CN101349504B - Seal heat treatment apparatus - Google Patents
Seal heat treatment apparatus Download PDFInfo
- Publication number
- CN101349504B CN101349504B CN2008100425769A CN200810042576A CN101349504B CN 101349504 B CN101349504 B CN 101349504B CN 2008100425769 A CN2008100425769 A CN 2008100425769A CN 200810042576 A CN200810042576 A CN 200810042576A CN 101349504 B CN101349504 B CN 101349504B
- Authority
- CN
- China
- Prior art keywords
- heat treatment
- substrate
- loaded layer
- treatment apparatus
- framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Tunnel Furnaces (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses a sealing heat treatment device, the heat treatment device comprises a loading layer which can place basal plates in multi-layer, a heater and a frame for fixing the loading layer and the heater, wherein the left side, the right side and the bottom of the loading layer are provided with metal clips, the frame is provided with controllable doors corresponding to each loading layer, and the heater is arranged on the bottom of the frame, wherein the controllable doors are arranged on the top end of the frame, and the basal plates and the loading layer are vertically arranged in the frame. The sealing heat treatment device provided by the invention can load heated objects with high intensity, and is convenient for the large-scale of the heat treatment device and not reducing heat treatment efficiency.
Description
Technical field
The present invention relates to a kind of annealing device, relate in particular to a kind of encapsulant annealing device.
Background technology
In the production process of most flat panel display equipment, all need to use annealing device basically.For these annealing devices, the structure of present existing sealing material annealing device as shown in Figure 1, be provided with heater 14 in the bottom of framework 11, on heater 14 successively at certain intervals placement of multiple layers place the loaded layer 12 that substrate is used, correspondingly, side at framework 11 is provided with and described loaded layer 12 corresponding controllable gates 13, described controllable gate 13 is for picking and placeing the slot-shaped opening that substrate is used, described substrate is put into and is taken out by robot device, substrate is horizontal positioned in annealing device, be prescribed the hot blast parcel of temperature, carry out corresponding heat treatment, be also referred to as and burn till by hot blast.Opposite side at framework 11 is provided with screen pack 10.
Because substrate is a horizontal positioned, when fetching substrate, robot device is subjected to the influence of himself weight, bending can appear in manipulator, so annealing device of most of prior art, predict the bending of robot device, spacing between substrate and the substrate generally can be very not little, usually at 70 millimeters to 150 millimeter.In recent years, be accompanied by the maximization of flat-panel display device, and as the substrate of heating object the trend of further maximization arranged also, this certainly will cause the weight of substrate heavier, and the length of manipulator is also longer, causes the amount of deflection of manipulator and thickness all to enlarge markedly.It is bigger that interval between substrate and the substrate also just must become, thus the problem of having brought annealing device to maximize.
Usually, flat-panel monitor is produced in purifying the room, so in case device maximizes, then corresponding meeting brings the increase that purifies the room height, causes that the operating cost that purifies room integral body rises.If it is constant to keep purifying the room height, then need to reduce the number of plies of loaded layer, enlarge the structure at the interval between the loaded layer, cause the heat treatment efficiency of annealing device to reduce.
In order to address the above problem, publication number is that the Chinese patent of CN1967118 discloses a kind of annealing device, can high density load heating object, heat-treat, but this device be in order to prevent base plate deformation, to bear big weight simultaneously, the slide mechanism quantity and the feet that need are many, increased equipment complexity, and the slide mechanism of substrate porch can have influence on putting into of substrate, can reduce beat, influence heat treatment efficiency; And be provided with in the substrate viewing area at feet place, because uneven phenomenon appears showing in the difference of thermal capacitance easily.
Summary of the invention
Technical problem to be solved by this invention provides a kind of annealing device, can highdensity loading heating object, and simple in structure, be convenient to annealing device and maximize and do not reduce heat treatment efficiency.
The present invention solves the problems of the technologies described above the technical scheme that adopts to provide a kind of seal heat treatment apparatus, comprise the loaded layer that multilayer placement substrate is used, heater, the framework that is used for fixing loaded layer and heater, the left and right sides and the bottom of described loaded layer are provided with metal clip, to each loaded layer, described framework is provided with corresponding controllable gate, described heater is arranged on base of frame, wherein, described controllable gate is arranged on the top of framework, and described substrate and loaded layer are vertically placed in framework.
In the above-mentioned seal heat treatment apparatus, the inboard of described metal clip can be lined with high-temperature resistant rubber.
