CN101341608A - 有机led器件 - Google Patents
有机led器件 Download PDFInfo
- Publication number
- CN101341608A CN101341608A CNA2006800479753A CN200680047975A CN101341608A CN 101341608 A CN101341608 A CN 101341608A CN A2006800479753 A CNA2006800479753 A CN A2006800479753A CN 200680047975 A CN200680047975 A CN 200680047975A CN 101341608 A CN101341608 A CN 101341608A
- Authority
- CN
- China
- Prior art keywords
- organic
- lamination
- layer
- electroluminescence device
- organic electroluminescence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 65
- 239000012876 carrier material Substances 0.000 claims abstract description 36
- 239000011888 foil Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000003475 lamination Methods 0.000 claims description 64
- 239000000463 material Substances 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 15
- 238000005401 electroluminescence Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 12
- 238000009792 diffusion process Methods 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 75
- 239000012044 organic layer Substances 0.000 abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 239000011368 organic material Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical group [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/81—Electrodes
- H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
- H10K50/171—Electron injection layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/818—Reflective anodes, e.g. ITO combined with thick metallic layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/88—Terminals, e.g. bond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05112417 | 2005-12-19 | ||
EP05112417.0 | 2005-12-19 | ||
PCT/IB2006/054696 WO2007072275A2 (en) | 2005-12-19 | 2006-12-08 | Organic led device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101341608A true CN101341608A (zh) | 2009-01-07 |
CN101341608B CN101341608B (zh) | 2011-05-18 |
Family
ID=38134588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800479753A Active CN101341608B (zh) | 2005-12-19 | 2006-12-08 | 有机led器件 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7990054B2 (zh) |
EP (1) | EP1966843B1 (zh) |
JP (1) | JP5106413B2 (zh) |
KR (1) | KR101345344B1 (zh) |
CN (1) | CN101341608B (zh) |
RU (1) | RU2414018C2 (zh) |
TW (1) | TWI470848B (zh) |
WO (1) | WO2007072275A2 (zh) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102381391B1 (ko) * | 2015-04-16 | 2022-03-31 | 삼성디스플레이 주식회사 | 표시 장치 |
DE102008020816B4 (de) * | 2008-02-29 | 2019-10-10 | Osram Oled Gmbh | Organische Leuchtdiode, flächiges, optisch aktives Element mit einer Kontaktanordnung und Verfahren zur Herstellung einer organischen Leuchtdiode |
US8536611B2 (en) * | 2008-06-17 | 2013-09-17 | Hitachi, Ltd. | Organic light-emitting element, method for manufacturing the organic light-emitting element, apparatus for manufacturing the organic light-emitting element, and organic light-emitting device using the organic light-emitting element |
JP2010032838A (ja) * | 2008-07-30 | 2010-02-12 | Sumitomo Chemical Co Ltd | 表示装置および表示装置の製造方法 |
US8653544B2 (en) | 2009-03-05 | 2014-02-18 | Koninklijke Philips N.V. | OLEDs connected in series |
US8613671B2 (en) * | 2009-06-08 | 2013-12-24 | Cfph, Llc | Data transfer and control among multiple computer devices in a gaming environment |
