CN101169602A - Focusing leveling measuring method and device - Google Patents
Focusing leveling measuring method and device Download PDFInfo
- Publication number
- CN101169602A CN101169602A CNA2007101784694A CN200710178469A CN101169602A CN 101169602 A CN101169602 A CN 101169602A CN A2007101784694 A CNA2007101784694 A CN A2007101784694A CN 200710178469 A CN200710178469 A CN 200710178469A CN 101169602 A CN101169602 A CN 101169602A
- Authority
- CN
- China
- Prior art keywords
- light
- focusing
- silicon chip
- leveling
- reflection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Measurement Of Optical Distance (AREA)
Abstract
The invention discloses a measuring method and device for focusing and leveling, and relates to a new method for the focusing and leveling sensor system of a wafer applicable to the projection photolithography system, and belongs to the field of optical measurement. The invention consists of three parts, namely, a light source collimating module, a focusing subsystem and a leveling subsystem. The laser of the invention emits laser light, the laser light is collimated by a single mode fiber and then passes through a drift compensation device, and then permeates a polarized optical splitter and a Lambda fourth wave plate and then shines on a measured silicon chip. The ray is led to pass through the measured silicon chip repeatedly through a planar mirror and a corner cube prism, and then is magnified in front of a position detector by a lens system, thereby obtaining the defocusing information of the silicon chip surface. The ray is rebounded along the path by a planar optical splitter, the ray permeates a lens and shines on a position-sensitive detector, thereby obtaining the two-dimensional inclination information of the silicon chip surface. The system has high resolution as well as simple structure of optical path and needs no complicated optical design.
Description
Technical field
The present invention relates to a kind of focusing and leveling detection method and device that is applied in the projection lithography system, be used for high Precision Detection is carried out with respect to the distance and the silicon chip two-dimensional tilting angle of projection objective in the surface of exposure silicon chip, belong to the optical measurement field.
Background technology
In projection lithography system, the silicon chip focusing, leveling measuring system is used for measuring height and corner (Z, the θ of silicon chip surface with respect to projection objective in litho machine
XAnd θ
Y), constitute feedback system with vertical 3 actuators of work stage, control the vertical position of silicon chip in real time, guarantee that silicon chip is in the focal depth range of projection objective in exposure process all the time when the front court.In the step and repeat projection litho machine in the early stage, the leveling of silicon chip only needs whole focusing and leveling, promptly in chip transmission the whole silicon wafer surface is positioned in the focal depth range.Raising along with step and repeat projection litho machine resolution and throughput rate, need to adopt to increase the surface form deviation that causes by a focusing and leveling with the quick shortening that adapts to effective depth of focus and die size and become big, the area of silicon wafer in the exposure visual field is positioned in effective focal depth range.Begin to be applied to now to have become a gordian technique of advanced scanning projecting photoetching machine in the step and repeat projection litho machine of sub-half-micron resolution by a focusing and leveling.Patented technology 1[Jan E.Van der Werf.Optical imagingarrangement comprising an opto-electronic focusing-error detectionsystem. U.S. Patent number: 4866262] utilize collimation laser to propose a kind of measuring method of focusing, concrete device sees also Fig. 1, laser 11 is through reflecting prism 12, again through behind lens 13 collimations, incide reflecting prism 14, reenter and be mapped to silicon chip 15 surfaces., incide on the detector 19 through lens 17, reflecting prism 18 again to reflecting prism 16 from silicon chip 15 surface reflections.When silicon chip surface moved up and down, detector 19 can obtain the information that silicon chip moves.In order to improve measuring accuracy, also mention in the patented technology 1 and utilize plane mirror to make twice incident silicon chip surface of light.Patent 2[Makoto U.Horizontal positiondetecting device. U.S. Patent number: 4558949] utilize collimation laser to propose a kind of measuring method of leveling.Concrete device can be referring to Fig. 2.Light source 21 focuses on through lens 22, after small holes 23 filtering, through lens 24 collimations, incides tested silicon chip 25 surfaces again.Through silicon chip surface 25 reflections, see through lens 26, incide detector 27.When silicon chip surface had two dimension to rotate, detector 27 can obtain two-dimentional rotation information.More than two kinds of technology can be used as photo-etching machine focusing and leveling respectively, but, particularly can not satisfy the requirement of the following resolution photo-etching machine focusing of present 100nm owing to measuring accuracy is difficult to satisfy the focusing and leveling precision of present projection mask aligner.Its major technology obstacle has two aspects: it is not high that (1) measures the reference precision of light own, makes systematic survey bring bigger error; (2) raising of detector resolution restriction system Measurement Resolution.