In the above-mentioned seal heat treatment apparatus, the bottom side, the left and right sides of described seal heat treatment apparatus can be provided with the hot air circulation pump.
The present invention contrasts prior art following beneficial effect: annealing device provided by the invention is by picking and placeing the controllable gate that substrate is used in its apical position setting, load multilager base plate accordingly at certain intervals at device interior, substrate and loaded layer adopt vertical modes of emplacement in annealing device, the support of substrate is mainly in the left and right sides, substantially do not bear substrate weight, quantity can be seldom, and therefore, annealing device structure of the present invention is simple relatively; Secondly, controllable gate of the present invention be positioned at apical position and the support of substrate mainly in the left and right sides, supporting mechanism does not influence putting into of substrate, does not influence heat treatment efficiency; At last, because no any supporting mechanism in the substrate viewing area is not easy to occur showing uneven phenomenon.In addition, because manipulator is vertically substrate to be put into loaded layer, so gravity direction and substrate to put into direction parallel, therefore, can not cause the warpage of manipulator because of the gravity of substrate,, help reducing the spacing distance of loaded layer so that the thickness of manipulator does not need yet is too thick, thereby can highdensity loading heating object, be convenient to annealing device and maximize and do not reduce heat treatment efficiency.
Description of drawings
Fig. 1 is the structural representation of existing seal heat treatment apparatus.
Fig. 2 is the structural representation of seal heat treatment apparatus of the present invention.
Fig. 3 is the structural representation of seal heat treatment apparatus of the present invention and robot device.
Fig. 4 is the loaded layer internal structure schematic diagram of the embodiment of the invention.
Fig. 5 is that circulated air in the embodiment of the invention is to schematic diagram.
Fig. 6 is the position views of photoetching bedding and padding on color membrane substrates.
Fig. 7 is the uneven principle key diagram of gravity.
Among the figure,
10 screen packs, 11 frameworks, 12 loaded layers
13 controllable gates, 14 heaters, 20 seal heat treatment apparatus
21 frameworks, 22 loaded layers, 23 controllable gates
24 heaters, 25 robot devices, 251 guide rails
252 manipulators, 253 chutes
26 supporting brackets, 261 vacuum suction holes, 27 CD-ROM drive motor
28 metal clips, 29 hot air circulation pumps, 30 substrates
31 light shield layers, 32 photoetching bedding and padding
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
Fig. 2 is the structural representation of seal heat treatment apparatus, and Fig. 3 is the structural representation of seal heat treatment apparatus of the present invention and robot device.
Please refer to Fig. 2 and Fig. 3, seal heat treatment apparatus 20 comprises the loaded layer 22 of multilayer placement substrate 30 usefulness, heater 24, the framework 21 that is used for fixing loaded layer 22 and heater 24, and the robot device 25 that is used to pick and place substrate 30, be divided into a plurality of loaded layers 22 by metal grid in the described framework 21, described robot device 25 comprises the closed slide 251 of two horizontal positioned, described guide rail 251 is positioned at the both sides, front and back of annealing device 20, erect on the described closed slide 251 two transportable manipulators 252 are arranged, the supporting bracket 26 that can be provided with chute 253 on the described manipulator 252 and can move up and down along described chute 253, the end of described supporting bracket 26 is provided with rotation drive motor 27, can be provided with vacuum suction hole 261 on the described supporting bracket 26.To each loaded layer 22, described framework 21 is provided with corresponding controllable gate 23, and described heater 24 is arranged on framework 21 bottoms, and wherein said controllable gate 23 is arranged on the top of framework 21, and described substrate 30 and loaded layer 22 are vertically placed in framework 21.
Fig. 4 is the loaded layer internal structure schematic diagram of the embodiment of the invention.
Please refer to Fig. 4, the left and right sides of described loaded layer 22 and bottom can be provided with metal clip 28.The inboard of described metal clip 28 can be lined with high-temperature resistant rubber.After substrate 30 was vertically put into this loaded layer 22, each metal clip 28 closures were because the inboard of metal clip 28 is lined with rubber, so be not easy to cause the fragmentation of substrate 30.Simultaneously because the position of metal clip 28 grippings is peripheries of substrate 30, so can not cause corresponding demonstration uneven in the viewing area of substrate 30.Because substrate 30 is vertical placements, so be not easy because gravity causes substrate 30 bendings.Vacuum on the robot device 25 is closed then, and manipulator 252 shifts out.Because manipulator 252 is vertically substrate 30 to be put into loaded layer 22, so gravity direction and substrate 30 to put into direction parallel, so can not cause the warpage of manipulator 252 because of the gravity of substrate 30, so it is too thick that the thickness of manipulator 252 does not need yet, these all are very beneficial for reducing the spacing distance of loaded layer 22.
