CN101410844B - 用晶片均匀性控制进行动态计量采样 - Google Patents

用晶片均匀性控制进行动态计量采样 Download PDF

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Publication number
CN101410844B
CN101410844B CN200780011392XA CN200780011392A CN101410844B CN 101410844 B CN101410844 B CN 101410844B CN 200780011392X A CN200780011392X A CN 200780011392XA CN 200780011392 A CN200780011392 A CN 200780011392A CN 101410844 B CN101410844 B CN 101410844B
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wafer
map
processing
data
measurement
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CN101410844A (zh
Inventor
麦里特·法克
拉哈·桑达拉拉简
丹尼尔·帕格
韦斯利·纳特勒
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Tokyo Electron Ltd
International Business Machines Corp
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Tokyo Electron Ltd
International Business Machines Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN200780011392XA 2006-03-28 2007-01-24 用晶片均匀性控制进行动态计量采样 Active CN101410844B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/390,415 2006-03-28
US11/390,415 US20070238201A1 (en) 2006-03-28 2006-03-28 Dynamic metrology sampling with wafer uniformity control
PCT/US2007/060953 WO2007117737A2 (en) 2006-03-28 2007-01-24 Dynamic metrology sampling with wafer uniformity control

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CN101410844A CN101410844A (zh) 2009-04-15
CN101410844B true CN101410844B (zh) 2011-08-03

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CN200780011392XA Active CN101410844B (zh) 2006-03-28 2007-01-24 用晶片均匀性控制进行动态计量采样

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US (1) US20070238201A1 (https=)
JP (1) JP5028473B2 (https=)
KR (1) KR101311640B1 (https=)
CN (1) CN101410844B (https=)
TW (1) TWI393169B (https=)
WO (1) WO2007117737A2 (https=)

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JP7408421B2 (ja) * 2020-01-30 2024-01-05 株式会社Ｓｃｒｅｅｎホールディングス 処理条件特定方法、基板処理方法、基板製品製造方法、コンピュータープログラム、記憶媒体、処理条件特定装置、及び、基板処理装置
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Also Published As

Publication number Publication date
WO2007117737A2 (en) 2007-10-18
JP5028473B2 (ja) 2012-09-19
KR101311640B1 (ko) 2013-09-25
TW200741810A (en) 2007-11-01
KR20080111105A (ko) 2008-12-22
JP2009531866A (ja) 2009-09-03
US20070238201A1 (en) 2007-10-11
CN101410844A (zh) 2009-04-15
TWI393169B (zh) 2013-04-11
WO2007117737A3 (en) 2008-04-17

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