CN101164773B - 涂层切削刀具 - Google Patents
涂层切削刀具 Download PDFInfo
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- CN101164773B CN101164773B CN2007101671164A CN200710167116A CN101164773B CN 101164773 B CN101164773 B CN 101164773B CN 2007101671164 A CN2007101671164 A CN 2007101671164A CN 200710167116 A CN200710167116 A CN 200710167116A CN 101164773 B CN101164773 B CN 101164773B
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- cutting tool
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- 238000005520 cutting process Methods 0.000 title claims abstract description 29
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 57
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 57
- 239000011248 coating agent Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 17
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 17
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 10
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 8
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 8
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 8
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- 229910000997 High-speed steel Inorganic materials 0.000 claims abstract description 5
- 239000011195 cermet Substances 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000006104 solid solution Substances 0.000 claims abstract description 4
- 229910052582 BN Inorganic materials 0.000 claims abstract description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 54
- 238000003475 lamination Methods 0.000 claims description 23
- 239000002131 composite material Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 9
- 229910052715 tantalum Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 7
- 150000004767 nitrides Chemical class 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- 150000001247 metal acetylides Chemical class 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 229910001392 phosphorus oxide Inorganic materials 0.000 claims description 5
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims description 4
- 239000010987 cubic zirconia Substances 0.000 claims description 4
- 238000005299 abrasion Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 2
- 230000001464 adherent effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 56
- 239000013078 crystal Substances 0.000 description 22
- 238000005240 physical vapour deposition Methods 0.000 description 20
- 239000002114 nanocomposite Substances 0.000 description 18
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 238000000151 deposition Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 238000001755 magnetron sputter deposition Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 239000004567 concrete Substances 0.000 description 4
- 238000003917 TEM image Methods 0.000 description 3
- 125000002015 acyclic group Chemical group 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000001678 elastic recoil detection analysis Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005524 ceramic coating Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 238000010237 hybrid technique Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
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Abstract
本发明涉及切削刀具,包括硬质合金、金属陶瓷、陶瓷、立方氮化硼或高速钢制成的基底,至少在该基底的表面的作用部分上涂敷有薄的、粘性的、硬的且耐磨的涂层,其中,所述涂层包括交替的PVD或PECVD金属氧化物层的叠层多层,Me1X+Me2X+Me1X+Me2X...,其中金属原子Me1和Me2为Ti,Nb,V,Mo,Zr,Cr,Al,Hf,Ta,Y和Si中的一种或多种,且Me1X和Me2X中的至少一个为由具有不同成分和不同结构的两种组分,组分A和组分B构成的金属氧化物+金属氧化物纳米复合层,这两种组分由一种金属元素的单相氧化物或两种或多种金属氧化物的固溶体组成,其中Me1X层和Me2X层在成分或结构或这两个特性方面均是不同的,且各层厚度大于0.4nm但小于50nm,所述叠层多层的总厚度在0.2和20μm之间。
Description
技术领域
本发明涉及用于金属加工的涂层切削刀具,其具有硬质合金的基底和在所述基底的表面上的通过物理气相沉积(PVD)或等离子增强化学气相沉积(PECVD)而沉积上的硬且耐磨的耐火涂层。
背景技术
在例如硬质合金切削刀具上沉积氧化铝、碳化钛和/或氮化物等材料的薄陶瓷涂层(1-20μm)的工艺为沿用已久的技术,当涂层切削刀具用于金属加工时,其刀具寿命将显著地延长。刀具的延长的使用寿命在一定条件下可延长得比无涂层切削刀具的使用寿命大几百个百分比。这些陶瓷涂层通常包括单个层或复合层。现代商用切削刀具的特征在于:具有两层或多层结构的多层组合。总涂层厚度在1μm和20μm之间变化,各个子层的厚度在几微米至百分之几微米之间变化。
用于沉积这种层的已确立的技术是CVD和PVD(例如参见U.S.4,619,866和U.S.4,346,123)。硬质合金或高速钢的PVD涂层的商用切削刀具通常具有单层的TiN,Ti(C,N)或(Ti,Al)N的均相成分,或所述相的多层涂层,各层均为单相材料。
