CN101230958A - LED lamp string and manufacturing method thereof - Google Patents
LED lamp string and manufacturing method thereof Download PDFInfo
- Publication number
- CN101230958A CN101230958A CNA200810026336XA CN200810026336A CN101230958A CN 101230958 A CN101230958 A CN 101230958A CN A200810026336X A CNA200810026336X A CN A200810026336XA CN 200810026336 A CN200810026336 A CN 200810026336A CN 101230958 A CN101230958 A CN 101230958A
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- lead
- lamp string
- led lamp
- luminescent wafer
- connecting line
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Abstract
The invention discloses an LED lamp string and the making method of the lamp string, and the LED lamp string comprises a lead, a luminous wafer and a coating body. The lead is divided into multiple sections of connecting lines which connect in serials, and the luminous wafer is connected among each section of the connecting line. One end of the connecting lines is provided with an installation platform, and the luminous wafer is arranged at the installation platform and is electrically connected with the installation platform. The other pole of the luminous wafer is connected with adjacent connecting lines through a down-lead, and the luminous wafer, the down-lead and the ends of two connecting lines are sealed in the coating body. When the invention is made, the guide line of the lamp string is divided into multiple connecting lines which are connected in serials, and two adjacent connecting lines are both connected to two poles of the luminous wafer; the LED lamp string is formed after glue injection and encapsulation. Adopting the making method can save the cost of specially producing LED and simplify tedious technology of using the existing LED to manufacture the LED lamp string, which causes the LED lamp string to have the advantages of simpler structure, more convenient and quicker manufacture, lower cost, higher efficiency, better lamp string intensity and better waterproof performance.
Description
Technical field
The present invention relates to a kind of lamp string product, particularly a kind of installation and encapsulated LED lamp string that directly on lead, carries out luminescent wafer; The invention still further relates to the preparation method of this LED lamp string.
Background technology
In recent years, the development of LED and application speed were very rapidly, produced or the like as the encapsulation of the LED of the appearance of great power LED and large-scale production, small volume.But studying carefully its luminous essence, all is that to have utilized semiconductor PN be that the electrical characteristic of luminescent wafer realizes.LED comprises wafer, is connected in the metal pins at wafer the two poles of the earth and the housing that wrapper is overlying on the luminescent wafer outside.Its preparation method is: big sheet metal is placed on carries out stamping-out on the mould earlier, remove most of material wherein, stay the stator between LED pin part and the pin part, after be placed on and weld automatically on the equipment and encapsulate, produce the stator that cuts off each pin part after finishing and promptly form one one LED.During use, again ground of the above-mentioned LED for preparing is soldered on the electrical equipments such as circuit board, lead.
For the lamp decoration product of making as LED lamp string, existing manufacture is, the installation of LED that makes is connected to forms LED lamp string on the lead, and the lamp string of this spline structure is not easy to produce, and its efficient is lower, and cost is also higher; And, the lamp of finishing conspires to create that the bonding strength between the LED pin and lamp string guide wire is difficult to guarantee in the product, the quality problems that have aspects such as connectivity robustness and water resistance be whether up to standard, also need do a little specially treateds, add silica gel sheath and wait and make it to meet the requirements as adding spacer, LED in the mount pad of making LED, the mount pad between encapsulating, pin.
Summary of the invention
In order to address the above problem, the object of the present invention is to provide a kind of simple in structure, easy to make, production cost is low and production efficiency is high LED lamp string.
Another object of the present invention is to provide a kind of manufacture method of above-mentioned LED lamp string.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of LED lamp string, comprise lead and luminescent wafer and outer cladding thereof, lead is divided into the connecting line of multistage serial connection, all be connected with luminescent wafer between every section connecting line, one end of connecting line is provided with the mounting platform that is electrically connected with it, luminescent wafer is installed on mounting platform and also with between the mounting platform is electrically connected, another utmost point of luminescent wafer is electrically connected to the connecting line that is adjacent by lead-in wire, and luminescent wafer, lead-in wire, the two connecting line ends that are electrically connected with luminescent wafer and lead-in wire are packaged in the cladding.
The manufacture method of above-mentioned LED lamp string, it comprises the steps:
F. lead fixed is good and at relevant position fabrication and installation platform;
G. above-mentioned lead is cut off in the mounting platform place, form the multistage connecting line;
H. a utmost point of luminescent wafer is installed and be connected on the mounting platform of connecting line end;
I. with lead-in wire another utmost point of luminescent wafer is electrically connected to the end of another adjacent connecting line;
J. the luminescent wafer in the combinations thereof part, lead-in wire, the two connecting line ends that are electrically connected with luminescent wafer and lead-in wire are packaged in the cladding, form the LED lamp and conspire to create product.
The invention has the beneficial effects as follows: the present invention is joined together to form a string this architectural feature according to LED lamp string needs with a plurality of LED, lamp string guide wire is divided into the multistage connecting line of serial connection, the injecting glue encapsulation back, the two poles of the earth that the two neighboring sections connecting line all is electrically connected to luminescent wafer forms LED lamp string, saved the cost of special making or purchase LED, and simplified the loaded down with trivial details technology that the LED that uses existing structure makes LED lamp string, after adopting the LED lamp string and manufacture method thereof of said structure, make LED lamp string structure simpler, make more convenient and quicker, cost is lower, efficient is higher, and the intensity of lamp string is better, and water resistance is better.
Description of drawings
The present invention is described in more detail below in conjunction with drawings and Examples.
Fig. 1 is the structural representation of LED lamp string of the present invention.
