CN101166024A - 克服使用寿命期间负偏压温度不稳定性效应的方法和设备 - Google Patents
克服使用寿命期间负偏压温度不稳定性效应的方法和设备 Download PDFInfo
- Publication number
- CN101166024A CN101166024A CNA2007101382681A CN200710138268A CN101166024A CN 101166024 A CN101166024 A CN 101166024A CN A2007101382681 A CNA2007101382681 A CN A2007101382681A CN 200710138268 A CN200710138268 A CN 200710138268A CN 101166024 A CN101166024 A CN 101166024A
- Authority
- CN
- China
- Prior art keywords
- stress
- voltage
- stress device
- parametric
- nbti
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000000694 effects Effects 0.000 title claims description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 230000006698 induction Effects 0.000 claims description 46
- 238000004088 simulation Methods 0.000 claims description 22
- 238000005259 measurement Methods 0.000 claims description 19
- 230000000295 complement effect Effects 0.000 claims description 9
- 230000005284 excitation Effects 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000006978 adaptation Effects 0.000 claims description 3
- 230000015556 catabolic process Effects 0.000 abstract description 9
- 238000006731 degradation reaction Methods 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 abstract description 3
- 230000007850 degeneration Effects 0.000 description 21
- 208000035795 Hypocalcemic vitamin D-dependent rickets Diseases 0.000 description 9
- 230000004044 response Effects 0.000 description 9
- 208000033584 type 1 vitamin D-dependent rickets Diseases 0.000 description 9
- 230000008859 change Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 101150101561 TOM70 gene Proteins 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 101150115693 ompA gene Proteins 0.000 description 1
- 101150090944 otomp gene Proteins 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000008080 stochastic effect Effects 0.000 description 1
- 230000009885 systemic effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/550,814 | 2006-10-19 | ||
US11/550,814 US7504847B2 (en) | 2006-10-19 | 2006-10-19 | Mechanism for detection and compensation of NBTI induced threshold degradation |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101166024A true CN101166024A (zh) | 2008-04-23 |
CN100586016C CN100586016C (zh) | 2010-01-27 |
Family
ID=39338547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710138268A Expired - Fee Related CN100586016C (zh) | 2006-10-19 | 2007-07-31 | 克服使用寿命期间负偏压温度不稳定性效应的方法和设备 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7504847B2 (zh) |
CN (1) | CN100586016C (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102866340A (zh) * | 2011-07-07 | 2013-01-09 | 中芯国际集成电路制造(上海)有限公司 | 负偏压温度不稳定性测试附加电路及测试方法 |
CN101841245B (zh) * | 2009-03-19 | 2013-07-31 | 株式会社日立制作所 | 功率变换装置以及使用该功率变换装置的电梯装置 |
CN103424684A (zh) * | 2012-05-24 | 2013-12-04 | 中芯国际集成电路制造(上海)有限公司 | 偏压温度不稳定性的检测电路及检测方法 |
CN103439644A (zh) * | 2013-08-13 | 2013-12-11 | 哈尔滨工业大学 | 一种SRAM-based FPGA退化测试系统 |
WO2014176812A1 (zh) * | 2013-05-02 | 2014-11-06 | 北京大学 | 分离soi器件中两种效应导致阈值电压漂移的方法 |
WO2022013648A1 (en) * | 2020-07-13 | 2022-01-20 | International Business Machines Corporation | Methods for detecting and monitoring bias in software application using artificial intelligence and devices thereof |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8717051B2 (en) * | 2009-10-22 | 2014-05-06 | Intersil Americas Inc. | Method and apparatus for accurately measuring currents using on chip sense resistors |
US8248095B2 (en) * | 2009-10-30 | 2012-08-21 | Apple Inc. | Compensating for aging in integrated circuits |
US9535473B2 (en) | 2009-10-30 | 2017-01-03 | Apple Inc. | Compensating for aging in integrated circuits |