存在几种能够在切削刀具上形成薄的耐火涂层的PVD技术。最常用的方法是离子镀,磁控溅射,电弧放电蒸发和IBAD(离子束辅助沉积)以及上述方法的混合工艺。各种方法具有其自有的优点,且所形成的层的固有特性,诸如微观结构和粒度,硬度,应力状态,内聚性和对下面基底的粘附性,这些特性可根据具体选择的PVD方法而变化。因此,可通过优化上述特性中的一个或多个特性而提高在具体加工操作中使用的PVD涂层切削刀具的耐磨性和刀刃完整性。
颗粒强化陶瓷已被熟知,其采用体积较大的形式的结构材料,然而不是纳米组合材料,直到近来为止。具有不同的纳米分散颗粒的氧化铝块状陶瓷公开在J.F.Kuntz等人的MRS Bulletin Jan 2004,pp 22-27中。氧化锆和二氧化钛增韧氧化铝CVD层,例如公开在US 6,660,371,US 4,702,907和US 4,701,384中。在这些公开文献中,层通过CVD技术沉积,因此形成的ZrO2相是热力学稳定相,其被称之为单斜晶相。此外,CVD沉积层通常具有拉伸应力或低水平的压缩应力,而PVD或PECVD层由于这些沉积工艺的固有性而通常具有高水平的压缩应力。在US 2005/0260432中描述了对氧化铝+氧化锆CVD层进行喷射而产生压缩应力水平。已知喷射工艺提供适度水平的压缩应力。
诸如四方相或立方相的氧化锆的亚稳相已经证明:通过称为相变增韧的机理(Hannink等人,J.Am.Ceram.Soc.83(3)461-67;Evans,Am.Ceram.Soc.73(2)187-206(1990))进一步增强块状陶瓷。通过添加诸如Y或Ce的稳定性元素,或者通过存在PVD应用通常所需要的诸如真空(Tomaszewski等人,J.Mater.Sci.Lett 7(1988)778-80)的缺氧环境,已经证明促进了这种亚稳相。PVD工艺参数的变化已经证明:导致氧化锆中的氧化学当量和亚稳相构成的变化,尤其是立方的氧化锆相(BenAmor等人,Mater.Sci.Eng.B57(1998)28)。
用于切割应用的、由金属氮化物或金属碳化物组成的多层PVD层在揭示金属氮化物和碳化物的对称的多层结构的文献EP0709483和描述非周期性层压的多层金属氮化物和碳化物的文献US 6,103,357中给出了叙述。
瑞典专利申请No.SE0500867-7和SE0600104-4公开了一种用于金属加工的切削刀具刀片,其中至少在该切削刀具刀片的表面的作用部分涂敷有薄的、粘附的、硬的耐磨涂层。涂层包括由粒度为1-100nm的两种组分组成的金属氧化物+金属氧化物纳米复合层。
发明内容
本发明的目的是提供一种PVD或PECVD涂层切削刀具,其具有改善的耐磨性和改善的抗热量引起的失效性。
根据本发明,提供一种切削刀具,包括硬质合金、金属陶瓷、陶瓷或高速钢制成的基底,至少在该基底的表面的作用部分上涂敷有薄的、粘性的、硬的且耐磨的涂层,其特征在于:所述涂层包括交替的PVD或PECVD金属氧化物层即交替的Me1X和Me2X层的叠层多层,其中所述金属原子Me1和Me2为Ti,Nb,V,Mo,Zr,Cr,Al,Hf,Ta,Y和Si中的一种或多种,且Me1X和Me2X中的至少一个为由具有不同成分和不同结构的两种组分即组分A和组分B构成的金属氧化物+金属氧化物的纳米复合层,所述两种组分均由一种金属元素的单相氧化物组成或由两种或两种以上金属氧化物的固溶体组成,其中所述Me1X层和Me2X层在成分或结构或这两个特性方面均是不同的,且各层厚度大于0.4nm但小于50nm,所述叠层多层的总厚度在0.2和20μm之间。
附图说明
图1是通过本发明的涂层切削刀具所得的横截面的示意性视图,其示出了涂有具有各个的金属氧化物+金属氧化物纳米复合层Me1X(3),Me2X(4)的非周期性层压的多层(2),每层均具有单独的层厚度(5)。各层厚度的顺序在整个多层上基本上是非周期性的。
具体实施方式
根据本发明,提供一种用于诸如车削、磨削、钻削的金属加工的切削刀具,其包括硬质合金的硬合金、金属陶瓷、陶瓷、立方氮化硼或高速钢制成的基底,优选为硬质合金或金属陶瓷的基底,在该基底上沉积有包括层压的多层的耐磨涂层。切削刀具的形状包括可转位刀片以及诸如钻头、端铣刀等的柄式工具。涂层还可在层压的多层下方包括金属碳化物、金属氮化物或金属碳氮化物的第一内部单层或多层,其中根据现有技术,金属原子为Ti,Nb,V,Mo,Zr,Cr,Al,Hf,Ta,Y或Si的一种或多种,厚度在0.2至20μm的范围中。
涂层被涂敷在整个基底或者至少在基底的作用表面上,例如切削刃,前刀面,侧刀面和参与金属切削工艺的任何其它表面。
