CN101311616B - 光源模块、背光组件、显示装置及其方法 - Google Patents

光源模块、背光组件、显示装置及其方法 Download PDF

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Publication number
CN101311616B
CN101311616B CN200810098330.3A CN200810098330A CN101311616B CN 101311616 B CN101311616 B CN 101311616B CN 200810098330 A CN200810098330 A CN 200810098330A CN 101311616 B CN101311616 B CN 101311616B
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CN
China
Prior art keywords
power panel
luminescence chip
main body
light
along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200810098330.3A
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English (en)
Chinese (zh)
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CN101311616A (zh
Inventor
禹胜均
周荣备
李益洙
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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Publication date
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Publication of CN101311616A publication Critical patent/CN101311616A/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Liquid Crystal (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
CN200810098330.3A 2007-05-25 2008-05-23 光源模块、背光组件、显示装置及其方法 Expired - Fee Related CN101311616B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020070050619 2007-05-25
KR1020070050619A KR101352921B1 (ko) 2007-05-25 2007-05-25 광원모듈, 이를 갖는 백라이트 어셈블리 및 이를 갖는표시장치
KR10-2007-0050619 2007-05-25

Publications (2)

Publication Number Publication Date
CN101311616A CN101311616A (zh) 2008-11-26
CN101311616B true CN101311616B (zh) 2014-04-23

Family

ID=39714129

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810098330.3A Expired - Fee Related CN101311616B (zh) 2007-05-25 2008-05-23 光源模块、背光组件、显示装置及其方法

Country Status (5)

Country Link
US (1) US8053968B2 (enExample)
EP (1) EP1995795A3 (enExample)
JP (1) JP2008293979A (enExample)
KR (1) KR101352921B1 (enExample)
CN (1) CN101311616B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI368336B (en) * 2007-07-12 2012-07-11 Chi Mei Lighting Tech Corp Light emitting diode device and applications thereof
KR101295146B1 (ko) 2008-12-19 2013-08-09 엘지디스플레이 주식회사 액정표시소자
JP5499905B2 (ja) * 2010-05-28 2014-05-21 三菱電機株式会社 表示・照明装置
TWI531840B (zh) * 2011-05-24 2016-05-01 友達光電股份有限公司 背光模組
CN103827738B (zh) * 2011-09-30 2016-08-31 夏普株式会社 显示装置和电视接收装置
KR102023457B1 (ko) * 2011-12-21 2019-09-20 엘지이노텍 주식회사 반사판 및 이를 포함하는 백라이트 유닛
JP5927056B2 (ja) * 2012-06-14 2016-05-25 ルネサスエレクトロニクス株式会社 半導体装置
KR102068766B1 (ko) * 2013-01-22 2020-01-21 엘지디스플레이 주식회사 발광다이오드 어셈블리 및 이를 포함하는 액정표시장치
DE102014208960A1 (de) * 2014-05-12 2015-11-12 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements
JP6323806B2 (ja) * 2014-06-30 2018-05-16 パナソニックＩｐマネジメント株式会社 発光デバイス及び移動体
CN104360528B (zh) * 2014-11-18 2017-06-06 深圳市华星光电技术有限公司 一种显示模组
WO2019213661A1 (en) 2018-05-04 2019-11-07 Red E Innovations, Llc System for monitoring an injection mold or stamping die
CN110174801B (zh) * 2019-05-30 2024-03-26 武汉华星光电技术有限公司 显示模组
CN119596587B (zh) * 2024-12-31 2025-11-11 惠科股份有限公司 显示模组及其温度控制方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
CN1189951C (zh) * 2000-04-24 2005-02-16 罗姆股份有限公司 侧发射型半导体光发射器件及其制造方法
CN1624944A (zh) * 2003-12-03 2005-06-08 住友电气工业株式会社 发光装置
CN1892361A (zh) * 2005-07-06 2007-01-10 三星电机株式会社 背光装置的光源引导结构及具有该结构的背光装置
CN1926694A (zh) * 2004-03-24 2007-03-07 株式会社瑞萨柳井半导体 发光器件的制造方法和发光器件

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JPH08201805A (ja) 1995-01-31 1996-08-09 Minolta Co Ltd 液晶表示面の照明構造
KR100708511B1 (ko) * 2000-03-17 2007-04-16 마츠시타 덴끼 산교 가부시키가이샤 반도체 발광장치 및 면 발광장치
JP2001345485A (ja) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd 発光装置
JP3930710B2 (ja) * 2000-09-13 2007-06-13 シチズン電子株式会社 チップ型発光ダイオード及びその製造方法
JP4379786B2 (ja) * 2003-11-11 2009-12-09 株式会社エンプラス 面光源装置
JP2005260276A (ja) * 2003-12-03 2005-09-22 Sumitomo Electric Ind Ltd 発光装置
JP4902114B2 (ja) * 2004-12-16 2012-03-21 日亜化学工業株式会社 発光装置
KR20060104795A (ko) 2005-03-31 2006-10-09 삼성에스디아이 주식회사 평판표시장치의 백라이트 유닛
KR100665216B1 (ko) * 2005-07-04 2007-01-09 삼성전기주식회사 개선된 측벽 반사 구조를 갖는 측면형 발광다이오드
JP4701904B2 (ja) * 2005-08-03 2011-06-15 ソニー株式会社 電気光学装置及び電子機器
KR100736670B1 (ko) 2005-08-08 2007-07-06 희성전자 주식회사 고효율 발광다이오드 백라이트 유닛
US8168989B2 (en) * 2005-09-20 2012-05-01 Renesas Electronics Corporation LED light source and method of manufacturing the same
DE102006032416A1 (de) * 2005-09-29 2007-04-05 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement
EP1929501A4 (en) * 2005-09-30 2010-01-06 Univ California NITRIDE AND OXYNITRIDCER BASED FUEL MATERIALS FOR SEMICONDUCTOR LIGHTING APPLICATIONS
TWI368336B (en) * 2007-07-12 2012-07-11 Chi Mei Lighting Tech Corp Light emitting diode device and applications thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
CN1189951C (zh) * 2000-04-24 2005-02-16 罗姆股份有限公司 侧发射型半导体光发射器件及其制造方法
CN1624944A (zh) * 2003-12-03 2005-06-08 住友电气工业株式会社 发光装置
CN1926694A (zh) * 2004-03-24 2007-03-07 株式会社瑞萨柳井半导体 发光器件的制造方法和发光器件
CN1892361A (zh) * 2005-07-06 2007-01-10 三星电机株式会社 背光装置的光源引导结构及具有该结构的背光装置

Also Published As

Publication number Publication date
JP2008293979A (ja) 2008-12-04
EP1995795A3 (en) 2009-02-11
EP1995795A2 (en) 2008-11-26
CN101311616A (zh) 2008-11-26
US8053968B2 (en) 2011-11-08
US20080291365A1 (en) 2008-11-27
KR20080103634A (ko) 2008-11-28
KR101352921B1 (ko) 2014-01-24

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SAMSUNG DISPLAY CO., LTD.

Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD.

Effective date: 20130104

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20130104

Address after: Gyeonggi Do, South Korea

Applicant after: Samsung Display Co.,Ltd.

Address before: Gyeonggi Do, South Korea

Applicant before: Samsung Electronics Co.,Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140423

Termination date: 20210523

CF01 Termination of patent right due to non-payment of annual fee