CN101321440A - 使用了导电性涂料的电路图案设计方法及印刷电路基板 - Google Patents
使用了导电性涂料的电路图案设计方法及印刷电路基板 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
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- Engineering & Computer Science (AREA)
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Abstract
本发明提供一种利用了导电性涂料具有的阻抗值及静电容量的印刷电路图案的设计方法及印刷电路基板。在印刷电路基板的电路图案设计中,在绝缘性基板上用导电性涂料印刷形成电路图案,在作为金属导电体所需的布线图案部分印刷焊膏,进行回流布线。另外,在绝缘性基板上用导电性涂料并利用该导电性涂料具有的阻抗值及静电容量值,印刷形成为R(电阻器)、C(电容器)、以及L(线圈)中的任一个。
Description
技术领域
本发明涉及一种使用了导电性涂料的印刷电路基板的电路图案设计方法及印刷电路基板。
背景技术
以往,设计电路图案的前提是使用覆铜板用抗蚀剂保护布线所需的电路,蚀刻去除其他部分的铜箔。
与此不同,近年来,研究了使用导电性涂料用丝网印刷等直接形成电路图案的技术(专利文献1)。
导电性涂料多为配合金属粉末和热固性树脂,用有机溶剂调整粘度的物质。
这种导电性涂料由于含有树脂成分,所以比电阻值为10-4程度,与铜的比电阻值1.68×10-6相比,约有100倍之差。
因此,如果使用导电性涂料进行印刷布线,有实质上的操作电流值低下的问题。
专利文献1:日本特开2006-28213号公报
发明内容
本发明的目的是解决上述问题,提供一种利用了导电性涂料具有的阻抗值及静电容量的印刷电路图案的设计方法及印刷电路基板。
方案1涉及的印刷电路图案设计方法的特征在于:在绝缘性基板上使用导电性涂料印刷形成电路图案,在作为金属导电体所需的布线图案部分印刷焊膏,进行回流布线。
在此,回流布线是指用导电性涂料在印刷电路基板上印刷形成用来在表面安装的电子零件间进行布线的配线,并在该导电性涂料配线上面印刷焊膏,通过加热回流来进行布线的工艺。
由此,即便导电性涂料的阻抗值大于铜箔图案,也可通过将焊料用作为金属导电配线,得到防止操作电流低下的印刷电路基板。
另外,在不需要焊接的电路部,由于作为降低导体电阻的手段导电性涂料不需要焊料的润湿性,所以在该部分的布线上也能够使用导体阻抗值低的导电性涂料。
方案2涉及的印刷电路图案的设计方法的特征在于:在绝缘性基板上使用导电性涂料并利用该导电性涂料具有的阻抗值及静电容量值,印刷形成为R(电阻器)、C(电容器)、以及L(线圈)中的任一个。
就导电性涂料来说,由于树脂成分是作为粘合剂含有,所以虽然电阻值比金属大100倍以上,但印刷形成在绝缘性基板上时,显示出稳定的阻抗值及静电容量,就是利用这样的性质。
因此,在绝缘性基板上使用导电性涂料印刷形成电路图案的同时,得到印刷形成为R(电阻器)、C(电容器)、以及L(线圈)中的任一个的印刷电路基板是。
在本发明中,通过采用在作为金属导电体所需的布线图案部分印刷焊膏进行回流布线的设计方法,能够实现解决了导电性涂料的阻抗值大的缺点的电路图案设计。
另外,反过来利用导电性涂料比铜等金属导电体的阻抗值约高100倍且静电容量也大的性质,设计图案宽度、图案形状、图案长度,由此作为电阻器、电容器、线圈等使用,可得到整体上廉价的印刷电路基板。
附图说明
图1表示使用了导电性涂料的印刷图案的阻抗值测定结果。
图2表示图案设计例。
图3表示使用导电性涂料制作的遥控器用基板的例。
具体实施方式
首先,为了掌握导电性涂料的电特性,使用麦克赛尔北陆精器株式会社制造的配合有Ag涂层Ni粉末和Ag粉末、用酚醛树脂作为粘合剂、配合有油酸和丁基卡必醇的有机溶剂的导电性涂料,在绝缘性基材上面丝网印刷布线图案后,用干燥炉在160℃干燥约30分钟(专利文献1记载的涂料)。
在图1表示布线图案样品、TP1和TP2。
样品TP1是,设定图案宽度2.0mm,通过丝网印刷形成布线图案的结果,成为了膜厚20.5μm的布线图案。
测定平均每1mm的阻抗值时为0.0395Ω,所以比电阻值为1.62×10-4Ω.cm。
样品TP2是,以布线图案为目的印刷形成图案宽度0.25mm的图案,其结果虽然在长度方向上有一些膜厚不均,但在平均每1mm的长度上为约0.265Ω,是稳定的。
此时求出比电阻值,结果为2.15×10-4Ω·cm。
因此,可以确认约为铜的比电阻值1.68×10-6Ω·cm的100倍。
从该测定结果可以确认:如果使用该导电性涂料,以1mm图案宽度印刷约11mm长度的话,就相当于约1Ω的电阻器。
根据以上的预备调查,如图2(a)所示,在作为电路需要阻抗值R的电阻器的场合,能够用导电涂料印刷相当于R1的阻抗值的宽度、长度,与剩余部分的电阻器RO串联组合。
另外,如图2(b)所示,在将电阻器R和电容器C连接的场合,如果在用导电性涂料形成布线图案后在上面将焊膏按a所示进行印刷并使其回流,则a的部分会因焊料而成为金属导电体。
这样,在图3表示了实际制作并评价了遥控基板的例。
在仅用导电性涂料形成布线图案的场合,电路漏电流为0.04μA以下,振荡频率也与设计目标一致,但操作电流的实测值为4.8~5.3mA,低于目标14mA,但使用焊膏将导电性涂料布线的一部分回流布线的结果,操作电流值得到了提高。
在将本发明适用于遥控基板的场合,还能够根据需要印刷碳接点。
Claims (4)
1.一种印刷电路图案的设计方法,其特征在于:在印刷电路基板的电路图案设计中,在绝缘性基板上用导电性涂料印刷形成电路图案,在作为金属导电体所需的布线图案部分印刷焊膏,进行回流布线。
2.一种印刷电路图案的设计方法,其特征在于,在印刷电路基板的电路图案设计中,在绝缘性基板上用导电性涂料并利用该导电性涂料具有的阻抗值及静电容量值,印刷形成为R(电阻器)、C(电容器)、以及L(线圈)中的任一个。
3.一种印刷电路基板,其特征在于:在绝缘性基板上用导电性涂料印刷形成电路图案,在作为金属导电体所需的布线图案部分印刷焊膏,进行了回流布线。
4.一种印刷电路基板,其特征在于:在绝缘性基板上用导电性涂料印刷形成电路图案的同时,印刷形成为了R(电阻器)、C(电容器)、以及L(线圈)中的任一个。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007152516 | 2007-06-08 | ||
JP2007152516A JP2008306031A (ja) | 2007-06-08 | 2007-06-08 | 導電性塗料を用いた回路パターン設計方法及びプリント回路基板 |
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CN101321440A true CN101321440A (zh) | 2008-12-10 |
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CNA200810108906XA Pending CN101321440A (zh) | 2007-06-08 | 2008-06-06 | 使用了导电性涂料的电路图案设计方法及印刷电路基板 |
Country Status (5)
Country | Link |
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US (1) | US20090067145A1 (zh) |
JP (1) | JP2008306031A (zh) |
KR (1) | KR20080107995A (zh) |
CN (1) | CN101321440A (zh) |
TW (1) | TW200904281A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110621466A (zh) * | 2017-04-10 | 2019-12-27 | 塔克托科技有限公司 | 电子组件的制造方法及电子组件 |
CN110972386A (zh) * | 2018-09-28 | 2020-04-07 | 深圳正峰印刷有限公司 | 适用于印刷电子元件的电路板 |
Family Cites Families (9)
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JPS61179712A (ja) * | 1984-12-24 | 1986-08-12 | Fuji Photo Film Co Ltd | 熱可塑性樹脂製箱形ケ−ス本体の製造方法 |
US5097247A (en) * | 1991-06-03 | 1992-03-17 | North American Philips Corporation | Heat actuated fuse apparatus with solder link |
JPH0878808A (ja) * | 1994-09-06 | 1996-03-22 | Sharp Corp | 印刷回路基板 |
JP4741045B2 (ja) * | 1998-03-25 | 2011-08-03 | セイコーエプソン株式会社 | 電気回路、その製造方法および電気回路製造装置 |
US6171921B1 (en) * | 1998-06-05 | 2001-01-09 | Motorola, Inc. | Method for forming a thick-film resistor and thick-film resistor formed thereby |
JP2003086906A (ja) * | 2001-09-10 | 2003-03-20 | Daiken Kagaku Kogyo Kk | フレキシブル回路基板 |
SG119230A1 (en) * | 2004-07-29 | 2006-02-28 | Micron Technology Inc | Interposer including at least one passive element at least partially defined by a recess formed therein method of manufacture system including same and wafer-scale interposer |
JP2006100328A (ja) * | 2004-09-28 | 2006-04-13 | Toppan Printing Co Ltd | 抵抗素子及び素子内蔵配線基板 |
JP5168838B2 (ja) * | 2006-07-28 | 2013-03-27 | 大日本印刷株式会社 | 多層プリント配線板及びその製造方法 |
-
2007
- 2007-06-08 JP JP2007152516A patent/JP2008306031A/ja active Pending
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2008
- 2008-04-17 KR KR1020080035431A patent/KR20080107995A/ko not_active Application Discontinuation
- 2008-04-30 TW TW097115936A patent/TW200904281A/zh unknown
- 2008-06-02 US US12/131,474 patent/US20090067145A1/en not_active Abandoned
- 2008-06-06 CN CNA200810108906XA patent/CN101321440A/zh active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110621466A (zh) * | 2017-04-10 | 2019-12-27 | 塔克托科技有限公司 | 电子组件的制造方法及电子组件 |
CN110621466B (zh) * | 2017-04-10 | 2022-09-13 | 塔克托科技有限公司 | 电子组件的制造方法及电子组件 |
CN110972386A (zh) * | 2018-09-28 | 2020-04-07 | 深圳正峰印刷有限公司 | 适用于印刷电子元件的电路板 |
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Publication number | Publication date |
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KR20080107995A (ko) | 2008-12-11 |
US20090067145A1 (en) | 2009-03-12 |
JP2008306031A (ja) | 2008-12-18 |
TW200904281A (en) | 2009-01-16 |
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