根据本发明的涂层被粘附性地结合至基底,并包括交替的PVD或PECVD金属氧化物层的叠层多层,Me1X+Me2X+Me1X+Me2X...,其中金属原子Me1和Me2为Ti,Nb,V,Mo,Zr,Cr,Al,Hf,Ta,Y和Si中的一种或多种,优选为Hf,Ta,Cr,Zr和Al,最优选为Zr和Al,且其中Me1X和Me2X中的至少一个为金属氧化物基体中的分散金属氧化物成分的纳米复合层,以下称之为金属氧化物+金属氧化物纳米复合。Me1X和Me2X层在成分或结构或者在这两个特性方面都是不同的。各个Me1X或Me2X层厚度的顺序优选在整个多层上为非周期性的。非周期性应理解为叠层多层中的具体的单个层的厚度不取决于紧接下方的单个层,也不与该具体的单个层上方的单个层存在任何关系。因此,叠层多层在各涂层厚度的顺序中不具有任何重复的周期性。此外,各层厚度大于0.4nm,但小于50nm,优选为大于1nm且小于30nm,最优选为大于5nm且小于20nm。叠层多层的总厚度在0.2和20μm之间,优选在0.5和5μm之间。
一个单独金属氧化物+金属氧化物纳米复合层由具有不同成分和不同结构的两种组分组成。各组分均为一种金属元素的单相氧化物或两种或多种金属氧化物的固溶体。材料的微观结构的特征在于,由组分B围绕的组分A的纳米尺寸的晶粒或晶柱的平均晶粒或晶柱尺寸为1-100nm,优选为1-70nm,最优选为1-20nm。组分B的平均线性截距为0.5-200nm,优选为0.5-50nm,最优选为0.5-20nm。
金属氧化物+金属氧化物纳米复合层的氧含量低于化学计量氧含量,其中氧:金属原子比为化学计量的氧:金属原子比的85-99%,优选为90-97%。组分A和B的体积含量分别为40-95%和5-60%。
在本发明的一个示例性实施例中,Me1X为包含组分A的晶粒或晶柱和围绕的组分B的金属氧化物+金属氧化物纳米复合层,组分A优选采用四方氧化锆或立方氧化锆的形式,组分B优选采用非晶氧化铝或晶态氧化铝的形式,其为阿尔法(α)和伽玛(γ)相中的一种或两种,Me2X为Al2O3层,优选为阿尔法(α)和伽玛(γ)相中的一种或两种。
在本发明的另一个示例性实施例中,Me1X为包含组分A的晶粒或晶柱和围绕的组分B的金属氧化物+金属氧化物纳米复合层,组分A采用铪氧化物的形式,组分B采用非晶氧化铝或晶态氧化铝的形式,其为阿尔法(α)和伽玛(γ)相中的一种或两种,Me2X为Al2O3层,优选为阿尔法(α)和伽玛(γ)相中的一种或两种。
在本发明的另一个示例性实施例中,Me1X为包含组分A的晶粒或晶柱和围绕的组分B的金属氧化物+金属氧化物纳米复合层,Me2X为包含组分A和围绕的组分B的晶粒或者晶柱的金属氧化物+金属氧化物纳米复合层,其中Me1X的组分A的金属原子与Me2X的组分A的金属原子不同,并且/或者Me1X的组分B的金属原子与Me2X的组分B的金属原子不同。
在本发明的又一个示例性实施例中,Me1X为包含组分A的晶粒或晶柱和围绕的组分B的金属氧化物+金属氧化物纳米复合层,组分A采用四方氧化锆或立方氧化锆的形式,组分B采用非晶氧化铝或晶态氧化铝的形式,Me2X为包含组分A的晶粒或晶柱和围绕的组分B的金属氧化物+金属氧化物纳米复合层,组分A采用四方氧化锆或立方氧化锆的形式,组分B采用非晶氧化铝或晶态氧化铝的形式,其中Me1X中的组分A的体积含量大于Me2X中的组分A的体积含量,优选Me1X中的组分A的体积含量以绝对单位比Me2X中的组分A的体积含量至少大2.5%,最优选Me1X中的组分A的体积含量以绝对单位比Me2X中的组分A的体积含量至少大5%。
叠层多层还具有由制造方法产生的残余应力,该应力在200至5000MPa的范围中,优选为在1000至3000MPa的范围中。
涂层在叠层多层的顶部还包括金属碳化物、金属氮化物或金属碳氮化物的外部单层或多层,其中金属原子为Ti,Nb,V,Mo,Zr,Cr,Al,Hf,Ta,Y和Si中的一种或多种,该层的厚度为0.2-5μm。
根据本发明的层通过PVD技术、PECVD技术或这些技术的混合而制成。这种技术的例子为RF(射频)磁控溅射,DC磁控溅射和脉冲双磁控溅射(DMS)。所述层在200-850℃的基底温度下形成。
当PVD工艺的类型允许时,利用组合氧化物靶材料沉积金属氧化物+金属氧化物纳米复合层。在环绕反应气体中,利用金属靶的反应工艺为可选的工艺路线。对于通过磁控溅射方法制造金属氧化物层的情况,可使用两种或多种单个金属靶,其中通过接通和切断分离的靶来控制金属氧化物+金属氧化物纳米复合成分。在优选方法中,靶为化合物,其具有反映所需层成分的成分。对于射频(RF)溅射的情况,通过对分离的靶施加独立的可控功率水平来控制成分。
可通过在大规模的PVD或PECVD工艺中多重旋转基底来形成非周期性的层结构。
例1
由交替的金属氧化物+金属氧化物纳米复合Al2O3+ZrO2层和Al2O3层组成的非周期性叠层多层利用射频溅射PVD方法而沉积在基底上。