Summary of the invention
The objective of the invention is in order to improve systematic survey resolution and measuring accuracy, proposed a kind of new on prior art of the present invention [1, the 2] basis based on collimation laser focusing and leveling system.(1) utilizes and singly to touch the precision that fiber optic collimator and drift autocompensation installation have improved the laser measurement benchmark; (2) under existing detector measurement resolution condition, by repeatedly reflecting the principle that mode and lens amplify, broken through the restriction of the resolution of detector own, improve resolution and measuring accuracy that focusing and leveling are measured.Make total system can satisfy the focusing and leveling requirement of the following resolution of present 100nm projection mask aligner.
Technical scheme of the present invention is as follows:
The present invention is used for projection mask aligner's focusing and leveling sensor-based system and comprises three parts: light source collimating module, focusing subsystem and leveling subsystem, and it is characterized in that: the light source collimating module comprises singly touches fiber optic collimator module and drift compensation module; The focusing subsystem comprises plane mirror, right-angle reflecting prism, lens combination, 4 quadrant detector; The leveling subsystem comprises: polarizing beam splitter, λ/4 wave plates, plane mirror, spectroscope, convex lens and Position-Sensitive Detector.Annexation between them is seen Fig. 3; At first, focusing subsystem annexation is: light source sends laser and sees through polarizing beam splitter and λ/4 wave plates, through catoptron, incide silicon chip surface, pass through catoptron again, see through optical splitter and incide right-angle prism, through the right-angle prism reflection, incide once more on catoptron and the silicon chip, arrive right-angle prism through mirror reflects again.Through right-angle prism, as Fig. 3 dotted portion, reflex to once more on catoptron and the silicon chip, incide direct prism through catoptron, reflex to catoptron and silicon chip from right-angle prism again, pass through catoptron incident right-angle prism again, see through lens combination again, incide on the detector, twice of this subsystem reflected light with last time through silicon chip surface; Secondly, leveling subsystem annexation is: light source sends laser and sees through polarizing beam splitter and λ/4 wave plates, through catoptron, incides silicon chip surface, pass through catoptron again, through spectrophotometric reflection, another mistake is to reflexing to catoptron and silicon chip, through mirror reflects, see through λ/4 wave plates, through the polarizing beam splitter reflection, see through lens, incide on the detector.Adopt and singly touch fiber optic collimator device and drift compensation device, obtain the measuring basis that high-acruracy survey requires; Satisfy the requirement of the following photo-etching machine focusing leveling of 100nm resolution, adopt repeatedly principle of reflection and lens combination amplification principle, reduce light datum drift to the error that measurement brings, make measuring system more stable, improve focusing and leveling subsystem Measurement Resolution and measuring accuracy.
Described collimating module adopts single-mode fiber collimating module and drift compensation module.
The focusing subsystem adopts four secondary reflection principles and lens amplification principle to improve and measures focusing resolution.
The leveling subsystem adopts twice principle of reflection to improve the leveling Measurement Resolution.
Right-angle reflecting prism can be a prism of corner cube.
Plane mirror can be a reflecting prism.
Spectroscope can be semi-transparent semi-reflecting optical splitter, also can be the optical splitter of other beam split ratio.
4 quadrant detector can be dual-quadrant detector, Position-Sensitive Detector and ccd detector.
Position-Sensitive Detector can be 4 quadrant detector and ccd detector.
The step of a kind of focusing leveling measuring method of the present invention is:
(1) laser that sends from light source passes through the drift compensation device again through singly touching the fiber optic collimator device, forms a light source collimating module;
(2) the high stable laser that comes out from the light source collimating module sees through polarizing beam splitter, and polarizing beam splitter makes light become linearly polarized light, sees through λ/4 wave plates again, incides on the tested silicon face through steering reflection mirror;
(3) from the measurand surface reflection, pass through the light behind the another one steering reflection mirror again, incide an optical splitter;
(4) light of returning from spectrophotometric reflection returns along original light path once more, for the second time through λ/4 wave plates, twice process of light λ/4 wave plates make the polarization direction of light rotate 90 °, light is polarized on spectrophotometric reflection to a Position-Sensitive Detector, obtain two dimension angular information, be used for the leveling signal;
(5) light from the optical splitter transmission reflects through right-angle prism, makes light translation certain position, reflexes to tested silicon chip surface once more;
(6) reflect for the second time through silicon chip surface and plane mirror, utilize reflecting prism to make light repeat the light path of preceding two secondary reflections; Four tested silicon chip surfaces of process of measuring light;
(7) last, measuring light sees through an extender lens group through the right-angle reflecting prism reflection, and the translation signal that light is carried amplifies once more, incides on the 4 quadrant detector, obtains the out of focus information of silicon chip, is used to the signal of focusing.
(8) signal of photodetector output is through after the signal Processing, promptly obtain the position and the angle information of measurand, drive three by motion control board and drive height and the inclination of regulating substrate surface, make and measure the available focal depth range that substrate surface is positioned at projection objective.
