CN101335218A - 金属平板式新型半导体封装方法 - Google Patents

金属平板式新型半导体封装方法 Download PDF

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CN101335218A
CN101335218A CNA2008100215012A CN200810021501A CN101335218A CN 101335218 A CN101335218 A CN 101335218A CN A2008100215012 A CNA2008100215012 A CN A2008100215012A CN 200810021501 A CN200810021501 A CN 200810021501A CN 101335218 A CN101335218 A CN 101335218A
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王新潮
于燮康
罗宏伟
梁志忠
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JCET Group Co Ltd
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Jiangsu Changjiang Electronics Technology Co Ltd
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Abstract

本发明涉及一种金属平板式新型半导体封装方法，主要用于半导体的四面无脚扁平贴片式封装。包括以下工艺步骤：取一片金属板；在金属板的正、背两面镀上金属层，将整片金属板分离成一个个单独的块状的功能引脚和芯片承载底座；取一片金属平板；将预先准备好的块状的功能引脚和芯片承载底座用粘结物质分别植入到金属平板上相应的凹槽处；在功能引脚和芯片承载底座上植入被动元件和芯片；对已完成芯片植入作业的半成品进行打金属线作业；将已打线完成的所述半成品正面进行塑封体包封作业，并进行塑封体包封后固化作业；去除打印后的所述半成品背面的金属平板，将半成品进行切割分离作业，形成一个个独立的半导体封装元器件。本发明方法材料成本较低、无化学物质污染、可靠性能更好。

Description

金属平板式新型半导体封装方法
(一)技术领域
本发明涉及一种半导体封装方法，主要用于半导体的四面无脚扁平贴片式封装。属半导体封装技术领域。
(二)背景技术
传统的四面无脚扁平贴片式封装采用的是在穿透式蚀刻好的整条框架的基础上进行装片、打线、包封等半导体封装方法。这种在穿透式蚀刻好的整条框架基础上进行的半导体封装主要存在以下不足：
1、因为框架是穿透式蚀刻过的，需要在整条框架的背面贴上一层专用胶带来避免半导体包封工序时产生塑封料溢料的问题，进而增加了材料成本。
2、穿透式蚀刻后的引线框架，在打线工序时因框架结构强度低而易产生晃动，进而影响到打线互联的稳定性，为产品的可靠性埋下隐忧。
3、虽然采取了专用胶带来防止包封时产生溢料，但在灌注塑封料时还是会因为灌注压力的问题而冲破粘结面，造成框架背面溢料。因此为了缩小溢料面积常常使用较低的灌注压力，这又导致塑封料过于疏松、吸水性高而影响到产品的可靠性。
4、因为专用胶带的使用，在作业时会有化学物质从胶带上散发出来污染到芯片和框架的表面，进而影响到后续的装片、打线作业。
5、在包封后去除胶带时因为胶带的粘性而会有粘性物质残留在引线框背面的引脚上，进而影响到后续表面贴装时的焊接性能。
(三)发明内容
本发明的目的在于克服上述不足，提供一种材料成本较低、可靠性能更好的金属平板式新型半导体封装方法。
本发明的目的是这样实现的：一种金属平板式新型半导体封装方法，其特征在于所述方法主要包括以下工艺步骤：
——取一片金属板，
——在所述金属板的正、背两面镀上金属层，
——将所述镀上金属层的整片金属板分离成一个个单独的块状的功能引脚和芯片承载底座，并依据所述块的外形进行分类包装保存，备用，
——取一片金属平板，
——将预先准备好的块状的功能引脚和芯片承载底座用粘结物质分别植入到所述金属平板上相应的凹槽处，
——在所述镀有金属层的功能引脚上植入被动元件，所述被动元件为电阻、电容或电感，
——在所述镀有金属层的芯片承载底座上植入芯片，
——对已完成芯片植入作业的半成品进行打金属线作业，
——将已打线完成的所述半成品正面进行塑封体包封作业，并进行塑封体包封后固化作业，
——在包封固化后的所述半成品正面进行打印识别作业，
——去除打印后的所述半成品背面的金属平板，金属平板可留作后续循环使用，
——清洗去除金属平板后的所述半成品背面的功能引脚和芯片承载底座的背面，
——将清洗后的所述半成品进行切割分离作业，形成一个个独立的半导体封装元器件。
本发明半导体封装方法与传统的采用穿透式框架制成的半导体封装元器件相比，具有如下优点：
1、金属平板的使用更好地增强了整体的结构强度，解决了原传统工艺中打线互联不稳定的隐患。
2、即使灌注压力再大，由于金属平板的使用，塑封料也无法钻透金属板从而避免了溢料的发生，增强了产品的可靠性能。
3、功能引脚和芯片承载底座采用预先形成并分类保存的方式，极大地提高了金属材料的利用率，减少了整体框架成型时废料的产生，进而降低了材料成本。
4、功能引脚和芯片承载底座采用后天植入的方式粘结到金属板上，针对不同封装结构只需更改金属板上的凹槽位置即可，从而增强了封装体内部结构的灵活性，同时也降低了新产品的开发成本。
5、金属平板可循环使用，提高了材料的利用率，也符合环保的要求。
(四)附图说明
图1～图11为本发明的生产工艺流程图。
图中：金属板1、金属层2、功能引脚3、芯片承载底座4、金属平板5、粘结物质6、芯片7、金属线8、塑封体9、被动元件10。
(五)具体实施方式
本发明涉及的金属平板式新型半导体封装方法，该方法主要包括以下工艺步骤：
——取一片金属板1，如图1，
——在所述金属板1的正、背两面镀上金属层2，如图2，
——用物理冲切或化学蚀刻的方式，将整片金属板分离成一个个单独的块状的功能引脚3和芯片承载底座4，并依据所述块的外形进行分类包装保存，备用，如图3，
——取一片金属平板5，如图4，
——将预先准备好的块状的功能引脚3和芯片承载底4座用粘结物质6(专用胶水)分别植入到所述金属平板5上相应的凹槽处，如图5，
——在所述镀有金属层的功能引脚3上植入被动元件10，所述被动元件10为电阻、电容或电感，如图6，
——在所述镀有金属层的芯片承载底座4上植入芯片7，如图6，
——对已完成芯片植入作业的半成品进行打金属线8作业，如图7，
——将已打线完成的所述半成品正面进行塑封体9包封作业，并进行塑封体包封后固化作业，如图8，
——在包封固化后的所述半成品正面进行打印识别作业，
——去除打印后的所述半成品背面的金属平板5，如图9，
——用化学药水清洗，化学药水有酒精、丙酮等，去除金属平板后的所述半成品背面的功能引脚和芯片承载底座的背面，如图10，
——将清洗后的所述半成品进行切割分离作业，形成一个个独立的半导体封装元器件，如图11。

Claims (1)

1、一种金属平板式新型半导体封装方法，其特征在于所述方法主要包括以下工艺步骤：
——取一片金属板，
——在所述金属板的正、背两面镀上金属层，
——将所述镀上金属层的整片金属板分离成一个个单独的块状的功能引脚和芯片承载底座，并依据所述块的外形进行分类包装保存，备用，
——取一片金属平板，
——将预先准备好的块状的功能引脚和芯片承载底座用粘结物质分别植入到所述金属平板上相应的凹槽处，
——在所述镀有金属层的功能引脚上植入被动元件，所述被动元件为电阻、电容或电感，
——在所述镀有金属层的芯片承载底座上植入芯片，
——对已完成芯片植入作业的半成品进行打金属线作业，
——将已打线完成的所述半成品正面进行塑封体包封作业，并进行塑封体包封后固化作业，
——在包封固化后的所述半成品正面进行打印识别作业，
——去除打印后的所述半成品背面的金属平板，
——清洗去除金属平板后的所述半成品背面的功能引脚和芯片承载底座的背面，
——将清洗后的所述半成品进行切割分离作业，形成一个个独立的半导体封装元器件。
CNA2008100215012A 2008-07-30 2008-07-30 金属平板式新型半导体封装方法 Pending CN101335218A (zh)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101335221B (zh) * 2008-07-30 2010-06-02 江苏长电科技股份有限公司 凹槽金属板式新型半导体封装方法
CN102157392A (zh) * 2011-01-31 2011-08-17 江阴长电先进封装有限公司 低成本芯片扇出结构的封装方法
CN104485316A (zh) * 2013-03-08 2015-04-01 英飞凌科技股份有限公司 半导体器件及其制造方法
CN106601636A (zh) * 2016-12-21 2017-04-26 江苏长电科技股份有限公司 一种贴装预包封金属导通三维封装结构的工艺方法
CN110060944A (zh) * 2019-04-03 2019-07-26 长电科技（宿迁）有限公司 一种具有等离子清洗功能的包封预热台
CN111403296A (zh) * 2020-03-30 2020-07-10 捷捷微电(上海)科技有限公司 一种半导体封装件及其制作方法
CN111739810A (zh) * 2020-06-22 2020-10-02 矽磐微电子(重庆)有限公司 半导体封装方法及半导体装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101335221B (zh) * 2008-07-30 2010-06-02 江苏长电科技股份有限公司 凹槽金属板式新型半导体封装方法
CN102157392A (zh) * 2011-01-31 2011-08-17 江阴长电先进封装有限公司 低成本芯片扇出结构的封装方法
CN104485316A (zh) * 2013-03-08 2015-04-01 英飞凌科技股份有限公司 半导体器件及其制造方法
CN106601636A (zh) * 2016-12-21 2017-04-26 江苏长电科技股份有限公司 一种贴装预包封金属导通三维封装结构的工艺方法
CN106601636B (zh) * 2016-12-21 2018-11-09 江苏长电科技股份有限公司 一种贴装预包封金属导通三维封装结构的工艺方法
CN110060944A (zh) * 2019-04-03 2019-07-26 长电科技（宿迁）有限公司 一种具有等离子清洗功能的包封预热台
CN111403296A (zh) * 2020-03-30 2020-07-10 捷捷微电(上海)科技有限公司 一种半导体封装件及其制作方法
CN111739810A (zh) * 2020-06-22 2020-10-02 矽磐微电子(重庆)有限公司 半导体封装方法及半导体装置

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