通过高纯度氧化物靶,根据温度和氧化锆对氧化铝的比率,施加不同的工艺条件,从而沉积纳米复合层。在形成的纳米复合层中的两种氧化物的含量通过在氧化锆靶上施加一个功率水平和在氧化铝靶上施加单独的功率水平来进行控制。将氧化铝添加至氧化锆熔剂(flux),以形成具有亚稳ZrO2相的复合材料。本例的靶功率水平在各氧化物靶上为80W。调节溅射速率,以使锆的百分比比铝的百分比高两倍。氧:金属原子比为化学计量的氧:金属原子比的94%。
在氩气环境中利用氧化铝靶来沉积Al2O3层。
通过XRD和TEM分析所得的层。XRD分析显示出:在纳米复合层中没有结晶的Al2O3的痕迹,而Al2O3层主要由伽玛Al2O3组成。
TEM研究显示出:沉积的涂层由交替的金属氧化物+金属氧化物纳米复合层的叠层多层组成,其包括由线性截距为2nm的非晶相(组分B)围绕的平均粒径为4nm的晶粒(组分A),和伽玛Al2O3层。纳米复合层的晶粒为立方ZrO2,而围绕的相具有较高的铝含量。各层厚度的范围为6至20nm,总的多层厚度为大约1μm。
两种组分A和B的相对体积含量分别为大约70%和30%,其通过TEM图像的ERDA分析和EDS线扫描确定。
例2
在氩气和氧气气氛中,利用高纯度铝和锆靶,利用反应射频溅射PVD方法,将由Al2O3+ZrO2和伽玛Al2O3层的交替的金属氧化物+金属氧化物纳米复合层组成的叠层多层涂层沉积在基底上。两种氧化物在所形成的层中的含量通过在锆靶上施加一个功率水平和在铝靶上施加单独的功率水平来控制。调节溅射速率,以促使形成复合材料,其具有高1-2倍at-%的锆。在氩气+氧气气氛中,利用铝靶沉积Al2O3层。
XRD结果显示:在纳米复合层中存在亚稳ZrO2相。TEM研究显示:沉积的涂层由交替的金属氧化物+金属氧化物纳米复合层的叠层多层组成,其包括由线性截距为3nm的非晶相(组分B)围绕的平均粒径为6nm的晶粒(组分A),和伽玛Al2O3层。纳米复合层的晶粒具有较高的锆含量,而围绕的相具有较高的铝含量。各层厚度的范围为10至20nm,总的多层厚度为大约3μm。
两种组分A和B的相对体积含量分别为大约75%和25%,其通过TEM图像的ERDA分析和EDS线扫描确定。
例3
在氩气和氧气气氛中,利用高纯度铝+锆靶,利用双磁控溅射PVD方法,将两个Al2O3+ZrO2的交替的金属氧化物+金属氧化物纳米复合层组成的叠层多层涂层沉积在基底上。两种氧化物在形成的相应的纳米复合层中的含量通过在两种元素在靶中的相对含量来控制。通过转动整个基底台、用于基底被安装处的、用于销的单独的保持器和各个销,使基底进行三重的旋转。
XRD结果显示:在层中存在亚稳ZrO2相。TEM研究显示:沉积的涂层由两种交替的金属氧化物+金属氧化物纳米复合层的叠层多层组成,其包括平均粒径为6nm的晶粒(组分A)。层的晶粒具有较高的锆含量,而围绕的相具有较高的铝含量。各层厚度的范围为10至20nm,总的多层厚度为大约3μm。
通过TEM图像的ERDA分析和EDS线扫描揭示出:叠层多层由交替的层组成:第一层具有体积含量为大约70%的组分A和体积含量为大约30%组分B,第二层具有体积含量为大约50%的组分A和体积含量为大约50%的组分B。
Claims (16)
1.一种切削刀具,包括硬质合金、金属陶瓷、陶瓷或高速钢制成的基底,至少在该基底的表面的作用部分上涂敷有薄的、粘性的、硬的且耐磨的涂层,其特征在于:所述涂层包括交替的PVD或PECVD金属氧化物层即交替的Me1X和Me2X层的叠层多层,其中所述金属原子Me1和Me2为Ti,Nb,V,Mo,Zr,Cr,Al,Hf,Ta,Y和Si中的一种或多种,且Me1X和Me2X中的至少一个为由具有不同成分和不同结构的两种组分即组分A和组分B构成的金属氧化物+金属氧化物的纳米复合层,所述两种组分均由一种金属元素的单相氧化物组成或由两种或多于两种的金属氧化物的固溶体组成,其中所述Me1X层和Me2X层在成分或结构或这两个特性方面均是不同的,且各层厚度大于0.4nm但小于50nm,所述叠层多层的总厚度在0.2和20μm之间。
2.如权利要求1所述的切削刀具,其特征在于:所述各个Me1X和Me2X层厚度大于1nm且小于30nm。
3.如权利要求2所述的切削刀具,其特征在于:所述涂层还包括在叠层多层的下方厚度在0.2μm和20μm之间的金属碳化物、金属氮化物或金属碳氮化物的内部的单层或多层,其中金属原子选自Ti,Nb,V,Mo,Zr,Cr,Al,Hf,Ta,Y或Si的一种或多种。
4.如权利要求1-3中任一项所述的切削刀具,其特征在于:所述涂层在叠层多层的顶部上还包括厚度在0.2μm和5μm之间的金属碳化物、金属氮化物或金属碳氮化物的外部的单层或多层涂层,其中金属原子选自Ti,Nb,V,Mo,Zr,Cr,Al,Hf,Ta,Y或Si的一种或多种。
5.如权利要求1-3中任一项所述的切削刀具,其特征在于:所述组分A的平均粒径为1-100nm。
6.如权利要求1-3中任一项所述的切削刀具,其特征在于:所述组分B的平均线性截距为0.5-200nm。
7.如权利要求1-3中任一项所述的切削刀具,其特征在于:组分A和B的体积含量分别为40-95%和5-60%。
8.如权利要求1-3中任一项所述的切削刀具,其特征在于:所述组分A包括四方氧化锆或立方氧化锆,所述组分B为非晶氧化铝或晶态氧化铝,其为阿尔法(α)和伽玛(γ)相中的一种或两种。
9.如权利要求1-3中任一项所述的切削刀具,其特征在于:Me1X为金属氧化物+金属氧化物的纳米复合层,Me2X为阿尔法(α)和伽玛(γ)相中的一种或两种的晶态氧化铝。
10.如权利要求1所述的切削刀具,其特征在于:陶瓷为立方氮化硼。.
11.如权利要求1所述的切削刀具,其特征在于:所述金属原子Me1和Me2为Hf,Ta,Cr,Zr和Al中的一种或多种。
12.如权利要求1所述的切削刀具,其特征在于:所述金属原子Me1和Me2为Zr和Al中的一种或多种。
13.如权利要求5所述的切削刀具,其特征在于:所述组分A的平均粒径为1-70nm。
14.如权利要求5所述的切削刀具,其特征在于:所述组分A的平均粒径为1-20nm。
15.如权利要求6所述的切削刀具,其特征在于:所述组分B的平均线性截距为0.5-50nm。
16.如权利要求6所述的切削刀具,其特征在于:所述组分B的平均线性截距为0.5-20nm。
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SE0602192-7 | 2006-10-18 | ||
SE0602192A SE530515C2 (sv) | 2006-01-19 | 2006-10-18 | Skärverktyg belagt med laminerade nanokompositskikt av metalloxider |
SE06021927 | 2006-10-18 |
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CN101164773A CN101164773A (zh) | 2008-04-23 |
CN101164773B true CN101164773B (zh) | 2012-02-22 |
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EP (1) | EP1914331B1 (zh) |
JP (1) | JP5148965B2 (zh) |
KR (1) | KR101444460B1 (zh) |
CN (1) | CN101164773B (zh) |
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DE102007030735A1 (de) * | 2007-07-02 | 2009-01-08 | Walter Ag | Werkzeug mit mehrlagiger Metalloxidbeschichtung |
DE102008026358A1 (de) * | 2008-05-31 | 2009-12-03 | Walter Ag | Werkzeug mit Metalloxidbeschichtung |
KR101614979B1 (ko) * | 2009-04-03 | 2016-04-22 | 산드빅 인터렉츄얼 프로퍼티 에이비 | 높은 온도를 발생시키는 금속 절삭 분야를 위한 코팅된 절삭 공구 |
SE533884C2 (sv) * | 2009-06-01 | 2011-02-22 | Seco Tools Ab | Nanolaminerat belagt skärverktyg |
JP5382594B2 (ja) * | 2012-02-13 | 2014-01-08 | 住友電工ハードメタル株式会社 | 表面被覆切削工具 |
EP2636764B1 (en) * | 2012-03-07 | 2014-07-09 | Seco Tools Ab | Nanolaminated coated cutting tool |
US20150072135A1 (en) * | 2012-04-02 | 2015-03-12 | Osg Corporation | Hard coating film for cutting tool and cutting tool coated with hard coating film |