Its course of work is: the laser that sends from light source passes through the drift compensation device again through singly touching the fiber optic collimator device, forms a light source collimating module.The high stable laser that comes out from the light source collimating module sees through polarizing beam splitter, and polarizing beam splitter makes light become linearly polarized light, sees through λ/4 wave plates again, incides on the tested silicon face through steering reflection mirror.From the measurand surface reflection, pass through the light behind the another one steering reflection mirror again, incide an optical splitter.The light of returning from spectrophotometric reflection returns along original light path once more, for the second time through λ/4 wave plates, twice process of light λ/4 wave plates make the polarization direction of light rotate 90 °, light is polarized on spectrophotometric reflection to a Position-Sensitive Detector, obtain two dimension angular information, be used for the leveling signal.The Measurement Resolution and the measuring accuracy of leveling subsystem are improved.In addition, the light process right-angle prism reflection from the optical splitter transmission makes light translation certain position, reflexes to tested silicon chip surface once more.Reflect for the second time through silicon chip surface and plane mirror, utilize reflecting prism to make light repeat the light path of preceding two secondary reflections.Four tested silicon chip surfaces of process of measuring light.At last, measuring light sees through an extender lens group, and the translation signal that light is carried amplifies once more, incides on the 4 quadrant detector, obtains the out of focus information of silicon chip, is used to the signal of focusing.Focusing subsystem Measurement Resolution and measuring accuracy are improved.The signal of photodetector output is through after the signal Processing, promptly obtain the position and the angle information of measurand, drive three by motion control board and drive height and the inclination of regulating substrate surface, make and measure the available focal depth range that substrate surface is positioned at projection objective.
Focusing subsystem and leveling subsystem have all adopted the method for collimation laser, and integrate.The focusing subsystem can adopt repeatedly reflection and lens combination amplification principle to improve Measurement Resolution; The leveling subsystem adopts repeatedly principle of reflection to improve Measurement Resolution; Right-angle prism can substitute with prism of corner cube; Plane mirror can be a reflecting prism; Optical splitter can be an optical splitter semi-transparent semi-reflecting or other beam split ratio; Repeatedly principle of reflection can be more than 2 times or 2 times; Described detector can be 4 quadrant detector or Position-Sensitive Detector or ccd detector; The collimated light source module comprises singly touches light collimator apparatus and drift compensation control device.
The present invention compares the characteristics that had with background technology:
One, provide the measuring basis of high stability.Adopted and singly touched fiber optic collimator device and drift compensation device and obtain the measuring basis that high-acruracy survey requires.
Two, pass through repeatedly principle of reflection and lens combination amplification principle, improved focusing and leveling subsystem Measurement Resolution and measuring accuracy, to satisfy the requirement of the following photo-etching machine focusing leveling of 100nm resolution.
Three, owing to repeatedly reflex to measured silicon chip surface, the contact area of hot spot and silicon chip surface is bigger, more on average silicon chip surface fluctuating influence that measurement is brought.
Four, repeatedly reflection can also reduce light datum drift to the error that measurement brings, and makes measuring system more stable.
Description of drawings
Fig. 1 is prior art [a 1] focusing measuring principle, wherein: 10-projection lens of lithography machine, 11-light source, 12,14,16, the 18-reflecting prism, 13, the 17-lens, the tested silicon chip of 15-, 19-detector;
Fig. 2 is prior art [a 2] leveling measuring principle, wherein: 20-projection lens of lithography machine, 21-light source, 22,24, the 26-lens, 23-pinhole filter, the tested silicon chip of 25-, 27-detector;
Fig. 3 is a focusing and leveling measuring system principle of the present invention, wherein: 300-projection lens of lithography machine, 301-light source collimating module, the 302-polarizing beam splitter, the 303-lens, 304-puts sensing detector, 305-λ/4 wave plates, 306,307,314-right-angle reflecting prism, the 308-lens combination, 309-4 quadrant detector, 310, the 312-plane mirror, the tested silicon chip of 311-, the semi-transparent semi-reflecting optical splitter of 313-;
Fig. 4 singly touches the fiber optic collimator module principle in the light source collimating module of the present invention; Wherein: 40-single-mode fiber collimating module, 41-are light source, and 42-is a condenser lens, and 43-is a single-mode fiber, the 44-collimation lens;
Fig. 5 is the drift compensation module principle in the light source collimating module of the present invention, wherein: 50-drift compensation module, 51-is a rhombic prism, 52-is a plane mirror, 53,55-is light-splitting device, 54,57-is detector, 56-is lens, and 58-is an emergent ray, the 59-incident ray;
Fig. 6 is-secondary reflection focusing subsystem principle; Wherein: 60-is a projection lens of lithography machine, and 61-is the light source collimating module, 62,64-is lens, and 63-is tested silicon chip, 65-is a Position-Sensitive Detector;
Fig. 7 be the silicon chip out of focus to the reflection ray translation principle, wherein: 70-is that silicon chip is in best focal plane, and 71-is position after the silicon chip out of focus;
Fig. 8 is twice principle of reflection of focusing subsystem; Wherein: 80-is a projection lens of lithography machine, and 81-is the light source collimating module, 83,85-is plane mirror, and 82-is a 4 quadrant detector, and 84-is tested silicon chip, and 86 is right-angle reflecting prism;
