CN101194214B - 载物台装置 - Google Patents

载物台装置 Download PDF

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Publication number
CN101194214B
CN101194214B CN2006800204661A CN200680020466A CN101194214B CN 101194214 B CN101194214 B CN 101194214B CN 2006800204661 A CN2006800204661 A CN 2006800204661A CN 200680020466 A CN200680020466 A CN 200680020466A CN 101194214 B CN101194214 B CN 101194214B
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CN
China
Prior art keywords
axis
holding member
mentioned
support base
objective table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800204661A
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English (en)
Chinese (zh)
Other versions
CN101194214A (zh
Inventor
中岛龙太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Publication of CN101194214A publication Critical patent/CN101194214A/zh
Application granted granted Critical
Publication of CN101194214B publication Critical patent/CN101194214B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Machine Tool Units (AREA)
CN2006800204661A 2005-07-21 2006-07-20 载物台装置 Expired - Fee Related CN101194214B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005211724A JP4664142B2 (ja) 2005-07-21 2005-07-21 ステージ装置
JP211724/2005 2005-07-21
PCT/JP2006/314356 WO2007010971A1 (ja) 2005-07-21 2006-07-20 ステージ装置

Publications (2)

Publication Number Publication Date
CN101194214A CN101194214A (zh) 2008-06-04
CN101194214B true CN101194214B (zh) 2010-09-29

Family

ID=37668843

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800204661A Expired - Fee Related CN101194214B (zh) 2005-07-21 2006-07-20 载物台装置

Country Status (6)

Country Link
US (1) US7997567B2 (https=)
JP (1) JP4664142B2 (https=)
KR (1) KR100909585B1 (https=)
CN (1) CN101194214B (https=)
TW (1) TW200715357A (https=)
WO (1) WO2007010971A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4976922B2 (ja) * 2007-05-29 2012-07-18 株式会社オーク製作所 基板搬送装置
JP4750090B2 (ja) * 2007-09-14 2011-08-17 住友重機械工業株式会社 ステージ装置
JP4917050B2 (ja) * 2008-01-23 2012-04-18 住友重機械工業株式会社 ステージ装置
KR101316804B1 (ko) * 2008-12-25 2013-10-11 가부시키가이샤 알박 정전척용의 척 플레이트의 제조 방법
US8084896B2 (en) * 2008-12-31 2011-12-27 Electro Scientific Industries, Inc. Monolithic stage positioning system and method
JP5137218B1 (ja) * 2011-08-30 2013-02-06 株式会社ソディック 工作機械
CN102501226B (zh) * 2011-10-31 2014-02-19 西安理工大学 一种宏微驱动变形导轨精密回转装置
CN104028944B (zh) * 2013-03-08 2016-08-10 鸿准精密模具（昆山）有限公司 整形装置及其定位机构
US10192773B2 (en) * 2016-06-20 2019-01-29 Nexperia B.V. Semiconductor device positioning system and method for semiconductor device positioning
CN107081607B (zh) * 2017-02-22 2019-01-18 浙江江山福鑫工艺品有限公司 一种加工工件用加工台装置
CN113606440B (zh) * 2021-08-05 2022-08-26 唐山师范学院 一种物联网用计算机支撑台
CN117597737A (zh) * 2022-06-15 2024-02-23 株式会社村田制作所 层叠装置以及层叠系统
KR102688248B1 (ko) * 2022-11-29 2024-07-25 이노로보틱스 주식회사 Zt 스테이지

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682658A (en) * 1996-03-04 1997-11-04 Utica Enterprises, Inc. Rotary index table assembly
EP1197988A2 (en) * 2000-10-10 2002-04-17 Applied Materials, Inc. Multiple wafer lift apparatus and method therefor
CN1588556A (zh) * 2004-07-30 2005-03-02 中国科学院上海光学精密机械研究所 五自由度精密定位平台
US20060104753A1 (en) * 2004-11-02 2006-05-18 Yoichi Arai Stage assembly with lightweight fine stage and low transmissibility
CN1824458A (zh) * 2005-02-21 2006-08-30 住友重机械工业株式会社 载物台装置和龙门型载物台装置及载物台装置的控制方法
CN101192511A (zh) * 2005-02-25 2008-06-04 Ips有限公司 真空处理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2903958B2 (ja) * 1993-06-23 1999-06-14 キヤノン株式会社 位置決め装置及びそれを用いた半導体素子の製造方法
JP3196798B2 (ja) * 1993-10-12 2001-08-06 キヤノン株式会社 自重支持装置
JP3164960B2 (ja) * 1994-02-18 2001-05-14 キヤノン株式会社 ステージ装置
US5609332A (en) * 1995-11-14 1997-03-11 Hassell; Clayton Device for lifting and holding cabinets
JP3732763B2 (ja) * 2001-07-13 2006-01-11 住友重機械工業株式会社 ステージ装置
JP3940277B2 (ja) * 2001-07-13 2007-07-04 住友重機械工業株式会社 ステージ装置
JP4223714B2 (ja) * 2001-11-30 2009-02-12 住友重機械工業株式会社 ステージ装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682658A (en) * 1996-03-04 1997-11-04 Utica Enterprises, Inc. Rotary index table assembly
EP1197988A2 (en) * 2000-10-10 2002-04-17 Applied Materials, Inc. Multiple wafer lift apparatus and method therefor
CN1588556A (zh) * 2004-07-30 2005-03-02 中国科学院上海光学精密机械研究所 五自由度精密定位平台
US20060104753A1 (en) * 2004-11-02 2006-05-18 Yoichi Arai Stage assembly with lightweight fine stage and low transmissibility
CN1824458A (zh) * 2005-02-21 2006-08-30 住友重机械工业株式会社 载物台装置和龙门型载物台装置及载物台装置的控制方法
CN101192511A (zh) * 2005-02-25 2008-06-04 Ips有限公司 真空处理装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP 平8-1066 A,全文.

Also Published As

Publication number Publication date
JP2007027659A (ja) 2007-02-01
JP4664142B2 (ja) 2011-04-06
TW200715357A (en) 2007-04-16
KR100909585B1 (ko) 2009-07-24
US7997567B2 (en) 2011-08-16
CN101194214A (zh) 2008-06-04
WO2007010971A1 (ja) 2007-01-25
US20080087791A1 (en) 2008-04-17
TWI307916B (https=) 2009-03-21
KR20080014989A (ko) 2008-02-15

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