CN101188902A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN101188902A
CN101188902A CNA2006101568991A CN200610156899A CN101188902A CN 101188902 A CN101188902 A CN 101188902A CN A2006101568991 A CNA2006101568991 A CN A2006101568991A CN 200610156899 A CN200610156899 A CN 200610156899A CN 101188902 A CN101188902 A CN 101188902A
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Prior art keywords
circuit board
printed circuit
pcb
ground plane
power module
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CN101188902B (zh
Inventor
张喨尧
许寿国
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2006101568991A priority Critical patent/CN101188902B/zh
Priority to US11/829,972 priority patent/US7655870B2/en
Publication of CN101188902A publication Critical patent/CN101188902A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印刷电路板，包括一接地层和一电源层，所述电源层包括被一隔离块隔离的两电源块，所述接地层上临近所述两电源块相对边缘处设有若干切割槽。在所述接地层上临近所述两电源块相对边缘处设有切割槽，等效于在噪声传导的路径上增加串联的电感，所述等效的串联电感有滤除高频分量的特性，可抑制所述两电源块间的噪声耦合。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板。
背景技术
在现今印刷电路板上，芯片往往需要多种不同的电压以支持不同的运算要求，因此，需要将印刷电路板的电源层切割成多个电源块，以提供不同的电压。由于不同的电源块的电压不同，故设置一个隔离块隔离相邻的电源块。此外，部分芯片为了避免来自其它芯片的噪声干扰，即使使用相同的电压，对应的电源块仍设置适当的隔离块。
如图1所示，传统的印刷电路板包括一接地层100、一电源层200和两电子元件A、B。所述电源层200包括两电源块210、220，和将两电源块210、220隔离的隔离块230。所述电源层200与所述接地层100之间填充玻璃纤维材料(图未示)，所述隔离块230为玻璃纤维材料。所述电子元件A、B位于所述印刷电路板的表层，并分别与所述电源块210、220电连接(图未示)。虽然两电源块210、220通过所述隔离块230相互隔离，但所述电子元件A输出的信号在高速切换操作时，仍有噪声通过所述隔离块230所存在的电容性耦合结构，从所述电源块210跨越该隔离块230，耦合至所述电源块220，使所述电子元件B输入的信号受到噪声干扰，从而可能造成所述电子元件B的误动作。
加宽所述电源块210、220之间的距离可有效抑制噪声耦合，然而，在保持所述电源层200面积不变的情况下加宽所述电源块210、220之间的距离，会减小所述电源层200承载电流的能力，在保持所述两电源块210、220面积不变的情况下加宽所述电源块210、220之间的距离，会增加所述电源层200的面积，影响印刷电路板的布线空间。
发明内容
鉴于以上内容，有必要提供一种可抑制电源块间噪声耦合的印刷电路板。
一种印刷电路板，包括一接地层和一电源层，所述电源层包括被一隔离块隔离的两电源块，所述接地层上临近所述两电源块相对边缘处设有若干切割槽。
相较现有技术，所述印刷电路板在接地层上临近所述两电源块相对边缘处设有切割槽，等效于在噪声传导的路径上增加串联的电感，所述等效的串联电感有滤除高频分量的特性，从而抑制所述两电源块间的噪声耦合。
附图说明
图1是传统的印刷电路板示意图。
图2是本发明印刷电路板的第一较佳实施方式的示意图。
图3是图2中印刷电路板接的俯视图。
图4是本发明印刷电路板的第二较佳实施方式的俯视图。
图5是本发明印刷电路板的较佳实施方式与图1所示的印刷电路板的频率响应比较示意图。
具体实施方式
请参阅图2及图3，本发明印刷电路板的第一较佳实施方式包括一接地层10、一电源层20。所述电源层20包括两电源块21、22及将两电源块21、22隔离的一隔离块(图未示)。所述两电源块21、22共用所述接地层10。所述电源层20与所述接地层10之间填充玻璃纤维材料(图未示)，所述隔离块为玻璃纤维材料。所述接地层10上设有若干切割槽24，所述切割槽24分布于所述接地层10上临近所述两电源块21、22的相对边缘处，所述切割槽24在所述接地层10上沿所述电源块21、22相对边缘排列。一般而言，接地层10为信号及噪声提供了一个电流返回路径，在所述接地层10上设有切割槽24，等效于在噪声传导的路径上增加串联的电感，所述等效的串联电感有滤除高频分量的特性，可有效抑制噪声。本实施例中，在接地层10上设有两排切割槽24，其中一排切割槽24位于所述电源块21靠近所述电源块22的边缘下方，另一排切割槽24位于所述电源块22靠近所述电源块21的边缘下方。所述切割槽24也可只设置一排，只位于电源块21或只位于电源块22的下方。所述印刷电路板中切割槽24的个数没有限制，但采用位于电源块21下方的切割槽24与位于所述电源块22下方的切割槽24对应设置且设置的切割槽24的排数越多对噪声的抑制效果越好。参阅附图4，在本发明的第二较佳实施方式中，对应每一电源块21、22位于接地层10的切割槽24的排数增加为二排以增强对噪声的抑制效果。
请参阅图5，在传统的印刷电路板和本发明印刷电路板的较佳实施方式上模拟插入损耗，曲线1为图1所示的传统的印刷电路板频率响应曲线，曲线2为采用本发明第一较佳实施方式的印刷电路板的频率响应曲线，曲线3为采用本发明第二较佳实施方式的印刷电路板的频率响应曲线，曲线4为采用本发明较佳实施方式结构且在接地层10上各自电源块21、22对应位置处设有五排切割槽的印刷电路板的频率响应曲线。对比曲线1和曲线2、3、4可以看出，在第一个共振频率出现前的频段(0～0.9GHz)内，具有切割槽24的结构，无论切割槽24的排数多少，相较于传统的印刷电路板，插入损耗值均有所降低。而插入损耗值越低，则表示对噪声耦合的抑制效果越好。从图5中也可看出，具有切割槽24排数越多的印刷电路板插入损耗值越低。故本发明印刷电路板与传统的印刷电路板相比能够更好的抑制电源块间噪声耦合，而且，在可行的PCB制程下，减小切割槽24的宽度及切割槽24间的间距，增加切割槽24的排数，抑制噪声的效果越好。