Fig. 9 is that the silicon chip out of focus of focusing subsystem two secondary reflections is to the light translation principle, wherein: 90-is a projection lens of lithography machine, 91-is the light source collimating module, 93,95-is a plane mirror, 92-is a 4 quadrant detector, 94-is that tested silicon chip is in best focal plane, and 96-is a right-angle reflecting prism, after 97-is the silicon chip out of focus;
Figure 10 is focusing subsystem four secondary reflection principles, wherein: 100-is a projection lens of lithography machine, 101-is the light source collimating module, 102,103,109-is a right-angle reflecting prism, 104-is a 4 quadrant detector, 105,107-is a plane mirror, and 106-is tested silicon chip, the semi-transparent semi-reflecting optical splitter of 108-;
Figure 11 be lens combination to light translation amplification principle, wherein: 110-is an incident ray, 111,112-is lens, 113-is an emergent ray;
Figure 12 is twice reflection measurement principle of leveling subsystem, among Figure 12: 120-is a projection lens of lithography machine, 121-is the light source collimating module, 122-is a polarizing beam splitter, 123-is lens, and 124-is a Position-Sensitive Detector, and 125-is λ/4 wave plates, 126,128,129-is plane mirror, 127-is tested silicon chip;
Figure 13 is the reflection synoptic diagram of leveling subsystem two secondary reflections to light, and wherein: 130-is that tested silicon chip is in best focal plane, and 131-is position after silicon chip surface tilts, the 132-plane mirror.
Embodiment
Further specify the present invention below in conjunction with accompanying drawing.
As shown in Figure 3, be the structural representation of photo-etching machine focusing leveling system of the present invention.Next coming in order in conjunction with the accompanying drawings 3 optical system of the present invention is described one by one each form module.Light source collimating module 301 sends the collimation laser of high stable, becomes linearly polarized light through polarizing beam splitter 302, sees through λ/4 wave plates 305, through plane mirror 310, incides measured silicon chip surface 311.Light reflexes on the semi-transparent semi-reflecting device 313 from silicon chip surface 311 and plane mirror 312.Semi-transparent semi-reflecting device 313 is light separated into two parts (reflected light and transmitted light).Wherein reflected light returns along original light path is reverse, promptly passes through plane mirror 312, tested silicon chip 311, plane mirror 310, sees through λ/4 wave plates 305 once more, and the polarization of light direction has been rotated 90 °, incides on the polarizing beam splitter 302.By 302 reflections, see through lens 303, incide on the Position-Sensitive Detector 304, the two-dimentional inclination information that obtains tested silicon chip 311 is used for leveling information.In addition, transmitted light from semi-transparent semi-reflecting device 313, through the reflection of right-angle prism 314, make the outgoing of light symmetry, incide plane mirror 312, tested silicon chip 311 once more, again through plane mirror 310 reflections, incide right-angle reflecting prism 306, make the outgoing of light symmetry, incide measured silicon chip 311 through plane mirror 310 once more, through plane mirror 312, light is incided on the right-angle reflecting prism 314 once more.Right-angle reflecting prism 314 translation light once more reflexes on the plane mirror 312, incide measured silicon chip surface 311, through plane mirror 310 and 307 reflections of corner cube mirror prism, see through lens combination 308 again, incide four-quadrant and survey the out of focus information that obtains silicon chip surface 311 on 309.For the two-dimentional inclination information of measuring silicon chip surface 311, measuring light has been passed through measured for twice, and for measuring silicon chip surface 311 out of focus information, measuring light has been passed through measured for 4 times.The signal of photodetector 309 and 304 outputs is through after the signal Processing, promptly obtain the position and the angle information of measurand, drive three by motion control board and drive height and the inclination of regulating substrate surface, make and measure the available focal depth range that substrate surface is positioned at projection objective.
In order to obtain high-precision measuring basis, adopted single-mode fiber collimating module and the drift compensation module that improves the collimation precision for the light source collimating module.Wherein, singly touch fiber optic collimator module 40 principles as shown in Figure 4, light source 41 sends laser and focuses on and singly touch in the optical fiber 43 through condenser lens 42, and the exit end of singly touching optical fiber 43 is fixed on the focal plane of collimation lens 44.The drift of light source 41 has obtained good restraining.In order to improve the stability singly touch light behind the fiber optic collimator once more, adopted drift compensation module 50 as shown in Figure 5.The laser of singly touching after light collimates 59 incides rhombic prism 51, through two parallel planes reflections of rhombic prism, incides on the plane mirror 52, incides on the detector 54 through optical splitter 53 again.The transmitted light of optical splitter 53 passes through optical splitter 55 again, and the reflected light of optical splitter 55 sees through lens 56 and incides on the detector 57.What wherein obtain on the detector 54 is the parallel drift information of light, and to the piezoelectric ceramics of control rhombic prism 51, the drive pressure electroceramics compensates the parallel drift of light two dimension with this information feedback; Detector 57 obtains the two dimension angular drift information of light, and to the piezoelectric ceramics of fixed pan catoptron 52, drive pressure electroceramics compensation light two dimension angular drifts about with this information feedback.Light provides the measuring basis of high stability by after singly touching fiber optic collimator module 40 and drift compensation module 50 for measurement.