US8419535B2 (en) * | 2009-06-08 | 2013-04-16 | Cfph, Llc | Mobile playing card devices |
US8784189B2 (en) | 2009-06-08 | 2014-07-22 | Cfph, Llc | Interprocess communication regarding movement of game devices |
US8771078B2 (en) | 2009-06-08 | 2014-07-08 | Cfph, Llc | Amusement device including means for processing electronic data in play of a game of chance |
US8545327B2 (en) * | 2009-06-08 | 2013-10-01 | Cfph, Llc | Amusement device including means for processing electronic data in play of a game in which an outcome is dependant upon card values |
US8287386B2 (en) * | 2009-06-08 | 2012-10-16 | Cfph, Llc | Electrical transmission among interconnected gaming systems |
US8545328B2 (en) * | 2009-06-08 | 2013-10-01 | Cfph, Llc | Portable electronic charge device for card devices |
US8816335B2 (en) * | 2009-12-16 | 2014-08-26 | Koninklijke Philips N.V. | Method for creating serially-connected OLED devices |
WO2011096923A1 (en) * | 2010-02-03 | 2011-08-11 | Universal Display Corporation | Organic light emitting device with conducting cover |
WO2011096922A1 (en) * | 2010-02-03 | 2011-08-11 | Universal Display Corporation | Organic light emitting device with enhanced emission uniformity |
KR101084271B1 (ko) | 2010-02-09 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 유기 발광 장치 및 그 제조 방법 |
DE102010042132A1 (de) * | 2010-10-07 | 2012-04-26 | Ledon Oled Lighting Gmbh & Co.Kg | Leuchtelement mit OLED-Modulen |
CN104094431B (zh) * | 2012-02-03 | 2018-03-27 | 皇家飞利浦有限公司 | Oled设备及其制造 |
DE102012201801B4 (de) | 2012-02-07 | 2024-10-02 | Pictiva Displays International Limited | Organische leuchtdiode und vorrichtung mit einer organischen leuchtdiode |
KR102033612B1 (ko) | 2012-12-27 | 2019-10-17 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 및 이의 제조방법 |
RU2528128C1 (ru) * | 2013-03-06 | 2014-09-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Томский государственный университет систем управления и радиоэлектроники" | Способ изготовления органического светоизлучающего диода |
EP2845726A1 (en) * | 2013-09-04 | 2015-03-11 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Electrically interconnecting foil |
US20150209654A1 (en) | 2013-11-12 | 2015-07-30 | Deq Systems Corp. | Reconfigurable playing cards and game display devices |
DE102013113190A1 (de) * | 2013-11-28 | 2015-05-28 | Osram Oled Gmbh | Elektronisches Bauteil |
DE102015100099B4 (de) | 2015-01-07 | 2017-10-19 | Osram Oled Gmbh | Verfahren zum Herstellen eines organischen lichtemittierenden Bauelements |
US10573843B2 (en) | 2015-08-05 | 2020-02-25 | Apple Inc. | Light-emitting device having an electrode with varying sheet resistance |
RU2631015C1 (ru) * | 2016-04-29 | 2017-09-15 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Томский государственный университет систем управления и радиоэлектроники" | Высоковольтное органическое люминесцентное устройство |
DE112020001856T5 (de) * | 2019-04-09 | 2021-12-23 | Ams Ag | On-chip-integration von indiumzinoxid (ito)-schichten für ohmschen kontakt zu bond-pads |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61230295A (ja) * | 1985-04-05 | 1986-10-14 | 株式会社日立製作所 | フレキシブル型発光素子 |
JP3676074B2 (ja) * | 1997-03-14 | 2005-07-27 | Tdk株式会社 | ホットメルト材およびラミネート体とその製造方法 |
US6420031B1 (en) | 1997-11-03 | 2002-07-16 | The Trustees Of Princeton University | Highly transparent non-metallic cathodes |