US8330534B2 (en) * | 2010-11-17 | 2012-12-11 | Advanced Micro Devices, Inc. | Circuit for negative bias temperature instability compensation |
CN103913694B (zh) * | 2013-01-09 | 2018-03-27 | 恩智浦美国有限公司 | 用于检测集成电路的劣化的监视系统 |
CN105334899B (zh) * | 2014-07-28 | 2017-12-01 | 中芯国际集成电路制造(上海)有限公司 | Pmos晶体管的修复电路及方法 |
US9251890B1 (en) | 2014-12-19 | 2016-02-02 | Globalfoundries Inc. | Bias temperature instability state detection and correction |
CN105895619B (zh) | 2015-01-23 | 2021-06-25 | 恩智浦美国有限公司 | 用于监测集成电路上金属退化的电路 |
CN105759190B (zh) * | 2016-02-23 | 2018-09-28 | 工业和信息化部电子第五研究所 | Mos管参数退化的检测电路 |
US10320387B1 (en) * | 2018-09-28 | 2019-06-11 | Nxp Usa, Inc. | Static state control of a digital logic circuit within an integrated circuit during low power mode |
CN115730544A (zh) * | 2021-08-31 | 2023-03-03 | 上海华力集成电路制造有限公司 | 用于评估bti效应的可测试性设计电路 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6456104B1 (en) * | 1999-08-18 | 2002-09-24 | International Business Machines Corporation | Method and structure for in-line monitoring of negative bias temperature instability in field effect transistors |
US6476632B1 (en) | 2000-06-22 | 2002-11-05 | International Business Machines Corporation | Ring oscillator design for MOSFET device reliability investigations and its use for in-line monitoring |
US6521469B1 (en) | 2000-09-25 | 2003-02-18 | International Business Machines Corporation | Line monitoring of negative bias temperature instabilities by hole injection methods |
JPWO2002050910A1 (ja) | 2000-12-01 | 2004-04-22 | 株式会社日立製作所 | 半導体集積回路装置の識別方法と半導体集積回路装置の製造方法及び半導体集積回路装置 |
US6815970B2 (en) | 2001-08-31 | 2004-11-09 | Texas Instruments Incorporated | Method for measuring NBTI degradation effects on integrated circuits |
US6574160B1 (en) | 2002-02-11 | 2003-06-03 | Sun Microsystems, Inc. | Mechanism to minimize failure in differential sense amplifiers |
US6731179B2 (en) | 2002-04-09 | 2004-05-04 | International Business Machines Corporation | System and method for measuring circuit performance degradation due to PFET negative bias temperature instability (NBTI) |
US6762961B2 (en) | 2002-04-16 | 2004-07-13 | Sun Microsystems, Inc. | Variable delay compensation for data-dependent mismatch in characteristic of opposing devices of a sense amplifier |
US20040073412A1 (en) | 2002-10-04 | 2004-04-15 | Walker John De Quincey | Negative bias temperature instability effect modeling |
US6812758B2 (en) | 2003-02-12 | 2004-11-02 | Sun Microsystems, Inc. | Negative bias temperature instability correction technique for delay locked loop and phase locked loop bias generators |
US7020035B1 (en) * | 2003-10-10 | 2006-03-28 | Sun Microsystems, Inc. | Measuring and correcting sense amplifier and memory mismatches using NBTI |
US7009905B2 (en) * | 2003-12-23 | 2006-03-07 | International Business Machines Corporation | Method and apparatus to reduce bias temperature instability (BTI) effects |
KR100585886B1 (ko) * | 2004-01-27 | 2006-06-01 | 삼성전자주식회사 | 동적 문턱 전압을 가지는 반도체 회로 |
US6933869B1 (en) * | 2004-03-17 | 2005-08-23 | Altera Corporation | Integrated circuits with temperature-change and threshold-voltage drift compensation |
-
2006
- 2006-10-19 US US11/550,814 patent/US7504847B2/en not_active Expired - Fee Related
-
2007
- 2007-07-31 CN CN200710138268A patent/CN100586016C/zh not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101841245B (zh) * | 2009-03-19 | 2013-07-31 | 株式会社日立制作所 | 功率变换装置以及使用该功率变换装置的电梯装置 |
CN102866340A (zh) * | 2011-07-07 | 2013-01-09 | 中芯国际集成电路制造(上海)有限公司 | 负偏压温度不稳定性测试附加电路及测试方法 |
CN102866340B (zh) * | 2011-07-07 | 2015-09-16 | 中芯国际集成电路制造(上海)有限公司 | 负偏压温度不稳定性测试附加电路及测试方法 |