Introducing it for focusing respectively below the subsystem repeatedly reflects and the lens amplification principle.The primary event of focusing subsystem as shown in Figure 6,60 be projection objective, light source collimating module 61 emission laser through plane mirror 62, incide silicon chip surface 63, pass through plane mirror 64 and incide on the 4 quadrant detector 65.Because silicon chip surface 64 has plated multilayer film, therefore, the interference effect of reflecting surface is avoided in the angle incident (generally getting greater than 75 °) that steering reflection mirror 62 should make incident light try one's best big, and increases reflectivity.Incide on the 4 quadrant detector 65 through plane mirror 64 from silicon chip surface 63 reflected light.When the silicon chip surface out of focus is d, as shown in Figure 7, reflection ray will have the translation of D, wherein D=2dcos α.If in Fig. 6, utilize right-angle reflecting prism to substitute its detector position, obtain structure as shown in Figure 8, measure twice measured silicon chip of process of light.As shown in Figure 9, can obtain the out of focus information D on the 4 quadrant detector 92 ' have: D '=2D=4dcos α during its silicon chip out of focus by Geometric Optics Analysis.In order further to obtain higher resolution, adopted four times through silicon chip surface, as shown in figure 10, on the basis of Fig. 8, increased by two right-angle reflecting prism 102 and 103.Then obtaining information on the 4 quadrant detector 104 has: D "=8dcos α.In order to improve Measurement Resolution once more, adopted the lens combination amplification principle, as shown in figure 11.When incident ray 110 had translation h, through lens 111 and 112 lens combination of forming, the translation H of emergent ray 113 had: H=hf
2/ f
1, f wherein
2And f
1Be respectively the focal length of lens 112 and 111.With Figure 11 lens combination, be placed on the focus front end of subsystem detector of Figure 10, can improve focusing subsystem Measurement Resolution.If silicon chip has defocus signal d, then on 4 quadrant detector, will have: D =(8df
2Cos α)/f
1To send into litho machine Control and Feedback system from the defocusing amount signal that 4 quadrant detector 104 obtains, and make it accommodate to best focal plane.
In the focusing subsystem, its optical wavelength of described light source will be away from the exposure wavelength of litho machine.Described plane mirror can be reflecting prism.Described right-angle reflecting prism can be prism of corner cube or opal.Described 4 quadrant detector can be dual-quadrant detector, can also be Position-Sensitive Detector.
For leveling subsystem principle as shown in figure 12, light source collimating module 121 sends the collimation laser of high stable, see through a polarizing beam splitter 122 and λ/4 wave plates 125, transmitted light incides tested silicon chip surface 127 through plane mirror 126, reflection through silicon chip surface 127, plane mirror 128 and 129, make the light retrodirective reflection, incide measured surface 127 once more.Pass through catoptron 126 and λ/4 wave plates 125 again, incide polarizing beam splitter 122, because twice process of linearly polarized laser λ/4 wave plates 125, the polarization direction has rotated 90 °.Therefore, light sees through lens 123 by polarizing beam splitter 122 reflections, incides on the Position-Sensitive Detector 124.Concrete light path amplification principle as shown in figure 13, when silicon chip surface 130 had θ deflection, by the retrodirective reflection of plane mirror 132, twice of measuring light made its reflected light that 4 θ angular deflections be arranged through tested silicon chip surface 131, plays the effect of a sensitivity multiplication.Therefore, the leveling subsystem precision that takes measurement of an angle is improved.If the focal length of lens 123 is f, luminous point moves on detector 124 and is Δ, and then the angle of inclination of Ce Lianging is θ=2 Δs/(4f).
