CN101356638B - 半导体装置和半导体装置的制造方法 - Google Patents

半导体装置和半导体装置的制造方法 Download PDF

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CN101356638B
CN101356638B CN2007800013688A CN200780001368A CN101356638B CN 101356638 B CN101356638 B CN 101356638B CN 2007800013688 A CN2007800013688 A CN 2007800013688A CN 200780001368 A CN200780001368 A CN 200780001368A CN 101356638 B CN101356638 B CN 101356638B
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film
fluorine
gas
silicon
oxygen
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CN101356638A (zh
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菊地良幸
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • General Chemical & Material Sciences (AREA)
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  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
CN2007800013688A 2006-03-31 2007-03-27 半导体装置和半导体装置的制造方法 Expired - Fee Related CN101356638B (zh)

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JP2006099770A JP5119606B2 (ja) 2006-03-31 2006-03-31 半導体装置及び半導体装置の製造方法
JP099770/2006 2006-03-31
PCT/JP2007/056447 WO2007116758A1 (ja) 2006-03-31 2007-03-27 半導体装置及び半導体装置の製造方法

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CN101356638B true CN101356638B (zh) 2010-12-01

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EP (1) EP2003687A4 (enExample)
JP (1) JP5119606B2 (enExample)
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WO (1) WO2007116758A1 (enExample)

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Publication number Priority date Publication date Assignee Title
JP5700513B2 (ja) * 2010-10-08 2015-04-15 国立大学法人東北大学 半導体装置の製造方法および半導体装置
JP5364765B2 (ja) 2011-09-07 2013-12-11 東京エレクトロン株式会社 半導体装置及び半導体装置の製造方法
JP2013058559A (ja) * 2011-09-07 2013-03-28 Tokyo Electron Ltd 半導体装置の製造方法及び基板処理システム
JP2014036148A (ja) * 2012-08-09 2014-02-24 Tokyo Electron Ltd 多層膜をエッチングする方法、及びプラズマ処理装置
CN102881611B (zh) * 2012-10-12 2015-05-20 上海华力微电子有限公司 晶圆电性测试的方法
CN104752400B (zh) * 2013-12-31 2019-06-04 中芯国际集成电路制造(上海)有限公司 互连介质层、其制作方法及包括其的半导体器件
JP6523091B2 (ja) 2015-07-24 2019-05-29 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム

Citations (2)

* Cited by examiner, † Cited by third party
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