JP2850906B1 (ja) * | 1997-10-24 | 1999-01-27 | 日本電気株式会社 | 有機el素子およびその製造方法 |
BE1012802A3 (fr) | 1999-07-28 | 2001-03-06 | Cockerill Rech & Dev | Dispositif electroluminescent et son procede de fabrication. |
TW493282B (en) * | 2000-04-17 | 2002-07-01 | Semiconductor Energy Lab | Self-luminous device and electric machine using the same |
JP4423767B2 (ja) * | 2000-08-22 | 2010-03-03 | ソニー株式会社 | 有機電界発光素子及びその製造方法 |
JP2002231444A (ja) * | 2001-01-30 | 2002-08-16 | Toppan Printing Co Ltd | 高分子el素子およびその製造方法 |
US6856086B2 (en) | 2001-06-25 | 2005-02-15 | Avery Dennison Corporation | Hybrid display device |
US6680578B2 (en) * | 2001-09-19 | 2004-01-20 | Osram Opto Semiconductors, Gmbh | Organic light emitting diode light source |
US7242398B2 (en) | 2002-02-18 | 2007-07-10 | Ignis Innovation Inc. | Flexible display device |
WO2003096752A1 (en) * | 2002-05-10 | 2003-11-20 | Koninklijke Philips Electronics N.V. | Electroluminescent panel |
US6797129B2 (en) | 2002-06-03 | 2004-09-28 | Eastman Kodak Company | Organic light-emitting device structure using metal cathode sputtering |
KR100477746B1 (ko) * | 2002-06-22 | 2005-03-18 | 삼성에스디아이 주식회사 | 다층 구조의 애노드를 채용한 유기 전계 발광 소자 |
TW578439B (en) | 2002-10-25 | 2004-03-01 | Ritdisplay Corp | Organic light emitting diode and material applied in the organic light emitting diode |
JP4218450B2 (ja) * | 2003-07-29 | 2009-02-04 | 株式会社豊田自動織機 | 有機エレクトロルミネッセンス素子 |
JP4432439B2 (ja) * | 2003-10-08 | 2010-03-17 | ソニー株式会社 | 表示装置 |
JP2005128040A (ja) * | 2003-10-21 | 2005-05-19 | Hitachi Displays Ltd | 表示装置 |
KR100581903B1 (ko) * | 2004-03-09 | 2006-05-22 | 삼성에스디아이 주식회사 | 전계 발광 디스플레이 장치 |
US7157156B2 (en) * | 2004-03-19 | 2007-01-02 | Eastman Kodak Company | Organic light emitting device having improved stability |
US7108392B2 (en) * | 2004-05-04 | 2006-09-19 | Eastman Kodak Company | Tiled flat panel lighting system |
JP4148182B2 (ja) | 2004-05-17 | 2008-09-10 | ソニー株式会社 | 表示装置 |
ATE417367T1 (de) | 2005-02-16 | 2008-12-15 | Koninkl Philips Electronics Nv | Oled-vorrichtung |
WO2007036850A2 (en) * | 2005-09-28 | 2007-04-05 | Koninklijke Philips Electronics N.V. | A large area organic diode device and a method of manufacturing it |
-
2006
- 2006-12-08 JP JP2008545193A patent/JP5106413B2/ja active Active
- 2006-12-08 EP EP06832169.4A patent/EP1966843B1/en active Active
- 2006-12-08 US US12/097,348 patent/US7990054B2/en active Active
- 2006-12-08 KR KR1020087017599A patent/KR101345344B1/ko active IP Right Grant
- 2006-12-08 WO PCT/IB2006/054696 patent/WO2007072275A2/en active Application Filing
- 2006-12-08 RU RU2008129758/28A patent/RU2414018C2/ru active
- 2006-12-08 CN CN2006800479753A patent/CN101341608B/zh active Active
- 2006-12-15 TW TW95147226A patent/TWI470848B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1966843A2 (en) | 2008-09-10 |
US7990054B2 (en) | 2011-08-02 |
TW200731591A (en) | 2007-08-16 |
RU2008129758A (ru) | 2010-01-27 |
US20080265759A1 (en) | 2008-10-30 |
EP1966843B1 (en) | 2017-08-30 |
JP5106413B2 (ja) | 2012-12-26 |
KR20080081049A (ko) | 2008-09-05 |
TWI470848B (zh) | 2015-01-21 |
RU2414018C2 (ru) | 2011-03-10 |
CN101341608B (zh) | 2011-05-18 |
KR101345344B1 (ko) | 2013-12-30 |
WO2007072275A3 (en) | 2007-10-11 |
JP2009520347A (ja) | 2009-05-21 |
WO2007072275A2 (en) | 2007-06-28 |
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