Claims (9)
1. focusing and leveling measuring system comprises three parts: light source collimating module (301), focusing subsystem and leveling subsystem, and it is characterized in that: the light source collimating module comprises singly touches fiber optic collimator module (40) and drift compensation module (50); The focusing subsystem comprises plane mirror (310,312), right-angle reflecting prism (306,307 and 314), lens combination (308), 4 quadrant detector (309); The leveling subsystem comprises: polarizing beam splitter (302), λ/4 wave plates (305), plane mirror (310,312), spectroscope (313), convex lens (303) and Position-Sensitive Detector (304), and the annexation between them is seen Fig. 3; At first, focusing subsystem annexation is: light source (310) sends laser and sees through polarizing beam splitter (302) and λ/4 wave plates (305), through catoptron (310), incide silicon chip surface (311), pass through catoptron (312) again, see through optical splitter (313) and incide right-angle prism (314), through right-angle prism reflection (314) reflection, incide once more on catoptron (312) and the silicon chip (311), pass through catoptron (310) again and reflex to right-angle prism (306), through right-angle prism (306), as Fig. 3 dotted portion, reflex to once more on catoptron (310) and the silicon chip (311), incide direct prism (314), reflex to catoptron (312) and silicon chip (311) from right-angle prism (314) again through catoptron (312), pass through catoptron (310) incident right-angle prism (307) again, see through lens combination (308) again, incide on the detector (309), twice of this subsystem reflected light with last time through silicon chip (311) surface; Secondly, leveling subsystem annexation is: light source (310) sends laser and sees through polarizing beam splitter (302) and λ/4 wave plates (305), through catoptron (310), incides silicon chip surface (311), pass through catoptron (312) again, through optical splitter (313) reflection, another mistake is to reflexing to catoptron (312) and silicon chip (311), through catoptron (310) reflection, see through λ/4 wave plates (305), through polarizing beam splitter (302) reflection, see through lens (303), incide on the detector (304); Adopt and singly touch fiber optic collimator device and drift compensation device, obtain the measuring basis that high-acruracy survey requires; Satisfy the requirement of the following photo-etching machine focusing leveling of 100nm resolution, adopt repeatedly principle of reflection and lens combination amplification principle, reduce light datum drift to the error that measurement brings, make measuring system more stable, improve focusing and leveling subsystem Measurement Resolution and measuring accuracy.
2. measuring system as claimed in claim 1 is characterized in that: described focusing subsystem and leveling subsystem can be to integrate to share same light source, also can be to use different light sources respectively.
3. measuring system as claimed in claim 1 is characterized in that: described collimating module (301) adopts single-mode fiber collimating module (40) and drift compensation module (50).
4. a kind of focusing and leveling measuring system as claimed in claim 1 is characterized in that: the focusing subsystem adopts four secondary reflection principles and lens amplification principle to improve and measures focusing resolution.
5. a kind of focusing and leveling measuring system as claimed in claim 1 is characterized in that: right-angle reflecting prism (306,307 and 314) can be a prism of corner cube.
6. a kind of focusing and leveling measuring system as claimed in claim 1 is characterized in that: plane mirror (310,312) can be a reflecting prism.
7. a kind of focusing and leveling measuring system as claimed in claim 1 is characterized in that: spectroscope can be semi-transparent semi-reflecting optical splitter, also can be the optical splitter of other beam split ratio.
8. a kind of focusing and leveling measuring system as claimed in claim 1 is characterized in that: 4 quadrant detector (309) can be dual-quadrant detector, Position-Sensitive Detector and ccd detector.
9. focusing leveling measuring method is characterized in that the step of implementation method is:
(1) laser that sends from light source passes through drift compensation device (50) again through singly touching fiber optic collimator device (40), forms a light source collimating module (301);
(2) the high stable laser that comes out from light source collimating module (301) sees through polarizing beam splitter (302), and polarizing beam splitter (302) makes light become linearly polarized light, sees through λ/4 wave plates (305) again, through turning to reflection (310) mirror to incide on the tested silicon face;
(3) from measurand surface (311) reflection, pass through the light behind the another one steering reflection mirror (312) again, incide an optical splitter (313);
(4) light that reflects from optical splitter (313) returns along original light path once more, for the second time through λ/4 wave plates (305), twice process of light λ/4 wave plates make the polarization direction of light rotate 90 °, light is polarized optical splitter (302) and reflexes on the Position-Sensitive Detector (304), obtain two dimension angular information, be used for the leveling signal;