The specific embodiment
With reference to Fig. 1, a kind of LED lamp string of the present invention, comprise lead 1 and luminescent wafer 2 and outer cladding 3 thereof, lead 1 is divided into the connecting line 11 of multistage serial connection, all be connected with luminescent wafer 2 between every section connecting line 11, one end of connecting line 11 is provided with the mounting platform 12 that is electrically connected with it, described luminescent wafer 2 be installed on mounting platform 12 and with mounting platform 12 between be electrically connected, another utmost point of luminescent wafer 2 20 is electrically connected to the connecting line 11 that is adjacent, described luminescent wafer 2 by going between, lead-in wire 20, two connecting lines, 11 ends that are electrically connected with luminescent wafer 2 and lead-in wire 20 are packaged in the cladding 3.
The present invention is joined together to form a string this architectural feature according to LED lamp string needs with a plurality of LED, directly substitutes the hard metal pin of prior art with lead 1 as the pin of LED, can reduce because of making the input cost of LED.Lead 1 is provided with mounting platform 12, and lead 1 cut off in mounting platform 12 places, be divided into the multistage connecting line 11 of serial connection, be electrically connected luminescent wafer 2 between every section connecting line 11, luminescent wafer 2 is installed on the mounting platform 12, and be electrically connected with mounting platform 12, another utmost point of luminescent wafer 2 20 is connected on the adjacent connecting line 11 by going between, and luminescent wafer 2, mounting platform 12, lead-in wire 20 and adjacent connecting line 11 end portion encloses are gone in the cladding 3.
The manufacture method of above-mentioned LED lamp string, it comprises the steps: A, lead 1 is fixed and fabrication and installation platform 12; B, above-mentioned lead 1 is cut off in mounting platform 12 places, form multistage connecting line 11; C, the utmost point of luminescent wafer 2 installed be connected on the mounting platform 12 of connecting line 11 ends; D, be electrically connected to the end of another connecting line 11 that is adjacent with lead-in wire 20 another utmost points with luminescent wafer 2; E, with the luminescent wafer in the combinations thereof part 2, lead-in wire 20, be packaged in the cladding 3 with the luminescent wafer 2 and 20 two connecting lines, 11 ends that are electrically connected that go between, form the LED lamp and conspire to create product.
After adopting the LED lamp string and manufacture method thereof of said structure, make LED lamp string structure simpler, make more convenient and quicker, cost is lower, and efficient is higher, and the intensity of lamp string is better, and water resistance is better.
Claims (2)
1. LED lamp string, comprise lead (1) and luminescent wafer (2) and outer cladding (3) thereof, it is characterized in that: lead (1) is divided into the connecting line (11) of multistage serial connection, all be connected with luminescent wafer (2) between every section connecting line (11), one end of connecting line (11) is provided with the mounting platform (12) that is electrically connected with it, described luminescent wafer (2) be installed on mounting platform (12) and with mounting platform (12) between be electrically connected, another utmost point of luminescent wafer (2) is electrically connected to the connecting line (11) that is adjacent, described luminescent wafer (2) by lead-in wire (20), lead-in wire (20), two connecting lines (11) end that is electrically connected with luminescent wafer (2) and lead-in wire (20) is packaged in the cladding (3).
2. the manufacture method of a LED lamp string, it comprises the steps:
A. lead (1) is fixed and at relevant position fabrication and installation platform (12);
B. above-mentioned lead (1) is located to cut off in mounting platform (12), form multistage connecting line (11);
C. a utmost point of luminescent wafer (2) is installed and be connected on the mounting platform (12) of connecting line (11) end;
D. with lead-in wire (20) another utmost point of luminescent wafer (2) is electrically connected to the end of another connecting line (11) that is adjacent;
E. with the luminescent wafer in the combinations thereof part (2), lead-in wire (20), be packaged in the cladding (3) with two connecting lines (11) end of luminescent wafer (2) and lead-in wire (20) electrical connection, formation LED lamp conspires to create product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200810026336XA CN101230958A (en) | 2008-02-05 | 2008-02-05 | LED lamp string and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200810026336XA CN101230958A (en) | 2008-02-05 | 2008-02-05 | LED lamp string and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101230958A true CN101230958A (en) | 2008-07-30 |
Family
ID=39897651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200810026336XA Pending CN101230958A (en) | 2008-02-05 | 2008-02-05 | LED lamp string and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101230958A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102454908A (en) * | 2010-10-18 | 2012-05-16 | 深圳市日上光电有限公司 | Light-emitting diode (LED)-exposed waterproof perforated lamp string and manufacturing process thereof |
| CN106224828A (en) * | 2016-09-30 | 2016-12-14 | 桂林电子科技大学 | Children's interesting light fixture |
| WO2018094887A1 (en) * | 2016-11-22 | 2018-05-31 | 鹤山建豪电光源有限公司 | Led light string having series structure and manufacturing process therefor |
| CN109945092A (en) * | 2019-03-29 | 2019-06-28 | 临海市大为光电科技有限公司 | A kind of LED light string and its processing technology |
-
2008
- 2008-02-05 CN CNA200810026336XA patent/CN101230958A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102454908A (en) * | 2010-10-18 | 2012-05-16 | 深圳市日上光电有限公司 | Light-emitting diode (LED)-exposed waterproof perforated lamp string and manufacturing process thereof |
| CN106224828A (en) * | 2016-09-30 | 2016-12-14 | 桂林电子科技大学 | Children's interesting light fixture |
| WO2018094887A1 (en) * | 2016-11-22 | 2018-05-31 | 鹤山建豪电光源有限公司 | Led light string having series structure and manufacturing process therefor |
| CN109945092A (en) * | 2019-03-29 | 2019-06-28 | 临海市大为光电科技有限公司 | A kind of LED light string and its processing technology |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080730 |