KR101626239B1 (ko) | 2012-04-09 | 2016-05-31 | 오에스지 가부시키가이샤 | 절삭 공구용 경질 피막 및 경질 피막 피복 절삭 공구 |
JP5950230B2 (ja) * | 2012-08-30 | 2016-07-13 | 住友電工ハードメタル株式会社 | セラミックス被膜 |
CN104313530B (zh) * | 2014-09-30 | 2017-05-10 | 苏州博利迈新材料科技有限公司 | 一种硬质合金表面纳米涂层及其制备方法 |
EP3323909A4 (en) * | 2015-07-15 | 2019-03-20 | Sumitomo Electric Industries, Ltd. | COATING |
RU2620521C2 (ru) * | 2015-10-06 | 2017-05-26 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Белгородский государственный национальный исследовательский университет" (НИУ "БелГУ") | Износостойкое покрытие для режущего инструмента |
US11247275B2 (en) | 2016-02-19 | 2022-02-15 | Walter Ag | Cutting tool |
JP6701384B2 (ja) * | 2016-12-28 | 2020-05-27 | 住友電気工業株式会社 | 被膜 |
CN106593458B (zh) * | 2017-01-12 | 2019-03-01 | 河北工程大学 | 地铁施工用盾构机刀具 |
JP7072053B2 (ja) * | 2018-04-11 | 2022-05-19 | 住友電気工業株式会社 | 被膜 |
CN109267008B (zh) * | 2018-11-23 | 2020-05-05 | 东南大学 | 一种Y-AlYN-AlYNC多元涂层刀具及其制备方法 |
CN109970453B (zh) * | 2019-05-20 | 2021-07-23 | 石家庄铁道大学 | 一种Cr-C-N三元硬质材料及其制备方法 |
CN114561621B (zh) * | 2021-12-10 | 2022-12-02 | 吉林大学 | 一种高熵金属玻璃薄膜及其制备方法和应用 |
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WO2004033751A1 (de) | 2002-10-07 | 2004-04-22 | Kennametal Widia Gmbh & Co. Kg | Verbundwerkstoff |
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SE529144C2 (sv) * | 2005-04-18 | 2007-05-15 | Sandvik Intellectual Property | Skär belagt med kompositoxidskikt |
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WO1999058738A1 (en) * | 1998-05-08 | 1999-11-18 | Valenite Inc. | Multilayered cvd coated article and process for producing same |
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EP1914331B1 (en) | 2019-07-24 |
JP5148965B2 (ja) | 2013-02-20 |
EP1914331A3 (en) | 2009-12-16 |
IL186533A0 (en) | 2008-01-20 |
JP2008100345A (ja) | 2008-05-01 |
KR20080035495A (ko) | 2008-04-23 |
CN101164773A (zh) | 2008-04-23 |
KR101444460B1 (ko) | 2014-09-24 |
EP1914331A2 (en) | 2008-04-23 |
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