CN101198721A - 无电解金电镀液 - Google Patents

无电解金电镀液 Download PDF

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Publication number
CN101198721A
CN101198721A CNA2006800210751A CN200680021075A CN101198721A CN 101198721 A CN101198721 A CN 101198721A CN A2006800210751 A CNA2006800210751 A CN A2006800210751A CN 200680021075 A CN200680021075 A CN 200680021075A CN 101198721 A CN101198721 A CN 101198721A
Authority
CN
China
Prior art keywords
gold
gold plating
tunicle
wire
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800210751A
Other languages
English (en)
Chinese (zh)
Inventor
松本雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NE Chemcat Corp
Original Assignee
NE Chemcat Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NE Chemcat Corp filed Critical NE Chemcat Corp
Publication of CN101198721A publication Critical patent/CN101198721A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
CNA2006800210751A 2005-06-16 2006-06-13 无电解金电镀液 Pending CN101198721A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005176000 2005-06-16
JP176000/2005 2005-06-16

Publications (1)

Publication Number Publication Date
CN101198721A true CN101198721A (zh) 2008-06-11

Family

ID=37532427

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800210751A Pending CN101198721A (zh) 2005-06-16 2006-06-13 无电解金电镀液

Country Status (4)

Country Link
KR (1) KR101230651B1 (ko)
CN (1) CN101198721A (ko)
TW (1) TWI439581B (ko)
WO (1) WO2006135079A1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102286736A (zh) * 2011-08-29 2011-12-21 深圳市化讯应用材料有限公司 一种置换型化学镀金液
CN104540983A (zh) * 2012-10-04 2015-04-22 日本电镀工程股份有限公司 非氰系电解镀金液
CN109457239A (zh) * 2018-12-27 2019-03-12 吉安宏达秋科技有限公司 还原型非氰镀金液、镀金方法以及镀金产品
CN110344089A (zh) * 2019-06-26 2019-10-18 深圳市瑞世兴科技有限公司 一种亚硫酸金钠镀液及其电镀方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
JP3146757B2 (ja) * 1993-05-26 2001-03-19 日立化成工業株式会社 置換金めっき液
JP2000087251A (ja) 1998-09-04 2000-03-28 Okuno Chem Ind Co Ltd 無電解金めっき液
JP4051513B2 (ja) * 1998-12-14 2008-02-27 奥野製薬工業株式会社 置換型無電解金めっき液
JP2003193250A (ja) * 2001-12-26 2003-07-09 Meltex Inc 無電解金めっき液
JP4146180B2 (ja) * 2002-07-08 2008-09-03 富士フイルム株式会社 カメラ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102286736A (zh) * 2011-08-29 2011-12-21 深圳市化讯应用材料有限公司 一种置换型化学镀金液
CN104540983A (zh) * 2012-10-04 2015-04-22 日本电镀工程股份有限公司 非氰系电解镀金液
CN104540983B (zh) * 2012-10-04 2019-05-21 日本电镀工程股份有限公司 非氰系电解镀金液
CN109457239A (zh) * 2018-12-27 2019-03-12 吉安宏达秋科技有限公司 还原型非氰镀金液、镀金方法以及镀金产品
CN110344089A (zh) * 2019-06-26 2019-10-18 深圳市瑞世兴科技有限公司 一种亚硫酸金钠镀液及其电镀方法
CN110344089B (zh) * 2019-06-26 2021-11-09 深圳市瑞世兴科技有限公司 一种亚硫酸金钠镀液及其电镀方法

Also Published As

Publication number Publication date
KR101230651B1 (ko) 2013-02-06
WO2006135079A1 (ja) 2006-12-21
TW200704832A (en) 2007-02-01
TWI439581B (zh) 2014-06-01
KR20080017320A (ko) 2008-02-26

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20080611