The thickness of preresearch estimates loaded layer 22 can be reduced to:
The thickness of thickness of glass substrate+manipulator aligning accuracy+manipulator+running surplus degree own,
Be approximately between 30 millimeters to 40 millimeters, that is to say that loading density of the present invention approximately is more than 2 times of common equipment.Can highdensity loading heating thing.
Fig. 5 is that circulated air in the embodiment of the invention is to schematic diagram.Please refer to Fig. 5, be provided with heater 24, be provided with hot air circulation pump 29 in the bottom side, the left and right sides of framework 21 in the bottom side of framework 21, finally obtain as shown in Figure 5 circulated air to.
In addition, please refer to Fig. 6, on the manufacturing process of LCD display part, particularly large-scale liquid crystal display device, usually making photoetching bedding and padding 42 on the light shield layer 41 of color membrane substrates 40, to keep the box of liquid crystal cell thick, the display device contrast that obtains is higher, display effect is better, but the use of photoetching bedding and padding 42 has also brought other problem, the most normal appearance is the gravity uneven phenomenon, particularly on large-scale display device.The uneven principle that occurs of gravity please refer to Fig. 7: when display device is vertically placed, when particularly vertically placement is subjected to high-temperature process simultaneously, liquid crystal volume expands, under action of gravity, liquid crystal moves to the below of display device, cause the bottom amount of liquid crystal on the high side, thereby the box of bottom is thick bigger than normal, to to a certain degree the time, this demonstration inequality will show when bigger than normal.At this problem, generally all be to measure down by accurate liquid crystal drop to prevent, but confirm whether amount is suitable under the liquid crystal drop, need other corresponding apparatus of configuration, cause the increase of equipment investment volume.And annealing device of the present invention is because with substrate 30 vertically placement in annealing device, so when heat-treating, if amount of liquid crystal has problem, when substrate 30 takes out, find out very easily.So do not need the extra new equipment of buying.
According to the demand of vertically putting into seal heat treatment apparatus, can carry out certain transformation to robot device 25, please continue with reference to figure 7, at first be provided with the moving guide rail 251 of manipulator 252 in the left and right sides of framework 21, corresponding these two guide rails 251 be two manipulators 252, it can move along the guide rail 251 on framework 21 both sides, thereby substrate 30 is put in the middle of each loaded layer 22.In the middle of two manipulators 253 is the supporting bracket 26 of substrate 30, and its top is provided with vacuum suction hole 261, and it is connected with the vacuum power source, when getting substrate 30, the vacuum state in vacuum suction hole 261 is On, and during mounted board 30, the adsorbed state in vacuum suction hole 261 is Off putting down.Supporting bracket 26 can move up and down along the chute 253 between two manipulators 252, and changes its height; Simultaneously the end of supporting bracket 26 is provided with rotation drive motor 27, can make supporting bracket 26 become plumbness by level, thereby finish the requirement of substrate 30 vertically being put into sealing material thermmohardening device.
The practical work process of hardening heat processing unit of the present invention can be briefly described as follows:
At first the supporting bracket 26 of robot device 25 is a level, and the guide rail 251 by framework 21 both sides moves near the one procedure equipment, by manipulator 252 substrate 30 is positioned on the supporting bracket 26; Supporting bracket 26 moves to target loaded layer 22 by guide rail 22, and supporting bracket 26 rises, and becomes vertical state by level simultaneously; The controllable gate 23 of corresponding then loaded layer 22 is opened, and supporting bracket 26 is carried substrate 30 and entered loaded layer 22; Metal fixture 29 in the loaded layer 22 is closed, and substrate 30 is fixed, and supporting bracket 26 shifts out, and the controllable gate 23 of loaded layer 22 is closed.
The above-mentioned flow process that circulates can be finished the production of goods.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing a little modification and perfect, so protection scope of the present invention is when with being as the criterion that claims were defined.
Claims (3)
1. seal heat treatment apparatus, comprise the loaded layer that multilayer placement substrate is used, heater is used for fixing the framework of loaded layer and heater, and the left and right sides and the bottom of described loaded layer are provided with metal clip, to each loaded layer, described framework is provided with corresponding controllable gate, and described heater is arranged on base of frame, it is characterized in that, described controllable gate is arranged on the top of framework, and described substrate and loaded layer are vertically placed in framework.
