CN101297401B - 用于电气器件的冷却结构 - Google Patents

用于电气器件的冷却结构 Download PDF

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Publication number
CN101297401B
CN101297401B CN200680040186.7A CN200680040186A CN101297401B CN 101297401 B CN101297401 B CN 101297401B CN 200680040186 A CN200680040186 A CN 200680040186A CN 101297401 B CN101297401 B CN 101297401B
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CN
China
Prior art keywords
cooling medium
inlet
cooling
passages
electrical device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200680040186.7A
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English (en)
Chinese (zh)
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CN101297401A (zh
Inventor
朝仓健
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Toyota Motor Corp
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Toyota Motor Corp
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Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of CN101297401A publication Critical patent/CN101297401A/zh
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Publication of CN101297401B publication Critical patent/CN101297401B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN200680040186.7A 2005-10-28 2006-10-26 用于电气器件的冷却结构 Expired - Fee Related CN101297401B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP314757/2005 2005-10-28
JP2005314757A JP4470857B2 (ja) 2005-10-28 2005-10-28 電気機器の冷却構造
PCT/JP2006/321931 WO2007049807A1 (ja) 2005-10-28 2006-10-26 電気機器の冷却構造

Publications (2)

Publication Number Publication Date
CN101297401A CN101297401A (zh) 2008-10-29
CN101297401B true CN101297401B (zh) 2010-05-19

Family

ID=37967908

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680040186.7A Expired - Fee Related CN101297401B (zh) 2005-10-28 2006-10-26 用于电气器件的冷却结构

Country Status (5)

Country Link
US (1) US8789578B2 (enExample)
JP (1) JP4470857B2 (enExample)
CN (1) CN101297401B (enExample)
DE (1) DE112006002839B4 (enExample)
WO (1) WO2007049807A1 (enExample)

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CN103477432B (zh) * 2011-05-16 2017-06-20 富士电机株式会社 半导体模块冷却器
CN102545723B (zh) * 2012-03-02 2014-09-17 杭州电子科技大学 半导体制冷片温差发电实验装置
JP5975110B2 (ja) * 2012-10-29 2016-08-23 富士電機株式会社 半導体装置
CN105075068B (zh) * 2013-09-10 2018-10-16 普罗蒂恩电子有限公司 电动机或发电机
US10257524B2 (en) * 2015-07-01 2019-04-09 Mediatek Inc. Residual up-sampling apparatus for performing transform block up-sampling and residual down-sampling apparatus for performing transform block down-sampling
JP2018093115A (ja) * 2016-12-06 2018-06-14 株式会社デンソー 冷却器
JP6698111B2 (ja) * 2018-01-09 2020-05-27 日本軽金属株式会社 液冷ジャケット
US10548245B2 (en) 2018-02-12 2020-01-28 Robert J Lipp Liquid cooled open compute project rack insert
JP2019057739A (ja) * 2019-01-07 2019-04-11 日本軽金属株式会社 液冷ジャケット
EP3836206B1 (en) * 2019-12-13 2025-05-07 Valeo eAutomotive Germany GmbH Cooling device for semiconductor switching elements, power inverter device, arrangement and manufacturing method
DE102021206107B4 (de) * 2021-06-15 2024-09-12 Bundesdruckerei Gmbh Vorrichtung und Verfahren zum Herstellen von Hologrammen im Kontaktkopierverfahren mit hoher Beugungseffizienz
CN117316895A (zh) * 2022-06-23 2023-12-29 中兴通讯股份有限公司 液冷封装结构、液冷散热系统和通信设备
CN118575268A (zh) * 2022-08-24 2024-08-30 富士电机株式会社 半导体装置

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JP特开2004-335516A 2004.11.25
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Also Published As

Publication number Publication date
JP2007123607A (ja) 2007-05-17
DE112006002839T5 (de) 2008-09-18
US8789578B2 (en) 2014-07-29
WO2007049807A1 (ja) 2007-05-03
US20090095450A1 (en) 2009-04-16
CN101297401A (zh) 2008-10-29
DE112006002839B4 (de) 2012-04-26
JP4470857B2 (ja) 2010-06-02

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100519

Termination date: 20191026