CN103424684A (zh) * | 2012-05-24 | 2013-12-04 | 中芯国际集成电路制造(上海)有限公司 | 偏压温度不稳定性的检测电路及检测方法 |
CN103424684B (zh) * | 2012-05-24 | 2015-12-09 | 中芯国际集成电路制造(上海)有限公司 | 偏压温度不稳定性的检测电路及检测方法 |
WO2014176812A1 (zh) * | 2013-05-02 | 2014-11-06 | 北京大学 | 分离soi器件中两种效应导致阈值电压漂移的方法 |
CN103439644A (zh) * | 2013-08-13 | 2013-12-11 | 哈尔滨工业大学 | 一种SRAM-based FPGA退化测试系统 |
CN103439644B (zh) * | 2013-08-13 | 2015-09-23 | 哈尔滨工业大学 | 一种SRAM-based FPGA退化测试系统 |
WO2022013648A1 (en) * | 2020-07-13 | 2022-01-20 | International Business Machines Corporation | Methods for detecting and monitoring bias in software application using artificial intelligence and devices thereof |
GB2611981A (en) * | 2020-07-13 | 2023-04-19 | Ibm | Methods for detecting and monitoring bias in software application using artificial intelligence and devices thereof |
US11861513B2 (en) | 2020-07-13 | 2024-01-02 | International Business Machines Corporation | Methods for detecting and monitoring bias in a software application using artificial intelligence and devices thereof |
Also Published As
Publication number | Publication date |
---|---|
CN100586016C (zh) | 2010-01-27 |
US7504847B2 (en) | 2009-03-17 |
US20080094092A1 (en) | 2008-04-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100586016C (zh) | 克服使用寿命期间负偏压温度不稳定性效应的方法和设备 | |
US8154353B2 (en) | Operating parameter monitor for an integrated circuit | |
Delbruck et al. | 32-bit configurable bias current generator with sub-off-current capability | |
US8710913B2 (en) | Circuit arrangement and method for operating a circuit arrangement | |
US20090231025A1 (en) | Method and Apparatus for Extending the Lifetime of a Semiconductor Chip | |
KR20090009293A (ko) | 보상 회로 및 보상 방법 | |
US10262985B2 (en) | Circuits and methods for lowering leakage in ultra-low-power MOS integrated circuits | |
US7849426B2 (en) | Mechanism for detection and compensation of NBTI induced threshold degradation | |
US7965133B2 (en) | Compensation techniques for reducing power consumption in digital circuitry | |
US7737721B2 (en) | Latch circuit and semiconductor integrated circuit device that has it | |
US7471114B2 (en) | Design structure for a current control mechanism for power networks and dynamic logic keeper circuits | |
US20090072810A1 (en) | Voltage-drop measuring circuit, semiconductor device and system having the same, and associated methods | |
US6927590B2 (en) | Method and circuit for testing a regulated power supply in an integrated circuit | |
US7573300B2 (en) | Current control mechanism for dynamic logic keeper circuits in an integrated circuit and method of regulating same | |
US9312850B2 (en) | Testable power-on-reset circuit | |
US7034598B2 (en) | Switching point detection circuit and semiconductor device using the same | |
US6982591B2 (en) | Method and circuit for compensating for tunneling current | |
US8648617B2 (en) | Semiconductor device and method of testing semiconductor device | |
US20090140713A1 (en) | Regulator circuit for testing inherent performance of an integrated circuit | |
TWI461959B (zh) | 輸出輸入介面裝置 | |
US11327112B2 (en) | Semiconductor device for detecting characteristics of semiconductor element and operating method thereof | |
US20200313664A1 (en) | Temperature sensors and methods of use | |
JP7175555B2 (ja) | テスト回路及び半導体装置 | |
KR100762899B1 (ko) | 반도체 메모리 장치 | |
US11546066B2 (en) | Transmitter device and calibration method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171117 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171117 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100127 Termination date: 20190731 |
|
CF01 | Termination of patent right due to non-payment of annual fee |