2. seal heat treatment apparatus according to claim 1 is characterized in that the inboard of described metal clip is lined with high-temperature resistant rubber.
3. seal heat treatment apparatus according to claim 1 is characterized in that, the bottom side, the left and right sides of described seal heat treatment apparatus is provided with the hot air circulation pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100425769A CN101349504B (en) | 2008-09-05 | 2008-09-05 | Seal heat treatment apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100425769A CN101349504B (en) | 2008-09-05 | 2008-09-05 | Seal heat treatment apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910178265XA Division CN101712154B (en) | 2008-09-05 | 2008-09-05 | Manipulator device for sealing heat treating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101349504A CN101349504A (en) | 2009-01-21 |
| CN101349504B true CN101349504B (en) | 2011-05-18 |
Family
ID=40268382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100425769A Expired - Fee Related CN101349504B (en) | 2008-09-05 | 2008-09-05 | Seal heat treatment apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101349504B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104109746B (en) * | 2014-06-24 | 2016-03-30 | 宿迁琛博信息科技有限公司 | A kind of grid is from homogeneous heating hardening process |
| CN105002329B (en) * | 2015-08-19 | 2017-03-08 | 苏州中门子工业炉科技有限公司 | A kind of material box continuous beat heat-treatment furnace and its technique |
-
2008
- 2008-09-05 CN CN2008100425769A patent/CN101349504B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101349504A (en) | 2009-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102021297B (en) | Aircraft skin aging furnace | |
| CN101349504B (en) | Seal heat treatment apparatus | |
| CN110942737B (en) | Display panel aging detection equipment and method | |
| JP2014214380A (en) | Horizontal atomic layer vapor deposition device for large area substrate | |
| CN201266014Y (en) | Sealing thermal treatment apparatus and its manipulator apparatus | |
| CN101712154B (en) | Manipulator device for sealing heat treating device | |
| KR101199954B1 (en) | Boat For Processing A Substrate | |
| JP2013531363A (en) | Substrate processing equipment | |
| JP2003165735A (en) | Heat treatment apparatus for glass substrates | |
| CN1467058A (en) | Base plate supporting structure and loading device and mechanical arm | |
| JP2007085702A (en) | Glass substrate treating device, glass substrate treating system and glass substrate treating method | |
| KR101066979B1 (en) | Apparatus to Sputter | |
| KR101659609B1 (en) | Chemical Reinforcement using Heater Assembly of Furnace | |
| CN104078384A (en) | In-line type heat treatment apparatus | |
| JP3299882B2 (en) | heating furnace | |
| KR101371707B1 (en) | Apparatus for annealing | |
| KR101129041B1 (en) | Holder Stage For Flexible Display And Its Substrate Loading Method | |
| JP3208047B2 (en) | heating furnace | |
| KR20150082142A (en) | Heating Process of Glass Plate using Chemical Reinforcement | |
| KR101297670B1 (en) | Apparatus for processing substrate | |
| KR102480947B1 (en) | Withdrawal jig apparatus for heating module for heat treatment system of display panel | |
| KR101496444B1 (en) | Transportation Method of Glass Substrate and Heat Treatment Apparatus using the Same | |
| KR102480952B1 (en) | Heat treatment system for display panel | |
| KR101188270B1 (en) | In-line type heat treatment apparatus | |
| KR20080024959A (en) | Glass substrate-retaining member and continuous burning apparatus for glass substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SVA-FUJIFILM OPTO-ELECTRONIC MATERIALS CO., LTD. Free format text: FORMER OWNER: SVA (GROUP) CO., LTD. Effective date: 20110718 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 200233 BUILDING 3, NO. 757, YISHAN ROAD, XUHUI DISTRICT, SHANGHAI TO: 201108 NO. 160, LANE 3306, HUANING ROAD, SHANGHAI |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110718 Address after: 201108 Shanghai City Huaning road 3306 Lane 160 Patentee after: SAV Fushi Photoelectric Material Co., Ltd. Address before: 200233, Shanghai, Yishan Road, No. 757, third floor, Xuhui District Patentee before: SVA (Group) Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 201108 Shanghai city Minhang District Huaning road 3306 Lane 160 Patentee after: INESA DISPLAY MATERIALS CO., LTD. Address before: 201108 Shanghai City Huaning road 3306 Lane 160 Patentee before: SAV Fushi Photoelectric Material Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110518 Termination date: 20160905 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |