically connect with this circuit pattern, and respectively forms the hollow out zone between this extension; And apply electrodeposited coating in this weld pad body surface with plated material.
The welding pad structure of this printed circuit board (PCB) by etched mode in this copper foil layer upper surface, the weld pad body that forms this circuit pattern and electrically connect with this circuit pattern.And this extension is to be " T " font, " individual " font, one of them person of " Y " font; The material of this electrodeposited coating is a copper.
Than prior art, the welding pad structure of printed circuit board (PCB) of the present invention, a kind of welding pad structure with special shape is provided, have a plurality of extensions and the hollow out zone between this extension respectively in the welding pad structure by the invention described above, the Copper Foil that existing large stretch of Copper Foil is separated to each other with a plurality of small pieces replaces, make the welding pad structure surface evenly smooth, thereby be easy to firm welding, avoid producing phenomenons such as failure welding, component pin perk and occur; In addition, the welding pad structure formation method of printed circuit board (PCB) of the present invention, be in existing design circuit pattern when welding pad structure and etching process, formation has the welding pad structure of reservation shape, thereby on the basis that does not increase cost of manufacture and time, form the welding pad structure of printed circuit board (PCB) with above-mentioned effect.
Description of drawings
Figure 1A is existing printed circuit board weld pad structural upright sectional view;
Figure 1B shows existing printed circuit board weld pad structure front plan view;
Fig. 2 A is the welding pad structure perspective, cut-away view of printed circuit board (PCB) of the present invention;
Fig. 2 B is the welding pad structure front plan view that shows printed circuit board (PCB) of the present invention; And
Fig. 3 A to Fig. 3 C is that the welding pad structure that shows printed circuit board (PCB) of the present invention forms the method step schematic diagram.
The main element symbol description:
10,20 substrates
11,21 copper foil layers
110,210 circuit patterns
111,211 weld pad bodies
114 large stretch of Copper Foils
212 weld pad patterns
213 hollow out zones
215 electrodeposited coatings
2111 stretch portion
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed.The present invention also can be implemented or be used by other different specific embodiment, and each details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
See also Fig. 2 A-Fig. 2 B, wherein, Fig. 2 A is the perspective, cut-away view that shows the welding pad structure of printed circuit board (PCB) of the present invention.As shown in the figure, this printed circuit board (PCB) (Printed CircuitBoard, PCB) has substrate 20 and be located at circuit pattern 210 on this substrate 20, wherein, this circuit pattern 210 is to design by related software, and copper foil layer 21 etchings of being laid by this substrate 20 surfaces form, and have certain circuit function.The welding pad structure of this printed circuit board (PCB) comprises weld pad body 211, hollow out zone 213, electrodeposited coating 215.
This weld pad body 211, Copper Foil with reservation shape is formed at this substrate 20 upper surfaces, promptly this weld pad body 211 is etched to the copper foil structure of this reservation shape for this copper foil layer 21, and this weld pad body 211 has a plurality of extensions 2111 that electrically connect with this circuit pattern 210, is electrically connected at this circuit pattern 210 to guarantee the electronic installation that is welded on this welding pad structure.Seeing also Fig. 2 B, is the welding pad structure front plan view that shows printed circuit board (PCB) of the present invention, and as shown in the figure, in present embodiment, this reservation shape is " T " font, and promptly this weld pad body 211 is " T " font.In addition, in other embodiment, this reservation shape can be " individual " font or " Y " font.
This hollow out zone 213 is formed at respectively between this extension 2111, promptly when etching, the copper foil layer 21 between this extension 2111 is respectively etched away, and Copper Foil that this welding pad structure place is large stretch of originally becomes the structure that is formed by a plurality of fritter Copper Foils.
This electrodeposited coating 215 is plated on this weld pad body 211 upper surfaces.In present embodiment, the material of this electrodeposited coating 215 is a copper, promptly is placed on this weld pad body 211 upper surfaces with the copper product electroplating.
Seeing also Fig. 3 A-Fig. 3 C, is that the welding pad structure that shows printed circuit board (PCB) of the present invention forms the method step schematic diagram.The welding pad structure formation method of printed circuit board (PCB) of the present invention, be to be used to form welding pad structure on this printed circuit board (PCB), wherein, this printed circuit board (PCB) has substrate 20 and is layed on this substrate for the copper foil layer 21 that forms circuit pattern 210, as shown in Figure 3A, in the default weld pad pattern 212 of these copper foil layer 21 upper surfaces with reservation shape, for example, utilize the associated circuit board design software when the design welding pad structure, it is designed to this reservation shape, and in present embodiment, this reservation shape is " T " font, and in other embodiment, this reservation shape can be " individual " font or " Y " font.
Shown in Fig. 3 B, when etching forms this circuit pattern 210, shape according to this weld pad pattern 212, form weld pad body 211 in these copper foil layer 21 upper surfaces etching in the lump, and this weld pad body 211 has a plurality of extensions 2111 that electrically connect with this circuit pattern 210, and etch away the respectively Copper Foil between this extension 2111, and form hollow out zone 213.
Shown in Fig. 3 C, apply electrodeposited coating 215 in these weld pad body 211 upper surfaces with plated material, shown in stain among the figure, owing to have the hollow out zone 213 that forms between this extension 2111 and this extension 2111, thereby make large stretch of originally Copper Foil become the Copper Foil of small pieces, when the copper foil surface of these small pieces is electroplated,, thereby make the surface evenly smooth with diminishing of electrode apart from the interval.
In sum, the welding pad structure of printed circuit board (PCB) of the present invention, welding pad structure of a kind of printed circuit board (PCB) and forming method thereof is provided, by having a plurality of extensions and the hollow out zone between this extension respectively in the above-mentioned welding pad structure, the Copper Foil that existing large stretch of Copper Foil is separated to each other with a plurality of small pieces replaces, make the welding pad structure surface evenly smooth, thereby be easy to firm welding, avoid producing phenomenons such as failure welding, component pin perk and occur; In addition, the present invention provides a kind of welding pad structure formation method of printed circuit board (PCB) again, be in existing design circuit pattern when welding pad structure and etching process, formation has the welding pad structure of the present invention of reservation shape, thereby on the basis that does not increase cost of manufacture and time, form the welding pad structure of printed circuit board (PCB) with above-mentioned effect.
The foregoing description only is illustrative principle of the present invention and effect thereof, but not is used to limit the present invention, that is the present invention in fact still can do other change.Therefore, any those skilled in the art all can make amendment to the foregoing description under spirit of the present invention and category.Therefore the scope of the present invention should be foundation with the scope of claims.
Claims (7)
1. the welding pad structure of a printed circuit board (PCB) is applied to the printed circuit board (PCB) that has substrate and be located at the circuit pattern on this substrate, and the welding pad structure of this printed circuit board (PCB) comprises:
The weld pad body is formed at this substrate surface, and has a plurality of extensions that electrically connect with this circuit pattern;
The hollow out zone is formed at respectively between this extension; And
Electrodeposited coating is formed at this weld pad body surface.
2. the welding pad structure of printed circuit board (PCB) according to claim 1, wherein, this extension is to be " T " font, " individual " font, one of them person of " Y " i section structure.
3. the welding pad structure of printed circuit board (PCB) according to claim 1, wherein, this electrodeposited coating is the copper product electroplated structural.
4. the welding pad structure formation method of a printed circuit board (PCB) is applied to form welding pad structure in having substrate and being layed on this substrate for the printed circuit board (PCB) of the copper foil layer that forms circuit pattern, and the step of the welding pad structure formation method of this printed circuit board (PCB) comprises:
Form weld pad pattern in this copper foil layer surface with reservation shape;
Form this circuit pattern and form the weld pad body according to this weld pad pattern in the lump in this copper foil layer surface simultaneously in this copper foil layer surface, and this weld pad body has a plurality of extensions that electrically connect with this circuit pattern, and respectively form the hollow out zone between this extension; And
Apply electrodeposited coating in this weld pad body surface with plated material.
5. the welding pad structure formation method of printed circuit board (PCB) according to claim 4, wherein, this extension is to be " T " font, " individual " font, one of them person of " Y " i section structure.
6. the welding pad structure formation method of printed circuit board (PCB) according to claim 4, this circuit pattern and with weld pad body that this circuit pattern electrically connects be in this copper foil layer upper surface by etched mode.
7. the welding pad structure formation method of printed circuit board (PCB) according to claim 4, wherein, the material of this electrodeposited coating is for being copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101866209A CN101437357B (en) | 2007-11-14 | 2007-11-14 | Welding pad structure for printed circuit board and method for forming the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101866209A CN101437357B (en) | 2007-11-14 | 2007-11-14 | Welding pad structure for printed circuit board and method for forming the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101437357A CN101437357A (en) | 2009-05-20 |
| CN101437357B true CN101437357B (en) | 2010-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101866209A Expired - Fee Related CN101437357B (en) | 2007-11-14 | 2007-11-14 | Welding pad structure for printed circuit board and method for forming the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101437357B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102529330B (en) * | 2011-12-26 | 2014-03-12 | 江苏劲嘉新型包装材料有限公司 | Irregular gilding copper plate of packing material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1494369A (en) * | 2002-09-14 | 2004-05-05 | Lg电子株式会社 | Electroplating method of prited circuit board |
| CN2847794Y (en) * | 2005-07-28 | 2006-12-13 | 威盛电子股份有限公司 | Circuit board with electroplating conductor |
-
2007
- 2007-11-14 CN CN2007101866209A patent/CN101437357B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1494369A (en) * | 2002-09-14 | 2004-05-05 | Lg电子株式会社 | Electroplating method of prited circuit board |
| CN2847794Y (en) * | 2005-07-28 | 2006-12-13 | 威盛电子股份有限公司 | Circuit board with electroplating conductor |
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| Publication number | Publication date |
|---|---|
| CN101437357A (en) | 2009-05-20 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Tao Qisheng Inventor after: Dong Rongrong Inventor after: Hu Yuehong Inventor after: He Yunlian Inventor after: Zou Qiufang Inventor after: Hu Chengfen Inventor before: Feng Dongfang Inventor before: Fan Wengang |
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| TR01 | Transfer of patent right |
Effective date of registration: 20170531 Address after: Guangdong province Dongguan Dongkeng Plainvim Industrial Park Patentee after: Dongguan Staci Industrial Co., Ltd. Address before: Taipei City, Taiwan, China Patentee before: Inventec Corporation |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100714 Termination date: 20171114 |