Claims (4)

1.一种印刷电路板，包括一接地层和一电源层，所述电源层包括被一隔离块隔离的两电源块，其特征在于，所述接地层上临近所述两电源块相对边缘处设有若干切割槽。
2.如权利要求1所述的印刷电路板，其特征在于，所述切割槽沿所述两电源块相对边缘排列。
3.如权利要求1所述的印刷电路板，其特征在于，所述电源层与所述接地层之间填充玻璃纤维材料。
4.如权利要求1所述的印刷电路板，其特征在于，所述隔离块为玻璃纤维材料。
CN2006101568991A 2006-11-17 2006-11-17 印刷电路板 Expired - Fee Related CN101188902B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2006101568991A CN101188902B (zh) 2006-11-17 2006-11-17 印刷电路板
US11/829,972 US7655870B2 (en) 2006-11-17 2007-07-30 Printed circuit board able to suppress simultaneous switching noise

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Application Number Priority Date Filing Date Title
CN2006101568991A CN101188902B (zh) 2006-11-17 2006-11-17 印刷电路板

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CN101188902A true CN101188902A (zh) 2008-05-28
CN101188902B CN101188902B (zh) 2011-08-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103369817A (zh) * 2012-04-09 2013-10-23 佳能株式会社 印刷电路板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201185508Y (zh) * 2008-04-11 2009-01-21 鸿富锦精密工业（深圳）有限公司 印刷电路板
TWI415560B (zh) 2011-01-24 2013-11-11 Univ Nat Taiwan 降低電磁輻射的結構與方法，以及電性物件與其製造方法
US9241400B2 (en) * 2013-08-23 2016-01-19 Seagate Technology Llc Windowed reference planes for embedded conductors
CN107318215A (zh) * 2016-04-26 2017-11-03 鸿富锦精密电子(天津)有限公司 印刷电路板及应用该印刷电路板的电子装置

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US5761051A (en) * 1994-12-29 1998-06-02 Compaq Computer Corporation Multi-layer circuit board having a supply bus and discrete voltage supply planes
JP3058121B2 (ja) * 1997-05-19 2000-07-04 日本電気株式会社 プリント基板
DE60002897D1 (de) * 1999-08-31 2003-06-26 Sun Microsystems Inc System und verfahren zur analyse von störsignalen bei gleichzeitigem schalten
JP2001332825A (ja) * 2000-03-14 2001-11-30 Fuji Xerox Co Ltd 回路基板装置及び設計支援装置
US6624729B2 (en) * 2000-12-29 2003-09-23 Hewlett-Packard Development Company, L.P. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
CN2549687Y (zh) * 2002-06-14 2003-05-07 威盛电子股份有限公司 一种包含有平滑弧状边界的电源区块的电源层
CN100574553C (zh) * 2006-10-25 2009-12-23 鸿富锦精密工业（深圳）有限公司 印刷电路板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103369817A (zh) * 2012-04-09 2013-10-23 佳能株式会社 印刷电路板
CN103369817B (zh) * 2012-04-09 2016-03-16 佳能株式会社 印刷电路板
US9326370B2 (en) 2012-04-09 2016-04-26 Canon Kabushiki Kaisha Printed circuit board

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US20080115964A1 (en) 2008-05-22
US7655870B2 (en) 2010-02-02
CN101188902B (zh) 2011-08-24

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