(5) light from optical splitter (313) transmission reflects (314) through right-angle prism, makes light translation certain position, reflexes to tested silicon chip surface (311) once more;
(6) through silicon chip surface (311) and plane mirror (310) reflection for the second time, utilize reflecting prism (306) to make light repeat the light path of preceding two secondary reflections; Four tested silicon chip surfaces of process of measuring light (311);
(7) last, measuring light sees through an extender lens group (308) through right-angle reflecting prism (307) reflection, and the translation signal that light is carried amplifies once more, incides on the 4 quadrant detector (309), obtains the out of focus information of silicon chip, is used to the signal of focusing;
(8) signal of photodetector (309 and 304) output is through after the signal Processing, promptly obtain the position and the angle information of measurand (311), drive three by motion control board and drive height and the inclination of regulating substrate surface, make and measure the available focal depth range that substrate surface is positioned at projection objective.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101784694A CN100535767C (en) | 2007-11-30 | 2007-11-30 | Focusing leveling measuring method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101784694A CN100535767C (en) | 2007-11-30 | 2007-11-30 | Focusing leveling measuring method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101169602A true CN101169602A (en) | 2008-04-30 |
| CN100535767C CN100535767C (en) | 2009-09-02 |
Family
ID=39390265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101784694A Expired - Fee Related CN100535767C (en) | 2007-11-30 | 2007-11-30 | Focusing leveling measuring method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100535767C (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102736422A (en) * | 2011-03-31 | 2012-10-17 | 上海微电子装备有限公司 | Proximity field exposure device and method |
| CN103091990A (en) * | 2011-10-28 | 2013-05-08 | 上海微电子装备有限公司 | Mechanism and method for adjusting light spot horizontal position in focusing and leveling system |
| CN105115476A (en) * | 2015-09-02 | 2015-12-02 | 合肥工业大学 | Flat plate inclination measurement device based on multi-point off-focus detection |
| CN105988302A (en) * | 2015-02-04 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | Method used for leveling verification test and method for calibrating lithographic projection equipment |
| CN108121179A (en) * | 2016-11-30 | 2018-06-05 | 上海微电子装备（集团）股份有限公司 | A kind of focusing leveling device |
| CN109443210A (en) * | 2018-12-13 | 2019-03-08 | 苏州亿拓光电科技有限公司 | Optical position detection device and method |
| CN109520928A (en) * | 2018-11-01 | 2019-03-26 | 佛山市同晓科技有限公司 | A kind of glass blocks levelling device |
| CN110379727A (en) * | 2019-08-06 | 2019-10-25 | 无锡奥特维科技股份有限公司 | A kind of testing agency and detection device |
| CN110501878A (en) * | 2018-05-18 | 2019-11-26 | 上海微电子装备（集团）股份有限公司 | A kind of focusing leveling device, lithographic equipment and focusing and leveling method |
| CN110514627A (en) * | 2019-08-26 | 2019-11-29 | 松山湖材料实验室 | Silicon wafer method for measuring reflectance and its measuring device |
| CN110988892A (en) * | 2019-12-09 | 2020-04-10 | 北京信息科技大学 | Laser active detection system |
| CN111103765A (en) * | 2018-10-29 | 2020-05-05 | 佳能株式会社 | Exposure apparatus and article manufacturing method |
| CN111208144A (en) * | 2020-03-05 | 2020-05-29 | 上海御微半导体技术有限公司 | Defect detection system and defect detection method |
| CN111272153A (en) * | 2020-03-03 | 2020-06-12 | 中国科学院光电技术研究所 | Leveling device and method for passive leveling structure |
| CN112254936A (en) * | 2020-10-27 | 2021-01-22 | 苏州卡睿知光电科技有限公司 | Optical path adjusting device and adjusting method |
| CN113059807A (en) * | 2021-03-18 | 2021-07-02 | 之江实验室 | High axial resolution three-dimensional printing method and device based on uniform active light sheet |
| CN114383822A (en) * | 2022-01-04 | 2022-04-22 | 中国科学院微电子研究所 | Detection device and method for focusing and leveling of optical system |
-
2007
- 2007-11-30 CN CNB2007101784694A patent/CN100535767C/en not_active Expired - Fee Related
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102736422B (en) * | 2011-03-31 | 2015-07-22 | 上海微电子装备有限公司 | Proximity field exposure device and method |
| CN102736422A (en) * | 2011-03-31 | 2012-10-17 | 上海微电子装备有限公司 | Proximity field exposure device and method |
| CN103091990A (en) * | 2011-10-28 | 2013-05-08 | 上海微电子装备有限公司 | Mechanism and method for adjusting light spot horizontal position in focusing and leveling system |
| CN105988302B (en) * | 2015-02-04 | 2018-11-16 | 中芯国际集成电路制造(上海)有限公司 | Method for leveling the method for validation test and calibrating lithographic projection apparatus |
| CN105988302A (en) * | 2015-02-04 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | Method used for leveling verification test and method for calibrating lithographic projection equipment |
| CN105115476A (en) * | 2015-09-02 | 2015-12-02 | 合肥工业大学 | Flat plate inclination measurement device based on multi-point off-focus detection |
| EP3550365A4 (en) * | 2016-11-30 | 2019-11-27 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Focusing and leveling device |
| CN108121179A (en) * | 2016-11-30 | 2018-06-05 | 上海微电子装备（集团）股份有限公司 | A kind of focusing leveling device |
| WO2018099348A1 (en) * | 2016-11-30 | 2018-06-07 | 上海微电子装备（集团）股份有限公司 | Focusing and leveling device |
| US10809059B2 (en) | 2016-11-30 | 2020-10-20 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Focusing and leveling device |
| CN110501878A (en) * | 2018-05-18 | 2019-11-26 | 上海微电子装备（集团）股份有限公司 | A kind of focusing leveling device, lithographic equipment and focusing and leveling method |
| CN111103765A (en) * | 2018-10-29 | 2020-05-05 | 佳能株式会社 | Exposure apparatus and article manufacturing method |
| CN109520928B (en) * | 2018-11-01 | 2021-05-18 | 佛山市威旭玻璃有限公司 | Glass block leveling device |
| CN109520928A (en) * | 2018-11-01 | 2019-03-26 | 佛山市同晓科技有限公司 | A kind of glass blocks levelling device |
| CN109443210A (en) * | 2018-12-13 | 2019-03-08 | 苏州亿拓光电科技有限公司 | Optical position detection device and method |
| CN110379727A (en) * | 2019-08-06 | 2019-10-25 | 无锡奥特维科技股份有限公司 | A kind of testing agency and detection device |
| CN110514627A (en) * | 2019-08-26 | 2019-11-29 | 松山湖材料实验室 | Silicon wafer method for measuring reflectance and its measuring device |
| CN110514627B (en) * | 2019-08-26 | 2024-06-07 | 松山湖材料实验室 | Silicon wafer reflectivity measuring method and measuring device thereof |
| CN110988892A (en) * | 2019-12-09 | 2020-04-10 | 北京信息科技大学 | Laser active detection system |
| CN111272153A (en) * | 2020-03-03 | 2020-06-12 | 中国科学院光电技术研究所 | Leveling device and method for passive leveling structure |
| CN111208144A (en) * | 2020-03-05 | 2020-05-29 | 上海御微半导体技术有限公司 | Defect detection system and defect detection method |
| CN112254936A (en) * | 2020-10-27 | 2021-01-22 | 苏州卡睿知光电科技有限公司 | Optical path adjusting device and adjusting method |
| CN112254936B (en) * | 2020-10-27 | 2024-05-10 | 苏州卡睿知光电科技有限公司 | Light path adjusting device and adjusting method |
| CN113059807A (en) * | 2021-03-18 | 2021-07-02 | 之江实验室 | High axial resolution three-dimensional printing method and device based on uniform active light sheet |
| CN113059807B (en) * | 2021-03-18 | 2022-05-06 | 之江实验室 | High axial resolution three-dimensional printing method and device based on uniform active light sheet |
| CN114383822A (en) * | 2022-01-04 | 2022-04-22 | 中国科学院微电子研究所 | Detection device and method for focusing and leveling of optical system |
| CN114383822B (en) * | 2022-01-04 | 2024-02-09 | 中国科学院微电子研究所 | Detection device and method for focusing and leveling of optical system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100535767C (en) | 2009-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100535767C (en) | Focusing leveling measuring method and device | |
| US7681439B2 (en) | Measuring apparatus | |
| JP2913984B2 (en) | Tilt angle measuring device | |
| CN101169601B (en) | Focusing leveling measuring system | |
| CN102679912B (en) | Auto-collimator based on differential comparison principle | |
| CN102519510B (en) | Calibration device and calibration method of position sensitive sensor | |
| TWI452262B (en) | Interferometer system for simultaneous measurement of linear displacement and tilt angle | |
| CN109470177B (en) | Three-dimensional angle measuring method and device based on double gratings | |
| CN101221044A (en) | Device and method for large distance light parallel regulation | |
| CN109387161A (en) | Auto-collimation system | |
| EP0208276A1 (en) | Optical measuring device | |
| US9797704B2 (en) | Interferometer having two transparent plates in parallel for making reference and measurement beams parallel | |
| JP2013050448A (en) | Mechanism for measuring interval by interferometer system | |
| US20010035961A1 (en) | Shape measuring apparatus | |
| CN111238408A (en) | Device and method for rapidly measuring parallelism of parallel flat plate | |
| CN102445854A (en) | Workpiece stage vertical position measuring system | |
| TW201719784A (en) | Method of improving lateral resolution for height sensor using differential detection technology for semiconductor inspection and metrology | |
| CN109579744A (en) | Trailing type three-dimensional photoelectric auto-collimation method and apparatus based on grating | |
| CN105737758B (en) | A kind of long-range profile measuring instrument | |
| TWI579525B (en) | An optical system and measuring methods for simultanuous absolute positioning distance and tilting angular measurements of a moving object | |
| CN105758333A (en) | Long-trace optical surface profile detector | |
| Saito et al. | A single lens micro-angle sensor | |
| CN113639665B (en) | High-stability nanoradian magnitude angle measurement method and device based on drift amount feedback | |
| CN100573032C (en) | The system and method that is used for three dimensional optical measuring | |
| Chen et al. | Effects of incident beam deviation from the center of a cat's eye retro-reflector on the measurement accuracy of a laser tracing system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090902 Termination date: 20141130 |
|
| EXPY | Termination of patent right or utility model |